Pad structure, circuit board and electronic product
By designing the extension area of the first pad in the pad structure and providing the drag function, the problem of tin connection after welding of plug-in structures such as connectors is solved, reducing manual rework, and improving product yield and production efficiency.
Patent Information
- Application Number
- CN202421774592.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-24
AI Technical Summary
The pin spacing of plug-in structures such as connectors is small and dense, resulting in serious problems with tin connection on the circuit board after wave soldering, requiring manual re-repair, affecting production progress and increasing labor investment costs.
A pad structure is designed, including two first pads and several second pads arranged on the substrate. The extension area of the first pad is arranged inclined to provide a dragging function to avoid the problem of tin connection between the pads.
The tin drag function is provided through the extension area of the first pad, which effectively prevents the problem of tin short circuit between adjacent pads, reduces the probability of manual rework, reduces the cost of manual rework, and improves product yield and production progress.
Smart Images
Figure CN222981742U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic devices, and particularly to a pad structure, a circuit board, and an electronic product. Background Art
[0002] For plug-in structures such as connectors, their pin pitches are small and dense, and the problem of solder bridging on the circuit board after wave soldering is relatively serious, requiring manual repair. Thus, it will affect the production progress and increase the labor input cost. Summary of the Utility Model
[0003] The present application provides a pad structure, a circuit board, and an electronic product to reduce the occurrence of solder bridging problems.
[0004] The present application provides a pad structure, including a substrate, on which two first pads and a plurality of second pads are provided;
[0005] The two first pads and the plurality of second pads are arranged at intervals along a first direction on one side of the substrate. The two first pads are respectively arranged at both ends of the plurality of second pads, and the two first pads are symmetrically arranged;
[0006] The first pad is configured with an extended area, and the extended area is inclined with respect to the first direction.
[0007] Based on the above technical solutions, the pad structure provided by the present application can provide a solder dragging function through the extended area of the first pad. Thus, the problem of solder bridging between pads can be avoided, the probability of manual repair can be reduced, the manual repair cost can be lowered, the product yield can be improved, and further the production progress can be increased.
[0008] In some possible implementation manners, the extended area includes a major axis, and an included angle α is configured between the major axis of the extended area and the first direction, where 30° ≤ α ≤ 75°.
[0009] In some possible implementation manners, the pad structure further includes a third pad;
[0010] In a second direction, the third pad is arranged on a side of the first pad away from the extended area, and the second direction is perpendicular to the first direction.
[0011] In some possible implementation manners, the included angle α is 45°.
[0012] In some possible implementation manners, the first pad further includes a circular pad body, the pad body is located at an end of the extended area close to the second pad, and the pad body partially overlaps with the extended area.
[0013] In some possible embodiments, the extension region includes a major axis, and the extension length m of the extension region on the major axis satisfies 1.5d ≤ m ≤ 2.0d, where d is the diameter of the pad body.
[0014] In some possible embodiments, the extension region includes a minor axis, and the width n of the extension region on the minor axis satisfies 0.9d ≤ n ≤ 1.2d, where d is the diameter of the pad body.
[0015] In some possible embodiments, the pad structure further includes a solder mask layer, which is disposed on the side of the substrate close to the first pad, and the solder mask layer is arranged to avoid the first pad and the second pad.
[0016] In addition, the present application also provides a circuit board, including the pad structure provided in each of the above embodiments.
[0017] In addition, the present application also provides an electronic product, including a connector and the pad structure provided in each of the above embodiments. Description of the Drawings
[0018] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 Shows a schematic structural diagram of a pad structure in some embodiments;
[0020] Figure 2 Shows a partial structural diagram of a pad structure in some embodiments;
[0021] Figure 3 Shows Figure 2 A partial enlarged structural diagram of part A in
[0022] Main Element Symbol Description:
[0023] 1000 - Pad Structure;
[0024] 100 - Substrate; 110 - Substrate Body; 111 - Pin Hole; 120 - Green Oil Layer; 121 - Window Opening;
[0025] 200 - First Pad; 210 - Pad Body; 220 - Extension Region;
[0026] 300 - Second Pad;
[0027] 400 - The third pad;
[0028] 500 - Solder mask layer;
[0029] 2000 - Pin;
[0030] X - The first direction; Y - The second direction; L 1 - Major axis; L 2 - Minor axis. Detailed implementation manners
[0031] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application.
[0032] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.
[0033] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.
[0034] In the present application, unless otherwise clearly specified and limited, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0035] In this application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.
[0036] As Figure 1 shown, in the embodiment, a pad structure 1000 is provided, which can be applied to a circuit board to realize the connection between the circuit board and connectors such as a Universal Serial Bus (USB) interface.
[0037] As Figure 1 shown, the pad structure 1000 includes a substrate 100, two first pads 200 and a plurality of second pads 300. The two first pads 200 and the plurality of second pads 300 can be arranged on the same side of the substrate 100 along the first direction X. Among them, the two first pads 200 can be respectively arranged at both ends of the plurality of second pads 300, and the two first pads 200 are symmetrically arranged with respect to the plurality of second pads 300.
[0038] As Figure 1 and Figure 2 shown, in the embodiment, the first pad 200 is configured with an extension area 220, and the extension area 220 can be arranged obliquely with respect to the first direction X. Thus, during the wave soldering process, the extension area 220 can extend the excess solder paste to achieve the effect of dragging the solder, effectively preventing the problem of solder short circuit between adjacent pads, reducing the probability of manual repair, and thus reducing the manual repair cost. At the same time, the product yield is improved, and thus the production progress is improved.
[0039] As Figure 1 and Figure 2 shown, in some embodiments, the pad structure 1000 may include three second pads 300, and the three second pads 300 can be evenly spaced along the first direction X between the two first pads 200.
[0040] In other embodiments, the pad structure 1000 may further include one, two or five second pads 300, etc., and the plurality of second pads 300 can be evenly or unevenly distributed between the two first pads 200.
[0041] In the embodiment, the two first pads 200 may be symmetrically arranged with respect to the three second pads 300. That is, the two first pads 200 are symmetrically arranged with respect to the central axis of the second pad 300 in the middle in the first direction X, and the central axis of the second pad 300 is parallel to the second direction Y, where the second direction Y is perpendicular to the first direction X.
[0042] In addition, the pad structure 1000 further includes two third pads 400. In the first direction X, the two third pads 400 may be correspondingly arranged on one side of the two first pads 200 away from the second pad 300. In addition, in the second direction Y, the two third pads 400 may be located on the same side of the two first pads 200.
[0043] In the embodiment, the first pad 200 further includes a pad body 210. The pad body 210 may be located at one end of the extension region 220, and the pad body 210 may partially overlap with the extension region 220. In some embodiments, the pad body 210 may be located at one end of the extension region 220 close to the second pad 300. In addition, the extension region 220 may be located on the side of the pad body 210 away from the third pad 400.
[0044] In some embodiments, the extension region 220 is generally in a runway shape. Accordingly, the extension region 220 may include a major axis L 1 and a minor axis L 2 .
[0045] As Figure 2 and Figure 3 shown, in some embodiments, an included angle α is configured between the major axis L 1 of the extension region 220 and the first direction X, and 30° ≤ α ≤ 75°. Thus, the problem of solder bridging between the first pad 200 and the second pad 300 and the third pad 400 can be avoided.
[0046] In some embodiments, the included angle α between the major axis L 1 of the extension region 220 and the first direction X may be set to 45°. Thus, the distance between the first pad 200 and the second pad 300 and the distance between the first pad 200 and the third pad 400 can reach a balance, so that the distance between the first pad 200 and the second pad 300 and the distance between the first pad 200 and the third pad 400 can be relatively large, further reducing the probability of solder bridging problems.
[0047] In some other embodiments, the included angle α between the major axis L 1 of the extension region 220 and the first direction X may also be set to 30°, 35°, 40°, 42°, 49°, 52°, 55°, 60°, 62°, 65°, 69°, 70°, 75° or any other angle in the range of 30° to 75°.
[0048] As Figure 2 and Figure 3 shown, in some embodiments, the pad body 210 may be circular, and the diameter of the pad body 210 may be denoted as d. The extension length m of the extension region 220 on the long axis L 1 may be set to 1.5d ≤ m ≤ 2.0d. While achieving the effect of dragging solder, the amount of solder paste used can also be reduced, the occupied space can be reduced, and the reasonable utilization of the space on the substrate 100 can be realized.
[0049] Exemplarily, in some embodiments, the extension length m of the extension region 220 on the long axis L 1 may be set to 1.5d, 1.65d, 1.6d, 1.75d, 1.82d, 1.85d, 1.9d, 1.95d, or any other length within 1.5d to 2.0d.
[0050] In some embodiments, the width n of the extension region 220 on the short axis L 2 may be set to 0.9d ≤ n ≤ 1.2d. While achieving the function of dragging solder, the problem of solder bridging caused by the first pad 200 being too close to other pads can also be avoided. Exemplarily, the width n of the extension region 220 on the short axis L 2 may be set to 0.9d, 0.95d, 1.0d, 1.05d, 1.1d, 1.15d, 1.2d, or any other width within 0.9d to 1.2d.
[0051] As Figure 2 and Figure 3 shown, the substrate 100 may include a substrate body 110 and a solder mask layer 120. Among them, the substrate body 110 may be provided with pin holes 111 for inserting the connector pins 2000. The pin holes 111 may penetrate the substrate body 110 along the thickness direction of the substrate body 110, that is, the pin holes 111 may be through-hole structures. It can be understood that each pad position can be configured with a pin hole 111, and the pads at the corresponding positions can be arranged around the circumference of the pin hole 111. That is, pin holes 111 are configured at the positions of the first pads 200, the second pads 300, and the third pads 400.
[0052] The solder mask layer 120 may be disposed on one side of the substrate body 110 close to the first pad 200. In the embodiment, at the setting positions of the pads, the solder mask layer 120 may be provided with openings 121 to provide setting positions for the pads, that is, each pad may be disposed in the corresponding opening 121. There may be a gap between the solder mask layer 120 and each pad.
[0053] As Figure 2 and Figure 3As shown, the pad structure 1000 further includes a solder mask layer 500. The solder mask layer 500 can be disposed on the side of the solder resist layer 120 away from the substrate body 110. And the solder mask layer 500 can be arranged to avoid the openings 121 of each solder resist layer 120, that is, the openings 121 and each pad can be exposed relative to the solder mask layer 500.
[0054] In an embodiment, the solder mask layer 500 can have a certain protruding height relative to the side of each pad away from the substrate 100. Thus, the solder mask layer 500 can play a blocking role around each pad, preventing the solder paste at the position of each pad from moving around, further reducing the probability of solder bridging problems and reducing the possibility of manual rework.
[0055] In some embodiments, the solder mask layer 500 can be printed with white oil.
[0056] In other embodiments, the solder mask layer 500 can also be printed with black oil.
[0057] An embodiment also provides a circuit board, which can include the pad structure 1000 provided in the embodiment. Among them, the circuit board can be a circuit board for installing a connector in an electronic product.
[0058] Of course, the circuit board can also be a circuit board for other purposes, such as a circuit board for carrying devices such as a main control chip.
[0059] An embodiment also provides an electronic product, which can include the pad structure 1000 provided in the embodiment. Among them, the electronic product can be, including but not limited to, products such as routers, optical network terminals, set-top boxes, laptop computers, desktop computers, etc.
[0060] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without conflict, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0061] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.
Claims
1. A pad structure, characterized in that: It comprises a substrate (100), on which two first solder pads (200) and a plurality of second solder pads (300) are arranged; The two first solder pads (200) and the plurality of second solder pads (300) are arranged at intervals on one side of the substrate (100) along a first direction (X), the two first solder pads (200) are arranged at both ends of the plurality of second solder pads (300), and the two first solder pads (200) are arranged symmetrically; The first pad (200) is provided with an extension region (220), and the extension region (220) is arranged obliquely with respect to the first direction (X).
2. The pad structure according to claim 1, characterized in that: The extended region (220) includes a long axis (L1), and an angle α is formed between the long axis (L1) of the extended region (220) and the first direction (X), and 30°≤α≤75°.
3. The pad structure according to claim 2, characterized in that: The pad structure further includes a third pad (400); In a second direction (Y), the third pad (400) is disposed on a side of the first pad (200) away from the extension region (220), and the second direction (Y) is perpendicular to the first direction (X).
4. The pad structure according to claim 3, characterized in that: The angle α is 45°.
5. The pad structure according to claim 1, characterized in that: The first pad (200) further comprises a circular pad body (210), wherein the pad body (210) is located at one end of the extension region (220) close to the second pad (300), and the pad body (210) partially overlaps with the extension region (220).
6. The pad structure according to claim 5, characterized in that: The extension region (220) comprises a major axis (L1), and an extension length m of the extension region (220) on the major axis (L1) is 1.5d≤m≤2.0d, wherein d is the diameter of the pad body (210).
7. The pad structure according to claim 5, characterized in that: The extension region (220) comprises a short axis (L2), and a width n of the extension region (220) on the short axis (L2) is 0.9d≤n≤1.2d, wherein d is the diameter of the pad body (210).
8. The pad structure according to claim 1, characterized in that: The pad structure further comprises a solder resist layer (500), wherein the solder resist layer (500) is arranged on a side of the substrate (100) close to the first pad (200), and the solder resist layer (500) is arranged avoiding the first pad (200) and the second pad (300).
9. A circuit board, characterized in that: Comprising the pad structure as claimed in any one of claims 1 to 8.
10. An electronic product, characterized in that: It comprises a connector and a pad structure as claimed in any one of claims 1 to 8, wherein the connector is welded to the pad structure.