Laser marking assembly and detection laser etching equipment

Abstract

The utility model discloses a laser marking assembly and detection laser etching equipment, and relates to the technical field of laser etching equipment, the laser marking assembly comprises a lifting assembly and a buffer rack, one side of the lifting assembly is horizontally connected with a laser marking mechanism, and the middle part of the laser marking mechanism is provided with a heat dissipation protection rack; a shade is installed at the side end, away from the lifting assembly, of the laser marking mechanism, and the buffer frames are symmetrically installed at the lower ends of the left side and the right side of the shade. According to the laser marking assembly and the detection laser etching equipment, the shielding cover and the buffer frame are installed at one end of the laser marking mechanism, the shielding cover can prevent marking from being affected by interference of external factors when a laser marking device operates to a certain extent, and the buffer frame installed at the lower ends of the two sides of the buffer frame can conduct laser marking in the vertical direction. Direct collision between the laser marking device and the surface of the material is avoided, the structure protection effect is achieved, and the heat dissipation protection frame provides good heat dissipation assistance and structure protection for the laser power source.

Description

Technical Field

[0001] The utility model relates to the technical field of laser engraving equipment, in particular to a laser marking component and a detection laser engraving equipment. Background Technique

[0002] A laser engraving equipment is a device that uses a laser beam to permanently mark various different material surfaces. It creates a permanent imprint on the surface or inside of the material by evaporating the surface material, causing chemical and physical changes in the surface material due to light energy, or burning off part of the material by light energy. This kind of equipment is widely used in industrial production, especially in occasions that require fine and high-precision marking, such as marking QR codes or barcodes on the surface of PCBs. The laser engraving equipment can work on a variety of materials, including but not limited to wood products, acrylic particles, plastic plates, metal plates, stones, etc., and achieves the engraving effect through the chemical changes of the laser. In addition, the laser engraving technology also supports the use of a variety of graphic processing software for design in the windows environment, and scanned graphics, vectorized graphics, and CAD files can be easily "printed" onto the engraving machine to achieve precise pattern and text engraving.

[0003] In a conventional laser marking component, the output end of the laser does not have structural shielding protection, making it prone to being affected by external factors during marking, resulting in problems with marking. At the same time, the output end of the laser is also prone to structural damage.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a laser marking component and a detection laser engraving equipment are proposed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a laser marking component and a detection laser engraving equipment to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A laser marking component and a detection laser engraving equipment, including a lifting component and a buffer frame. One side of the lifting component is horizontally connected with a laser marking mechanism, and a heat dissipation protection frame is installed in the middle of the laser marking mechanism. Moreover, a mask is installed at one side end of the laser marking mechanism far away from the lifting component. The buffer frames are symmetrically installed at the lower ends on the left and right sides of the mask. The buffer frame includes a stable frame, a guide rod, a damping slider, a buffer rod, and a buffer suction cup. A guide rod is horizontally installed at the bottom of the stable frame, damping sliders are slidably installed at the left and right ends of the guide rod, a buffer rod is vertically connected to the bottom of the damping slider, and a buffer suction cup is installed at the bottom of the buffer rod.

[0007] Further, the lifting assembly includes a guiding column, an electric slider, a support frame, and fixing bolts. An electric slider is slidably installed on one side of the guiding column, and a support frame is installed on the top of the electric slider. Moreover, fixing bolts are vertically installed at the four diagonal corners of the support frame.

[0008] Further, the laser marking mechanism includes a laser power supply, a laser marker, and a docking frame. A laser marker is installed at one end of the laser power supply, and a docking frame is connected to the bottom of the laser power supply.

[0009] Further, the surface structure of the top of the support frame matches the surface structure of the bottom of the docking frame, and the fixing bolts are threadedly connected to the docking frame.

[0010] Further, the heat dissipation and protection frame includes first heat dissipation fins, a first protection frame, a second protection frame, and second heat dissipation fins. The first heat dissipation fins are inserted into the top surface of the first protection frame, and the second protection frames are connected to the left and right sides of the first protection frame. Moreover, the second heat dissipation fins are connected to the side of the second protection frame close to the laser marking mechanism.

[0011] Further, the first heat dissipation fins and the second heat dissipation fins have the same structure, and the first heat dissipation fins and the second heat dissipation fins are attached to the side surface of the laser power supply.

[0012] Further, the stabilizing frame is fixedly connected to the mask, and the mask is fixedly connected to the laser marker.

[0013] A detection laser engraving device, which is installed with the laser marking assembly as described above.

[0014] The present utility model provides a laser marking assembly and a detection laser engraving device, having the following beneficial effects:

[0015] 1. In the present utility model, a mask is connected to the surface of the laser marker. At the same time, buffer frames are installed at the lower ends of the left and right sides of the mask. Among them, the damping slider is used to make the buffer rods and buffer suction cups at the bottom slide and translate along the surfaces of the stabilizing frame and the guiding rods. At the same time, in cooperation with the telescopic properties of the buffer rods and buffer suction cup structures, when the laser marker moves up and down vertically, its bottom can be maximally prevented from directly contacting the material to be marked directly below in terms of structure. By using the combination of the above structures, it can not only provide good buffer protection to avoid damage to the output end of the laser marker, but also can be flexibly adjusted within a certain range according to the surface size of the material below.

[0016] 2. In this utility model, a heat dissipation protection frame is installed on the outer surface of the laser power supply. The first protection frame and the second protection frame are arranged at equal distances on the surfaces of the first heat dissipation fins and the second heat dissipation fins. By using the insertion structure, the first heat dissipation fins and the first protection frame are movably connected to each other, and the second protection frame and the second heat dissipation fins are movably connected to each other. With the use of the above structure, the first heat dissipation fins and the second heat dissipation fins can absorb, conduct and dissipate the heat generated during the operation of the laser power supply to the greatest extent. At the same time, in combination with the use of the first protection frame and the second protection frame, it is possible to minimize the influence of external forces on the laser power supply while ensuring sufficient and rapid heat dissipation.

[0017] 3. In this utility model, a docking frame is installed at the bottom of the laser marking machine. By using the structural setting where the surface structure of the bottom of the docking frame matches the surface structure of the top of the support frame, and in combination with the use of four sets of fixing bolts, the lifting assembly and the laser marking mechanism can be flexibly disassembled and assembled in structure, facilitating the structural maintenance of the equipment. Furthermore, the disassembly and assembly operations are also simplified as much as possible, thereby improving the operation efficiency of maintenance. In addition, the use of the mask structure can, to a certain extent, reduce the influence of external factors during the operation of the laser marking machine, prevent unnecessary problems from occurring during the marking operation, and play a role in structural shielding. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic side view structure diagram of the main body of a laser marking component and a detection laser engraving device of this utility model;

[0019] Figure 2 It is a schematic structure diagram of the lifting assembly and the laser marking mechanism of a laser marking component and a detection laser engraving device of this utility model;

[0020] Figure 3 It is a schematic three-dimensional structure diagram of the heat dissipation protection frame of a laser marking component and a detection laser engraving device of this utility model;

[0021] Figure 4 It is a schematic three-dimensional structure diagram of the buffer frame of a laser marking component and a detection laser engraving device of this utility model.

[0022] In the figure: 1. Lifting assembly; 101. Guide post; 102. Electric slider; 103. Support frame; 104. Fixing bolt; 2. Laser marking mechanism; 201. Laser power supply; 202. Laser marking machine; 203. Docking frame; 3. Heat dissipation protection frame; 301. First heat dissipation fin; 302. First protection frame; 303. Second protection frame; 304. Second heat dissipation fin; 4. Mask; 5. Buffer frame; 501. Stabilizing frame; 502. Guide rod; 503. Damping slider; 504. Buffer rod; 505. Buffer suction cup. Detailed implementation mode

[0023] The following further describes the implementation mode of the present utility model in detail in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0024] As Figures 1 to 4 shown, a laser marking assembly and a detection laser engraving device include a lifting assembly 1 and a buffer frame 5. A laser marking mechanism 2 is horizontally connected to one side of the lifting assembly 1. A heat dissipation protection frame 3 is installed in the middle of the laser marking mechanism 2. A mask 4 is installed at one end of the laser marking mechanism 2 away from the lifting assembly 1. The buffer frames 5 are symmetrically installed at the lower ends on the left and right sides of the mask 4. The buffer frame 5 includes a stable frame 501, a guide rod 502, a damping slider 503, a buffer rod 504, and a buffer suction cup 505. A guide rod 502 is horizontally installed at the bottom of the stable frame 501. Damping sliders 503 are slidably installed at the left and right ends of the guide rod 502. A buffer rod 504 is vertically connected to the bottom of the damping slider 503. A buffer suction cup 505 is installed at the bottom of the buffer rod 504. The stable frame 501 is fixedly connected to the mask 4, and the mask 4 is fixedly connected to the laser marker 202. Among them, the damping slider 503 enables the buffer rod 504 and the buffer suction cup 505 at the bottom to slide and translate along the surfaces of the stable frame 501 and the guide rod 502. At the same time, with the telescopic property of the buffer rod 504 and the buffer suction cup 505 structure, when the laser marker 202 moves up and down in the vertical direction, its bottom can avoid direct structural contact with the material to be marked directly below to the greatest extent.

[0025] As Figures 1 to 4 shown, the lifting assembly 1 includes a guide post 101, an electric slider 102, a support frame 103, and a fixing bolt 104. An electric slider 102 is slidably installed on one side of the guide post 101. A support frame 103 is installed on the top of the electric slider 102. Fixing bolts 104 are vertically installed at the four diagonals of the support frame 103. The laser marking mechanism 2 includes a laser power supply 201, a laser marker 202, and a docking frame 203. A laser marker 202 is installed at one end of the laser power supply 201. A docking frame 203 is connected to the bottom of the laser power supply 201. The surface structure of the top of the support frame 103 matches the surface structure of the bottom of the docking frame 203. The fixing bolt 104 and the docking frame 203 are in threaded connection. Among them, the first protection frame 302 and the second protection frame 303 are arranged at equal distances on the surfaces of the first heat dissipation fins 301 and the second heat dissipation fins 304. Using the insertion structure, the first heat dissipation fins 301 and the first protection frame 302 are movably connected to each other, and the second protection frame 303 and the second heat dissipation fins 304 are movably connected to each other.

[0026] As Figures 1 to 4As shown, the heat dissipation and protection frame 3 includes a first heat dissipation fin 301, a first protection frame 302, a second protection frame 303 and a second heat dissipation fin 304. The first protection frame 302 is inserted on the top surface of the first heat dissipation fin 301, and the left and right sides of the first protection frame 302 are connected with the second protection frame 303. Moreover, the second heat dissipation fin 304 is connected to the side of the second protection frame 303 close to the laser marking mechanism 2. The first heat dissipation fin 301 and the second heat dissipation fin 304 have the same structure, and the first heat dissipation fin 301 and the second heat dissipation fin 304 are attached to the side surface of the laser power supply 201. By installing a docking frame 203 at the bottom of the laser marker 202, using the structure where the bottom surface structure of the docking frame 203 matches the top surface structure of the support frame 103, and cooperating with the use of four fixing bolts 104, the lifting assembly 1 and the laser marking mechanism 2 can be flexibly disassembled and assembled structurally.

[0027] By installing a mask 4 and a buffer frame 5 at one end of the laser marking mechanism 2, the mask 4 can, to a certain extent, prevent the laser marker 202 from being affected by external factors during operation, resulting in an impact on the marking. And the buffer frames 5 installed at the lower ends on both sides of the buffer frame 5 can prevent the laser marker 202 from directly colliding with the surface of the material in the vertical direction, playing a role in structural protection. The heat dissipation and protection frame 3 provides good heat dissipation assistance and structural protection for the laser power supply 201.

[0028] In summary, as Figures 1 to 4 shown, when using this laser marking component and the detection and laser engraving equipment, first, the docking frame 203 at the bottom of the laser power supply 201 is structurally docked with the support frame 103 at the top of the electric slider 102 in the vertical direction, and then the four fixing bolts 104 are sequentially screwed into the inside of the support frame 103 and the docking frame 203 from bottom to top, so as to quickly dock the lifting assembly 1 and the laser marking mechanism 2;

[0029] Then, the first protection frame 302 connected with the second protection frame 303 is inserted onto the surface of the first heat dissipation fin 301 one by one, then the second heat dissipation fin 304 is inserted and docked with the second protection frame 303, and finally the entire heat dissipation and protection frame 3 is sleeved on the surface of the laser power supply 201;

[0030] Next, according to the size of the material to be marked, the buffer rod 504 and the buffer suction cup 505 connected to the bottom are slid and adjusted along the surfaces of the stable frame 501 and the guide rod 502 by using the damping slider 503 until adjusted to a suitable position. Under the operation of the electric slider 102, the laser marking mechanism 2, the heat dissipation and protection frame 3, the mask 4 and the buffer frame 5 are simultaneously vertically lifted and moved along the surface of the guide post 101 in the vertical direction and adjusted to a suitable height. Under the operation of the laser power supply 201, the laser marker 202 starts to perform laser marking on the surface of the material.

[0031] The embodiments of the present utility model are given for purposes of illustration and description, and are not exhaustive or limit the present utility model to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better explain the principles of the present utility model and its practical applications, and to enable those of ordinary skill in the art to understand the present utility model so as to design various embodiments with various modifications suitable for specific purposes.

Claims

1. A laser marking assembly, comprising a lifting assembly (1) and a buffer frame (5), characterized in that: A laser marking mechanism (2) is horizontally connected to one side of the lifting component (1), and a heat dissipation protection frame (3) is installed in the middle of the laser marking mechanism (2), and a shield (4) is installed on one side of the laser marking mechanism (2) away from the lifting component (1), and the buffer frame (5) is symmetrically installed at the lower ends of the left and right sides of the shield (4), and the buffer frame (5) includes a stabilizing frame (501), a guide rod (502), a damping slider (503), a buffer rod (504) and a buffer suction cup (505), the bottom of the stabilizing frame (501) is horizontally installed with a guide rod (502), and the left and right ends of the guide rod (502) are slidably installed with a damping slider (503), and the bottom of the damping slider (503) is vertically connected with the buffer rod (504), and the bottom of the buffer rod (504) is installed with a buffer suction cup (505).

2. A laser marking assembly according to claim 1, characterized in that: The lifting assembly (1) comprises a guide column (101), an electric slider (102), a support frame (103) and fixing bolts (104); the electric slider (102) is slidably mounted on one side of the guide column (101), the support frame (103) is mounted on the top of the electric slider (102), and fixing bolts (104) are vertically mounted at four diagonal positions of the support frame (103).

3. A laser marking assembly according to claim 2, characterized in that: The laser marking mechanism (2) comprises a laser power supply (201), a laser marker (202) and a docking frame (203); the laser marker (202) is installed at one end of the laser power supply (201), and the docking frame (203) is connected to the bottom of the laser power supply (201).

4. A laser marking assembly according to claim 3, characterized in that: The top surface structure of the support frame (103) matches the bottom surface structure of the docking frame (203), and the fixing bolt (104) and the docking frame (203) are threadedly connected.

5. A laser marking assembly according to claim 3, characterized in that: The heat dissipation protection frame (3) comprises a first heat dissipation fin (301), a first protection frame (302), a second protection frame (303) and a second heat dissipation fin (304); the first protection frame (302) is inserted on the top surface of the first heat dissipation fin (301), and the second protection frame (303) is connected to the left and right sides of the first protection frame (302), and the second heat dissipation fin (304) is connected to the side of the second protection frame (303) close to the laser marking mechanism (2).

6. A laser marking assembly according to claim 5, characterized in that: The first heat dissipation fin (301) and the second heat dissipation fin (304) have the same structure, and the first heat dissipation fin (301) and the second heat dissipation fin (304) are attached to the side surface of the laser power supply (201).

7. A laser marking assembly according to claim 3, characterized in that: The stabilizing frame (501) is fixedly connected to the mask (4), and the mask (4) is fixedly connected to the laser marker (202).

8. A laser engraving detection device, characterized in that :The laser engraving detection equipment is equipped with a laser marking component as described in any one of claims 1-7.

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