Mini LED lamp panel structure and backlight module

Abstract

The utility model discloses a Mini LED lamp panel structure and a backlight module, and belongs to the technical field of LED display, the Mini LED lamp panel structure comprises a lamp panel and a plurality of LED lamp beads, and the lamp panel is provided with a circuit layer connected with the LED lamp beads; the LED lamp beads are arranged on the lamp panel side by side at intervals and distributed in a matrix array mode. The ratio of the X-axis distance to the Y-axis distance of every two adjacent LED lamp beads is as follows: the X-axis distance / the Y-axis distance = the X-axis size of the light-emitting area of the LED lamp beads / the Y-axis size of the light-emitting area of the LED lamp beads. The distance between the Mini LED light sources is designed at the position of the lamp panel according to a certain proportion, so that the energy of the light sources in unit area is consistent, the problem of non-uniform local brightness is solved, and the overall light emitting effect is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED display, and relates to a Mini LED light board structure and a backlight module. Background Art

[0002] Today, with the continuous development of display technology, Mini LED light boards, as a new type of liquid crystal backlight technology, are gradually emerging. Although the traditional direct-lit backlight technology has its advantages in long-term applications, it also faces some bottlenecks that are difficult to break through.

[0003] Traditional direct-lit backlights usually use relatively large-sized light-emitting diodes (LEDs) as light sources. Due to the large size of the light sources, it is difficult to achieve fine local dimming, which results in relatively limited contrast and color performance of the display screen. At the same time, the traditional direct-lit backlight has a relatively large thickness, which is not conducive to the thin and light design of products.

[0004] The emergence of Mini LED light board technology has brought new changes to the display field. Mini LED refers to small light-emitting diodes with a size between 100 microns and 200 microns. Such small-sized light sources have many advantages. First of all, MiniLED can achieve a higher pixel density, thus providing a more delicate image display effect. Secondly, due to its small size, more precise local dimming can be carried out, greatly improving the contrast and color saturation of the display screen. In addition, the Mini LED light board can also achieve a thinner design to meet the requirements of modern electronic products for thin and light.

[0005] However, there are still some problems in the current design of Mini LED light boards. Among them, the most prominent problem is that the MiniLED light sources are not arranged on the light board in a certain proportion. This leads to inconsistent light energy in the X and Y directions, and then causes the phenomenon of uneven brightness and darkness of the display screen at local positions. This uneven brightness and darkness not only affects the visual experience but also makes the product have a certain taste defect problem.

[0006] Therefore, it is necessary to improve the existing technology to overcome the defects in the existing technology. Summary of the Utility Model

[0007] The purpose of the utility model is to provide a Mini LED light board structure and a backlight module to improve the phenomenon of uneven brightness and darkness of the existing display screen and improve the overall light output effect.

[0008] The purpose of the utility model is achieved through the following technical solutions:

[0009] A Mini LED light board structure includes a light board and multiple LED lamp beads. The light board is provided with a circuit layer connected to the LED lamp beads. The LED lamp beads are arranged side by side and spaced apart on the light board in a matrix array distribution. The ratio of the X-axis spacing to the Y-axis spacing between two adjacent LED lamp beads is: X-axis spacing / Y-axis spacing = X-axis dimension of the light-emitting area of the LED lamp bead / Y-axis dimension of the light-emitting area of the LED lamp bead.

[0010] As a further improvement of an embodiment of the present invention, the X-axis spacing between two adjacent LED lamp beads is 2.44 pitch, and the Y-axis spacing between two adjacent LED lamp beads is 2.16 pitch.

[0011] As a further improvement of an embodiment of the present invention, an encapsulation glue layer covering the LED lamp beads and the circuit layer is provided on the light board.

[0012] As a further improvement of an embodiment of the present invention, inkjet printing treatment is performed at the gaps between the LED lamp beads on the front surface of the light board to form a black ink layer, and the black ink layer is covered by the encapsulation glue layer. The contrast of the LED lamp bead display is improved through the black ink layer, and the light-emitting effect is improved.

[0013] As a further improvement of an embodiment of the present invention, the upper surface of the black ink layer is lower than the upper surface of the LED lamp beads.

[0014] As a further improvement of an embodiment of the present invention, a protective film is provided on the LED lamp beads. The protective film is covered by the encapsulation glue layer, and the edge of the protective film is distributed at intervals with the edge of the black ink layer.

[0015] As a further improvement of an embodiment of the present invention, the black ink layer is a black ink layer composed of UV-curable ink or thermosetting ink and has a matte effect.

[0016] As a further improvement of an embodiment of the present invention, an IC component is attached to the back surface of the light board. The IC component is mainly attached to the back surface of the light board by SMD (Surface Mounted Devices) technology to drive the LED lamp beads to work.

[0017] As a further improvement of an embodiment of the present invention, the refractive index of the encapsulation glue layer is greater than the refractive index of the protective film.

[0018] A backlight module includes a backplane. An LED light board is provided at one edge of the backplane, and the LED light board adopts the above-mentioned Mini LED light board structure.

[0019] Adopting the above technical solution, the following beneficial effects are achieved: By arranging the LED lamp beads according to the ratio of the X-axis spacing to the Y-axis spacing of the LED lamp beads, the problem of uneven brightness and darkness of the display screen caused by inconsistent light source energy per unit area in the prior art can be effectively solved, and the overall light output effect can be improved. Brief Description of the Drawings

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can be obtained by extending according to the provided drawings.

[0021] The structures, ratios, sizes, etc. illustrated in this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0022] Figure 1 It is a top view schematic diagram of multiple LED lamp beads provided by the present invention.

[0023] Figure 2 It is a structural schematic diagram provided by the present invention.

[0024] In the figure:

[0025] 1 - Lamp board;

[0026] 2 - LED lamp bead;

[0027] 3 - IC component;

[0028] 4 - Encapsulation glue layer;

[0029] 5 - Black ink layer;

[0030] 6 - Protective film;

[0031] 7 - Circuit layer. Detailed Embodiments

[0032] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The following will refer to the drawings and combine with the embodiments to detail the present invention.

[0033] It should be noted that unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0034] In this utility model, unless otherwise stated, the orientation terms such as "upper, lower, top, bottom" are usually in reference to the direction shown in the drawings, or in reference to the vertical, perpendicular or gravitational direction of the component itself; similarly, for the convenience of understanding and description, "inner, outer" refer to the inner and outer of the contour of each component itself, but the above orientation terms are not used to limit this utility model. Embodiment

[0035] See Figure 1 - Figure 2 As shown, a Mini LED light board structure includes a light board 1 and a plurality of LED lamp beads 2. Among them, the light board 1 serves as the basis for carrying the LED lamp beads 2 and is provided with a circuit layer connected to the LED lamp beads 2. This circuit layer ensures the stable transmission of electricity and provides a solid guarantee for the normal light emission of the LED lamp beads 2.

[0036] Numerous LED lamp beads are arranged side by side and spaced on the light board 1, presenting a regular matrix array distribution. This distribution method not only gives people a sense of neatness and order visually, but more importantly, it can achieve a uniform lighting effect.

[0037] In order to solve the problem of uneven brightness and darkness of the display screen caused by inconsistent light source energy per unit area in the prior art, in this embodiment, the ratio of the X-axis spacing D1 to the Y-axis spacing D2 of two adjacent LED lamp beads is limited. Specifically, the ratio of the X-axis spacing D1 to the Y-axis spacing D2 is: X-axis spacing / Y-axis spacing = X-axis dimension of the light-emitting area of the LED lamp bead / Y-axis dimension of the light-emitting area of the LED lamp bead. This unique design makes the layout of the LED lamp beads more scientific and reasonable, can give full play to the light-emitting efficiency of each lamp bead, and avoids uneven illumination and waste (the relevant specification dimensions of the light-emitting area of the LED lamp bead are recorded in the product manual of the LED lamp bead).

[0038] Specifically, in this embodiment, the X-axis spacing D1 between two adjacent LED lamp beads is 2.44 pitch, and the Y-axis spacing D2 between two adjacent LED lamp beads is 2.16 pitch.

[0039] In this embodiment, an IC component 3 is attached to the back surface of the light board 1. The above IC component 3 is connected to the circuit layer 7. Specifically, the above IC component is mainly attached to the back surface of the light board by SMD (Surface Mounted Devices) technology to drive the LED lamp beads to work.

[0040] In the above Mini LED lamp board structure, a packaging glue layer 4 is further provided on the lamp board 1. This packaging glue layer 4 wraps the LED lamp beads and the circuit layer 7, providing effective protection for the LED lamp beads 2 and the circuit layer 7. On the one hand, it can prevent external impurities such as dust and moisture from damaging the LED lamp beads 2 and the circuit layer 7, ensuring the stability and reliability of the lamp board. On the other hand, the packaging glue layer 4 can also play a role in fixing the LED lamp beads 2, making their positions on the lamp board 1 more stable. Even when subjected to a certain external force impact or vibration, they can still maintain a good working state.

[0041] In this embodiment, inkjet printing treatment is performed at the gaps between the LED lamp beads on the front surface of the lamp board 1 to form a black ink layer 5, and the above black ink layer 5 is covered by the packaging glue layer 4.

[0042] The existence of the black ink layer 5 has multiple key functions. First of all, it can significantly improve the contrast of the LED lamp beads 2. Without the black ink layer, the gaps between the LED lamp beads may cause light scattering, affecting the overall display effect. The black ink layer is like a black barrier, effectively absorbing the surrounding stray light, making the light emitted by the LED lamp beads more concentrated, thus greatly enhancing the contrast. Secondly, it can also improve the light output effect. By controlling the stray light, the black ink layer makes the propagation of light more directional, making the light output more uniform and soft, bringing a more comfortable visual experience to users.

[0043] Specifically, the upper surface of the black ink layer 5 is lower than the upper surface of the LED lamp beads. This design ensures on the one hand that the LED lamp beads can fully play their lighting role without being blocked by the black ink layer; on the other hand, it allows the black ink layer to maximize its function of improving the contrast and light output effect without affecting the normal lighting of the LED lamp beads.

[0044] Furthermore, the black ink layer 5 on the lamp board is composed of UV-curable ink or thermosetting ink. These two types of inks each have their unique advantages. UV-curable ink can quickly cure under the irradiation of ultraviolet light to form a firm and uniform black ink layer. Thermosetting ink undergoes a curing reaction under heating conditions and can also provide a stable and reliable black coating for the lamp board.

[0045] This black ink layer 5 has a matte effect. The matte surface does not produce strong reflections, effectively reducing the generation of glare and making viewing more comfortable. At the same time, the matte effect also makes the black ink layer 5 form a more harmonious contrast with the lighting effect of the LED lamp beads 2, further improving the contrast and light output effect of the display.

[0046] In the Mini LED light board structure of this embodiment, a protective film 6 is also provided on the LED lamp bead 2. This protective film 6 is also covered by the encapsulation glue layer 4. The presence of the protective film 6 provides additional protection for the LED lamp bead 2, and it can effectively prevent the LED lamp bead 2 from being physically damaged or chemically eroded by the outside world during use.

[0047] It should be noted that the edge of the protective film 6 and the edge of the black ink layer 5 are distributed with a gap. This design not only ensures the independence of their respective functions but also avoids mutual interference. The black ink layer 5 can still play its role in improving the contrast and light-emitting effect, while the protective film 6 can focus on protecting the LED lamp bead 2.

[0048] Furthermore, the refractive index of the encapsulation glue layer 4 is greater than that of the protective film 6. When light emits from the LED lamp bead 2 and passes through the protective film 6 and the encapsulation glue layer 4, due to the difference in refractive index, the light will undergo refraction and reflection. Reasonably controlling this refraction and reflection can optimize the light propagation path, improve the light-emitting efficiency and uniformity. The higher refractive index of the encapsulation glue layer 4 can make more light emit from the light board, enhancing the lighting effect. While the lower refractive index of the protective film 6 can reduce unnecessary reflections, avoiding light loss and interference. Through this carefully designed refractive index combination, the Mini LED light board can achieve more excellent optical performance, bringing a brighter and more uniform lighting experience to users.

[0049] This embodiment also provides a backlight module. Similar to a conventional backlight module, it includes a backplane, and an LED light board is arranged on one edge of the backplane. The difference is that the LED light board adopts the Mini LED light board structure of the above structure to improve the light-emitting effect. Of course, in addition to the above backlight module, if a liquid crystal display / touch liquid crystal display adopts the Mini LED light board structure of this application, it can also improve the light-emitting effect.

[0050] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0051] It should be noted that the terms used here are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used here, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "include" and / or "comprise" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0052] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of this application are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here.

[0053] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A Mini LED light board structure, comprising a light board and a plurality of LED lamp beads, wherein the light board is provided with a circuit layer connected to the LED lamp beads; the LED lamp beads are arranged side by side and spaced apart on the light board to form a matrix array; characterized in that: The ratio of the X-axis spacing to the Y-axis spacing of two adjacent LED lamp beads is: X-axis spacing / Y-axis spacing=X-axis size of the light-emitting area of ​​the LED lamp bead / Y-axis size of the light-emitting area of ​​the LED lamp bead.

2. The Mini LED light board structure according to claim 1, characterized in that: The lamp board is provided with a packaging glue layer covering the LED lamp beads and the circuit layer.

3. The Mini LED light board structure according to claim 2, characterized in that: Ink is sprayed on the gaps between the LED lamp beads on the front side of the lamp board to form a black ink layer, and the black ink layer is covered by the packaging glue layer.

4. The Mini LED light board structure according to claim 3, characterized in that: The upper surface of the black ink layer is lower than the upper surface of the LED lamp bead.

5. The Mini LED light board structure according to claim 4, characterized in that: A protective film is arranged on the LED lamp bead, the protective film is covered by the packaging glue layer, and a gap is distributed between the edge of the protective film and the edge of the black ink layer.

6. The Mini LED light board structure according to claim 5, characterized in that: The black ink layer is a black ink layer composed of UV curable ink or thermosetting ink.

7. The Mini LED light board structure according to claim 1, characterized in that: IC components are attached to the back of the lamp board.

8. A backlight module, comprising a back plate, an edge of which is provided with an LED light board, characterized in that: The LED light board adopts the Mini LED light board structure described in any one of claims 1 to 7.

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