Air conditioning device
By using a separate base and heat dissipation fin structure in the semiconductor dehumidifier and using a copper tube to thermally connect, the problem of difficult to optimize the fixing of the heat dissipation fin structure in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421314455.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-06-07
AI Technical Summary
The existing semiconductor dehumidifiers have fixed heat dissipation fin structures, making it difficult to optimize the layout, which limits the improvement of heat dissipation efficiency.
The separated base and heat dissipation fin structure are heat-conductingly connected through copper tubes, and the heat at the hot end of the semiconductor refrigeration sheet is transferred to the heat dissipation fins through copper tubes, shortening the heat dissipation path and improving heat dissipation efficiency.
It effectively shortens the heat dissipation path, reduces the time for heat transfer, and allows heat to be transferred from the heat source to the environmental media faster, thereby improving the overall heat dissipation efficiency.
Smart Images
Figure CN223036531U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of household appliances, and particularly relates to an air conditioning device. Background Art
[0002] The dehumidification effect of a semiconductor dehumidifier depends to a large extent on whether the temperature difference between the cold end where the cold quantity is generated and the environment is large enough. That is, generally, the better the refrigeration effect, the better the dehumidification effect. And the refrigeration effect at the cold end is affected by the heat generation end (hot end). That is, improving the heat dissipation effect at the hot end can improve the refrigeration effect at the cold end and thus improve the dehumidification effect. The semiconductor heat dissipation fins in the prior art usually use aluminum profile fins closely attached to the hot end of the semiconductor refrigeration sheet for heat dissipation. However, due to the limited structural space of the dehumidifier, the direction of its air duct is relatively fixed, and the heat dissipation fins are also fixedly connected to the semiconductor refrigeration sheet. Various limitations make it difficult to layout each component in the product more optimally and flexibly, restricting the optimizable space and making it difficult to improve the heat dissipation efficiency by optimizing the layout. Summary of the Utility Model
[0003] The purpose of the utility model is to provide an air conditioning device, which adopts a more reasonable structure of the heat dissipation component, greatly improving the heat dissipation efficiency of the semiconductor refrigeration sheet.
[0004] Based on this, the utility model provides an air conditioning device, including a housing. The housing has an inner cavity, and the housing is also provided with an air inlet part and an air outlet part communicating with the inner cavity. A semiconductor refrigeration sheet and a heat dissipation component arranged on the hot end of the semiconductor refrigeration sheet are provided between the air inlet part and the air outlet part;
[0005] The heat dissipation component includes a base, a copper tube and heat dissipation fins. The base is installed on the hot end of the semiconductor refrigeration sheet. One end of the copper tube is embedded in the base and abuts against the hot end of the semiconductor refrigeration sheet. The other end of the copper tube is bent and penetrates through the heat dissipation fins, so that the air inlet of the heat dissipation fins is opposite to and spaced from the end face of the base away from the hot end of the semiconductor refrigeration sheet;
[0006] A fan component for driving air to flow from the air inlet part to the air outlet part is also provided between the air inlet part and the air outlet part;
[0007] It further includes a condensing member. The air inlet part and the air outlet part are oppositely arranged. The condensing member, the semiconductor refrigeration sheet, the base, the heat dissipation fins and the fan component are arranged in a straight line between the air inlet part and the air outlet part.
[0008] An air conditioning device as described above, wherein the copper tube includes a heat conduction section and a heat dissipation section. The heat conduction section is fixed to the base and forms a heat conduction surface for fitting the hot end. The heat dissipation section extends away from the heat conduction section, and a plurality of heat dissipation fins are arranged at intervals along the length direction of the heat dissipation section. The inside of the copper tube is in a vacuum state and contains a refrigerant, and the refrigerant can absorb heat and change from a liquid state to a gaseous state or release heat and change from a gaseous state to a liquid state.
[0009] An air conditioning device as described above, wherein the refrigerant is water.
[0010] An air conditioning device as described above, wherein the heat dissipation fins are connected to the fan assembly.
[0011] An air conditioning device as described above, wherein the condensing member is provided on the cold end of the semiconductor refrigeration chip.
[0012] An air conditioning device as described above, further comprising a water tank, which is arranged in the housing and located below the inner cavity.
[0013] Implementing the embodiments of the present utility model has the following beneficial effects:
[0014] The present utility model provides an air conditioning device, the heat dissipation component of which adopts a separated base and heat dissipation fin structure. The base and the heat dissipation fins are thermally connected through a copper tube, and the heat at the hot end of the semiconductor refrigeration chip is dissipated to the heat dissipation fins through the copper tube, which can effectively shorten the heat dissipation path, reduce the time of heat transfer, and enable the heat to be transferred from the heat source to the environmental medium faster, thereby improving the overall heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0016] Figure 1 A schematic diagram of an air conditioning device provided by an embodiment of the present utility model;
[0017] Figure 2 For Figure 1 the internal view;
[0018] Figure 3 A schematic diagram of the air flow flowing through the air conditioning device of the present utility model;
[0019] Figure 4 An exploded view of an air conditioning device provided by an embodiment of the present utility model. Detailed implementation mode
[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0021] As Figures 1 to 4 shown, an air conditioning device provided by an embodiment of the present invention includes a housing 1. The housing 1 has an inner cavity 101. The housing 1 is further provided with an air inlet part 102 and an air outlet part 103 that communicate with the inner cavity 101. A semiconductor refrigeration sheet 21 and a heat dissipation assembly 23 provided on the hot end of the semiconductor refrigeration sheet 21 are arranged between the air inlet part 102 and the air outlet part 103. The heat dissipation assembly 23 includes a base 231, a copper pipe 232 and heat dissipation fins 233. The base 231 is installed on the hot end of the semiconductor refrigeration sheet 21. One end of the copper pipe 232 is embedded in the base 231 and abuts against the hot end of the semiconductor refrigeration sheet 21. The other end of the copper pipe 232 is bent and penetrates through the heat dissipation fins 233, so that the air inlet of the heat dissipation fins 233 is opposite to and spaced from the end face of the base 231 away from the hot end of the semiconductor refrigeration sheet 21. Conducting the heat at the hot end of the semiconductor refrigeration sheet to the heat dissipation fins through the copper pipe can effectively shorten the heat dissipation path, reduce the time of heat transfer, and enable the heat to be transferred from the heat source to the environmental medium faster, thereby improving the overall heat dissipation efficiency.
[0022] In this solution, its heat dissipation assembly adopts a separated structure of a base and heat dissipation fins. The base and the heat dissipation fins are thermally connected through a copper pipe. Generally, the heat dissipation fins are relatively large in volume, so that the heat dissipation fins do not need to be restricted on the hot end of the semiconductor refrigeration sheet. The installation methods and installation positions that can be adopted are more flexible, and it is also suitable for appropriately adjusting the installation position in the limited internal space of the dehumidifier.
[0023] In addition, the heat dissipation assembly adopts a combination of a base, a copper pipe and heat dissipation fins. The heat dissipation fins 233 and the hot end maintain a ventilation interval, so that during the process of air flow out, the heat of the heat dissipation fins 233 can be better taken away, thereby achieving a better heat dissipation effect on the semiconductor refrigeration sheet 21. And the greater the temperature difference at both ends of the semiconductor refrigeration sheet 21, the better its refrigeration effect, thereby improving the dehumidification effect of the product.
[0024] In the embodiment of the present utility model, the copper tube 232 includes a heat conduction section 2321 and a heat dissipation section 2322. The heat conduction section 2321 is fixed to the base 231 and forms a heat conduction surface 3211 for fitting the hot end. The heat dissipation section 2322 extends away from the heat conduction section 2321, and multiple heat dissipation fins 233 are arranged at intervals along the length direction of the heat dissipation section 2322. The inside of the copper tube 232 is in a vacuum state and contains a refrigerant. The refrigerant can absorb heat and change from a liquid state to a gaseous state or release heat and change from a gaseous state to a liquid state. The inside of the copper tube is in a vacuum state and contains a refrigerant. A capillary structure is provided inside the copper tube 232. More specifically, the capillary structure covers the inner wall of the copper tube 232. The refrigerant can absorb heat and change from a liquid state to a gaseous state or release heat and change from a gaseous state to a liquid state. Among them, the refrigerant is preferably water. Of course, ethanol or naphthalene can also be selected according to the situation.
[0025] During operation, the hot end of the semiconductor refrigeration chip 21 contacts the heat conduction surface 3211, and transfers heat to the heat conduction section 2321 of the copper tube 232 in the form of heat transfer. Since the inside of the copper tube 232 is in a vacuum state and the boiling point of the refrigerant is relatively low, the refrigerant in the heat conduction section 2321 can change into a gaseous state more quickly after absorbing heat. After the gaseous refrigerant reaches the heat dissipation section 2322, its temperature drops and it returns to a liquid state under the heat dissipation effect of the heat dissipation fins 233. The liquid refrigerant continues to return to the heat conduction section 2321 to absorb heat under the capillary action of the capillary structure, and so on in a cycle. Among them, multiple heat dissipation fins achieve a good heat dissipation effect through their large surface area. With the help of the vacuum state and capillary action, the heat of the heat conduction section 2321 can be transferred to the heat dissipation section 322 more quickly, and the heat of the hot end can be dissipated more quickly, improving the condensation performance and thus enhancing the dehumidification effect.
[0026] As one of the specific implementation manners rather than a limitation, the capillary structure is a porous nanofiber arranged along the length direction of the copper tube 232. The pore structure of the porous nanofiber can enhance the capillary action, thereby enhancing the circulation effect of the refrigerant inside the copper tube 232.
[0027] As one of the specific implementation manners rather than a limitation, the capillary structure is a porous nanofiber arranged along the length direction of the copper tube 232. The pore structure of the porous nanofiber can enhance the capillary action, thereby enhancing the circulation effect of the refrigerant inside the copper tube 232.
[0028] As one of the specific implementation manners rather than a limitation, the capillary structure can also be a metal powder sintered structure or a groove structure.
[0029] The metal powder sintered structure is formed by washing the copper tube with dilute sulfuric acid, injecting copper powder particles with a super high purity and a diameter of about 75 - 150 μm into the inside of the copper tube, and then putting it into a furnace for sintering. After the sintered copper tube is clamped and sealed with a special tool, a metal powder sintered structure that can play a capillary role is formed. The groove structure is formed by an integrated molding method with the copper tube.
[0030] For the convenience of processing, the heat-conducting surface 3211 is a flat surface. Further, the base 231 is provided with a mounting portion and a groove. The heat-conducting section 2321 of the copper tube 232 is embedded in the groove, and the heat-conducting surface 3211 of the heat-conducting section 2321 is flush with the notch surface of the groove, so that both the heat-conducting surface 3211 and the notch surface are in close contact with the hot end. The base 231 mainly plays a role in installation and fixation, and its material is aluminum, and it can also play a role in assisting heat dissipation.
[0031] In the embodiment of the present utility model, several of the heat dissipation fins 233 are all aluminum fins. The function of the heat dissipation fins 233 is to increase the contact area with the air flow, so that the heat is carried out by the air flow to achieve heat dissipation, and the cost is relatively low. Of course, several of the heat dissipation fins 233 can be aluminum fins and copper fins. That is, among the multiple fins, there are both aluminum fins and some are copper fins, which is lighter in weight while ensuring the heat dissipation efficiency. A scheme of all copper fins can also be adopted, which can make the heat dissipation fins themselves thinner and lighter, and have better thermal conductivity.
[0032] In the embodiment of the present utility model, a fan assembly 3 for driving the air flow from the air inlet portion 102 to the air outlet portion 103 is further provided between the air inlet portion 102 and the air outlet portion 103. Through the driving of the internal fan assembly 3, an air flow is formed that flows in from the air inlet portion 102, passes through the cold end of the semiconductor refrigeration sheet 21 and the heat dissipation assembly, and then blows out from the air outlet portion 103. In order to have a better condensation effect when the air flow passes through the cold end of the semiconductor refrigeration sheet 21, this solution further includes a condensing member 22, and the condensing member 22 is disposed on the cold end of the semiconductor refrigeration sheet 21. The condensing member 22 can effectively increase the contact area of the inflowing air flow, so as to achieve the effect of cooling and dehumidifying.
[0033] In this solution, the heat dissipation fins 233 are connected to the fan assembly 3. This is equivalent to setting the heat dissipation fins 233 at the air inlet of the fan assembly 3, so that the air flow necessarily passes through the heat dissipation fins 233, achieving a better heat dissipation effect.
[0034] Specifically, in the embodiment of the present utility model, a water tank 12 is further provided in the housing 1, and a partition 13 is provided above the water tank 12 in the housing. The partition 13 and the housing 1 form the inner cavity 101. In addition, a connecting frame 9 is provided on the partition 13 in the inner cavity 101. The semiconductor refrigeration sheet 21 of the dehumidification component 2 is installed on the connecting frame 9, the condensation member 22 is installed on the cold end of the semiconductor refrigeration sheet 21 and faces the air inlet part 102, and the heat dissipation component 23 is installed on the hot end of the semiconductor refrigeration sheet 21 and faces the fan component 3. Its structure is simple and convenient for assembly, and a conduction port 91 is opened above the connecting frame 9. In this way, the air flow entering from the air inlet part 102 first goes upward, so that it fully passes through the condensation member 22 for dehumidification, and then flows out through the conduction port 91 above. Moreover, in this solution, the bottom of the connecting frame 9 has a water receiving tray 92 located below the condensation member 22. When the semiconductor refrigeration sheet 21 works, the condensation member 22 liquefies the moisture in the air and drips it onto the water receiving tray 92 below for collection. Of course, for the convenience of use, a water collecting pipe communicating with the water tank below is also opened on the water receiving tray 92 in this solution.
[0035] In the embodiment of the present utility model, the air inlet part 102 and the air outlet part 103 are oppositely arranged, and the condensation member 22, the semiconductor refrigeration sheet 21, the heat dissipation component 23, the base 231, the heat dissipation fins 233 and the fan component 3 are arranged in a straight line between the air inlet part 102 and the air outlet part 103. Its reasonable layout makes the structure more compact, fully utilizes the internal space, and moreover, the distance between the air inlet part 102 and the air outlet part 103 is shortened, and the internal air duct can be seen, so that the air duct distance is reduced, thereby improving the efficiency.
[0036] The present utility model provides an air conditioning device, the heat dissipation component of which adopts a separated base and heat dissipation fin structure. The base and the heat dissipation fins are thermally connected by a copper pipe. The heat at the hot end of the semiconductor refrigeration sheet is conducted to the heat dissipation fins through the copper pipe for heat dissipation, which can effectively shorten the heat dissipation path, reduce the time of heat transfer, and enable the heat to be transferred from the heat source to the environmental medium faster, thereby improving the overall heat dissipation efficiency.
[0037] It should be understood that in the present utility model, terms such as "first" and "second" are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of the present utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information. In addition, the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.
[0038] The above is the preferred embodiment of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications are also regarded as the protection scope of the present utility model.
Claims
1. An air conditioning device, comprising a housing (1), the housing (1) having an inner cavity (101), the housing (1) further being provided with an air inlet (102) and an air outlet (103) in communication with the inner cavity (101), a semiconductor cooling sheet (21) and a heat dissipation component (23) provided on a hot end of the semiconductor cooling sheet (21) being provided between the air inlet (102) and the air outlet (103), wherein: The heat dissipation component (23) comprises a base (231), a copper tube (232) and a heat dissipation fin (233); the base (231) is mounted on the hot end of the semiconductor cooling plate (21); one end of the copper tube (232) is embedded in the base (231) and abuts against the hot end of the semiconductor cooling plate (21); the other end of the copper tube (232) is bent and passes through the heat dissipation fin (233), so that the air inlet of the heat dissipation fin (233) is opposite to the end face of the base (231) away from the hot end of the semiconductor cooling plate (21) and is arranged at a distance; A fan assembly (3) for driving wind from the air inlet (102) to the air outlet (103) is also provided between the air inlet (102) and the air outlet (103); It also includes a condensing element (22), the air inlet (102) and the air outlet (103) are arranged relative to each other, and the condensing element (22), the semiconductor cooling sheet (21), the base (231), the heat dissipation fins (233) and the fan assembly (3) are arranged in a straight line between the air inlet (102) and the air outlet (103).
2. An air conditioning device according to claim 1, characterized in that: The copper tube (232) comprises a heat conducting section (2321) and a heat dissipation section (2322); the heat conducting section (2321) is fixed to the base (231) and forms a heat conducting surface (3211) for fitting the hot end; the heat dissipation section (2322) extends in a direction away from the heat conducting section (2321); a plurality of heat dissipation fins (233) are arranged at intervals along the length direction of the heat dissipation section (2322); the interior of the copper tube (232) is in a vacuum state and contains a refrigerant; the refrigerant can change from a liquid state to a gas state after absorbing heat or change from a gas state to a liquid state after dissipating heat.
3. An air conditioning device according to claim 2, characterized in that: The refrigerant is water.
4. An air conditioning device according to claim 3, characterized in that: The heat dissipation fins (233) are connected to the fan assembly (3).
5. An air conditioning device according to any one of claims 1 to 4, characterized in that: The condensing element (22) is arranged on the cold end of the semiconductor refrigeration sheet (21).
6. An air conditioning device according to any one of claims 1 to 4, characterized in that: It also comprises a water tank, which is arranged in the shell (1) and located below the inner cavity (101).