Small LED panel module and display screen

Abstract

The utility model relates to the technical field of semiconductor LEDs, in particular to a small LED panel module and a display screen, which comprise a substrate, a Mini / Micro LED chip array is fixedly connected to one side of the top of the substrate, a chip protection cover is fixedly connected to one side of the top of the substrate, a plurality of groups of connecting holes are formed in one side of the top of the chip protection cover, and the Mini / Micro LED chip array is fixedly connected to the other side of the top of the substrate. The chip protection cover is provided with a plurality of connecting holes, the inner walls of the connecting holes sleeve the surface of the Mini / Micro LED chip array, one side of the top of the chip protection cover is in lap joint with an optical film, one side of the bottom of the substrate is fixedly connected with a plurality of groups of driving chips, and the chip protection cover is made of a material with high light transmittance, low hygroscopicity and good thermal stability; according to the Mini / Micro LED display screen, efficient and accurate integration of the Mini / Micro LED chips is achieved through the optimized die bonding and packaging technology, compared with a traditional method, production efficiency and integration density are remarkably improved, the simplified manufacturing technology and low-cost material selection are adopted, the manufacturing cost of the Mini / Micro LED display screen is reduced, meanwhile, the production yield is improved, and the overall cost is further reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor LEDs, and particularly relates to a small LED panelized module and a display screen. Background Technique

[0002] With the continuous development of display technology, Mini / Micro LED technology is gradually becoming a shining star in the display field with its unique advantages. This technology uses extremely small-sized LED chips as light-emitting units, which not only achieves unprecedented high brightness, high contrast, and high resolution, but also gives the display screen a longer service life, bringing a more vivid and delicate visual feast to users. These characteristics of Mini / Micro LED technology have shown great application potential in fields such as high-end display devices, virtual reality, augmented reality, and future wearable devices.

[0003] However, despite the many advantages of Mini / Micro LED technology, it still faces many challenges in practical applications. First of all, due to the extremely small size of LED chips, how to efficiently and accurately integrate these chips onto the display panel has become an urgent problem to be solved. Traditional packaging and integration methods often have problems such as low efficiency and high cost, and it is difficult to meet the needs of large-scale production.

[0004] Secondly, the manufacturing process of Mini / Micro LED display screens is complex and involves multiple key steps, such as chip transfer, mass bonding, and driving circuit design. These steps not only require high precision and high stability, but also need to consider issues such as cost control and yield improvement. Therefore, how to optimize the manufacturing process and improve production efficiency and product quality has become the key to the development of Mini / Micro LED technology. Content of the Utility Model

[0005] The purpose of the utility model is to provide a small LED panelized module and a display screen to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] A small LED panelized module, comprising:

[0008] A substrate;

[0009] One side of the top of the substrate is fixedly connected with a Mini / Micro LED chip array. One side of the top of the substrate is fixedly connected with a chip protection cover. A plurality of connecting holes are formed in one side of the top of the chip protection cover, and the inner wall of the connecting hole is sleeved on the surface of the Mini / Micro LED chip array. An optical film is lapped on one side of the top of the chip protection cover. A plurality of driving chips are fixedly connected to one side of the bottom of the substrate.

[0010] Preferably, the material of the substrate is one of a transparent material and a translucent material.

[0011] Preferably, the chip protection cover is made of a material with high light transmittance, low moisture absorption and good thermal stability.

[0012] Preferably, the shape of the connecting hole is an inverted bowl shape.

[0013] A display screen includes a plurality of Mini / Micro LED panelized modules, and the plurality of Mini / Micro LED panelized modules are spliced with each other.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] (1) Through optimized die bonding and encapsulation processes, efficient and precise integration of Mini / Micro LED chips is achieved. Compared with traditional methods, the production efficiency and integration density are significantly improved.

[0016] (2) By adopting a simplified manufacturing process and low-cost material selection, the manufacturing cost of the Mini / Micro LED display screen is reduced. At the same time, the production yield is improved, further reducing the overall cost.

[0017] (3) Due to the high brightness, high contrast and high resolution characteristics of the Mini / Micro LED chips, the display screen of the present utility model has a more vivid and delicate display effect. At the same time, the design of the protection cover and the optical film further improves the display effect and optical performance.

[0018] (4) The design of the protection cover and the encapsulation structure effectively protects the Mini / Micro LED chips from the influence of the external environment, improving the durability and reliability of the display screen. At the same time, the curing treatment ensures the stability and long service life of the encapsulation material. Description of the Drawings

[0019] Figure 1 It is a split structure three-dimensional view of the present utility model;

[0020] Figure 2 It is a three-dimensional view of the present utility model;

[0021] Figure 3 Isometric view of the driving chip of the present utility model;

[0022] Figure 4 Process flow chart of the present utility model;

[0023] In the figure: 1, substrate; 2, Mini / Micro LED chip array; 3, chip protective cover; 4, connection hole; 5, optical film; 6, driving chip. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment 1:

[0026] Please refer to Figures 1 to 3 As shown, a small LED panelized module includes:

[0027] Substrate 1;

[0028] On one side of the top of the substrate 1, a Mini / Micro LED chip array 2 is fixedly connected. Tiny LED chips are precisely placed at designated positions on the substrate 1 through an accurate die bonding process and fixed using an adhesive. To ensure the accurate positioning and high stability of the chips, the die bonding process requires high-precision equipment and strict operating procedures. On one side of the top of the substrate 1, a chip protection cover 3 is fixedly connected. The chip protection cover 3 not only protects the LED chips from external physical damage and chemical erosion but also directly affects the light propagation efficiency. Therefore, the chip protection cover 3 should be made of materials with high light transmittance, low hygroscopicity, and good thermal stability. High light transmittance materials such as special optical glass or high-transparency resin can minimize light loss during propagation; low hygroscopicity materials can effectively prevent water vapor intrusion and protect the LED chips from moisture; and good thermal stability can ensure that the chip protection cover 3 does not deform or crack due to temperature changes during long-term use. The chip protection cover 3 is made of materials with high light transmittance (≥95%), low hygroscopicity (≤0.1%), and good thermal stability (able to withstand temperature changes from -40°C to +120°C), such as special optical glass or high-performance resin. On one side of the top of the chip protection cover 3, multiple connecting holes 4 are provided, and the inner wall of the connecting hole 4 is sleeved on the surface of the Mini / Micro LED chip array 2. The design of the connecting hole 4 not only facilitates subsequent connection and assembly operations but also improves the heat dissipation performance of the module to a certain extent. To further optimize the heat dissipation effect, the connecting hole 4 is designed in an inverted bowl shape with a smooth edge and no sharp corners to reduce light scattering and improve light efficiency. At the same time, the edge of the chip protection cover 3 is precisely processed to ensure close fit with the substrate 1, and the shape of the connecting hole 4 helps to guide hot air upward and discharge it outside the module. On one side of the top of the chip protection cover 3, an optical film 5 is overlapped. The main function of the optical film 5 is to adjust the light distribution and angle to improve the display effect and viewing comfort. On one side of the bottom of the substrate 1, multiple driving chips 6 are fixedly connected. The driving chips 6 are responsible for providing stable current and voltage to the LED chips to ensure that the LED chips can emit light normally and achieve the expected display effect. The material of the substrate 1 is one of transparent materials and semi-transparent materials. The chip protection cover 3 is made of materials with high light transmittance, low hygroscopicity, and good thermal stability. The shape of the connecting hole 4 is in an inverted bowl shape.

[0029] The substrate 1 is made of a PCB board, and Mini or Micro LED chips or devices are fixed on the PCB board using die bonding or surface mounting technology.

[0030] Design the chip protection cover 3 according to the product pitch and assemble it automatically through Mark points for alignment;

[0031] The design optimizes the heat dissipation structure. The chip pad areas of multiple bowl cups are connected together, increasing the heat dissipation area and improving the heat dissipation ability of the light source;

[0032] The LED bowl cup provides a stable encapsulation environment for the LED chip, which can protect the chip from the influence of the external environment, such as dust, moisture, etc., and protect the chip or device from being crushed during the encapsulation process;

[0033] After the light is refracted inside the protective cover, a more uniform and soft light spot can be formed, avoiding the dazzling and glare problems caused by the direct light of the light source. At the same time, the refracted light can better cover the target area, improving the lighting effect and comfort.

[0034] Use the GOB encapsulation process for secondary encapsulation to form a panelized display module.

[0035] Use a CNC or dicing machine to cut the process edge of the display panel.

[0036] Assemble to form an LED display screen.

[0037] A display screen includes a number of Mini / Micro LED panelized modules, and the number of Mini / Micro LED panelized modules are spliced with each other.

[0038] Splice multiple Mini / Micro LED panelized modules in a preset arrangement to form a complete display screen. During the splicing process, it is necessary to ensure the alignment accuracy and connection stability between the modules;

[0039] Design and install a drive circuit to ensure that each Mini / Micro LED chip can obtain a stable current and voltage supply;

[0040] Conduct system debugging on the assembled display screen, including adjusting parameters such as brightness, contrast, and color saturation. At the same time, check the display effect and stability of the display screen to ensure that there are no problems such as light leakage and dead pixels.

[0041] Please refer to Figure 4 As shown, a process for a small LED panelized module and a display screen includes the following steps:

[0042] S1. Die bonding: Precisely place the Mini / Micro LED chip at a specified position on the substrate and fix it using an adhesive;

[0043] S2. AOI inspection: The equipment scans the substrate after die bonding to check for defects, misalignment, and impurity problems to ensure that each chip is correctly placed on the substrate;

[0044] S3. Install the protective cover: To protect the Mini / Micro LED chip from the external environment, a transparent protective cover will be installed above the Mini / Micro LED chip;

[0045] S4. Upper release film: The release film is placed on the substrate with the protective cover installed to protect its surface from contamination and scratches;

[0046] S5. Hemming: Fold the release film border to a specific position to surround and fix the internal Mini / Micro LED chips and the protective cover;

[0047] S6. Glue injection: Inject liquid resin into the encapsulation structure to fill the voids and fix the internal components;

[0048] S7. Upper module: After the internal encapsulation is completed, install the encapsulated chip module into the display screen;

[0049] S8. Vacuum lamination: In LED encapsulation, tightly bond the encapsulation layer and the substrate to improve the sealing and stability of the overall structure;

[0050] S9. Unloading: Remove the processed display screen from the production line and conduct preliminary inspection and classification;

[0051] S10. Curing: The resin undergoes a chemical reaction under specific conditions, changing from a liquid state to a solid state, ensuring the performance and stability of the encapsulation material.

[0052] In step S1, introduce a machine vision assistance system to monitor the position deviation and angular error during the die bonding process in real time, ensuring the accuracy of chip placement;

[0053] In step S2, adopt a high-resolution AOI detection device to comprehensively scan the substrate after die bonding, automatically identify and mark problems such as defects, misalignment, and impurities;

[0054] In step S3, use an automated robotic arm to install the protective cover, reducing human operation errors and improving the installation accuracy and efficiency;

[0055] In steps S4 - S5, introduce automated film feeding and hemming equipment to ensure that the release film is flat without wrinkles and the hemming position is accurate without deviation;

[0056] In steps S6 - S10, select a low-viscosity, high-fluidity encapsulation resin to ensure that the resin can fully fill the voids and discharge air bubbles. During the curing process, adopt precise temperature and time control to ensure that the resin is fully cured, achieving the best mechanical and optical properties.

[0057] All the standard parts used in the present utility model can be purchased from the market. The special-shaped parts can be customized according to the descriptions in the specification and the attached drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, welding, etc. that are mature in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art. In addition, the circuit connection adopts the conventional connection method in the prior art, which will not be elaborated here. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0058] In the description of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0059] In the present utility model, unless otherwise clearly specified and defined, the terms "installed", "connected", "connected with", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the connection inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0060] In the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on the top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature is at a higher level than the second feature in terms of horizontal height. The first feature being "under", "beneath" and "under the bottom of" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature is at a lower level than the second feature in terms of horizontal height.

[0061] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0062] In the drawings of the disclosed embodiments of the present utility model, only the structures related to the disclosed embodiments are involved, and other structures can refer to the usual designs. Without conflict, the same embodiment and different embodiments of the present utility model can be combined with each other.

[0063] Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A small-sized LED panelized module, characterized in that, Including: A substrate (1); On one side of the top of the substrate (1), a Mini / Micro LED chip array (2) is fixedly connected. On one side of the top of the substrate (1), a chip protection cover (3) is fixedly connected. On one side of the top of the chip protection cover (3), a plurality of connection holes (4) are formed. The inner wall of the connection hole (4) is sleeved on the surface of the Mini / Micro LED chip array (2). An optical film (5) is lapped on one side of the top of the chip protection cover (3). On one side of the bottom of the substrate (1), a plurality of driving chips (6) are fixedly connected.

2. The small LED panelized module according to claim 1, characterized in that: The material of the substrate (1) is one of a transparent material and a translucent material.

3. The small LED panelized module according to claim 1, wherein: The chip protection cover (3) is made of a material with high light transmittance, low moisture absorption and good thermal stability.

4. A small LED panelized module according to claim 1, characterized in that: The connection hole (4) is in an inverted bowl shape.

5. A display screen, comprising a plurality of Mini / Micro LED panelization modules, wherein the plurality of Mini / Micro LED panelization modules are spliced with each other, and is characterized in that: The Mini / Micro LED panelized module is the Mini / Micro LED panelized module according to any one of claims 1 to 4.

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