LED lamp packaging support

Abstract

The utility model discloses an LED lamp packaging support which comprises a support body, a groove is formed in the upper end face of the support body, a chip is arranged in the groove, a heat dissipation groove is formed in the bottom of the support body, a plurality of heat conduction plates are arranged at the top end in the heat dissipation groove, and the heat conduction plates are arranged in the heat dissipation groove. The upper end faces of the multiple heat conduction plates are symmetrically provided with heat conduction rods, the multiple heat conduction rods extend upwards to penetrate into the groove, the bottom end of the interior of the groove is connected with a fan, the fan is electrically connected with a chip, the upper end face of the support is detachably provided with a lens, and the upper end face of the support body is provided with a fixing ring corresponding to the lens. According to the LED lamp, through the design of the fan, the heat dissipation effect is improved, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, and more specifically, it relates to an LED lamp packaging bracket. Background Art

[0002] LED, a light-emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. It has the advantages of high energy efficiency, long life, and anti-pollution. In the processing of LEDs, it mainly includes steps such as wafer dicing, packaging, soldering, spectroscopy, and integrated packaging. One end of the LED wafer is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the entire wafer is encapsulated by colloid. During the processing and production of LED lamps, it is necessary to encapsulate the LED lamps relative to the packaging bracket. When the existing packaging bracket is in use, the bottom of the device is sealed, lacking a suitable heat dissipation mechanism. Moreover, the top of the device dissipates heat through a heat dissipation plate in contact with the lens, and the heat dissipation efficiency is poor, and the top heat dissipation efficiency needs to be improved. In addition, when the device is in use, while the arc-shaped baffle protects against overflow of the colloid poured into the interior, it affects the lighting effect, and there is a lack of a suitable anti-overflow mechanism. Summary of the Utility Model

[0003] (1) Technical Problems to be Solved

[0004] In view of the problems existing in the prior art, the utility model provides an LED lamp packaging bracket to solve the technical problem that the bottom of the device in the background art is sealed and lacks a suitable heat dissipation mechanism.

[0005] (2) Technical Solutions

[0006] To achieve the above object, the utility model provides the following technical solution: an LED lamp packaging bracket, including a bracket body. A groove is provided on the upper end surface of the bracket body, and a chip is arranged inside the groove. A heat dissipation groove is provided at the bottom of the bracket body, and a heat conduction plate is arranged at the top end inside the heat dissipation groove. There are multiple heat conduction plates, and heat conduction rods are symmetrically arranged on the upper end surfaces of the multiple heat conduction plates. The multiple heat conduction rods all extend upward through the groove. A blower is connected to the bottom end inside the groove, and the blower is electrically connected to the chip. A lens is detachably arranged on the upper end surface of the bracket, and a fixing ring is provided on the upper end surface of the bracket body corresponding to the lens, and an installation ring is provided at the bottom end of the lens corresponding to the fixing ring.

[0007] The utility model is further arranged such that a first threaded hole is provided on the fixing ring, and multiple first threaded holes are arranged in the circumferential direction. Corresponding to the multiple first threaded holes, second threaded holes are provided on the installation ring, and the first threaded holes and the second threaded holes are connected by bolts, which is convenient for installing and locking the lens.

[0008] The present utility model is further configured such that through grooves are formed in the fixing ring, and a plurality of the through grooves are arranged in the circumferential direction. Heat dissipation holes are correspondingly formed in the mounting ring for the plurality of through grooves, facilitating heat dissipation at the top.

[0009] The present utility model is further configured such that filter meshes are provided inside the plurality of heat dissipation holes, filtering and dust-proofing the heat dissipation position at the top.

[0010] The present utility model is further configured such that an overflow groove is formed at the top end of the inner wall of the groove, and an overflow seat is provided on the overflow groove to prevent the colloid from overflowing.

[0011] The present utility model is further configured such that a plurality of the support bodies are provided, and the plurality of support bodies are detachably arranged. A connecting plate is provided between adjacent support bodies, facilitating the connection between the support bodies.

[0012] The present utility model is further configured such that connection grooves are correspondingly formed on the lower end surfaces of the plurality of support bodies for the connecting plates. A plurality of the connection grooves are arranged in the circumferential direction, facilitating connection at different angles.

[0013] The present utility model is further configured such that first connection holes are symmetrically formed on the plurality of connecting plates, and second connection holes are correspondingly formed on the inner walls of the plurality of connection grooves for the first connection holes. The first connection holes and the second connection holes are connected by bolts to lock the connection.

[0014] (III) Advantageous Effects

[0015] Compared with the prior art, the present utility model provides an LED lamp encapsulation support, having the following advantageous effects:

[0016] 1. Through the design of the fan, the fan is arranged at the bottom end inside the groove, and the heat conduction plate is communicated with the top groove through the heat conduction rod, facilitating the downward transfer of the heat inside the groove to the heat dissipation groove. The fan blows the heat outwards, improving the heat dissipation effect and extending the service life.

[0017] 2. Through the design of the lens, the first threaded hole and the second threaded hole are locked in cooperation with bolts, facilitating the disassembly and assembly of the lens. The mounting ring and the fixing ring of the lens are cooperatively arranged, and the through groove and the heat dissipation hole are cooperatively arranged, facilitating the heat dissipation adjustment of the lens position at the top of the device.

[0018] 3. Through the design of the overflow groove, the overflow groove is arranged at the top end of the inner wall of the groove, and the overflow seat is fixedly arranged inside the overflow groove. During the glue injection process, the colloid first enters the overflow groove and enters the inner groove of the overflow seat after exceeding the overflow seat, achieving overflow protection and avoiding waste caused by the overflow of the colloid. Description of the Drawings

[0019] Figure 1Schematic diagram of the preferred cooperating structure of multiple bracket bodies of an LED lamp packaging bracket;

[0020] Figure 2 Schematic diagram of the structure of the bracket body of an LED lamp packaging bracket without a lens installed;

[0021] Figure 3 Cross-sectional view of the internal structure of the bracket body of an LED lamp packaging bracket;

[0022] Figure 4 Schematic diagram of the overall structure of the lens of an LED lamp packaging bracket;

[0023] Figure 5 For Figure 2 Enlarged schematic diagram of the partial structure of A in

[0024] In the figure: 1. Bracket body; 2. Groove; 3. Chip; 4. Heat dissipation groove; 5. Heat conduction plate; 6. Heat conduction rod; 7. Fan; 8. Lens; 9. Fixed ring; 10. Installation ring; 11. First threaded hole; 12. Second threaded hole; 13. Through groove; 14. Heat dissipation hole; 15. Filter screen; 16. Overflow groove; 17. Overflow seat; 18. Connecting plate; 19. Connecting groove; 20. First connection hole; 21. Second connection hole. Detailed implementation manner

[0025] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0026] It should be pointed out that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs.

[0027] In the present invention, without contrary description, the orientations such as "upper, lower" are generally in the directions shown in the drawings, or in the vertical, perpendicular or gravitational directions; similarly, for the convenience of understanding and description, "left, right" are generally in the left and right shown in the drawings; "inside, outside" refer to the inside and outside relative to the contours of each component itself, but the above orientation terms are not used to limit the present invention.

[0028] Please refer to Figures 1-5, an LED lamp packaging bracket, including a bracket body 1. A groove 2 is opened on the upper end surface of the bracket body 1. A chip 3 is arranged inside the groove 2. A heat dissipation groove 4 is opened at the bottom of the bracket body 1. A heat conduction plate 5 is arranged at the top end inside the heat dissipation groove 4. There are multiple heat conduction plates 5. Heat conduction rods 6 are symmetrically arranged on the upper end surfaces of the multiple heat conduction plates 5. The multiple heat conduction rods 6 all extend upward through the inside of the groove 2. A blower 7 is connected to the bottom end inside the groove 2. The blower 7 is electrically connected to the chip 3. A lens 8 is detachably arranged on the upper end surface of the bracket. A fixing ring 9 is arranged on the upper end surface of the bracket body 1 corresponding to the lens 8. An installation ring 10 is arranged at the bottom end of the lens 8 corresponding to the fixing ring 9.

[0029] In this embodiment, the blower 7 is electrically connected to the chip 3. When an external power supply supplies power to the chip 3, the blower 7 starts synchronously. The heat of the groove 2 and the whole bracket is transferred to the position of the heat dissipation groove 4 through the heat conduction rods 6. The heat is exported outward through the heat dissipation plate. The blower 7 pushes the heat outward, improving the heat dissipation effect.

[0030] More specifically, the installation ring 10 of the lens 8 is installed corresponding to the fixing ring 9.

[0031] Please refer to Figures 1-4 , as an implementation manner of the lens 8: a first threaded hole 11 is opened on the fixing ring 9. There are multiple first threaded holes 11 arranged in the circumferential direction. A second threaded hole 12 is opened on the installation ring 10 corresponding to the multiple first threaded holes 11. The first threaded hole 11 and the second threaded hole 12 are connected by bolts. A through groove 13 is opened on the fixing ring 9. There are multiple through grooves 13 arranged in the circumferential direction. A heat dissipation hole 14 is opened on the installation ring 10 corresponding to the multiple through grooves 13. A filter screen 15 is arranged inside each of the multiple heat dissipation holes 14.

[0032] Specifically, the installation ring 10 and the fixing ring 9 are installed in cooperation. The first threaded hole 11 and the second threaded hole 12 are aligned. The bolts are passed through and tightened for fixation. The through groove 13 and the heat dissipation hole 14 are aligned. The filter screen 15 filters the incoming and outgoing gases.

[0033] Please refer to Figure 2 , Figure 3 and Figure 5 , as an implementation manner of anti-overflow: an overflow groove 16 is opened at the top end of the inner wall of the groove 2. An overflow seat 17 is arranged on the overflow groove 16.

[0034] Specifically, the overflow groove 16 and the overflow seat 17 cooperate to realize the overflow protection during the glue injection process.

[0035] Please refer to Figures 1-3, as an embodiment of the bracket body 1: There are multiple bracket bodies 1, and the multiple bracket bodies 1 are detachably arranged. A connecting plate 18 is provided between adjacent bracket bodies 1. A connecting groove 19 is correspondingly provided on the lower end surfaces of the multiple bracket bodies 1 for the connecting plate 18. A plurality of connecting grooves 19 are arranged in the circumferential direction. A plurality of first connection holes 20 are symmetrically provided on the plurality of connecting plates 18. A plurality of second connection holes 21 are correspondingly provided on the inner walls of the plurality of connecting grooves 19 for the first connection holes 20. The first connection holes 20 and the second connection holes 21 are connected by bolts.

[0036] Specifically, the bracket bodies 1 of multiple LED lights are installed in cooperation. The connecting plate 18 is installed corresponding to the connecting grooves 19 of two adjacent bracket bodies 1 on both sides. The first connection holes 20 and the second connection holes 21 are aligned, and bolts are passed through and tightened for fixation.

[0037] In summary, when the whole device is in use:

[0038] When in the glue injection state, the chip 3 is installed and connected to the gold wire inside the groove 2. After the chip 3 is installed, glue is injected into the groove 2. When the glue is injected to a certain height, the glue enters the overflow groove 16 inside, and the inner groove of the overflow seat 17 collects the glue exceeding the overflow seat 17.

[0039] When in the heat dissipation state, when the chip 3 starts, the fan 7 starts synchronously. The heat conduction rod 6 and the heat conduction plate 5 cooperate to transfer the heat inside the groove 2 downward to the heat dissipation groove 4. The fan 7 blows the heat inside the heat dissipation groove 4 outwards. The top position cooperates with the through groove 13 and the heat dissipation holes 14 to realize the air inlet and outlet, which is convenient for heat dissipation and improves the heat dissipation effect.

[0040] When in the connection state of multiple bracket bodies 1, according to the usage needs, the multiple bracket bodies 1 are connected and assembled. The connecting plate 18 is installed corresponding to the connecting grooves 19 on adjacent bracket bodies 1. The first connection holes 20 on the connecting plate 18 and the second connection holes 21 on the connecting grooves 19 are aligned, and bolts are passed through and tightened for fixation.

[0041] In all the above-mentioned solutions, for the connection between two components, welding, the cooperation of bolts and nuts, bolt or screw connection, or other well-known connection methods can be selected according to the actual situation, which will not be elaborated one by one here. For those mentioned above that involve fixed connection, welding is preferably considered. Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An LED lamp packaging bracket, comprising a bracket body (1), characterized in that: A groove (2) is formed on the upper end surface of the bracket body (1), a chip (3) is arranged inside the groove (2), a heat dissipation groove (4) is formed at the bottom of the bracket body (1), a heat conduction plate (5) is arranged at the top end inside the heat dissipation groove (4), there are multiple heat conduction plates (5), heat conduction rods (6) are symmetrically arranged on the upper end surfaces of the multiple heat conduction plates (5), the multiple heat conduction rods (6) all extend upward through to the inside of the groove (2), a fan (7) is connected to the bottom end inside the groove (2), the fan (7) is electrically connected to the chip (3), a lens (8) is detachably arranged on the upper end surface of the bracket, a fixing ring (9) is arranged on the upper end surface of the bracket body (1) corresponding to the lens (8), and an installation ring (10) is arranged at the bottom end of the lens (8) corresponding to the fixing ring (9).

2. The LED lamp packaging bracket according to claim 1, characterized in that: A first threaded hole (11) is formed in the fixing ring (9), there are multiple first threaded holes (11) arranged in the circumferential direction, a second threaded hole (12) is formed in the installation ring (10) corresponding to each of the multiple first threaded holes (11), and the first threaded hole (11) and the second threaded hole (12) are connected by bolts.

3. The LED lamp packaging bracket according to claim 2, characterized in that: A through groove (13) is formed in the fixing ring (9), there are multiple through grooves (13) arranged in the circumferential direction, and heat dissipation holes (14) are formed in the installation ring (10) corresponding to each of the multiple through grooves (13).

4. The LED lamp packaging bracket according to claim 3, wherein: Filter nets (15) are arranged inside the multiple heat dissipation holes (14).

5. The LED lamp packaging bracket according to claim 1, characterized in that: An overflow groove (16) is formed at the top end of the inner wall of the groove (2), and an overflow seat (17) is arranged on the overflow groove (16).

6. The LED lamp packaging bracket according to claim 1, characterized in that: There are multiple bracket bodies (1), and the multiple bracket bodies (1) are detachably arranged. A connecting plate (18) is arranged between adjacent bracket bodies (1).

7. The LED lamp packaging bracket according to claim 6, characterized in that: Connecting grooves (19) are formed in the lower end surfaces of the multiple bracket bodies (1) corresponding to the connecting plate (18), and there are multiple connecting grooves (19) arranged in the circumferential direction.

8. The LED lamp packaging bracket according to claim 7, characterized in that: First connecting holes (20) are symmetrically formed in the multiple connecting plates (18), second connecting holes (21) are formed in the inner walls of the multiple connecting grooves (19) corresponding to the first connecting holes (20), and the first connecting holes (20) and the second connecting holes (21) are connected by bolts.

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