Semiconductor test support

Abstract

The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor testing support, which comprises a supporting mechanism, a clamping mechanism, a clamping mechanism and a clamping mechanism. The clamping assembly is installed on the mechanical arm and comprises a base plate and an adsorption unit, and the adsorption unit is externally connected with a negative pressure source; the heat dissipation assembly is installed on the adsorption unit and used for conducting active heat dissipation on the semiconductor in the test, the support integrates the functions of automatic moving, precise clamping, active heat dissipation and the like, the semiconductor test device is very suitable for high-precision and high-efficiency semiconductor test scenes, and the test quality and the production efficiency can be remarkably improved. Through cooperative work of all the components in the design, the accuracy, safety and high efficiency of the semiconductor testing process are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor testing bracket. Background Art

[0002] The semiconductor industry is the core of modern information technology, and its products are widely used in many fields such as communication, computer, consumer electronics, and automobile. With the continuous progress of semiconductor technology, the integration degree of devices is getting higher and higher, and the functions are getting more and more complex, which directly leads to an increasing demand for semiconductor testing technology. Testing is not only a key step in the semiconductor manufacturing process, but also a necessary means to ensure product quality, reliability and performance. As an important part of the testing system, the semiconductor testing bracket undertakes the tasks of fixing and connecting the devices under test, and transmitting test signals.

[0003] Currently, the semiconductor testing brackets on the market mainly include bed-of-nails test sockets, socket test sockets, flying probe test systems, and micro-needle testing technologies, etc. Although the existing semiconductor testing bracket technologies are quite mature, high-power chips will generate a large amount of heat during testing, resulting in test failures. Summary of the Utility Model

[0004] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part, as well as in the abstract and title of the application of this application, to avoid obscuring the purpose of this part, the abstract and the title of the utility model, and such simplifications or omissions shall not be used to limit the scope of the utility model.

[0005] In view of the above problem that high-power chips will generate a large amount of heat during testing and an effective heat dissipation mechanism is needed to avoid test failures, the present utility model is proposed.

[0006] Therefore, the purpose of the utility model is to provide a semiconductor testing bracket.

[0007] To solve the above technical problems, the utility model provides the following technical solution: A semiconductor testing bracket, comprising,

[0008] A support mechanism, comprising a shaft electric platform and a robotic arm, the robotic arm is slidably mounted on the shaft electric platform;

[0009] A clamping assembly, mounted on the robotic arm, comprising a substrate and an adsorption unit, the adsorption unit is externally connected to a negative pressure source;

[0010] A heat dissipation assembly, mounted on the adsorption unit, for actively dissipating heat from the semiconductor under test.

[0011] As a preferred solution of a semiconductor test stand of the utility model, the mechanical arm includes an axis electric platform and an axis electric platform, which are used to drive the substrate to flip up and down and left and right.

[0012] As a preferred solution of a semiconductor testing bracket of the utility model, the adsorption unit includes a base, a suction plate, a piston and a connecting rod, the base has a first through hole that passes through from top to bottom, the connecting rod is slidably connected in the first through hole and the two ends are respectively fixed to the suction plate and the piston, the connecting rod has a second through hole, and the second through hole passes through the suction plate and the piston.

[0013] As a preferred solution of the semiconductor test stand of the utility model, a tension spring is movably installed on the connecting rod, and two ends of the tension spring are respectively in contact with the inner top surface of the base and the piston.

[0014] As a preferred solution of the semiconductor test bracket of the utility model, wherein: the inner wall of the substrate has a baffle, and the contact surface between the baffle and the semiconductor is provided with an insulating layer.

[0015] As a preferred solution of the semiconductor test bracket of the utility model, the adsorption unit further includes a metal rib, one side of the metal rib is connected to the base, and the other side is used for connecting to an external negative pressure source.

[0016] As a preferred solution of the semiconductor test bracket of the utility model, wherein: the contact surface between the metal rib and the semiconductor is provided with an insulating layer.

[0017] As a preferred solution of a semiconductor test bracket of the utility model, wherein: an adjusting bolt is rotatably installed on the base plate, a slide rail is fixedly installed on the axial electric platform, the adjusting bolt is threadedly installed in the slide rail, a slider is slidably installed in the slide rail, and the slider is fixedly connected to the base plate.

[0018] As a preferred solution of a semiconductor test stand of the utility model, the heat dissipation assembly includes a protective cover fixedly mounted on the side of the metal rib away from the semiconductor and a sleeve arranged in the protective cover, the outer edge surface of the sleeve is provided with linear grooves distributed along the circumferential direction, a gear ring is slidably mounted in the sleeve, and a fan blade is rotatably mounted on the gear ring;

[0019] A sliding rod is elastically mounted on the metal rib, and an end of the sliding rod facing away from the semiconductor has a connecting portion, and the connecting portion penetrates the linear groove and is slidably connected to the gear ring;

[0020] A motor is fixedly installed in the protective cover, and a gear that can be meshed and connected with the gear ring is fixedly installed at the output end of the motor.

[0021] As a preferred embodiment of a semiconductor test bracket of the present utility model, wherein: both sides of the substrate along the length direction have grooves for taking the semiconductor after testing.

[0022] Beneficial effects of a semiconductor test bracket of the present utility model: Through the settings of the Y-axis electric platform, robotic arm, substrate, adsorption unit and heat dissipation component, the bracket integrates functions such as automated movement, precise clamping and active heat dissipation, and is very suitable for high-precision and high-efficiency semiconductor test scenarios, which can significantly improve the test quality and production efficiency. The coordinated work of each component in the design ensures the accuracy, safety and efficiency of the semiconductor test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings. Among them:

[0024] Figure 1 It is an overall schematic diagram of a semiconductor test bracket.

[0025] Figure 2 It is a schematic structural diagram of the clamping component of a semiconductor test bracket.

[0026] Figure 3 It is a schematic structural diagram of the adsorption unit of a conductor test bracket.

[0027] Figure 4 It is a schematic structural diagram of the heat dissipation component of a conductor test bracket.

[0028] Reference numerals: 100, support mechanism; 101, Y-axis electric platform; 102, robotic arm; 102a, R-axis electric platform; 102b, U-axis electric platform; 102b-1, slide rail; 102b-2, slider; 200, clamping component; 201, substrate; 201a, retaining platform; 201b, groove; 202, adsorption unit; 202a, base; 202a-1, first through hole; 202b, suction plate; 202c, piston; 202d, connecting rod; 202d-1, second through hole; 202d-2, tension spring; 202e, metal rib; 203, adjusting bolt; 300, heat dissipation component; 301, protective cover; 302, sleeve; 302a, linear groove; 303, toothed ring; 304, fan blade; 305, slide bar; 305a, connecting part; 306, motor; 307, gear; 400, insulating layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0029] In order to make the above - mentioned objects, features, and advantages of the present utility model more obvious and understandable, the following will provide a detailed description of the specific implementation manners of the present utility model with reference to the accompanying drawings of the specification.

[0030] In the following description, many specific details are set forth to facilitate a thorough understanding of the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0031] Secondly, the so - called "one embodiment" or "embodiment" herein refers to specific features, structures, or characteristics that can be included in at least one implementation manner of the present utility model. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0032] Example 1, referring to Figures 1 - 4 , the embodiment of the present application provides a semiconductor test bracket, which includes a support mechanism 100, a clamping assembly 200, and a heat dissipation assembly 300.

[0033] The support mechanism 100 includes a Y - axis electric platform 101 and a robotic arm 102. The robotic arm 102 is slidably installed on the Y - axis electric platform 101 and has the ability to move in other directions by itself, so as to place semiconductor devices more flexibly, and can perform precise linear motion along the Y - axis direction, thereby realizing the positioning of the test bracket in space. As an option, the robotic arm 102 includes an R - axis electric platform 102a and a U - axis electric platform 102b, which are used to drive the substrate 201 to flip up and down and left and right. The use of the Y - axis electric platform 101 and the robotic arm 102 improves the automation level and accuracy of the test process, reduces the error of manual operation, and improves the test efficiency.

[0034] The clamping assembly 200 is installed on the robotic arm 102 and includes a substrate 201 and an adsorption unit 202. The substrate 201 is used to provide stability and lightness when clamping semiconductor devices. When clamping semiconductor devices, the adsorption unit 202 is externally connected to a negative pressure source, which can achieve non - damaging fixation, especially suitable for vulnerable or precision semiconductor devices, and at the same time ensures high precision in the test process.

[0035] The heat dissipation assembly 300 is installed on the adsorption unit 202 and is used to actively dissipate heat from the semiconductor being tested through active heat dissipation technology, preventing overheating from affecting the test results or damaging the device.

[0036] With the above structure, functions such as automatic movement, precise clamping, and active heat dissipation are integrated, which is very suitable for high-precision and high-efficiency semiconductor testing scenarios, and can significantly improve the testing quality and production efficiency. The coordinated operation of each component in the design ensures the accuracy, safety, and efficiency of the semiconductor testing process.

[0037] The following will introduce each structure in detail with reference to the accompanying drawings.

[0038] Referring to Figure 2 and Figure 3 , the adsorption unit 202 includes a base 202a, a suction plate 202b, a piston 202c, and a connecting rod 202d. The base 202a has a first through hole 202a-1 that penetrates up and down. The connecting rod 202d is slidably connected in the first through hole 202a-1 and is fixed to the suction plate 202b and the piston 202c at both ends respectively. The connecting rod 202d has a second through hole 202d-1, and the second through hole 202d-1 penetrates the suction plate 202b and the piston 202c.

[0039] Furthermore, a tension spring 202d-2 is movably installed on the connecting rod 202d, and both ends of the tension spring 202d-2 are in contact with the inner top surface of the base 202a and the piston 202c respectively.

[0040] With the above structure, when it is necessary to adsorb a semiconductor device, negative pressure is transmitted to the suction plate 202b through the second through hole 202d-1, and a vacuum is formed between the suction plate 202b and the semiconductor device, thereby adsorbing the device. And when a relatively airtight environment is formed after adsorption between the suction plate 202b and the semiconductor device, the first through hole 202a-1 in the base 202a forms an airtight environment, and the negative pressure pulls the piston 202c together with the connecting rod 202d, the suction plate 202b, and the semiconductor device as a whole to move downward into the substrate 201, and the tension spring 202d-2 is stretched by force, avoiding unnecessary physical damage to the fragile semiconductor device.

[0041] When it is necessary to release the device, disconnect or weaken the negative pressure, and the tension spring 202d-2 resets and pulls the piston 202c to move back, so that the semiconductor device pops up, facilitating material taking.

[0042] Referring to Figure 2 , the inner wall of the substrate 201 has a retaining platform 201a, and an insulating layer 400 is provided on the contact surface between the retaining platform 201a and the semiconductor.

[0043] With the above structure, the stop platform 201a can prevent the adsorption unit 202 from moving excessively, ensuring its operation in the correct position, maintaining the stability and precision of the adsorption unit 202. The insulating layer 400 covers the part where the stop platform 201a contacts the semiconductor, and is usually made of non-conductive materials such as polytetrafluoroethylene PTFE, epoxy resin, or silicone rubber, preferably ceramics or advanced polymers, which have low thermal resistance and can effectively conduct heat from the surface of the semiconductor device to the heat dissipation component 300, effectively preventing short circuits or charge leakage caused by accidental contact between the metal components of the substrate 201 or the adsorption unit 202 and the semiconductor device during the test.

[0044] Referring to Figure 2 , the adsorption unit 202 further includes a metal rib 202e. One side of the metal rib 202e is connected to the base 202a, and the other side is used to connect to a negative pressure source.

[0045] Furthermore, an insulating layer 400 is provided on the contact surface between the metal rib 202e and the semiconductor.

[0046] With the above structure, the metal rib 202e not only strengthens the overall structure of the adsorption unit 202, but also serves as a channel for negative pressure transmission, ensuring the stable transmission of negative pressure from the negative pressure source to the suction plate 202b. The metal material is preferably copper because of its excellent strength and heat conduction performance, which can withstand mechanical stress and at the same time contribute to the dissipation of heat energy. The presence of the insulating layer 400 effectively isolates the direct electrical contact between the metal rib 202e and the semiconductor device, preventing problems such as short circuits and electrostatic discharges that may occur during the test, and protecting the electrical safety of the semiconductor device.

[0047] Referring to Figure 2 , an adjusting bolt 203 is rotatably installed on the substrate 201, and a slide rail 102b-1 is fixedly installed on the U-axis electric platform 102b. The adjusting bolt 203 is threadedly installed in the slide rail 102b-1, and a slider 102b-2 is slidably installed in the slide rail 102b-1. The slider 102b-2 is fixedly connected to the substrate 201.

[0048] With the above structure, the adjusting bolt 203 is designed to be rotatable, and its thread matches the slide rail 102b-1, so that by rotating the adjusting bolt 203, a displacement can be generated along the linear direction of the thread to form a fine-tuning mechanism, allowing the operator or the control system to finely adjust the position of the substrate 201 relative to the U-axis electric platform 102b to meet different test requirements. The slide rail 102b-1 slider 102b-2 system ensures the smooth movement of the substrate 201, and at the same time, through cooperation with the adjusting bolt 203, precise positioning of the substrate 201 in the U-axis direction can be achieved.

[0049] Referring to Figure 4, the heat dissipation component 300 includes a protective cover 301 fixedly installed on the side of the metal rib 202e facing away from the semiconductor, and a sleeve 302 arranged inside the protective cover 301. Linear grooves 302a are distributed on the outer circumferential surface of the sleeve 302 in the circumferential direction. A toothed ring 303 is slidably installed inside the sleeve 302, and a fan blade 304 is rotatably installed on the toothed ring 303. A sliding rod 305 is elastically installed on the metal rib 202e. One end of the sliding rod 305 facing away from the semiconductor has a connecting portion 305a. The connecting portion 305a penetrates through the linear groove 302a and is slidably connected to the toothed ring 303. A motor 306 is fixedly installed inside the protective cover 301, and a gear 307 that can be meshed and connected with the toothed ring 303 is fixedly installed at the output end of the motor 306.

[0050] Through the above structural arrangement, the protective cover 301 is installed on the side of the metal rib 202e facing away from the semiconductor, forming a closed area for accommodating the moving parts of the heat dissipation component 300 and protecting them from the external environment. The sleeve 302 is fixed inside the protective cover 301, and the linear grooves 302a distributed on its outer circumferential surface are used for sliding cooperation with the connecting portion 305a of the sliding rod 305. When the semiconductor device abuts against the metal rib 202e, the sliding rod 305 can slide along the linear grooves 302a distributed on the sleeve 302, pushing out the toothed ring 303 and the fan blade 304 and engaging them with the gear 307. When the gear 307 rotates, the toothed ring 303 rotates accordingly, driving the fan blade 304 to generate an air current, directly blowing on the metal rib 202e, accelerating the heat exchange process, and thus effectively reducing the temperature of the semiconductor device during the test.

[0051] It should be noted that a spring is movably installed on the sliding rod 305 for driving the sliding rod 305 to reset.

[0052] Refer to Figure 2 , both sides of the substrate 201 in the length direction have grooves 201b for taking the semiconductor after the test.

[0053] Through the above structural arrangement, the grooves 201b provide a grasping point, enabling the operator to easily insert fingers or tools such as tweezers into them, thereby making it easier to grasp and move the semiconductor device on the substrate 201. For an automated production line, the grooves 201b can also be recognized and utilized by a manipulator or other automated equipment to achieve the automatic unloading of the semiconductor device after the test, improving production efficiency and reducing errors caused by manual operation.

[0054] In summary, the working principle of a semiconductor test bracket is as follows:

[0055] First, place the semiconductor device inside the substrate 201;

[0056] Then, the negative pressure is transmitted to the suction plate 202b through the second through hole 202d-1, and a vacuum is formed between the suction plate 202b and the semiconductor device, thereby adsorbing the device. And when a relatively airtight environment is formed after adsorption between the suction plate 202b and the semiconductor device, the first through hole 202a-1 in the base 202a forms an airtight environment, and the negative pressure pulls the piston 202c together with the connecting rod 202d, the suction plate 202b and the semiconductor device to move downward integrally into the substrate 201;

[0057] Meanwhile, the sliding rod 305 can slide along the linear grooves 302a distributed on the sleeve 302, push out the toothed ring 303 and the fan blade 304 and engage them with the gear 307. When the gear 307 rotates, the toothed ring 303 rotates accordingly, driving the fan blade 304 to generate an air current, directly blowing the metal rib 202e, accelerating the heat exchange process, and thus effectively reducing the temperature of the semiconductor device during the test;

[0058] Next, by rotating the adjusting bolt 203, the substrate 201 can be displaced along the threaded linear direction, realizing precise positioning of the substrate 201 in the U-axis direction for testing;

[0059] Finally, when it is necessary to release the device, the negative pressure is disconnected or weakened, and the tension spring 202d-2 resets to pull the piston 202c back, causing the semiconductor device to bounce up. The groove 201b provides a gripping point, enabling the operator to easily insert a finger or a tool such as tweezers into it, thereby more easily grasping and moving the semiconductor device on the substrate 201. For an automated production line, the groove 201b can also be recognized and utilized by a manipulator or other automated equipment, realizing automatic unloading of the semiconductor device after testing, improving production efficiency and reducing errors caused by manual operations.

[0060] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A semiconductor test bracket, characterized in that: including, a support mechanism (100), including a Y-axis electric platform (101) and a robotic arm (102), the robotic arm (102) being slidably mounted on the Y-axis electric platform (101); a clamping assembly (200), mounted on the robotic arm (102), including a substrate (201) and an adsorption unit (202), the adsorption unit (202) being externally connected to a negative pressure source; a heat dissipation assembly (300), mounted on the adsorption unit (202), for actively dissipating heat from the semiconductor under test.

2. The semiconductor test bracket according to claim 1, wherein: The robotic arm (102) includes an R-axis electric platform (102a) and a U-axis electric platform (102b), for driving the up-and-down and left-and-right flipping of the substrate (201).

3. The semiconductor test bracket according to claim 2, wherein: The adsorption unit (202) includes a base (202a), a suction plate (202b), a piston (202c), and a connecting rod (202d), the base (202a) having a first through hole (202a-1) that penetrates up and down, the connecting rod (202d) being slidably connected within the first through hole (202a-1) and fixed to the suction plate (202b) and the piston (202c) at both ends respectively, the connecting rod (202d) having a second through hole (202d-1) therein, the second through hole (202d-1) penetrating the suction plate (202b) and the piston (202c).

4. The semiconductor test bracket according to claim 3, wherein: A tension spring (202d-2) is movably mounted on the connecting rod (202d), and both ends of the tension spring (202d-2) abut against the inner top surface of the base (202a) and the piston (202c) respectively.

5. The semiconductor test bracket according to claim 4, wherein: The inner wall of the substrate (201) has a retaining platform (201a), and an insulating layer (400) is provided on the contact surface between the retaining platform (201a) and the semiconductor.

6. The semiconductor test bracket according to claim 5, characterized in that: The adsorption unit (202) further includes a metal rib (202e), one side of the metal rib (202e) communicating with the base (202a), and the other side being used for external connection to a negative pressure source.

7. The semiconductor test bracket according to claim 6, wherein: An insulating layer (400) is provided on the contact surface between the metal rib (202e) and the semiconductor.

8. The semiconductor test bracket according to claim 7, characterized in that: An adjusting bolt (203) is rotatably mounted on the substrate (201), a slide rail (102b-1) is fixedly mounted on the U-axis electric platform (102b), the adjusting bolt (203) is threadedly mounted in the slide rail (102b-1), a slider (102b-2) is slidably mounted within the slide rail (102b-1), and the slider (102b-2) is fixedly connected to the substrate (201).

9. The semiconductor test bracket according to claim 8, wherein: The heat dissipation assembly (300) includes a protective cover (301) fixedly mounted on the side of the metal rib (202e) away from the semiconductor and a sleeve (302) provided within the protective cover (301), linear grooves (302a) being distributed along the circumferential direction on the outer edge surface of the sleeve (302), a toothed ring (303) being slidably mounted within the sleeve (302), and a fan blade (304) being rotatably mounted on the toothed ring (303); A sliding rod (305) is elastically mounted on the metal rib (202e), and an end of the sliding rod (305) facing away from the semiconductor has a connecting portion (305a), and the connecting portion (305a) penetrates the linear groove (302a) and is slidably connected to the gear ring (303); A motor (306) is fixedly installed in the protective cover (301), and a gear (307) capable of meshing with the gear ring (303) is fixedly installed at the output end of the motor (306).

10. The semiconductor test bracket according to any one of claims 2-9, characterized in that: The substrate (201) has grooves (201b) on both sides along the length direction for taking out the semiconductor after testing.

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