Display structure and display device
The pre-packaged light emitting chip is packaged through CSP technology, combined with the flexible adjustment of the three-color light emitting chip, and the problem of complex RGBW LED lamp bead packaging process is solved, achieving efficient and low-cost packaging effect.
Patent Information
- Application Number
- CN202421817908.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-07-29
AI Technical Summary
The existing RGBW LED lamp bead packaging process is cumbersome and inefficient. It requires additional trial assembly and multiple potting, resulting in complex and high cost.
The pre-packaged light emitting chip is packaged using CSP technology, and the tri-color light emitting chip and the pre-packaged light emitting chip are packaged together to avoid trial assembly, shorten the packaging process flow, and improve flexibility by adjusting the light emitting position of the pre-packaged light emitting chip.
Effectively reduce light loss, improve luminous efficiency, improve color area concentration and yield, reduce costs, reduce packaging size, and have a wider range of adaptability.
Smart Images
Figure CN223168628U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of LED packaging, and particularly to a display structure and a display device. Background Art
[0002] RGBW LED lamp beads can emit four primary colors: red, green, blue, and white. The color performance is balanced and full, and can more accurately restore the original color of an object.
[0003] Currently, the encapsulation of RGBW LED lamp beads requires adding a trial matching link and multiple potting processes, which are cumbersome and inefficient. Utility Model Content
[0004] In view of this, this application provides a display structure and a display device, aiming to solve one of the technical problems in the prior art.
[0005] To achieve the above object, the technical solution adopted in this application is as follows:
[0006] In a first aspect, an embodiment of this application provides a display structure, including:
[0007] A housing having a receiving space and a central axis disposed along a first direction;
[0008] A red light-emitting chip, a green light-emitting chip, a blue light-emitting chip, and at least one pre-packaged light-emitting chip disposed at intervals in the receiving space. The pre-packaged light-emitting chip includes a first light-emitting portion and two first electrodes. The two first electrodes are disposed at intervals to form a first gap;
[0009] Two first pads disposed at intervals in the receiving space. The pre-packaged light-emitting chip is mounted on the two first pads so that the first electrodes of the pre-packaged light-emitting chip are electrically connected to the first pads correspondingly. In a second direction, the center line of the first gap in the first direction has an offset distance D from the central axis, satisfying: 0 ≤ D ≤ 0.25L, where L is the length of the housing in the second direction, and the first direction and the second direction are perpendicular.
[0010] In one of the embodiments of the first aspect, in the second direction, the distance between the two first electrodes is not greater than the distance between the two first pads.
[0011] In one of the embodiments of the first aspect, the housing includes:
[0012] A substrate;
[0013] A surrounding plate having openings at opposite ends. The substrate covers one of the openings to form the receiving space;
[0014] A partition board, which is connected to the inner side of the enclosure board and divides the accommodation space into a first area and a second area. The pre-packaged light-emitting chip is arranged in the first area, and the red light-emitting chip, the green light-emitting chip and the blue light-emitting chip are arranged in the second area.
[0015] In one embodiment of the first aspect, the housing further includes a barrier wall, which is arranged in the second area and is connected to the partition board and the enclosure board.
[0016] In one embodiment of the first aspect, the barrier wall, the enclosure board and the partition board are all non-light-transmitting structures, and / or the top end of the partition board is higher than the top end of the pre-packaged light-emitting chip and does not exceed the top end of the enclosure board.
[0017] In one embodiment of the first aspect, the red light-emitting chip, the blue light-emitting chip and the green light-emitting chip are in a front-mounted package structure. The display structure includes a second pad arranged on the housing. The red light-emitting chip, the blue light-emitting chip and the green light-emitting chip are arranged on one second pad at intervals, and the second pad is electrically connected to the red light-emitting chip, the blue light-emitting chip and the green light-emitting chip through leads respectively.
[0018] In one embodiment of the first aspect, the red light-emitting chip, the blue light-emitting chip and the green light-emitting chip are in a flip-chip package structure. The display structure includes three third pads arranged on the housing at intervals. The red light-emitting chip, the blue light-emitting chip and the green light-emitting chip are respectively arranged on one of the third pads and are electrically connected through welding respectively.
[0019] In one embodiment of the first aspect, the display structure further includes a sealant, which seals the red light-emitting chip, the green light-emitting chip, the blue light-emitting chip and the pre-packaged light-emitting chip into one body.
[0020] In one embodiment of the first aspect, the sealant is one of silicone or epoxy resin.
[0021] In a second aspect, an embodiment of the present application further provides a display device, including the display structure in any of the above embodiments.
[0022] Compared with the prior art, the beneficial effects of the present application are as follows: The present application provides a display structure, which includes a housing, a red light-emitting chip, a green light-emitting chip, a blue light-emitting chip and at least one pre-packaged light-emitting chip that are spaced apart in a receiving space, and two first pads that are spaced apart and arranged in the receiving space. The pre-packaged light-emitting chip is packaged by CSP technology, and then the three-color light-emitting chips and the pre-packaged light-emitting chip are packaged together, thus avoiding the trial fitting process and shortening the time of the packaging process flow; it can effectively reduce the light loss between the pre-packaged light-emitting chips, improve the light-emitting efficiency; it can avoid the color area deviation caused by the traditional dispensing process, has a high color area concentration, good consistency and high yield; it can also reduce wiring, save costs and reduce the size of the package.
[0023] In addition, the housing has a receiving space and a central axis arranged in a first direction; the pre-packaged light-emitting chip includes a first light-emitting part and two first electrodes, and the two first electrodes are spaced apart to form a first gap; the pre-packaged light-emitting chip is mounted on the two first pads so that the first electrodes of the pre-packaged light-emitting chip are electrically connected to the first pads correspondingly. In a second direction, the center line of the first gap in the first direction has an offset distance D from the central axis, satisfying: 0≤D≤0.25L, where L is the length of the housing in the second direction, and the first direction and the second direction are perpendicular. In this way, the light-emitting position of the pre-packaged light-emitting chip can be adjusted according to actual needs, improving flexibility and making the adaptation range of the display structure wider. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.
[0025] Figure 1 FIG. 1 shows one of the structural schematic diagrams of the display structure without a barrier wall in some embodiments of the present application;
[0026] Figure 2 FIG. 2 shows another structural schematic diagram of the display structure without a barrier wall in some embodiments of the present application;
[0027] Figure 3 FIG. 3 shows Figure 1 one of the cross-sectional structural schematic diagrams of the display structure in FIG. 1;
[0028] Figure 4 FIG. 4 shows Figure 3 the enlarged structural schematic diagram of the part marked I in FIG. 3;
[0029] Figure 5 FIG. 5 showsFigure 1 The second cross-sectional structure diagram of the display structure shown;
[0030] Figure 6 The structure diagram of the display structure provided with a barrier wall in some embodiments of the present application;
[0031] Figure 7 The structure diagram of the display structure having multiple pre-packaged light-emitting chips in some embodiments of the present application;
[0032] Figure 8 The third structure diagram of the display structure without a barrier wall provided in some embodiments of the present application.
[0033] Description of main component symbols: 100 - display structure; 110 - housing; 120 - red light-emitting chip; 130 - green light-emitting chip; 140 - blue light-emitting chip; 150 - pre-packaged light-emitting chip; 111 - accommodation space; 112 - central axis; 151 - first light-emitting part; 152 - first electrode; 160 - first pad; 113 - substrate; 114 - enclosing plate; 115 - partition plate; 1111 - first region; 1112 - second region; 116 - barrier wall; 170 - second pad; 171 - lead; 180 - third pad; D1 - first direction; D2 - second direction. Detailed description of the specific embodiments
[0034] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.
[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.
[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.
[0037] In the present application, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0038] In the present application, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0039] Existing light-emitting components are mostly combinations of R, G, B (red, green, blue). However, a light-emitting device with only an RGB combination has the problem of a narrow color performance range and cannot provide a richer color effect. An RGBW light-emitting component can emit four primary colors: red, green, blue, and white, and a richer color effect can be produced by mixing these four colors.
[0040] In the related art, the encapsulation process of a display structure with red, green, blue, and white light-emitting chips is as follows: First, a red light-emitting chip, a green light-emitting chip, a blue light-emitting chip, and a pre-encapsulated light-emitting chip are fixed on a substrate. After the fixing is completed, it is transferred to wire bonding. After the wire bonding is completed, fitting and encapsulating the pre-encapsulated light-emitting chip with a fluorescent glue are carried out. After the fluorescent glue is cured, a transparent glue is then used to encapsulate the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip. Such an encapsulation process requires adding a fitting link and two encapsulation links, and the process is cumbersome and inefficient.
[0041] In view of the above problems, as Figure 1 shown, an embodiment of the present application provides a display structure 100, which is mainly used to achieve rich color display.
[0042] The display structure 100 includes a housing 110, a red light-emitting chip 120, a green light-emitting chip 130, a blue light-emitting chip 140, and at least one pre-packaged light-emitting chip 150 that are spaced apart in a receiving space 111, and two first pads 160 that are spaced apart and disposed in the receiving space 111.
[0043] Wherein, as Figure 1 and Figure 2 shown, the housing 110 has a receiving space 111 and a central axis 112 disposed along a first direction D1.
[0044] In this embodiment, the cross-section of the housing 110 is generally rectangular and has a central axis 112 along the length direction.
[0045] As Figure 3 and Figure 4 shown, the pre-packaged light-emitting chip 150 includes a first light-emitting portion 151 and two first electrodes 152. The two first electrodes 152 are spaced apart to form a first gap, and the two first electrodes 152 are spaced apart and disposed below the first light-emitting portion 151.
[0046] In this embodiment, the pre-packaged light-emitting chip 150 is packaged on a substrate 113 by using CSP (Chip Scale Package) technology. By encapsulating the pre-packaged light-emitting chip 150 with CSP technology, the trial fitting link is avoided, and the time of the encapsulation process flow is shortened; the light loss between the pre-packaged light-emitting chips 150 can be effectively reduced, and the light-emitting efficiency is improved; the color area deviation caused by the traditional dispensing process can be avoided, the color area concentration is high, the consistency is good, and the yield is high; the wiring can also be reduced, the cost can be saved, and the size of the package can be reduced.
[0047] As Figure 2 shown, the pre-packaged light-emitting chip 150 is mounted on the two first pads 160 so that the first electrodes 152 of the pre-packaged light-emitting chip 150 are electrically connected to the first pads 160 correspondingly. In a second direction D2, the center line of the first gap in the first direction D1 has a bias distance D from the central axis 112, satisfying: 0 ≤ D ≤ 0.25L, where L is the length of the housing 110 in the second direction D2. In this way, the light-emitting position of the pre-packaged light-emitting chip 150 can be adjusted according to actual needs, the flexibility is improved, and the adaptation range of the display structure 100 is wider.
[0048] It should be noted that, as Figure 1 and Figure 2 shown, the first direction D1 is the width direction of the housing 110, the second direction D2 is the length direction of the housing 110, and the first direction D1 and the second direction D2 are perpendicular. In other embodiments, the first direction D1 and the second direction D2 can be adjusted according to requirements.
[0049] In one embodiment, the pre-packaged light-emitting chip 150, the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 are all LED lamp beads.
[0050] In some embodiments, as Figure 4 shown, in the second direction D2, the distance between the two first electrodes 152 is not greater than the distance between the two first pads 160. In this way, sufficient space can be reserved between the two first pads 160 to form an open circuit, avoiding short circuits caused by the two first pads 160 contacting each other.
[0051] In some embodiments, as Figure 5 shown, the housing 110 includes a substrate 113, a surrounding plate 114, and a partition plate 115.
[0052] The opposite ends of the surrounding plate 114 have openings. The substrate 113 is connected to one end of the surrounding plate 114 to form a receiving space 111. The substrate 113 covers one opening, and the other opening of the display structure 100 is used as the light-emitting side.
[0053] The partition plate 115 is connected to the inner side of the surrounding plate 114 and divides the receiving space 111 into a first region 1111 and a second region 1112. The pre-packaged light-emitting chip 150 is disposed in the first region 1111, and the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 are disposed in the second region 1112.
[0054] Exemplarily, as Figure 5 shown, one pre-packaged light-emitting chip 150 is disposed in the first region 1111, and the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 are disposed in the second region 1112 at intervals.
[0055] Exemplarily, as Figure 7 shown, two pre-packaged light-emitting chips 150 are disposed in the first region 1111, and the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 are disposed in the second region 1112 at intervals.
[0056] In this embodiment, the light-emitting color of the pre-packaged light-emitting chip 150 is white. In other embodiments, the light-emitting color of the pre-packaged light-emitting chip 150 is pink, light blue, etc. The light-emitting color of the pre-packaged light-emitting chip 150 can be set as required.
[0057] In some embodiments, as Figure 7As shown, when the number of pre-packaged light-emitting chips 150 is multiple, the color temperatures between the pre-packaged light-emitting chips 150 are different. The CSP packaging of the pre-packaged light-emitting chip 150 can be derived into a multi-color temperature package, and the color temperatures between two adjacent pre-packaged light-emitting chips 150 can be the same or different.
[0058] By changing the position of the partition plate 115, the duty ratios of the pre-packaged light-emitting chip 150, the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 can be adjusted as required to achieve the performance of the desired color.
[0059] In this embodiment, the arrangement order among the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 can be set as required without any particular limitation. By arranging the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 at intervals in the second region 1112, the light output effect is improved.
[0060] In some embodiments, as Figure 6 shown, the housing 110 further includes a barrier wall 116. The barrier wall 116 is disposed in the second region 1112 and is connected to the partition plate 115 and the surrounding plate 114.
[0061] The barrier wall 116 is generally in an ear shape. A recess is provided on the side of the barrier wall 116 close to the red / green / blue light-emitting chip 140 to form an avoidance space convenient for welding operations, facilitating the welding of the red / green / blue light-emitting chip 140 onto the pad.
[0062] Meanwhile, the barrier wall 116 also functions to block water vapor, preventing the water vapor from flowing back into the housing 110 and damaging the packaging structure.
[0063] In some embodiments, the barrier wall 116, the surrounding plate 114, and the partition plate 115 are all non-transparent structures, and / or the top end of the partition plate 115 is higher than the top end of the pre-packaged light-emitting chip 150 but does not exceed the top end of the surrounding plate 114.
[0064] By providing the non-transparent partition plate 115, the red light-emitting chip 120 / green light-emitting chip 130 / blue light-emitting chip 140 and the pre-packaged light-emitting chip 150 are isolated to avoid the phenomenon of color mixing caused by the excitation of the phosphor on the pre-packaged light-emitting chip 150 when the red light-emitting chip 120 / green light-emitting chip 130 / blue light-emitting chip 140 is lit.
[0065] Such as Figure 5As shown, the top end of the partition plate 115 is flush with the top end of the surrounding plate 114, or the top end of the partition plate 115 is lower than the top end of the surrounding plate 114 but higher than the top end of the pre-packaged light-emitting chip 150, which serves to prevent the phosphor on the pre-packaged light-emitting chip 150 from emitting light when the red light-emitting chip 120 / green light-emitting chip 130 / blue light-emitting chip 140 is lit, thus avoiding color mixing.
[0066] In this embodiment, the pre-packaged light-emitting chip 150, red light-emitting chip 120, green light-emitting chip 130, and blue light-emitting chip 140 are coaxially arranged, and the centers of the pre-packaged light-emitting chip 150, red light-emitting chip 120, green light-emitting chip 130, and blue light-emitting chip 140 all fall on the central axis 112 of the housing 110.
[0067] In other embodiments, there may be a deviation distance between the centers of the pre-packaged light-emitting chip 150, red light-emitting chip 120, green light-emitting chip 130, and blue light-emitting chip 140 and the central axis 112, and the specific size of the deviation distance can be set according to actual requirements.
[0068] In some embodiments, such as Figure 1 and Figure 6 As shown, the red light-emitting chip 120, green light-emitting chip 130, and blue light-emitting chip 140 are in a flip-chip package structure. The display structure 100 includes a second pad 170 provided on the housing 110. The red light-emitting chip 120, blue light-emitting chip 140, and green light-emitting chip 130 are spaced apart and arranged on a second pad 170. The second pad 170 is electrically connected to the red light-emitting chip 120, blue light-emitting chip 140, and green light-emitting chip 130 through leads 171 respectively.
[0069] Among them, the packaging of the red light-emitting chip 120, green light-emitting chip 130, and blue light-emitting chip 140 may include different packaging structure forms such as IC, IR, etc.
[0070] Such as Figure 1 and Figure 6 As shown, electrodes are provided on the red light-emitting chip 120, green light-emitting chip 130, and blue light-emitting chip 140. Multiple leads 171 are provided on the second pad 170, and each lead 171 is welded to the electrode on the red light-emitting chip 120, green light-emitting chip 130, or blue light-emitting chip 140. The pre-packaged light-emitting chip 150, red light-emitting chip 120, green light-emitting chip 130, and blue light-emitting chip 140 are connected in parallel through the leads 171.
[0071] In some embodiments, such as Figure 8As shown, the red light-emitting chip 120, the blue light-emitting chip 140, and the green light-emitting chip 130 are in a flip-chip package structure. The display structure 100 includes three third pads 180 spaced apart in the housing 110. The red light-emitting chip 120, the blue light-emitting chip 140, and the green light-emitting chip 130 are respectively disposed on one third pad 180 and are electrically connected by welding.
[0072] In some embodiments, the display structure 100 further includes a sealant (not shown in the figure). The sealant seals the red light-emitting chip 120, the green light-emitting chip 130, the blue light-emitting chip 140, and the pre-packaged light-emitting chip 150 into one body, improving the sealing performance of the display structure 100. At the same time, it can also simplify the sealing steps.
[0073] Optionally, the transparent colloid is one of silicone or epoxy resin.
[0074] The encapsulation manufacturing process of the display structure 100 of the present application is as follows:
[0075] Step 1: Provide the housing 110. The partition plate 115 in the housing 110 divides the accommodation space 111 of the housing 110 into a first region 1111 and a second region 1112.
[0076] Step 2: Fix at least one pre-packaged light-emitting chip 150 encapsulated by CSP technology in the first region 1111 at intervals.
[0077] Step 3: Fix the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 in the second region 1112 respectively.
[0078] Step 4: When the three-color chips are in a front-mounted package, weld the leads 171 of the second pads 170 to the electrodes on the red light-emitting chip 120, the green light-emitting chip 130, or the blue light-emitting chip 140; when the three-color chips are in a flip-chip package, directly weld the electrodes of the red light-emitting chip 120, the green light-emitting chip 130, or the blue light-emitting chip 140 to one third pad 180 respectively.
[0079] Step 5: Apply glue to seal the pre-packaged light-emitting chip 150, the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140.
[0080] Step 6: Electrically connect the pre-packaged light-emitting chip 150, the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140 to the driving board through a circuit respectively.
[0081] Step 7: By controlling the brightness and duty cycle of the pre-packaged light-emitting chip 150, the red light-emitting chip 120, the green light-emitting chip 130, and the blue light-emitting chip 140, the performance of the required color is achieved.
[0082] The display structure 100 provided by the present application can not only be applied to the projection part of electronic devices such as optical projection and HUD (Head Up Display), but also to the display part of electronic devices. For example, the electronic device may include: any device with a display screen such as a smart phone, a smart watch, a laptop computer, a tablet computer, a driving recorder, a navigator, a head-mounted device, etc., and can also be applied to the lighting part of electronic devices. For example, the electronic device may include: any device with a lighting component such as a vehicle, a street lamp, etc.
[0083] The display structure 100 proposed by the present application is particularly applicable to the following electronic devices: projection devices for long-distance display, such as optical projection, etc.; application devices with requirements for display brightness, such as in-vehicle products like window displays and HUDs that are usually used outdoors, and also such as aiming scopes and telescopes in the military industry, and also head-mounted devices such as AR glasses, ski goggles, swimming goggles, etc.
[0084] In an embodiment of the present application, a display device is further provided, which includes the display structure 100 in any of the above embodiments. Therefore, it has all the beneficial effects of the display structure 100 in any of the above embodiments, and will not be described in detail herein one by one.
[0085] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0086] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.
Claims
1. A display structure, characterized in that, Comprising: A housing having a receiving space and a central axis arranged in a first direction; A red light-emitting chip, a green light-emitting chip, a blue light-emitting chip, and at least one pre-packaged light-emitting chip arranged at intervals in the receiving space, the pre-packaged light-emitting chip including a first light-emitting portion and two first electrodes, the two first electrodes being arranged at intervals to form a first gap; Two first pads arranged at intervals in the receiving space, the pre-packaged light-emitting chip being mounted on the two first pads so that the first electrodes of the pre-packaged light-emitting chip are electrically connected to the first pads correspondingly. In a second direction, there is an offset distance D between the center line of the first gap in the first direction and the central axis, satisfying: 0≤D≤0.25L, where L is the length of the housing in the second direction, and the first direction and the second direction are perpendicular.
2. The display structure according to claim 1, wherein In the second direction, the distance between the two first electrodes is not greater than the distance between the two first pads.
3. The display structure according to claim 1, wherein The housing includes: A substrate; A surrounding plate having openings at opposite ends thereof, the substrate covering one of the openings to form the receiving space; A partition plate connected to the inner side of the surrounding plate and dividing the receiving space into a first region and a second region, the pre-packaged light-emitting chip being arranged in the first region, and the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip being arranged in the second region.
4. The display structure according to claim 3, characterized in that, The housing further includes a barrier wall arranged in the second region, the barrier wall being connected to the partition plate and the surrounding plate.
5. The display structure according to claim 4, wherein, The barrier wall, the surrounding plate, and the partition plate are all non-light-transmitting structures, and / or the top end of the partition plate is higher than the top end of the pre-packaged light-emitting chip and does not exceed the top end of the surrounding plate.
6. The display structure according to any one of claims 1 to 5, characterized in that, The red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip are in a front-mounted package structure. The display structure includes a second pad arranged on the housing. The red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip are arranged at intervals on one second pad, and the second pad is electrically connected to the red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip respectively through leads.
7. The display structure according to any one of claims 1 to 5, characterized in that, The red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip are in a flip-chip package structure. The display structure includes three third pads arranged at intervals on the housing. The red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip are respectively arranged on one of the third pads and are electrically connected through welding respectively.
8. The display structure according to any one of claims 1 to 5, characterized in that, The display structure further includes a sealing glue, and the sealing glue seals the red light-emitting chip, the green light-emitting chip, the blue light-emitting chip, and the pre-packaged light-emitting chip into an integral body.
9. The display structure according to claim 8, wherein The sealing glue is one of silicone or epoxy resin.
10. A display device, characterized in that, Including the display structure according to any one of claims 1 to 9.