Self-cleaning air draft pipeline device of photoetching machine

Abstract

The utility model relates to a photoetching machine self-cleaning air draft pipeline device in the technical field of photoetching machine self-cleaning, which comprises a cavity, a communicating pipe is fixedly mounted at the bottom of the cavity, an exhaust pipe is fixedly connected to one side of the bottom of the communicating pipe, and the exhaust pipe penetrates through the communicating pipe and is communicated with the inside of the cavity. A plurality of cleaning nozzles are arranged on the inner wall of the exhaust pipe, a collecting tank is in threaded connection with the bottom of the exhaust pipe, a sensor is arranged on the inner wall of the joint of the exhaust pipe and the collecting tank, an inner filter screen is fixedly arranged in the middle of the collecting tank, and a baffle is arranged on the inner wall of the exhaust pipe; the baffle is arranged on the right side of the joint of the exhaust pipe and the collecting tank. According to the utility model, the cleaning nozzle is additionally arranged in the exhaust pipeline, so that the self-cleaning of the pipe wall can be realized, the photoresist suspended particles cleaned from the pipe wall can be collected by using the detachable collecting tank, the blockage of the exhaust pipeline can be avoided, the occurrence of photoresist coating defects can be reduced, and the exhaust pipeline can be applied to the design field of the exhaust pipeline of the photoresist coating machine.

Description

Technical Field

[0001] The utility model relates to the technical field of self-cleaning of photolithography machines, in particular to a self-cleaning exhaust pipeline device for photolithography machines. Background Art

[0002] Photoresist coating is a crucial step in semiconductor lithography. During photoresist coating, a nozzle sprays photoresist onto the wafer surface. A rotary motor controls the wafer's rotation, flinging out excess photoresist, forming a uniform photoresist layer on the wafer surface. The flung photoresist impacts the inner wall of the cavity, where some becomes aerosol and floats freely within the cavity. If it falls onto the wafer surface, it can cause defects. To address this issue, this patent proposes a self-cleaning exhaust duct device for a lithography machine. Utility Model Content

[0003] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a self-cleaning exhaust pipeline device for a photolithography machine.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: a self-cleaning exhaust pipe device for a photolithography machine, comprising a cavity, a connecting pipe fixedly installed at the bottom of the cavity, an exhaust pipe fixedly connected to one side of the bottom of the connecting pipe, the exhaust pipe passes through the connecting pipe and is connected to the interior of the cavity, a plurality of cleaning nozzles are provided on the inner wall of the exhaust pipe, a collecting tank is threadedly connected to the bottom of the exhaust pipe, a sensor is provided on the inner wall of the interface between the exhaust pipe and the collecting tank, an inner filter is fixedly provided in the middle of the collecting tank, a baffle is provided on the inner wall of the exhaust pipe, and the baffle is provided on the right side of the interface between the exhaust pipe and the collecting tank.

[0005] As a further description of the above technical solution:

[0006] A vacuum suction pipe is passed through and fixedly provided inside the communicating tube, a vacuum suction cup is fixedly connected to the top of the vacuum suction pipe, a wafer is provided on the vacuum suction cup, and the vacuum suction pipe is communicated with the interior of the vacuum suction cup.

[0007] As a further description of the above technical solution:

[0008] A photoresist nozzle is fixedly installed on the upper part of the cavity, the outlet of the photoresist nozzle is arranged inside the cavity, the end of the photoresist nozzle away from the cavity is connected to a photoresist liquid inlet pipe, and the photoresist nozzle is arranged just above the center of the wafer.

[0009] As a further description of the above technical solution:

[0010] A back-side photoresist edge repair liquid inlet pipe is passed through and fixedly connected to the side of the cavity, and one end of the back-side photoresist edge repair liquid inlet pipe is fixedly connected to a back-side photoresist edge repair nozzle. The back-side photoresist edge repair nozzle is arranged inside the cavity, and the back-side photoresist edge repair nozzle is arranged on the back side of one edge of the wafer.

[0011] As a further description of the above technical solution:

[0012] A drain pipe is fixedly provided at the bottom of the connecting pipe, which passes through the connecting pipe and is connected to the interior of the cavity. The drain pipe is arranged on a different side from the exhaust pipe and on the same side as the back side photoresist edge repair liquid inlet pipe and the back side photoresist edge repair nozzle.

[0013] As a further description of the above technical solution:

[0014] A rotating motor is fixedly arranged at the bottom of the vacuum suction pipe, and a vacuum exhaust pipe is fixedly connected to the bottom of the rotating motor.

[0015] As a further description of the above technical solution:

[0016] The vacuum suction pipe is communicated with the vacuum exhaust pipe.

[0017] The utility model has the following beneficial effects:

[0018] The utility model changes the exhaust duct structure, adds a cleaning nozzle at the exhaust duct mouth, cleans the exhaust duct wall regularly, effectively avoids the accumulation of photoresist particles on the duct wall, and uses a detachable collection tank connected to the middle of the duct to timely collect the photoresist suspended particles cleaned from the duct wall. The collection tank mouth can use a sensor to monitor the collection situation of the tank body. If the liquid accumulates to a certain height, the collection tank can be removed for cleaning. A filter is provided in the collection tank for separating and collecting solid particles in the liquid for easy recycling. The utility model can avoid the blockage of the exhaust duct and reduce the situation of photoresist coating defects caused by problems with the exhaust flow rate. It can be applied to the field of exhaust duct design for photoresist coating machines. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural diagram of a self-cleaning exhaust pipe device for a photolithography machine proposed in the utility model;

[0020] Figure 2 For this utility model Figure 1 Enlarged view of point A in the middle.

[0021] Legend:

[0022] 1. Cavity; 2. Connecting pipe; 3. Vacuum suction pipe; 4. Vacuum suction cup; 5. Wafer; 6. Photoresist nozzle; 7. Photoresist liquid inlet pipe; 8. Back side photoresist edge repair liquid inlet pipe; 9. Back side photoresist edge repair nozzle; 10. Exhaust pipe; 11. Cleaning nozzle; 12. Collection tank; 13. Sensor; 14. Inner filter; 15. Baffle; 16. Drain pipe; 17. Rotating motor; 18. Vacuum exhaust pipe. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] Reference Figure 1-2 The utility model provides an embodiment: a self-cleaning exhaust pipe device for a photolithography machine, comprising a cavity 1, a connecting pipe 2 is fixedly installed at the bottom of the cavity 1, an exhaust pipe 10 is fixedly connected to one side of the bottom of the connecting pipe 2, the exhaust pipe 10 passes through the connecting pipe 2 and is connected to the interior of the cavity 1, a plurality of cleaning nozzles 11 are provided on the inner wall of the exhaust pipe 10, and the cleaning nozzles 11 are regularly flushed on the wall of the exhaust pipe 10 through program settings to avoid pipe blockage.

[0025] The bottom of the exhaust pipe 10 is threadedly connected to a collection tank 12, and a sensor 13 is provided on the inner wall of the interface between the exhaust pipe 10 and the collection tank 12. The sensor 13 can timely monitor the accumulation height of the liquid in the collection tank 12. If the liquid in the tank reaches a certain height, a warning signal is sent to prompt the technician to replace or clean the collection tank 12.

[0026] An inner filter screen 14 is fixedly provided in the middle of the collection tank 12. The inner filter screen 14 can separate and collect solid particles in the liquid for easy recovery.

[0027] The inner wall of the exhaust pipe 10 is provided with a baffle 15, which is arranged on the right side of the interface between the exhaust pipe 10 and the collection tank 12. The baffle 15 can ensure that the photoresist falls into the collection tank 12 to prevent it from entering the rear exhaust pipe 10.

[0028] A vacuum suction pipe 3 is fixedly provided inside the connecting pipe 2, and a vacuum suction cup 4 is fixedly connected to the top of the vacuum suction pipe 3. A wafer 5 is provided on the vacuum suction cup 4. The vacuum suction pipe 3 is connected to the inside of the vacuum suction cup 4. A vacuum exhaust pipe 18 is fixedly connected to the bottom of the vacuum suction pipe 3. The vacuum suction pipe 3 is connected to the vacuum exhaust pipe 18. An external vacuum suction device provides vacuum suction force to the vacuum suction pipe 3, the vacuum suction cup 4, and the vacuum exhaust pipe 18, thereby sucking and fixing the wafer 5. Figure 1 The arrows in the vacuum suction pipe 3, the vacuum suction cup 4 and the vacuum exhaust pipe 18 represent the air flow direction of the vacuum suction.

[0029] A photoresist nozzle 6 is fixedly installed on the upper part of the cavity 1. The outlet of the photoresist nozzle 6 is set inside the cavity 1. The end of the photoresist nozzle 6 away from the cavity 1 is connected to a photoresist liquid inlet pipe 7. The photoresist passes through the photoresist liquid inlet pipe 7 and is sprayed from the photoresist nozzle 6 to coat the wafer 5. A rotating motor 17 is fixedly installed at the bottom of the vacuum suction pipe 3. The rotating motor 17 rotates and drives the vacuum suction pipe 3, the vacuum suction cup 4 and the wafer 5 to rotate, thereby spin coating the wafer 5. Figure 1 The arrow in the photoresist inlet pipe 7 represents the inflow direction of the photoresist liquid flow.

[0030] A back photoresist edge repair liquid inlet pipe 8 is passed through and fixedly connected to the side of the cavity 1. One end of the back photoresist edge repair liquid inlet pipe 8 is fixedly connected to a back photoresist edge repair nozzle 9. The back photoresist edge repair nozzle 9 is arranged inside the cavity 1. During the photoresist spin coating process, due to the action of centrifugal force, excess glue will be pushed to the edge of the wafer 5 and part of it will remain. These residual photoresists will quickly solidify to form a raised edge and even flow to the back of the wafer 5 under the action of surface tension, causing pollution. Therefore, the de-edging solvent passes through the back photoresist edge repair liquid inlet pipe 8 and is then sprayed out from the back photoresist edge repair nozzle 9 and sprayed on the back edge of the wafer 5 to dissolve the residual photoresist and perform edge repair on the back of the wafer 5.

[0031] A drain pipe 16 is fixedly provided at the bottom of the connecting pipe 2. The drain pipe 16 passes through the connecting pipe 2 and is connected to the interior of the cavity 1. The drain pipe 16 is arranged on a different side from the exhaust pipe 10. The drain pipe 16 is arranged on the same side as the back side photoresist edge repair liquid inlet pipe 8 and the back side photoresist edge repair nozzle 9. The de-edging solvent sprayed by the back side photoresist edge repair nozzle 9 is discharged from the drain pipe 16 and leaves the cavity 1.

[0032] Working principle:

[0033] Preliminary preparation:

[0034] The wafer 5 is fixed on the top of the vacuum suction pipe 3 through the vacuum suction cup 4. The vacuum suction pipe 3 is connected to the external vacuum suction device to ensure that the wafer 5 is stable and motionless during the spin coating process.

[0035] Photoresist coating:

[0036] The photoresist enters the photoresist nozzle 6 from the photoresist liquid inlet pipe 7. The nozzle is located inside the cavity 1. The photoresist is evenly sprayed onto the surface of the wafer 5 through the nozzle.

[0037] The rotating motor 17 is started, driving the vacuum pipe 3, vacuum chuck 4 and wafer 5 to rotate together to realize the spin coating of photoresist. During this process, the photoresist is evenly covered on the surface of the wafer 5 under the action of centrifugal force, and the excess photoresist is pushed to the edge of the wafer 5.

[0038] Photoresist edge processing:

[0039] Since excess photoresist will remain on the edge of the wafer 5 during the spin coating process, the back side photoresist edge repair nozzle 9 receives the de-edging solvent through the back side photoresist edge repair liquid inlet pipe 8. The nozzle is located inside the cavity 1, and the sprayed de-edging solvent dissolves the residual photoresist at the back side edge of the wafer 5 to perform edge repair.

[0040] De-edging solvent recovery:

[0041] The sprayed edge removal solvent and dissolved residual photoresist are discharged from the cavity 1 through the drain pipe 16. The drain pipe 16 is arranged on a different side from the exhaust pipe 10 to ensure that the edge removal solvent will not be mixed with the exhaust system.

[0042] Exhaust and cleaning:

[0043] The exhaust pipe 10 is connected to the interior of the cavity 1 through the connecting pipe 2 and is responsible for discharging the gas in the cavity 1. Figure 2 The arrow in the figure represents the direction of gas discharge. A plurality of cleaning nozzles 11 are provided on the inner wall of the exhaust pipe 10. These nozzles are programmed to regularly flush the wall of the exhaust pipe 10 to prevent the pipe from being blocked.

[0044] The bottom of the exhaust pipe 10 is threadedly connected to a collection tank 12, and a sensor 13 is provided on the inner wall of the collection tank 12 to monitor the accumulation height of the liquid in the collection tank 12. When the liquid reaches a certain height, the sensor 13 sends a warning signal to prompt the technician to replace or clean it.

[0045] Solid particle recovery:

[0046] An inner filter 14 is fixedly provided in the middle of the collection tank 12. The inner filter 14 can separate and collect solid particles in the liquid for easy recovery and treatment.

[0047] Maintenance and warning:

[0048] When the liquid in the collection tank 12 reaches a certain height, the sensor 13 will promptly send a warning signal to prompt the technician to replace or clean the collection tank 12 to ensure the normal operation of the system.

[0049] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A self-cleaning exhaust pipe device for a photolithography machine, comprising a cavity (1), characterized in that: A connecting pipe (2) is fixedly installed at the bottom of the cavity (1), an exhaust pipe (10) is fixedly connected to one side of the bottom of the connecting pipe (2), the exhaust pipe (10) passes through the connecting pipe (2) and is connected to the interior of the cavity (1), a plurality of cleaning nozzles (11) are provided on the inner wall of the exhaust pipe (10), a collecting tank (12) is threadedly connected to the bottom of the exhaust pipe (10), a sensor (13) is provided on the inner wall of the interface between the exhaust pipe (10) and the collecting tank (12), an inner filter (14) is fixedly provided in the middle of the collecting tank (12), a baffle (15) is provided on the inner wall of the exhaust pipe (10), and the baffle (15) is provided on the right side of the interface between the exhaust pipe (10) and the collecting tank (12).

2. The self-cleaning exhaust pipe device for a lithography machine according to claim 1, characterized in that: A vacuum suction pipe (3) is passed through and fixedly provided inside the connecting pipe (2); a vacuum suction cup (4) is fixedly connected to the top of the vacuum suction pipe (3); a wafer (5) is provided on the vacuum suction cup (4); and the vacuum suction pipe (3) is connected to the inside of the vacuum suction cup (4).

3. The self-cleaning exhaust pipe device for a lithography machine according to claim 2, characterized in that: A photoresist nozzle (6) is fixedly mounted on the upper portion of the cavity (1); an outlet of the photoresist nozzle (6) is arranged inside the cavity (1); an end of the photoresist nozzle (6) away from the cavity (1) is connected to a photoresist liquid inlet pipe (7); and the photoresist nozzle (6) is arranged directly above the center of the wafer (5).

4. The self-cleaning exhaust pipe device for a lithography machine according to claim 3, characterized in that: A backside photoresist edge repair liquid inlet pipe (8) is passed through and fixedly connected to the side of the cavity (1); one end of the backside photoresist edge repair liquid inlet pipe (8) is fixedly connected to a backside photoresist edge repair nozzle (9); the backside photoresist edge repair nozzle (9) is arranged inside the cavity (1); and the backside photoresist edge repair nozzle (9) is arranged on the backside of one edge of the wafer (5).

5. The self-cleaning exhaust pipe device for a lithography machine according to claim 4, characterized in that: A liquid drain pipe (16) is fixedly provided at the bottom of the connecting pipe (2), the liquid drain pipe (16) passes through the connecting pipe (2) and is in communication with the interior of the cavity (1), the liquid drain pipe (16) is arranged on a side different from the exhaust pipe (10), and the liquid drain pipe (16) is arranged on the same side as the back side photoresist edge repair liquid inlet pipe (8) and the back side photoresist edge repair nozzle (9).

6. The self-cleaning exhaust pipe device for a lithography machine according to claim 5, characterized in that: A rotating motor (17) is fixedly provided at the bottom of the vacuum suction pipe (3), and a vacuum exhaust pipe (18) is fixedly connected to the bottom of the rotating motor (17).

7. The self-cleaning exhaust pipe device for a lithography machine according to claim 6, characterized in that: The vacuum suction pipe (3) is communicated with the vacuum exhaust pipe (18).

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