Camera module and jitter compensation packaging unit thereof

Abstract

The utility model discloses a camera module and a shake compensation packaging unit thereof, and the camera module comprises a lens unit and the shake compensation packaging unit. The jitter compensation packaging unit comprises an image sensor assembly, a jitter compensation assembly which bears the image sensor assembly and drives the image sensor assembly to move so as to realize optical anti-jitter, and a fixed circuit board which bears the jitter compensation assembly and supplies power to the jitter compensation assembly and the image sensor assembly. When a camera module of a non-mobile-phone digital product shakes, the driving assembly in the shake compensation packaging unit provides driving force to drive the moving circuit board to drive the image sensor assembly to move in the opposite direction of shake, so that the influence caused by shake is counteracted, the optical anti-shake function is achieved, and the imaging quality is improved.

Description

Technical Field

[0001] The utility model relates to a camera module and a jitter compensation packaging unit thereof. Background Art

[0002] For non-mobile phone camera modules, such as security surveillance cameras, sports cameras, law enforcement recorders, electronic telescopes, night vision devices, and other equipment, jitter or vibration generated during the shooting process will directly affect the clarity of the picture, potentially leading to a series of defects such as image blur, video quality degradation, loss of details, difficulty in capturing dynamic scenes, and the effects of long exposure. These defects may affect the clarity, stability, and performance of professional applications of images and videos, increase the workload of post-processing, reduce user experience, and may limit the scope of application of the product in professional fields.

[0003] For devices without shake compensation, the only way to improve image quality is to optimize device settings, use an external stabilizer, or improve the shooting environment. While some devices have electronic image stabilization (ESI), the image quality is relatively poor. EIS primarily uses image processing algorithms to offset shake or vibration, but this method can reduce image sensor utilization and compromise image clarity. Furthermore, EIS requires high computing power, which can result in reduced image quality or frame rate, while also increasing power consumption.

[0004] The statements herein merely provide background technology related to the present invention and do not necessarily constitute prior art. Utility Model Content

[0005] The purpose of the present utility model is to provide a camera module and a jitter compensation packaging unit thereof, which realizes the optical image stabilization function, offsets the influence of jitter by physically moving the photosensitive element, and improves the imaging quality of the camera module of non-mobile digital products.

[0006] In order to achieve the above-mentioned object, the present invention provides a jitter compensation packaging unit for non-mobile phone digital products, comprising:

[0007] An image sensor assembly, comprising an image sensor;

[0008] a jitter compensation component, which carries the image sensor component and drives the image sensor component to move to achieve optical image stabilization;

[0009] A fixed circuit board carries the jitter compensation component and provides electrical connection between the jitter compensation component and the image sensor component.

[0010] The jitter compensation component includes: a motion component, a driving component and an electrical connection unit;

[0011] The motion assembly includes a motion circuit board, and the image sensor assembly is fixed on the motion circuit board and is electrically connected to the motion circuit board;

[0012] The driving assembly includes a plurality of telescopic units, each of which includes a shape memory alloy wire, and a first clamping jaw and a second clamping jaw for respectively clamping two ends of the shape memory alloy wire. The first clamping jaw is fixedly disposed on the moving circuit board, and the second clamping jaw is fixedly disposed on the fixed circuit board. The driving assembly provides a driving force to drive the moving circuit board to move.

[0013] The electrical connection unit includes multiple groups of elastic electrical connection components, one end of the elastic electrical connection component is connected to the moving circuit board, and the other end is connected to the fixed circuit board. The elastic electrical connection component realizes electrical connection between the moving circuit board and the fixed circuit board, and provides a reset rebound force to keep the moving circuit board in the center position of the jitter compensation packaging unit.

[0014] The motion circuit board is rectangular, and each side of the motion circuit board is provided with a group of telescopic units;

[0015] Different first clamping jaws are respectively arranged at opposite corners of the motion circuit board;

[0016] Different second clamping jaws are respectively arranged at opposite corners of the fixed circuit board.

[0017] A first pad is provided on the moving circuit board, and the first clamp is fixedly provided on the first pad; a second pad is provided on the fixed circuit board, and the second clamp is fixedly provided on the second pad.

[0018] The driving component further includes a controller, which controls the magnitude and direction of the driving force of the driving component.

[0019] The driving component further includes a temperature sensor, which detects the temperature signal of the shape memory alloy wire in real time and sends it to the controller, so that the controller adjusts the driving force size and direction of the driving component in real time according to the temperature signal.

[0020] The fixed circuit board has a first hollow portion, the shape of the first hollow portion matches the shape of the moving circuit board, and the size of the first hollow portion is larger than the size of the moving circuit board, and the first hollow portion accommodates the moving circuit board.

[0021] The motion component further includes a height limiting component, which is arranged above the fixed circuit board. The motion circuit board is fixedly connected below the height limiting component, and the height limiting component provides a stable reference surface for the motion circuit board.

[0022] The height limiting assembly includes an upper cover unit and a limiting unit;

[0023] The upper cover unit comprises: an upper cover bracket fixedly arranged above the fixed circuit board and a first support plate arranged above the upper cover bracket, wherein the first support plate is made of ferromagnetic material;

[0024] The limiting unit includes: a limiting bracket and a second support plate fixedly arranged below the limiting bracket, and the moving circuit board is fixedly arranged below the second support plate; a plurality of adsorption components and a plurality of limiting components are arranged on the limiting bracket, and the adsorption components use permanent magnets, and the adsorption components are adsorbed to the first support plate, and the limiting components are located between the first support plate and the second support plate.

[0025] The upper cover bracket has a second hollow portion, the shape of the second hollow portion matches the shape of the limiting unit, and the size of the second hollow portion is larger than the size of the limiting unit. The limiting unit is located in the second hollow portion, and the limiting unit and the upper cover bracket are located in the same plane.

[0026] The first support plate has a third hollow portion, the size of the third hollow portion is larger than the size of the image sensor assembly, and the size of the third hollow portion is smaller than the size of the limiting unit.

[0027] The limiting bracket has a plurality of first installation grooves, and the adsorption assembly is fixedly arranged in the first installation grooves.

[0028] The limiting bracket has multiple second installation grooves, the limiting component is located in the second installation groove, the limiting component uses balls, each ball has the same size, and the balls are in contact with the first support plate and the second support plate respectively.

[0029] The limiting bracket has a fourth hollow portion, and the size of the fourth hollow portion is larger than the size of the image sensor assembly;

[0030] The second supporting plate has a fifth hollow portion, and a size of the fifth hollow portion is larger than a size of the image sensor assembly.

[0031] The jitter compensation package unit further includes a bottom cover unit, which is fixedly disposed below the fixed circuit board.

[0032] The bottom cover unit comprises: a bottom plate, and a connecting plate and a heat dissipation plate arranged on the bottom plate;

[0033] The connecting plate has a sixth hollow portion, the connecting plate is fixedly arranged on the bottom surface of the fixed circuit board, and the bottom plate is fixedly arranged on the bottom surface of the connecting plate;

[0034] The heat dissipation plate is located in the sixth hollow portion, and the heat dissipation plate is in contact with the motion circuit board and the bottom plate respectively.

[0035] The present invention also provides a camera module for non-mobile phone digital products, including:

[0036] lens unit;

[0037] The jitter compensation packaging unit is fixedly arranged below the lens unit to realize the optical image stabilization function.

[0038] This utility model applies optical image stabilization to camera modules of non-mobile digital products. By installing a jitter compensation package unit below the lens unit of the camera module, the image sensor assembly carried by the jitter compensation package unit is positioned below the lens and on the focal plane of the lens. Light captured by the lens is focused onto the image sensor assembly to form a clear image. When the camera module of a non-mobile digital product experiences jitter, the drive assembly in the jitter compensation package unit provides driving force to drive the motion circuit board, which in turn moves the image sensor assembly in the opposite direction of the jitter, thereby offsetting the effects of the jitter, achieving optical image stabilization and improving image quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a structural schematic diagram of a camera module provided by the utility model.

[0040] Figure 2 yes Figure 1 Schematic diagram of the explosion structure.

[0041] Figure 3 It is a schematic diagram of the cross-sectional structure of the jitter compensation packaging unit.

[0042] Figure 4 It is a schematic diagram of the exploded structure of the jitter compensation package unit.

[0043] Figure 5 This is a connection diagram of the moving circuit board and the fixed circuit board.

[0044] Figure 6 It is a structural diagram of the drive component.

[0045] Figure 7 It is a schematic diagram of the exploded structure of the upper cover unit.

[0046] Figure 8 It is a schematic diagram of the exploded structure of the limit assembly.

[0047] Figure 9 It is a schematic diagram of the combined relationship between the upper cover unit and the limit assembly.

[0048] Figure 10 It is a schematic diagram of the exploded structure of the bottom cover unit. DETAILED DESCRIPTION

[0049] The present invention is described in further detail below in conjunction with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the present invention will become clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the efficacy and purpose that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0050] The utility model provides a camera module, which is a camera module for non-mobile phone digital products, such as security monitoring, sports cameras, law enforcement recorders, electronic telescopes, night vision devices and other non-mobile phone digital products with image acquisition functions. Figure 1 and Figure 2 As shown, the camera module includes a lens unit 1 and a shake compensation packaging unit 2 fixedly arranged on the lens unit 1. Figure 2 As shown, the lens unit 1 includes a lens mount 101 and a lens 102. The lens mount 101 has an internal thread, and the lens 102 has an external thread. The lens 102 is assembled to the lens mount 101 through screw engagement. The focus position of the lens is adjusted by rotation to achieve the purpose of clear imaging. The lens mount 101 is fixedly connected to the jitter compensation packaging unit 2. Automatic optical axis alignment equipment can be used for auxiliary assembly. The lens unit 1 is placed on the jitter compensation packaging unit 2. After ensuring that the imaging center coincides with the lens center, epoxy resin or other types of glue are used to reinforce and fix it to enhance the stability of the connection.

[0051] like Figures 2 to 4 As shown, the jitter compensation packaging unit 2 includes an image sensor component 21, a jitter compensation component 22 that carries the image sensor component 21 and drives the image sensor component 21 to move to achieve optical image stabilization, and a fixed circuit board 23 that carries the jitter compensation component 22 and provides electrical connection between the jitter compensation component 22 and the image sensor component 21.

[0052] The image sensor assembly 21 serves as a photosensitive element, and includes an image sensor and its peripheral components.

[0053] The jitter compensation component 22 includes a motion component, a driving component 202 and an electrical connection unit 203. Figure 2 、 Figure 3 and Figure 5 As shown, the motion assembly includes a motion circuit board 201, and the image sensor assembly 21 is fixed to the motion circuit board 201. The image sensor assembly 21 moves with the movement of the motion circuit board 201. In this embodiment, electrical communication between the image sensor assembly 21 and the motion circuit board 201 is achieved through chip-scale packaging (CSP), chip-on-board (COB), chip-on-module (COM), or flip-chip packaging (FC). The use of chip packaging reduces signal transmission delay, improves electrical performance, allows for higher-density integration, enhances heat dissipation, improves overall reliability, and achieves smaller size and lower cost.

[0054] like Figure 5 and Figure 6As shown, the drive assembly 202 includes multiple sets of telescopic units 2021, each of which includes a shape memory alloy wire 2022, and a first clamping jaw 2023 and a second clamping jaw 2024 that respectively clamp the ends of the shape memory alloy wire 2022. The first clamping jaw 2023 is fixedly disposed on the moving circuit board 201, and the second clamping jaw 2024 is fixedly disposed on the fixed circuit board 23. In this embodiment, two first clamping jaws 2023 and two second clamping jaws 2024 are used. The two first clamping jaws 2023 are respectively fixedly disposed at opposite corners of the moving circuit board 201, and each first clamping jaw 2023 is connected to a different shape memory alloy wire 2022. Similarly, the two second clamping jaws 2024 are also respectively fixedly disposed at opposite corners of the fixed circuit board 23, and each second clamping jaw 2024 is also connected to a different shape memory alloy wire 2022. The fixed circuit board provides current to the shape memory alloy wire 2022 through the second clamping jaws 2024. The two first clamping jaws 2023 and the two second clamping jaws 2024 are positioned at the four corners of the rectangle, allowing the four shape memory alloy wires 2022 to be positioned along the four sides of the moving circuit board 201. This evenly distributes the telescopic units 2021 along the edges of the moving circuit board 201, allowing the driving force provided by the drive assembly 202 to better act on the moving circuit board 201. Pads (not shown) can be welded to the diagonal corners of the moving circuit board 201 before the first clamping jaws 2023 are secured to the pads using laser welding. Similarly, the second clamping jaws 2024 are secured to the pads at the diagonal corners of the fixed circuit board 23. The pads elevate the clamping jaws, preventing them from colliding and deforming with the circuit board, thus protecting them. Mounting the clamping jaws on the pads facilitates their removal while preventing friction with the circuit board, reducing circuit board wear.

[0055] The first clamping jaw 2023 and the second clamping jaw 2024 in each of the telescopic units 2021 are respectively connected to the moving circuit board 201 and the fixed circuit board 23, so that the shape memory alloy wire 2022 is in a cantilever state with one end fixed and the other end free. The shape memory alloy wire 2022 is an alloy material with a shape memory effect, which has the characteristics of thermal contraction and cold expansion, giving it a unique shape memory effect and super elasticity.

[0056] like Figure 5As shown, the drive assembly 202 further includes a controller 2025 and a temperature sensor 2026. Both the controller 2025 and the temperature sensor 2026 are disposed on the fixed circuit board 23. The fixed circuit board 23 provides an electrical connection between the controller 2025 and the temperature sensor 2026, enabling signal transmission between the controller 2025 and the temperature sensor 2026. The controller 2025 precisely controls the magnitude and direction of the current supplied to the shape memory alloy wire 2022 to achieve precise control of the length change of the shape memory alloy wire 2022. The temperature sensor 2026 is used to detect the temperature of the shape memory alloy wire 2022 in real time, and the temperature signal is converted into an electrical signal and then fed back to the controller 2025. The controller 2025 generates a corresponding control signal based on the received temperature signal, thereby accurately adjusting the magnitude and direction of the current provided to the shape memory alloy wire 2022, so that the length of the shape memory alloy wire 2022 changes accordingly, thereby driving the movement of the moving circuit board 201, realizing the translation of the moving circuit board 201 along the X direction and the Y direction, and the rotation angle of the moving circuit board 201 around the Z axis, so as to achieve micro-distance movement and realize the jitter compensation function.

[0057] like Figure 4 As shown, the electrical connection unit 203 includes multiple groups of elastic electrical connection components 2031, one end of the elastic electrical connection component 2031 is connected to the moving circuit board 201, and the other end is connected to the fixed circuit board 23. The elastic electrical connection component 2031 realizes the electrical connection between the moving circuit board 201 and the fixed circuit board 23, and provides a reset rebound force to keep the moving circuit board 201 in the center position of the jitter compensation packaging unit 2.

[0058] like Figure 3 As shown, the fixed circuit board 23 is connected to an external power source (not shown), which provides power to the fixed circuit board 23, the jitter compensation component 22, and the image sensor component 21. Two conductive paths are formed in the jitter compensation package unit 2: a first conductive path: external power source → fixed circuit board 23 → electrical connection unit 203 → moving circuit board 201 → image sensor component 21; and a second conductive path: external power source → fixed circuit board 23 → driving component 202. The external power source supplies power to the image sensor component 21 along the first conductive path, and supplies power to the driving component 202 along the second conductive path.

[0059] The fixed circuit board 23 also has a horizontal limiting function. The fixed circuit board 23 has a first hollow portion 231. The shape of the first hollow portion 231 matches the shape of the moving circuit board 201, and the size of the first hollow portion 231 is larger than the size of the moving circuit board 201. After the moving circuit board 201 and the fixed circuit board 23 are connected together through the electrical connection unit 203, the moving circuit board 201 is located in the first hollow portion 231, so that the moving circuit board 201 and the fixed circuit board 23 are located in the same plane, so as to reduce the size of the jitter compensation package unit 2 in the vertical direction, thereby reducing the overall volume of the jitter compensation package unit 2.

[0060] The present invention mounts the jitter compensation package unit 2 below the lens unit 1, positioning the image sensor assembly 21 below the lens 102 and on the focal plane of the lens 102. Light captured by the lens 102 is focused onto the image sensor assembly 21 to form a clear image. When a non-mobile phone camera module experiences jitter, the drive assembly 202 provides the driving force to drive the motion circuit board 201, driving the image sensor assembly 21 in the opposite direction of the jitter, thereby offsetting the effects of the jitter and improving image quality.

[0061] In another embodiment of the present invention, the motion component further includes a height limiting component, and the motion circuit board 201 is fixedly connected to the height limiting component. When the jitter compensation component 22 is working, the height limiting component can provide a stable reference surface for the motion circuit board 201 to ensure the inclination of the optical axis of the image sensor component 21.

[0062] like Figure 3 、 Figure 4 and Figure 7 As shown, the height limiting assembly includes an upper cover unit 204 and a limiting unit 205. The upper cover unit 204 includes an upper cover bracket 2041 and a first support plate 2042 disposed above the upper cover bracket 2041. Figure 3 As shown, the upper cover bracket 2041 is fixed on the fixed circuit board 23 by dispensing glue, as shown in FIG. Figure 7As shown, the upper cover bracket 2041 has a recessed portion 2043, the size of which matches the size of the first support plate 2042, for accommodating the first support plate 2042 and preventing it from falling off. The upper cover bracket 2041 also has a second hollow portion 2044, the shape of which matches the shape of the limiting unit 205 and is larger than the size of the limiting unit 205, so that the limiting unit 205 is located within the second hollow portion 2044, so that the limiting unit 205 and the upper cover bracket 2041 are located in the same plane, thereby reducing the vertical size of the jitter compensation package unit 2 and thus reducing the overall volume of the jitter compensation package unit 2. The first support plate 2042 is made of ferromagnetic material to absorb the limiting unit 205 and is fixed to the top of the upper cover bracket 2041 using thermosetting adhesive to increase the stability of the structural connection. The first support plate 2042 has a third hollow portion 2045, the size of which is larger than the size of the image sensor component 21 to avoid blocking the image sensor component 21 and affecting imaging. At the same time, the size of the third hollow portion 2045 is smaller than the size of the limiting unit 205 to prevent the limiting unit 205 from falling off from the third hollow portion 2045, thereby ensuring that the first support plate 2042 can confine the limiting unit 205 within the second hollow portion 2044.

[0063] like Figure 8 As shown, the limiting unit 205 includes a limiting bracket 2051 and a second support plate 2052 disposed below the limiting bracket 2051, as well as multiple adsorption components 2053 and multiple limiting units 2054 disposed within the limiting bracket 2051. The limiting bracket 2051 has a fourth hollow portion 2055, the size of which is larger than the size of the image sensor component 21. Similarly, the second support plate 2052 has a fifth hollow portion 2056, the size of which is larger than the size of the image sensor component 21, so as to avoid blocking the image sensor component 21 and affecting imaging. Figure 9 As shown, the top surface of the second support plate 2052 is fixedly connected to the bottom of the limiting bracket 2051 by using conductive glue, and the top of the motion circuit board 201 is fixedly connected to the bottom surface of the second support plate 2052 by using conductive glue.

[0064] like Figure 8As shown, the limiting bracket 2051 has a plurality of first mounting grooves 2057, which are used to accommodate and mount the adsorption assembly 2053. In this embodiment, the adsorption assembly 2053 uses a permanent magnet, so that the adsorption assembly 2053 can be adsorbed onto the first support plate 2042. In this embodiment, the depth of the first mounting grooves 2057 can be less than the thickness of the limiting bracket 2051. In this case, the bottom of the adsorption assembly 2053 is connected to the first mounting grooves 2057 using conductive adhesive. The bottom of the adsorption assembly 2053 is fixedly connected to the limiting bracket 2051 as a whole. When the top of the adsorption assembly 2053 is adsorbed onto the bottom surface of the first support plate 2042, the motion circuit board 201 and the upper cover unit 204 can be connected together through the limiting unit 205. In other embodiments, the depth of the first mounting groove 2057 can be equal to the thickness of the limiting bracket 2051. In this case, the first mounting groove 2057 is actually a through groove connecting the upper and lower surfaces of the limiting bracket 2051. At this time, when installing the adsorption component 2053, it is necessary to first place the adsorption component 2053 into the first mounting groove 2057, and then use conductive glue to fix the bottom of the adsorption component 2053 to the top surface of the second support plate 2052, so that the bottom of the adsorption component 2053 and the second support plate 2052 are fixedly connected as one. When the top of the adsorption component 2053 is adsorbed to the bottom surface of the first support plate 2042, the motion circuit board 201 and the upper cover unit 204 can be connected together through the limiting unit 205.

[0065] The limiting bracket 2051 also has a plurality of second mounting grooves 2058, and the second mounting grooves 2058 are used to accommodate the limiting units 2054. In this embodiment, the depth of the second mounting grooves 2058 is equal to the thickness of the limiting bracket 2051, that is, the second mounting grooves 2058 are through grooves connecting the upper and lower surfaces of the limiting bracket 2051, so that after the limiting units 2054 are placed in the second mounting grooves 2058, the top and bottom of the limiting units 2054 can contact the first support plate 2042 and the second support plate 2052 respectively. Figure 9As shown, in this embodiment, the limiting unit 2054 is a ball bearing. After the ball bearing surface is coated with lubricating grease, it is placed in the second mounting groove 2058. When the top of the adsorption assembly 2053 is adsorbed to the bottom surface of the first support plate 2042, the first and second support plates 2042 and 2052 sandwich the ball bearing, and the ball bearing rolls tangentially with the first and second support plates 2042 and 2052, respectively. When the driving assembly 202 drives the moving circuit board 201 to move, the moving circuit board 201 also drives the limiting unit 205 to move. At this time, the ball bearing can roll between the first and second support plates 2042 and 2052. Because all the ball bearings are of the same size, when the moving circuit board 201 moves, the ball bearings can limit the gap between the moving circuit board 201 and the first support plate 2042, providing a uniform support effect, providing a stable reference surface for the moving circuit board 201, and ensuring the optical axis inclination of the image sensor assembly 21.

[0066] The first mounting grooves 2057 and the second mounting grooves 2058 are evenly distributed on the limiting bracket 2051, and the number and distribution of the first mounting grooves 2057 and the second mounting grooves 2058 are adjusted according to the shape of the limiting bracket 2051. Figure 8 As shown, in this embodiment, the limiting bracket 2051 is rectangular, and the number of the first mounting grooves 2057 is set to at least 4, and at least one first mounting groove 2057 is distributed on each side of the limiting bracket 2051. Accordingly, each first mounting groove 2057 is installed with an adsorption component 2053. By evenly arranging the first mounting grooves 2057 and the adsorption components 2053 on the limiting bracket 2051, a uniform distribution of adsorption force is achieved, ensuring firm contact between the upper cover unit 204 and the limiting unit 205 to prevent loosening. Similarly, the number of the second mounting grooves 2058 is also set to at least 4, and at least one second mounting groove 2058 is distributed on each side of the limiting bracket 2051. Accordingly, one limiting unit 2054 is installed in each second mounting groove 2058. By evenly arranging the second mounting grooves 2058 and the limiting units 2054 on the limiting bracket 2051, balanced support is achieved, ensuring the parallel relationship between the upper cover unit 204 and the limiting unit 205, and ensuring that each point on the moving circuit board 201 is on the same reference plane, so as to ensure the inclination of the optical axis of the image sensor component 21.

[0067] like Figure 3 、 Figure 4 and Figure 10As shown, the jitter compensation package unit 2 further includes a bottom cover unit 206, which is disposed below the fixed circuit board 23 and is fixedly connected to the fixed circuit board 23. The bottom cover unit 206 is used to provide support and protection for the entire jitter compensation package unit 2. Figure 10 As shown, the bottom cover unit 206 includes a bottom plate 2061, a connecting plate 2062, and a heat dissipation plate 2063 disposed on the bottom plate 2061. The connecting plate 2062 has a sixth hollow portion 2064 for accommodating the heat dissipation plate 2063. The bottom surface of the connecting plate 2062 is fixedly connected to the bottom plate 2061 by means of thermosetting adhesive, and the top surface of the connecting plate 2062 is fixedly connected to the bottom surface of the fixed circuit board 23 by means of thermosetting adhesive. The heat sink 2063 is located between the motion circuit board 201 and the base plate 2061. The heat sink 2063 is made of copper, while the connecting plate 2062 and the base plate 2061 are both made of steel. The copper heat sink 2063 can effectively conduct the heat accumulated on the jitter compensation component 22. The copper heat sink 2063 quickly conducts the heat on the motion circuit board 201 to the steel connecting plate 2062 and the base plate 2061. The heat is transmitted from the internal high-temperature area to the external low-temperature area. The steel connecting plate 2062 and the base plate 2061 are in contact with the external air, and the surface air flow will dissipate the heat. The steel connecting plate 2062 and the base plate 2061 can not only receive the heat transferred from the heat sink 2063, but also protect the electrical connection unit 203.

[0068] This utility model applies optical image stabilization to non-mobile camera modules, achieving optical image stabilization and improving image quality. It significantly improves image stability and reduces blur caused by environmental vibrations or vehicle movement. Especially at night or in low-light environments, combined with a high-sensitivity sensor, it captures clearer images with less noise. Furthermore, in dynamic scenes, such as when recording with a dashcam, optical image stabilization ensures continuous and stable images, preventing jitter caused by vehicle movement. Some dashcams equipped with optical image stabilization can also be transformed into action cameras, suitable for outdoor sports, cycling, and other activities, providing stable first-person perspective video. Optical image stabilization also helps quickly adjust exposure in high-contrast environments with drastic lighting changes, maintaining correct exposure and avoiding over- or underexposure. In the event of an accident, it reduces camera shake caused by impact, ensuring a clear recording of the accident, facilitating subsequent accountability assessment and evidence collection. Furthermore, it supports multiple shooting modes, such as slow motion and timed photography, to meet the needs of different scenarios, enhancing the overall shooting experience and video recording reliability.

[0069] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0070] In the description of the present invention, it should be understood that the terms "center," "height," "thickness," "up," "down," "vertical," "horizontal," "top," "bottom," "inside," "outside," "axial," "radial," "circumferential," and the like, indicating positions or location relationships, are based on the positions or location relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0071] In the description of this utility model, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0072] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0073] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. After reading the above description, various modifications and alternatives to the present invention will be readily apparent to those skilled in the art. Therefore, the scope of protection of the present invention shall be defined by the appended claims.

Claims

1. A jitter compensation packaging unit for non-mobile digital products, characterized in that: Include: An image sensor assembly, comprising an image sensor; a jitter compensation component, which carries the image sensor component and drives the image sensor component to move to achieve optical image stabilization; A fixed circuit board carries the jitter compensation component and provides electrical connection between the jitter compensation component and the image sensor component.

2. The jitter compensation package unit according to claim 1, wherein: The jitter compensation component includes: a motion component, a driving component and an electrical connection unit; The motion assembly includes a motion circuit board, and the image sensor assembly is fixed on the motion circuit board and is electrically connected to the motion circuit board; The driving assembly includes a plurality of telescopic units, each of which includes a shape memory alloy wire, and a first clamping jaw and a second clamping jaw for respectively clamping two ends of the shape memory alloy wire. The first clamping jaw is fixedly disposed on the moving circuit board, and the second clamping jaw is fixedly disposed on the fixed circuit board. The driving assembly provides a driving force to drive the moving circuit board to move. The electrical connection unit includes multiple groups of elastic electrical connection components, one end of the elastic electrical connection component is connected to the moving circuit board, and the other end is connected to the fixed circuit board. The elastic electrical connection component realizes electrical connection between the moving circuit board and the fixed circuit board, and provides a reset rebound force to keep the moving circuit board in the center position of the jitter compensation packaging unit.

3. The jitter compensation package unit according to claim 2, wherein: The motion circuit board is rectangular, and each side of the motion circuit board is provided with a group of telescopic units; Different first clamping jaws are respectively arranged at opposite corners of the motion circuit board; Different second clamping jaws are respectively arranged at opposite corners of the fixed circuit board.

4. The jitter compensation package unit according to claim 2, wherein: A first pad is provided on the moving circuit board, and the first clamp is fixedly provided on the first pad; a second pad is provided on the fixed circuit board, and the second clamp is fixedly provided on the second pad.

5. The jitter compensation package unit according to claim 2, wherein: The driving component further includes a controller, which controls the magnitude and direction of the driving force of the driving component.

6. The jitter compensation package unit according to claim 5, wherein: The driving component further includes a temperature sensor, which detects the temperature signal of the shape memory alloy wire in real time and sends it to the controller, so that the controller adjusts the driving force size and direction of the driving component in real time according to the temperature signal.

7. The jitter compensation package unit according to claim 2, wherein: The fixed circuit board has a first hollow portion, the shape of the first hollow portion matches the shape of the moving circuit board, and the size of the first hollow portion is larger than the size of the moving circuit board, and the first hollow portion accommodates the moving circuit board.

8. The jitter compensation package unit according to claim 2, wherein: The motion component further includes a height limiting component, which is arranged above the fixed circuit board. The motion circuit board is fixedly connected below the height limiting component, and the height limiting component provides a stable reference surface for the motion circuit board.

9. The jitter compensation package unit according to claim 8, wherein: The height limiting assembly includes an upper cover unit and a limiting unit; The upper cover unit comprises: an upper cover bracket fixedly arranged above the fixed circuit board and a first support plate arranged above the upper cover bracket, wherein the first support plate is made of ferromagnetic material; The limiting unit includes: a limiting bracket and a second support plate fixedly arranged below the limiting bracket, and the moving circuit board is fixedly arranged below the second support plate; a plurality of adsorption components and a plurality of limiting components are arranged on the limiting bracket, and the adsorption components use permanent magnets, and the adsorption components are adsorbed to the first support plate, and the limiting components are located between the first support plate and the second support plate.

10. The jitter compensation package unit according to claim 9, wherein: The upper cover bracket has a second hollow portion, the shape of the second hollow portion matches the shape of the limiting component, and the size of the second hollow portion is larger than the size of the limiting unit. The limiting unit is located in the second hollow portion, and the limiting unit and the upper cover bracket are located in the same plane.

11. The jitter compensation package unit according to claim 9, wherein: The first support plate has a third hollow portion, the size of the third hollow portion is larger than the size of the image sensor assembly, and the size of the third hollow portion is smaller than the size of the limiting unit.

12. The jitter compensation package unit according to claim 9, wherein: The limiting bracket has a plurality of first installation grooves, and the adsorption assembly is fixedly arranged in the first installation grooves.

13. The jitter compensation package unit according to claim 9, wherein: The limiting bracket has multiple second installation grooves, the limiting component is located in the second installation groove, the limiting component uses balls, each ball has the same size, and the balls are in contact with the first support plate and the second support plate respectively.

14. The jitter compensation package unit according to claim 9, wherein: The limiting bracket has a fourth hollow portion, and the size of the fourth hollow portion is larger than the size of the image sensor assembly; The second supporting plate has a fifth hollow portion, and a size of the fifth hollow portion is larger than a size of the image sensor assembly.

15. The jitter compensation package unit according to claim 2, wherein: The jitter compensation package unit further includes a bottom cover unit, which is fixedly disposed below the fixed circuit board.

16. The jitter compensation package unit according to claim 15, wherein: The bottom cover unit comprises: a bottom plate, and a connecting plate and a heat dissipation plate arranged on the bottom plate; The connecting plate has a sixth hollow portion, the connecting plate is fixedly arranged on the bottom surface of the fixed circuit board, and the bottom plate is fixedly arranged on the bottom surface of the connecting plate; The heat dissipation plate is located in the sixth hollow portion, and the heat dissipation plate is in contact with the motion circuit board and the bottom plate respectively.

17. A camera module for non-mobile digital products, characterized in that: Include: lens unit; The jitter compensation packaging unit according to any one of claims 1 to 16, which is fixedly arranged below the lens unit to achieve an optical image stabilization function.

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