Appearance detection machine for QFN / LGA / BGA packaging chip

Abstract

An appearance detector for QFN / LGA / BGA packaged chips relates to the field of detection equipment and comprises a frame. The top of the rack is provided with a four-axis robot, a rotatable index plate, a first camera used for detecting a chip bottom bonding pad and a chip grabbing angle, a second camera used for detecting the bottom flatness of a chip, four third cameras used for detecting the four side faces of the chip respectively, and a fourth camera used for detecting the top face of the chip. The first material taking manipulator device is used for grabbing the chips to the position above the second camera, the second material taking manipulator device is used for grabbing the chips to the four side face detection positions, the conveying device is used for conveying the chips detected to be qualified, the NG tray is used for bearing the chips detected to be unqualified, and a plurality of chip placing jigs are arranged on the top face of the index plate. According to the utility model, the comprehensive automatic detection of six surfaces of the vehicle-mounted chip is realized, the detection efficiency is obviously improved, the time and the cost of manual operation are reduced, and the detection accuracy is improved at the same time.

Description

Technical Field

[0001] The utility model relates to the field of detection equipment, in particular to an appearance detection machine for QFN / LGA / BGA packaged chips. Background Art

[0002] As core components of modern automotive electronic systems, the appearance quality of automotive chips is crucial. Currently, automotive chips are primarily packaged in QFN, LGA, and BGA packaging options. With the automotive industry's growing demand for intelligent and automated production, the scale of automotive chip production has rapidly expanded, raising the bar for inspection efficiency and accuracy. In the past, post-package visual inspection of automotive chips often relied on manual labor. This method was not only time-consuming and labor-intensive, but also difficult to guarantee 100% inspection accuracy, often leading to undetected defects such as scratches, cracks, contamination, and missing pins. If these defects are not effectively screened, they can lead to quality issues during subsequent vehicle manufacturing and use, impacting vehicle performance and even endangering driving safety, leading to customer dissatisfaction and complaints. Utility Model Content

[0003] The utility model provides an appearance inspection machine for QFN / LGA / BGA packaged chips, the main purpose of which is to overcome the problem of low inspection efficiency and accuracy caused by manual inspection of the appearance of existing packaged automotive chips.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] The appearance inspection machine for QFN / LGA / BGA packaged chips includes a frame, the top of which is provided with a four-axis robot, a rotatable indexing plate, a first camera for detecting the bottom pad of the chip and the chip grabbing angle, a second camera for detecting the flatness of the bottom of the chip, four third cameras for detecting the four sides of the chip respectively, a fourth camera for detecting the top surface of the chip, a first material-picking robot device for grabbing the chip above the second camera, a second material-picking robot device for grabbing the chip to the four side inspection positions, a conveying device for transmitting qualified chips and an NG tray for receiving unqualified chips. The top surface of the indexing plate is provided with multiple chip placement jigs.

[0006] Furthermore, the first camera, the second camera, the four third cameras and the fourth camera are respectively distributed on four sides of the indexing plate.

[0007] Furthermore, a divider is provided on the top of the frame, and the bottom of the dividing plate is fixedly connected to the top of the divider.

[0008] Furthermore, the first camera, the four third cameras and the fourth camera are all area array cameras, and the second camera is a 3D line scan camera.

[0009] Furthermore, the first material picking robot device includes a first mounting frame, a first cylinder, a first linear slide module and a first material picking robot. The first cylinder is arranged on the first mounting frame. The first cylinder is connected to the first linear slide module and drives the first linear slide module and the first material picking robot to move left and right. The first material picking robot is connected to the first linear slide module and the first linear slide module drives the first material picking robot to move up and down.

[0010] Furthermore, the second material picking robot device includes a second mounting frame, a second cylinder, a second linear slide module and a second material picking robot. The second cylinder is arranged on the second mounting frame. The second cylinder is connected to the second linear slide module and drives the second linear slide module and the second material picking robot to move left and right. The second material picking robot is connected to the second linear slide module and the second linear slide module drives the second material picking robot to move up and down.

[0011] Furthermore, the conveying device includes a left support rod, a right support rod, a left conveyor belt and a right conveyor belt. The left conveyor belt and the right conveyor belt are respectively arranged on the right side of the left support rod and the left side of the right support rod. A collection frame is provided between the top surfaces of the left conveyor belt and the right conveyor belt.

[0012] Furthermore, the width between the left support rod and the right support rod is adjustable.

[0013] Furthermore, a first workstation, a second workstation, a third workstation and a fourth workstation are arranged from left to right between the left support rod and the right support rod. The first workstation is provided with a first placement space, a liftable first intercepting rod and a liftable first lifting seat. The first intercepting rod is located at the rear side of the first lifting seat. The second workstation is provided with a liftable second intercepting rod, a left baffle that can be moved left and right, and a front baffle that can be moved forward and backward and lifted. The second intercepting rod is located at the rear side of the front baffle. The third workstation is provided with a third placement space, a liftable intercepting seat and a liftable third lifting seat. The fourth workstation is provided with a fourth placement space, a liftable third intercepting rod and a liftable fourth lifting seat.

[0014] Furthermore, the four-axis robot is provided with a code reader.

[0015] From the above description of the utility model, it can be seen that compared with the prior art, the utility model has the following advantages: the four-axis robot grabs the chip to the top of the first camera to detect the chip bottom pad and the chip grabbing angle, and then grabs the chip to the chip placement jig, the dividing plate rotates a certain angle, the first material picking robot device grabs the chip to the top of the second camera to detect the flatness of the chip bottom, after the detection is completed, the first material picking robot device places the chip on the chip placement jig, and then the dividing plate continues to rotate a certain angle, the second material picking robot device grabs the chip to the four side detection positions, the four third cameras respectively detect the four sides of the chip, after the detection is completed, the second material picking robot device places the chip on the chip placement jig, and then the dividing plate continues to rotate a certain angle, the fourth camera detects the top surface of the chip, thereby completing all detections of the six sides of the chip, and then the dividing plate continues to rotate a certain angle, the four-axis robot places the qualified chips on the conveying device, and places the unqualified chips on the NG tray. The utility model realizes comprehensive automatic detection of the six sides of the packaged vehicle-mounted chip, significantly improves the detection efficiency, reduces the time and cost of manual operation, and also improves the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural diagram of the utility model.

[0017] Figure 2 This is a structural diagram of the utility model without the frame.

[0018] Figure 3 This is a structural diagram of the four-axis robot of the present utility model.

[0019] Figure 4 This is a structural diagram of the indexing plate of the utility model.

[0020] Figure 5 This is a structural diagram of the first material reclaiming manipulator device of the present utility model.

[0021] Figure 6 This is a structural diagram of the second material reclaiming robot device of the present utility model.

[0022] Figure 7 This is a structural diagram of the conveying device of the present utility model.

[0023] Figure 8 This is a partial structural diagram of the top of the rack of the utility model.

[0024] Figure 9 for Figure 8 A structural diagram from another angle.

[0025] Figure 10This is a structural diagram of the collection frame of the present utility model. DETAILED DESCRIPTION

[0026] Reference Figures 1 to 3 、 Figure 9 The appearance inspection machine for QFN / LGA / BGA packaged chips includes a frame 1. The top of the frame 1 is provided with a four-axis robot 2, a rotatable indexing plate 3, a first camera 4 for detecting the bottom pad of the chip and the chip grabbing angle, a second camera 5 for detecting the flatness of the bottom of the chip, four third cameras 6 for detecting the four sides of the chip respectively, a fourth camera 7 for detecting the top surface of the chip, a first material-picking robot device 8 for grabbing the chip above the second camera 5, a second material-picking robot device 9 for grabbing the chip to the four side inspection positions, a conveying device 10 for transmitting qualified chips, and an NG tray 11 for receiving unqualified chips. The top surface of the indexing plate 3 is provided with four chip placement jigs 12. The four-axis robot 2 is an existing device, and its specific structure is not repeated here. The four-axis robot 2 is provided with a first suction nozzle 21 for sucking chips.

[0027] Reference Figure 1 、 Figure 2 、 Figure 4 and Figure 9 The first camera 4, second camera 5, four third cameras 6, and fourth camera 7 are respectively distributed on the four sides of the indexing plate 3. The first camera 4 and second camera 5 are located below the indexing plate 3, and the fourth camera 7 is located above the indexing plate 3. The first camera 4, four third cameras 6, and fourth camera 7 are all area array cameras, and the second camera 5 is a 3D line scan camera. A divider 13 is provided at the top of the frame 1. The bottom of the indexing plate 3 is fixedly connected to the top of the divider 13. The divider 13 drives the indexing plate 3 to rotate, and the indexing plate 3 rotates 90 degrees each time.

[0028] Reference Figure 2 and Figure 5 The first retrieving robot device 8 includes a first mounting frame 81, a first cylinder 82, a first linear slide module 83, and a first retrieving robot 84. The first mounting frame 81 is connected to the top of the frame 1. The first cylinder 82 is arranged on the first mounting frame 81. The first cylinder 82 is connected to the first linear slide module 83 and drives the first linear slide module 83 and the first retrieving robot 84 to move left and right. The first retrieving robot 84 is connected to the first linear slide module 83, and the first linear slide module 83 drives the first retrieving robot 84 to move up and down. The first retrieving robot 84 is provided with a second suction nozzle 85 for sucking chips.

[0029] Reference Figure 2 and Figure 6The second retrieving robot device 9 includes a second mounting frame 91, a second cylinder 92, a second linear slide module 93, and a second retrieving robot 94. The second mounting frame 91 is connected to the top of the frame 1. The second cylinder 92 is located on the second mounting frame 91. The second cylinder 92 is connected to the second linear slide module 93 and drives the second linear slide module 93 and the second retrieving robot 94 to move left and right. The second retrieving robot 94 is connected to the second linear slide module 93, and the second linear slide module 93 drives the second retrieving robot 94 to move up and down. The second retrieving robot 94 is provided with a third suction nozzle 95 for sucking chips.

[0030] Reference Figure 2 、 Figure 7 and Figure 10 The conveying device 10 includes a left support rod 14, a right support rod 15, a left conveyor belt 16 and a right conveyor belt 17. The left conveyor belt 16 and the right conveyor belt 17 are respectively arranged on the right side of the left support rod 14 and the left side of the right support rod 15. A collection frame 18 is provided between the top surfaces of the left conveyor belt 16 and the right conveyor belt 17. The collection frame 18 is provided with a plurality of chip placement slots 181. The width between the left support rod 14 and the right support rod 15 is adjustable. Specifically, the left side of the left support rod 14 and the right side of the right support rod 15 are provided with a first screw nut 19, and a first screw rod 20 is provided between the first screw nut 19 on the left support rod 14 and the first screw nut 19 on the right support rod 15. One end of the first screw rod 20 is connected to a handwheel 22, and a slide rail 53 is provided on the top of the frame 1, and a slider 54 is provided at the bottom of the front end of the left support rod 14 and the right support rod 15. The slider 54 slides with the slide rail 53, and the width between the left support rod 14 and the right support rod 15 can be adjusted by shaking the handwheel 22 to adapt to collection frames 18 of different sizes.

[0031] Reference Figure 2 、 Figure 7 and Figure 8, a first workstation 23, a second workstation 24, a third workstation 25 and a fourth workstation 26 are arranged from left to right between the left support rod 14 and the right support rod 15. The first workstation 23 is provided with a first placement space, a liftable first intercepting rod 27 and a liftable first lifting seat 28. The first placement space is composed of four first vertical rods 29 with an L-shaped cross-section. The first lifting seat 28 is located below the first placement space. There are two first intercepting rods 27 and they are arranged on the left and right. The two first intercepting rods 27 are located on the rear side of the first lifting seat 28. The second workstation 24 is provided with a liftable second intercepting rod 241, a left baffle 30 that can move left and right, and a front baffle 31 that can move forward and backward and can be lifted and lowered. There are two second intercepting rods 241 and they are arranged on the left and right. The two second intercepting rods 241 are located on the rear side of the front baffle 31. The third workstation 25 is provided with a third placement space, a liftable intercepting seat 32, and a liftable third lifting seat 33. The third placement space is composed of four second vertical rods 34 with an L-shaped cross section. The third lifting seat 33 is located below the third placement space, and the intercepting seat 32 is located behind the third lifting seat 33. The fourth workstation 26 is provided with a fourth placement space, a liftable third intercepting rod 35, and a liftable fourth lifting seat 36. The fourth placement space is composed of four third vertical rods 37 with an L-shaped cross section. The fourth lifting seat 36 is located below the fourth placement space. Two third intercepting rods 35 are provided and arranged on the left and right. The two third intercepting rods 35 are located behind the fourth lifting seat 36.

[0032] Reference Figure 2 、 Figures 7 to 9 , the first intercepting rod 27 is driven to rise and fall by a first cylinder 38, and the lifting method of the second intercepting rod 29 and the third intercepting rod 35 is the same as the lifting method of the first intercepting rod; the first jacking seat 28 is lifted and lowered by the cooperation of the second screw rod 39 and the second screw nut 40. Specifically, the top of the frame 1 is provided with a first motor 41 and a second screw nut 40, the second screw rod 39 passes through the second screw nut 40, the first motor 41 and the second screw rod 39 are connected by a belt 42, the first jacking seat 28 is connected to the top of the second screw rod 39, and the lifting method of the fourth jacking seat 36 is the same as the lifting method of the first jacking seat 28; the left baffle 30 is driven to move left and right by a second cylinder 43; the front baffle 31 is driven to rise and fall by a third cylinder 44, and the third cylinder 44 is driven to move forward and backward by a fourth cylinder 45, thereby realizing the forward and backward movement and lifting of the front baffle 31; the intercepting seat 32 is driven to rise and fall by a fifth cylinder 46; the third jacking seat 33 is driven to rise and fall by a sixth cylinder 47.

[0033] Reference Figures 7 to 9In this embodiment, the left conveyor belt 16 and the right conveyor belt 17 are each divided into three sections. Each section of the left conveyor belt 16 and the right conveyor belt 17 is driven by a second motor 48. Specifically, the second motor 48 is disposed at the top of the frame 1. A rotating rod 49 is disposed between the left support rod 14 and the right support rod 15. The rotating rod 49 is equipped with two conveyor pulleys 50. Each section of the left conveyor belt 16 and the right conveyor belt 17 corresponds to a corresponding conveyor pulley 50 and is driven by the conveyor pulleys 50. The second motor 48 is connected to the rotating rod 49 via a belt 51. Of course, the left conveyor belt 16 and the right conveyor belt 17 can also be a single, integral piece.

[0034] Reference Figures 1 to 10The design principle of the present invention is as follows: the chip to be tested is placed on the front side of the four-axis robot 2, and the four-axis robot 2 grabs the chip to the top of the first camera 4 to detect the chip bottom pad and the chip grabbing angle. If there is a deviation in the chip grabbing angle, the four-axis robot 2 can directly adjust it, and then grab the chip to the chip placement fixture 12, the indexing plate 3 rotates 90 degrees, and the first material picking manipulator device 8 grabs the chip to the top of the second camera 5 to detect the flatness of the chip bottom. After the detection is completed, the first picking manipulator device 8 is used to pick up the chip. The material robot device 8 then places the chip on the chip placement fixture 12, and then the dividing plate 3 continues to rotate 90°. The second material picking robot device 9 grabs the chip to the four side detection positions, and the four third cameras 6 respectively detect the four sides of the chip. After the detection is completed, the second material picking robot device 9 places the chip on the chip placement fixture 12, and then the dividing plate 3 continues to rotate 90°. The fourth camera 7 detects the top surface of the chip, thereby completing all detections of the six sides of the chip, and then the dividing plate 3 continues to rotate 90°. The first placement space is provided with collection frames 18 stacked up and down, and the top surface of each collection frame 18 is provided with a corresponding QR code, and the top surface of each chip is also provided with a corresponding QR code. The QR code on the collection frame 18 is bound to the QR code on the chip in the same system, and the first lifting seat 28 descends so that the collection frame 18 contacts the left conveyor belt 16 and the right conveyor belt 17. After the first intercepting rod 27 descends, the collection frame 18 flows to the second station 24. At this time, the second intercepting rod 29 rises, the left baffle 30 moves to the right, and the front baffle 31 moves backward and rises, thereby fixing the mobile phone frame 18 on the second station 24. After the six sides of the chip are inspected, the four-axis robot 2 will grab the chip with at least one side that fails the inspection and put it on the NG tray 11. The four-axis robot 2 will grab the chip that passes the inspection and put it on the collection frame 18. The four-axis robot 2 is provided with a code reader 52. When the four-axis robot 2 initially grabs the chip, it reads The encoder 52 reads the QR code on the chip at the same time. Before the four-axis robot 2 places the qualified chips on the collection frame 18, it will read the QR code of the collection frame 18. If the QR code of the collection frame 18 is not associated with the QR code on the detected chip, the second intercepting rod 29 rises, the left baffle 30 moves to the right, the front baffle 31 is reset, the intercepting seat 32 rises, and the third lifting seat 33 rises to lift the collection frame 18 to the third placement space for manual removal. If the QR code of the collection frame 18 is associated with the QR code on the detected chip, the collection frame 18 on the second workstation is in a fixed state, and the four-axis robot 2 places the qualified chips on the chip placement slot 181 of the collection frame 18 until the collection frame 18 is full. After the collection frame 18 is full of qualified chips, the third intercepting rod 35 rises, and the collection frame 18 flows directly to the fourth workstation, and then the fourth lifting seat 36 lifts the collection frame 18 full of chips to the fourth placement space for manual removal.It should be noted that the control methods of all the above actions are well known to those skilled in the art and will not be described in detail here.

[0035] The above is only a specific implementation method of the present invention, but the design concept of the present invention is not limited to this. Any non-substantial changes to the present invention using this concept shall be deemed as an infringement of the protection scope of the present invention.

Claims

1. Appearance inspection machine for QFN / LGA / BGA packaged chips, featuring: The machine comprises a frame, the top of which is provided with a four-axis robot, a rotatable dividing plate, a first camera for detecting the bottom pad of the chip and the chip grabbing angle, a second camera for detecting the flatness of the bottom of the chip, four third cameras for detecting the four sides of the chip respectively, a fourth camera for detecting the top surface of the chip, a first material-picking robot device for grabbing the chip above the second camera, a second material-picking robot device for grabbing the chip to the four side detection positions, a conveying device for transmitting qualified chips and an NG tray for receiving unqualified chips. The top surface of the dividing plate is provided with multiple chip placement jigs.

2. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 1, characterized in that: The first camera, the second camera, the four third cameras and the fourth camera are respectively distributed on four sides of the indexing plate.

3. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 1, characterized in that: A divider is provided on the top of the frame, and the bottom of the dividing plate is fixedly connected to the top of the divider.

4. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 1, characterized in that: The first camera, the four third cameras and the fourth camera are all area array cameras, and the second camera is a 3D line scan camera.

5. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 1, characterized in that: The first material picking robot device includes a first mounting frame, a first cylinder, a first linear slide module and a first material picking robot. The first cylinder is arranged on the first mounting frame. The first cylinder is connected to the first linear slide module and drives the first linear slide module and the first material picking robot to move left and right. The first material picking robot is connected to the first linear slide module and the first linear slide module drives the first material picking robot to move up and down.

6. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 1, characterized in that: The second material picking robot device includes a second mounting frame, a second cylinder, a second linear slide module and a second material picking robot. The second cylinder is arranged on the second mounting frame. The second cylinder is connected to the second linear slide module and drives the second linear slide module and the second material picking robot to move left and right. The second material picking robot is connected to the second linear slide module and the second linear slide module drives the second material picking robot to move up and down.

7. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 1, characterized in that: The conveying device includes a left support rod, a right support rod, a left conveying belt and a right conveying belt. The left conveying belt and the right conveying belt are respectively arranged on the right side of the left support rod and the left side of the right support rod. A collection frame is provided between the top surfaces of the left conveying belt and the right conveying belt.

8. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 7, characterized in that: The width between the left support rod and the right support rod is adjustable.

9. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 7, characterized in that: A first workstation, a second workstation, a third workstation and a fourth workstation are arranged from left to right between the left support rod and the right support rod. The first workstation is provided with a first placement space, a liftable first intercepting rod and a liftable first jacking seat. The first intercepting rod is located at the rear side of the first jacking seat. The second workstation is provided with a liftable second intercepting rod, a left baffle that can be moved left and right, and a front baffle that can be moved back and forth and lifted. The second intercepting rod is located at the rear side of the front baffle. The third workstation is provided with a third placement space, a liftable intercepting seat and a liftable third jacking seat. The fourth workstation is provided with a fourth placement space, a liftable third intercepting rod and a liftable fourth jacking seat.

10. The appearance inspection machine for QFN / LGA / BGA packaged chips according to claim 1, characterized in that: The four-axis robot is provided with a code reader.

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