Electronic equipment

Abstract

The embodiment of the utility model provides electronic equipment, and relates to the field of display equipment. The thickness of the electronic equipment is reduced. According to the specific scheme, the protection structure is arranged on the periphery of the cover plate in a surrounding mode and does not cover the light-emitting face of the cover plate. In the thickness direction of the electronic equipment, the protection structure is at least overlapped on the frame; when the electronic equipment is in an unfolded state, a first gap is formed between the protection structure and the frame in the thickness direction of the frame; the width of the first gap is reduced in the process that the electronic equipment moves from the flattened state to the folded state. The size of the protection structure protruding out of the cover plate can be zero or close to zero, and the electronic equipment can be thinned. The first gap is located inside the electronic device and is invisible externally, thereby facilitating beauty of the electronic device.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of display devices, and in particular to an electronic device. Background Art

[0002] With the continuous development of display technology, electronic devices (such as foldable phones) are becoming a trend in future mobile electronic products. When unfolded, the terminal device can provide a larger display area, improving the viewing experience. When folded, the terminal device can be compact and easy to carry.

[0003] As users pursue lighter and more portable electronic devices, how to reduce the thickness of electronic devices has become a problem that needs to be solved. Utility Model Content

[0004] An embodiment of the present application provides an electronic device, aiming to reduce the thickness of the electronic device.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions.

[0006] In a first aspect, an embodiment of the present application provides an electronic device. The electronic device includes a display screen, a cover plate, a protective structure, and a frame. The display screen includes a display module and a cover plate disposed on the light-emitting side of the display module. The protective structure is disposed around the periphery of the cover plate and does not cover the light-emitting surface of the cover plate. The protective structure covers at least part of the non-display area of ​​the display screen; the frame is disposed around the periphery of the display screen, and the protective structure overlaps the frame; the electronic device is in a flattened state, and a first gap is provided between the protective structure and the frame along the thickness direction of the frame.

[0007] Exemplarily, the light emitting surface of the cover plate includes: a light emitting surface of the cover plate located in the non-display area and a light emitting surface located in the display area.

[0008] The smaller the size of the protective structure protruding from the cover plate, the thinner the electronic device. Since the protective structure does not cover the light-emitting surface of the cover plate, the protective structure does not need to be protruding from the light-emitting side of the cover plate, and the size of the protective structure protruding from the cover plate can be zero or close to zero, which is beneficial for thinning the electronic device. During the movement of the electronic device from the flattened state to the folded state, the protective structure moves toward the frame. Since there is a first gap between the protective structure and the frame in the flattened state. The first gap provides space for the protective structure to move toward the frame, and also provides moving space for the display module, which is beneficial for releasing the stress of the display module and the cover plate during the folding process, and avoiding stress concentration and damage to the display module.

[0009] In combination with the first aspect, in some feasible embodiments, the protective structure is arranged around the outer periphery of the cover plate.

[0010] In combination with the first aspect, in some feasible embodiments, the protective structure is disposed around the periphery of the display module.

[0011] In combination with the first aspect, in some feasible embodiments, the protective structure is disposed around the periphery of the cover plate and the periphery of the display module.

[0012] In conjunction with the first aspect, in some achievable embodiments, the width of the first gap decreases as the electronic device moves from the flattened state to the folded state. Thus, as the display module and the protective structure move toward the frame, the width of the first gap decreases, providing space for the display module and the protective structure to move.

[0013] In combination with the first aspect, in some feasible embodiments, the electronic device further includes: a middle plate, the frame is connected to the periphery of the middle plate, the display module is located between the middle plate and the cover plate; the display module or the protective structure is bonded to the middle plate.

[0014] In this way, under the action of external force, the bonded display module and middle frame can move relative to each other. When the electronic device moves from a flat state to a folded state, the display module and protective structure can move relative to the middle plate. Similarly, under the action of external force, the bonded protective structure and middle frame can move relative to each other. The display module and protective structure can move relative to the middle plate together.

[0015] In conjunction with the first aspect, in some possible implementations, the electronic device further includes an adhesive member, wherein the display module or the protective structure is bonded to the middle frame via the adhesive member. Thus, under the action of an external force, deformation of the adhesive member can cause relative movement between the display module and the middle frame.

[0016] In conjunction with the first aspect, in some achievable embodiments, the electronic device further comprises a flexible circuit board, the display module comprises a bent portion located in the non-display area, the bent portion being connected to the flexible circuit board; the protective structure comprises a connected top cover and an encapsulating portion, the top cover being disposed around the periphery of the cover plate; at least a portion of the bent portion is embedded within the encapsulating portion, and the first gap is located between the encapsulating portion and the frame. Thus, the encapsulating portion has a deformable characteristic, and the portion of the bent portion embedded within the encapsulating portion can avoid direct collision with the top cover and the frame. The first gap provides space for movement of the encapsulating portion and the bent portion.

[0017] In conjunction with the first aspect, in some achievable embodiments, the protective structure further includes a first support portion, the first support portion being connected to the top cover, the first support portion being located between the encapsulating portion and the frame, and the first gap being located between the first support portion and the frame. In this manner, the first support portion can support the top cover. Furthermore, the first support portion isolates the first gap from the encapsulating portion, preventing the encapsulating portion from deforming and narrowing the first gap. This allows for smoother movement of the protective structure relative to the frame.

[0018] In conjunction with the first aspect, in some achievable embodiments, the first support portion and the top cover are connected as an integrally formed part. This provides a high connection strength between the first support portion and the top cover, thereby improving the strength of the protective structure.

[0019] In conjunction with the first aspect, in some possible implementations, the protective structure further includes a second support portion, the second support portion being connected to a side of the encapsulating portion facing away from the top cover, and the second support portion being connected to an end of the first support portion away from the top cover. In this manner, the first and second support portions jointly support the encapsulating portion, preventing deformation of the encapsulating portion that would otherwise cause smoother movement of the protective structure relative to the frame.

[0020] In conjunction with the first aspect, in some achievable embodiments, the encapsulating portion and the top cover are connected as an integrally formed part. This provides a high connection strength between the first support portion and the top cover, thereby improving the strength of the protective structure.

[0021] In conjunction with the first aspect, in some achievable embodiments, the material of the encapsulation portion includes glue. Thus, the glue in the encapsulation portion can connect the mid-board, eliminating the need for adhesives in the electronic device, thereby reducing the manufacturing cost of the electronic device and the thickness of the electronic device.

[0022] In conjunction with the first aspect, in some practicable embodiments, the material of the encapsulation portion includes photosensitive adhesive or foam adhesive. The photosensitive adhesive or foam adhesive can be bonded to the midboard, thereby connecting the encapsulation portion and the midboard without the need for additional adhesive components, thereby reducing the cost of the electronic device.

[0023] In combination with the first aspect, in some feasible embodiments, the electronic device further comprises an enclosure, the enclosure being connected to the frame and being arranged around the periphery of the protective structure; when the electronic device is in the unfolded state, a second gap is present between the enclosure and the protective structure along the thickness direction of the frame. In this way, the presence of the second gap prevents the enclosure from interfering with the movement of the protective structure relative to the frame. Since the enclosure is arranged around the periphery of the protective structure, the enclosure can shield at least part of the outer peripheral surface of the protective structure, rendering the shielded portion invisible, thereby improving the aesthetics of the electronic device. In addition, the enclosure can prevent some external forces from damaging the outer peripheral surface of the protective structure.

[0024] In conjunction with the first aspect, in some achievable embodiments, the enclosure and the frame are connected to form an integrally formed part. In this way, the connection strength between the enclosure and the frame is high, and the process of forming the enclosure and the frame is relatively simple.

[0025] In conjunction with the first aspect, in some possible implementations, the display module includes a stacked light-emitting layer and a support layer, the support layer being located on a backlight surface of the light-emitting layer; and the bent portion includes the light-emitting layer and the support layer located in the non-display area. This reduces the space occupied by the bent portion, and the size of the encapsulation portion used to embed the bent portion is also reduced, thereby facilitating a reduction in the thickness of the electronic device.

[0026] In conjunction with the first aspect, in some achievable embodiments, the electronic device further comprises: a polarizer, the polarizer being located between the cover plate and the display module, with one end of the polarizer extending into the protective structure. Compared to a protective structure covering the light-emitting surface of the polarizer, a protective structure not covering the light-emitting surface of the polarizer is advantageous in saving installation space for the protective structure, and the thickness of the protective structure can be increased, which is advantageous in improving the strength of the protective structure. In addition, the protective structure not covering the light-emitting surface of the polarizer eliminates the need for the polarizer to extend to the bend, providing more space for the protective structure.

[0027] In conjunction with the first aspect, in some possible implementations, the electronic device further includes a protective film, the protective film covering the light-emitting surface of the cover plate, and the protective structure not covering the light-emitting surface of the protective film. In this way, the protective film does not occupy the installation space of the protective structure, and the protective structure can be thicker. Furthermore, the protective film also serves to protect the cover plate.

[0028] In conjunction with the first aspect, in some achievable embodiments, when the electronic device is in a flat state, the width of the first gap is 0.1 mm to 1 mm. Thus, the first gap of this size can provide a larger space for the display module to move closer to the frame.

[0029] In a second aspect, an embodiment of the present application provides an electronic device. The electronic device includes a display module, a cover plate, a protective structure and a frame. The cover plate is arranged on the light-emitting side of the display module; the protective structure is arranged around the periphery of the cover plate and does not cover the light-emitting side of the cover plate, and the protective structure is arranged on the light-emitting side of the display module; the frame is arranged around the periphery of the display module, and the protective structure is connected to the frame; during the movement of the electronic device from the flattened state to the folded state, the protective structure bends. In this way, during the movement of the electronic device from the flattened state to the folded state, the display module and the cover plate move together close to the frame, the force of the display module is transmitted to the protective structure, and the protective structure bends to release the internal stress of the display module. Since the protective structure does not cover the light-emitting surface of the cover plate, the protective structure does not need to be protruded from the light-emitting side of the cover plate, and the size of the protective structure protruding from the cover plate can be zero or close to zero, which is conducive to thinning the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic diagram of the structure of an electronic device in a flat state.

[0031] Figure 2 This is a schematic diagram of the structure of an electronic device in a folded state.

[0032] Figure 3 Schematic diagram of the exploded structure of the electronic device.

[0033] Figure 4 for Figure 1 Enlarged schematic diagram of point A in the middle.

[0034] Figure 5 for Figure 1 Cross-section of the BB.

[0035] Figure 6 A schematic structural diagram of a protective structure and a frame provided in an embodiment of the present application.

[0036] Figure 7 A schematic structural diagram of another protective structure and frame provided in an embodiment of the present application.

[0037] Figure 8 A structural schematic diagram of another protective structure and frame provided in an embodiment of the present application.

[0038] Figure 9 A structural schematic diagram of another protective structure and frame provided in an embodiment of the present application.

[0039] Figure 10 A structural schematic diagram of another protective structure and frame provided in an embodiment of the present application.

[0040] In the figure: 10-electronic device; 210-first middle frame; 220-second middle frame; 230-rotating shaft; 100-display module; 110-protective structure; 111-top cover; 112-encapsulation part; 113-first supporting part; 114-second supporting part; 211-frame; 20-printed circuit board; 15a, 15b-back shell; 101-cover plate; 102-bending part; 103-flexible circuit board; 104-chip; 105-enclosure; 212-middle plate; 213-adhesive; 011-first surface; 012-second surface; 002-first gap; 003-second gap; 004-third gap; 301-connecting layer; 302-supporting layer; 303-light-emitting layer; 304-optical adhesive layer; 305-polarizer; 201-protective film; 010-ink layer. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0042] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0043] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0044] This application provides an electronic device, which is an electronic device. This electronic device can display a screen and can also be folded, thereby changing the size of the electronic device. In this application, the electronic device can be a mobile phone, a monitor, a tablet computer, an in-vehicle computer, or other product with a display interface. The embodiments of this application are described using a foldable mobile phone as an example.

[0045] Figure 1 FIG. 1 is a schematic structural diagram of the electronic device 10 in a flat state. Figure 2 Schematic diagram of the structure of the electronic device 10 in the folded state. Figure 1 and Figure 2 The electronic device 10 can be folded or unfolded, thereby changing the size of the electronic device 10 according to actual needs and usage scenarios. For example, when the screen needs to be viewed, the electronic device 10 can be unfolded to Figure 1In the state shown, the display screen of the electronic device 10 is unfolded so that the screen can be better viewed. When the electronic device 10 needs to be stored, the electronic device 10 can be folded to the state shown. Figure 2 For example, in an embodiment where the electronic device 10 is a mobile phone, Figure 2 The status shown makes it convenient for users to hold the device to answer or make calls, thereby improving user experience.

[0046] It is understood that the folded state of the electronic device 10 is not limited to Figure 2 The electronic device 10 can have multiple folding states, for example, Figure 1 The flattened state and Figure 2 The electronic device 10 may also have multiple folding states.

[0047] Figure 3 FIG1 is a schematic diagram of the exploded structure of the electronic device 10. Figure 3 The electronic device 10 includes a first middle frame 210, a second middle frame 220 and a hinge 230. The first middle frame 210 is connected to the hinge 230, and the second middle frame 220 is connected to the hinge 230. The first middle frame 210 and the second middle frame 220 have the function of supporting the entire device.

[0048] For example, the first middle frame 210 and the rotating shaft 230 can be connected by bolts, snaps, adhesive layers, or welding layers. Similarly, the second middle frame 220 and the rotating shaft 230 can be connected by bolts, snaps, adhesive layers, or welding layers. When the electronic device 10 is in a flat state, the first middle frame 210, the rotating shaft 230, and the second middle frame 220 are arranged in sequence along the x-direction. The rotating shaft 230 can rotate about the y-direction. In other words, the axis of the rotating shaft 230 extends along the y-direction.

[0049] For ease of description, the thickness direction of the electronic device 10 is defined as the z direction, wherein the x direction is perpendicular to the z direction, the x direction is perpendicular to the y direction, and the y direction is perpendicular to the z direction.

[0050] It should be understood that the x- and z-directions being perpendicular is not limited to a 90° angle between them; assembly and manufacturing errors can be tolerated. For example, the angle between the x- and z-directions can be 85° to 95°. For example, it can be 85°, 87°, 88°, 89°, 90°, 91°, 92°, 93°, or 95°. The same applies to the rest of the description regarding perpendicularity.

[0051] The embodiment of the present application does not limit the structure of the rotating shaft 230. For example, the rotating shaft 230 includes a first door panel, a second door panel and a shaft body. When the electronic device 10 is in a flat state, the first door panel, the second door panel and the shaft body are arranged along the x-direction. The first door panel and the shaft body are rotationally connected. For example, the first door panel and the shaft body are rotationally connected through an arc groove and a slider; or, the first door panel and the shaft body are rotationally connected through a hinge. Similarly, the second door panel and the shaft body are rotationally connected. For example, the second door panel and the shaft body are rotationally connected through an arc groove and a slider; or, the second door panel and the shaft body are rotationally connected through a hinge. The first middle frame 210 is connected to the first door panel, for example, by screwing or clamping. The second middle frame 220 is connected to the second door panel, for example, by screwing or clamping.

[0052] During the adjustment of the electronic device 10 between the folded state and the flattened state, the first middle frame 210 faces the display module 100 (eg Figure 1 The angle between the surface of the first middle frame 210 (shown in FIG. 1 ) and the surface of the second middle frame 220 facing the display module 100 will change accordingly. When the electronic device 10 is adjusted from the flat state to the folded state, the first middle frame 210 connected to the hinge 230 and the second middle frame 220 connected to the hinge 230 can both rotate about the y-direction, causing the angle between the plane of the first middle frame 210 and the plane of the second middle frame 220 to gradually decrease. When the electronic device 10 is adjusted from the folded state to the flat state, the first middle frame 210 and the second middle frame 220 rotate about the y-direction, causing the angle between the plane of the first middle frame 210 and the plane of the second middle frame 220 to gradually increase.

[0053] When the electronic device 10 is in the folded state, the angle between the surface of the first middle frame 210 facing the display module 100 and the surface of the second middle frame 220 facing the display module 100 may be -10° to 10°, for example, ±10°, ±9°, ±8°, ±7°, ±6°, ±5°, ±4°, ±3°, ±2°, ±1°, or 0°. When the electronic device 10 is in the flattened state, the angle between the surface of the first middle frame 210 facing the display module 100 and the surface of the second middle frame 220 facing the display module 100 may be 170° to 190°, for example, 170°, 172°, 175°, 178°, 179°, 180°, 181°, 182°, 185°, 188°, or 190°.

[0054] For example, the electronic device 10 may further include a printed circuit board (PCB) 20, the printed circuit board 20 and the display module 100 (eg Figure 1 as shown) electrical connections.

[0055] For example, electronic components may be carried on the printed circuit board 20. In some embodiments, components such as input buttons, a transmitter, a processor, a memory, a battery, a charging circuit, a system on chip (SoC) structure, etc. may be mounted on or connected to the printed circuit board 20.

[0056] In some embodiments, the electronic device 10 may further include a rear housing 15a (15b), which is also called a rear cover. Figure 3 In the embodiment, the printed circuit board 20 is located between the display module 100 and the rear housing 15a (15b). Figure 3 In the embodiment, the electronic device 10 includes two rear shells, wherein one rear shell 15a is connected to the first middle frame 210 and stacked along the z direction, and the other rear shell 15b is connected to the second middle frame 220 and stacked along the z direction.

[0057] For example, the electronic device 10 may further include a battery (not shown in the figure). The battery is disposed between the display module 100 and the rear housing 15a (15b), which is not limited in this application.

[0058] The embodiment of the present application does not limit the folding type of the electronic device 10. In some embodiments, the electronic device 10 is an inward folding structure, that is, when the electronic device 10 is in the folded state, the display module 100 (such as Figure 1 ) is located between the first middle frame 210 and the second middle frame 220. In other embodiments, the electronic device 10 has an outward folding structure, that is, when the electronic device 10 is in the folded state, the first middle frame 210 and the second middle frame 220 are both located between opposite ends of the display module 100.

[0059] During the transition from the flattened state to the folded state, the display module 100 bends, and the edge of the display module 100 moves along the x-direction. The edge of the display module 100 moves away from the bending region of the display module 100. In other words, the edge of the display module 100 moves relative to the first middle frame 210 and the second middle frame 220.

[0060] In an embodiment of the present application, the electronic device 10 further includes a protective structure 110, which is used to protect the edge of the display module 100 and prevent the edge of the display module 100 from being damaged by impact. Currently, the provision of a protective structure will increase the thickness of the electronic device.

[0061] The electronic device 10 provided in the embodiment of the present application effectively solves the problem of the electronic device 10 becoming thicker due to the protective structure.

[0062] Figure 4 for Figure 1 A magnified diagram of point A in the middle. Figure 4 The electronic device further includes a frame 211 and a cover plate 101. The cover plate 101 is disposed on the light-emitting side of the display module 100. The cover plate 101 can protect the display module 100 and prevent the display module 100 from being scratched. For example, the cover plate 101 and the display module 100 can be regarded as a display screen. In other words, the display screen includes the cover plate 101 and the display module 100. The protective structure 110 is disposed around the periphery of the display screen, and the protective structure 110 does not cover the light-emitting surface of the cover plate 101.

[0063] Figure 5 for Figure 1 Cross-section of the BB. Figure 5 The display module 100 includes a display area W and a non-display area E. The display area W is used to display images, and the light emitted by the display area W can enter the user's eyes and be viewed. The non-display area E is arranged around the periphery of the display area W. The non-display area E does not emit light or the light emitted by the non-display area E is blocked (for example, by the ink layer 010 described later) and cannot enter the user's eyes. The non-display area E protective structure 110 covers part of the non-display area E of the display module 100.

[0064] The aforementioned light-emitting surface of the cover plate 101 includes the light-emitting surface of the cover plate located in the display area W and the light-emitting surface of the cover plate located in the non-display area E. In some embodiments, the light-emitting surface of the cover plate 101 can also be referred to as the exterior surface of the cover plate 101. Alternatively, the light-emitting surface of the cover plate 101 can also be referred to as the surface of the cover plate 101 facing away from the display module 100 along the thickness direction of the electronic device.

[0065] Illustratively, the cover plate 101 covers the display area W of the display module 100. The cover plate 101 may also cover a portion of the non-display area E. Illustratively, the display module 100 further includes a bent portion 102. The bent portion 102 is located in the non-display area E.

[0066] The electronic device 10 further includes a flexible printed circuit board (FPC) 103, and the bending portion 102 is connected to the flexible printed circuit board 103. The flexible printed circuit board 103 is used to send an image signal to the display module 100, and the display module 100 displays the image after receiving the aforementioned image signal. The frame 211 is arranged around the periphery of the display screen, and the protective structure 110 is overlapped on the frame 211. When the electronic device 10 moves from the flat state to the folded state, the display screen also moves from the flat state to the folded state accordingly. Since the display screen is close to the rotating shaft 230 (such as Figure 3The area of ​​the display screen (as shown) is connected to the first middle frame 210, and the distance of relative movement between the area and the first middle frame 210 is small or there is no relative movement. Because the display screen has a certain thickness along the z-direction, the portion of the stacked layers of the display screen away from the first middle frame 210 (such as the cover plate 101) moves relative to the first middle frame 210, and the area of ​​the cover plate 101 away from the rotation axis 230 moves in a direction away from the rotation axis 230. This movement pushes the protective structure 110 toward the direction close to the frame 211. Conversely, when the electronic device 10 moves from the folded state to the flattened state, the portion of the stacked layers of the display screen away from the first middle frame 210 (such as the cover plate 101) moves relative to the first middle frame 210, and the area of ​​the cover plate 101 away from the rotation axis 230 moves in a direction close to the rotation axis 230. This movement causes the protective structure 110 to move away from the frame 211.

[0067] Exemplarily, the flexible circuit board 103 is electrically connected to the printed circuit board 20. The printed circuit board 20 is used to send electrical signals to the flexible circuit board 103. In addition, the printed circuit board 20 can also support the flexible circuit board 103.

[0068] The smaller the size of the protective structure 110 protruding from the cover plate 101, the smaller the thickness of the electronic device 10. Since the protective structure 110 does not cover the light-emitting surface of the cover plate 101, the protective structure 110 does not need to be protruding from the light-emitting side of the cover plate 101. In other words, the size of the protective structure 110 protruding from the cover plate 101 can be zero. During the movement of the electronic device 10 from the flat state to the folded state, the protective structure 110 moves toward the frame 211. This movement of the protective structure 110 provides space for the display module 100 during the folding and unfolding process, releases the internal stress of the display module 100, and avoids damage due to stress concentration.

[0069] Exemplarily, the cover plate 101 is a flexible cover plate. The material of the cover plate 101 can be, for example, a transparent polyimide film (colorless polyimide, CPI), ultra-thin glass (UTG), ultra-flexible glass (UFG) of varying thickness, or polyethylene terephthalate film (PET).

[0070] In some embodiments of the present application, the protective structure 110 may cover at least a portion of the surface of the cover plate 101 located in the non-display area E and facing away from the light-emitting surface. The surface of the cover plate 101 facing away from the light-emitting surface is: along the thickness direction of the electronic device, the surface of the cover plate 101 facing the display module 100. In other words, the protective structure 110 may cover at least a portion of the surface of the cover plate 101 facing the display module 100 and located in the non-display area E. In some embodiments of the present application, the protective structure 110 does not cover the surface of the cover plate 101 facing away from the light-emitting surface.

[0071] In some embodiments of the present application, the surface of the protective structure 110 facing away from the frame 211 can be coplanar with the light-emitting surface of the cover 101. For example, when the electronic device 10 is in a flat state, the surface of the protective structure 110 facing away from the frame 211 is flush with the light-emitting surface of the cover 101. This makes the surface of the electronic device 10 smoother and more aesthetically pleasing.

[0072] In some embodiments, the surface of the protective structure 110 facing away from the frame 211 may protrude from the light-emitting surface of the cover 101. In other words, compared with the light-emitting surface of the cover 101, the surface of the protective structure 110 facing away from the frame 211 is closer to the rear shell 15a (eg, Figure 2 The distance between them is larger.

[0073] For example, the distance between the surface of the protective structure 110 facing away from the frame 211 and the light-emitting surface of the cover plate 101 can be 0.02 mm (millimeter) to 0.2 mm. This distance can be, for example, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.1 mm, 0.12 mm, 0.15 mm, or 0.2 mm. In this way, the thickness of the protective structure 110 can be relatively thick, which is beneficial for improving the strength of the protective structure 110.

[0074] In some embodiments of the present application, the edge of the protective structure 110 facing the cover plate 101 is connected to the cover plate 101 through an adhesive layer, for example, Figure 6 、 Figure 7 、 Figure 8 or Figure 9 An adhesive layer is provided at the position indicated by S in the figure. This fills the gap between protective structure 110 and cover plate 101 with the optical adhesive layer, which acts as a dust and water vapor barrier, preventing impurities such as dust and water vapor from entering electronic device 10. Furthermore, the optical adhesive layer reduces the visibility of the gap between protective structure 110 and cover plate 101, thereby enhancing the aesthetics of electronic device 10. Exemplarily, the adhesive layer connecting the edge of protective structure 110 and cover plate 101 can be made of a photosensitive adhesive, a pressure-sensitive adhesive, or a thermosetting adhesive.

[0075] In some embodiments of the present application, the edge of the protective structure 110 facing the cover plate 101 may not be connected to the cover plate 101 by an adhesive layer. For example, a gap may exist between the edge of the protective structure 110 facing the cover plate 101 and the cover plate 101.

[0076] In some embodiments of the present application, the electronic device 10 may further include a protective film 201 that covers the light-emitting side of the cover plate 101. The protective structure 110 does not cover the light-emitting side of the protective film 201. In other words, the protective film 201 does not occupy the installation space of the protective structure 110, allowing the protective structure 110 to be thicker. Furthermore, the protective film 201 also serves to protect the cover plate 101.

[0077] Similar to the aforementioned relationship between the surface of the protective structure 110 facing away from the frame 211 and the light-emitting surface of the cover 101, in some embodiments, the surface of the protective structure 110 facing away from the frame 211 can be flush with the light-emitting surface of the protective film 201. Alternatively, the surface of the protective structure 110 facing away from the frame 211 can protrude beyond the light-emitting surface of the protective film 201.

[0078] Alternatively, in some embodiments, the protective film 201 may cover a portion of the protective structure 110 . For example, the protective film 201 may overlap the protective structure 110 .

[0079] In some embodiments of the present application, the protective film 201 is not necessary, and the electronic device 10 may not be provided with the protective film 201 .

[0080] In some embodiments of the present application, the electronic device 10 further includes a mid-plate 212. The frame 211 is connected to the periphery of the mid-plate 212. For example, the frame 211 and the periphery of the mid-plate 212 are connected by a welding layer or an adhesive layer, or the frame 211 and the mid-plate 212 are connected to form an integral molded part.

[0081] The component after the frame 211 and the middle plate 212 are connected can be regarded as the first middle frame 210. It can be understood that Figure 3 The second middle frame 220 also includes a connected frame and mid-plate. The electronic device 10 includes two protective structures 110, one of which overlaps the frame of the first middle frame 210, and the other overlaps the frame of the second middle frame. This embodiment of the application describes the connection relationship between one protective structure 110 and the frame of the first middle frame 210. The other protective structure and the frame of the second middle frame can be obtained similarly.

[0082] In some embodiments, the frame can also be considered as the sidewall of the rear housing 15a (15b). In some embodiments, the electronic device 10 may not have the middle plate 212. In such embodiments, the rear housing 15a can be considered as the middle plate 212 in the embodiment, and the rear housing 15a has the same function as the middle plate described in the embodiments of the present application. For example, the rear housing 15a and the sidewall can be integrally formed, or the rear housing 15a and the sidewall can be two separate pieces.

[0083] In addition, the aforementioned “movement of the protective structure 110 toward the direction close to the frame 211” means: Figure 1 In the x-direction shown in FIG, the protective structure moves along the left side to approach the frame in the first middle frame 210. Similarly, the other protective structure moves along the right side to approach the frame in the second middle frame 220.

[0084] The display module 100 is located between the middle plate 212 and the cover plate 101, and the protective structure 110 is bonded to the middle plate 212. Exemplarily, the electronic device 10 further includes an adhesive 213, and the protective structure 110 is connected to the middle plate 212 via the adhesive 213. In this way, a space for accommodating the display module 100 is enclosed between the middle plate 212 and the cover plate 101. During the movement of the electronic device from the flattened state to the folded state, the adhesive 213 between the protective structure 110 and the middle plate 212 generates a shear force, causing a misalignment or relative displacement between the protective structure 110 and the middle plate 212. The misalignment or relative displacement causes the protective structure 110 to move relative to the middle plate 212 and the frame 211. In addition, the adhesive 213 can also prevent water vapor or dust from entering the space between the middle plate 212 and the display module 100.

[0085] Illustratively, adhesive 213 is made of foam adhesive or photosensitive adhesive. Foam adhesive or photosensitive adhesive is susceptible to deformation under external forces. As the electronic device moves from a flattened state to a folded state, adhesive 213 deforms, providing margin for relative movement between protective structure 110 and midplane 212.

[0086] In some embodiments of the present application, the display module 100 and the mid-plate 212 are connected via adhesives 213. Thus, the adhesives 213 between the display module 100 and the mid-plate 212 generate shear forces, causing a shift or relative displacement between the display module 100 and the mid-plate 212. This shift or relative displacement causes the display module 100 to move relative to the mid-plate 212. The adhesives 213 can also prevent moisture and dust from entering the interior of the electronic device.

[0087] In some embodiments of the present application, the adhesive 213 is not necessary, the protective structure 110 is not connected to the middle plate 212, and the display module 100 is not connected to the middle plate 212. For example, the protective structure 110 and the display module 100 are both in contact with the middle plate 212 and are not connected. The protective structure 110 and the display module 100 are both not in contact with and are not connected to the middle plate 212. Similarly, during the movement of the electronic device from the flat state to the folded state, a misalignment or relative displacement may occur between the protective structure 110 and the middle plate 212, and the misalignment or relative displacement causes the protective structure 110 to move relative to the middle plate 212 and the frame 211.

[0088] In the embodiment of the present application, the protective structure 110 has a variety of structures, and the protective structure 110 and the frame 211 also have a variety of connection methods. Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10 An exemplary description is given.

[0089] Figure 6 This is a schematic diagram of the structure of a protective structure 110 and a frame 211 provided in an embodiment of the present application. Figure 6 Along the thickness direction of the electronic device 10, the protective structure 110 at least partially overlaps the frame 211. When the electronic device is in the unfolded state, along the thickness direction of the frame 211, a first gap 002 is formed between the protective structure 110 and the frame 211.

[0090] For example, along the thickness direction (z-direction) of the electronic device, the frame 211 has a first surface 011 facing away from the rear housing 15a. Along the thickness direction of the frame 211, the frame 211 has a second surface 012 proximate to the display module 100. The protective structure 110 covers at least a portion of the first surface 011. The aforementioned first gap 002 is located between the second surface 012 and the protective structure 110. During the movement of the electronic device 10 from the flattened state to the folded state, the first gap 002 provides space for the protective structure 110 to move closer to the frame 211 and also provides space for the display module 100 to move. This helps relieve stress during the folding process of the display module 100 and the cover plate 101, preventing stress concentration from damaging the display module 100. Furthermore, the first gap 002 is located between the protective structure 110 and the frame 211. When viewing the electronic device 10 from the light-emitting side, the first gap 002 is not visible, which helps enhance the aesthetics of the electronic device 10.

[0091] like Figure 6As shown, the protective structure 110 includes a top cover 111 and an encapsulating portion 112. The top cover 111 is located on the side of the encapsulating portion 112 close to the cover plate 101. At least part of the bent portion 102 is buried in the encapsulating portion 112. The first gap 002 is located between the encapsulating portion 112 and the frame 211. In this way, the portion of the bent portion 102 buried in the encapsulating portion 112 can avoid direct collision with the top cover 111 and the frame 211. The encapsulating portion 112 has the function of connecting the top cover 111 and the bent portion 102, and also has the function of protecting the bent portion 102. The first gap 002 provides movement space for the movement of the encapsulating portion 112 and the bent portion 102.

[0092] The phrase "at least a portion of the bent portion 102 is embedded within the encapsulation 112" means that a portion of the bent portion 102 is embedded within the encapsulation 112, while the remaining portion is located outside the encapsulation 112. Alternatively, the entire bent portion 102 may be embedded within the encapsulation 112. For example, the entire non-display area E between the flexible circuit board 103 and the display area W may be embedded within the encapsulation 112. This ensures that the encapsulation 112 effectively encapsulates the bent portion 102, preventing collisions.

[0093] Furthermore, the side of the bent portion 102 close to the second surface 012 and the side of the bent portion 102 away from the second surface 012 are both in contact with the encapsulating portion 112. In other words, part of the encapsulating portion 112 is located on the side of the bent portion 102 close to the second surface 012, and part of the encapsulating portion 112 is located on the side of the bent portion 102 away from the second surface 012. In this way, the encapsulating portion 112 effectively wraps the bent portion 102.

[0094] The embodiment of the present application does not limit the size of the first gap 002. For example, when the electronic device 10 is in a flat state, the width d1 of the first gap 002 is 0.1 mm to 1 mm. For example, the width d1 of the first gap 002 is 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm.

[0095] Figure 6 In the example, a third gap is also provided between the top cover 111 and the first surface 011. The embodiment of the present application does not impose any limitation on the width of the third gap. For example, the width of the third gap between the top cover 111 and the first surface 011 can be 0.1 mm to 1 mm. For example, the third gap can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm, etc. In this way, when the protective structure 110 moves relative to the frame 211, the top cover 111 and the frame 211 are not easily rubbed against each other, thereby reducing wear.

[0096] In some embodiments, there may be no third gap between the top cover 111 and the first surface 011, which can reduce the entry of substances such as dust into the interior of the electronic device 10 between the top cover 111 and the first surface 011.

[0097] As described above, the surface of the protection structure 110 facing away from the frame 211 may be coplanar with the light-emitting surface of the cover plate 101. Alternatively, the surface of the protection structure 110 facing away from the frame 211 may protrude from the light-emitting surface of the cover plate 101. In embodiments where the protection structure 110 includes a top cover 111 and an encapsulation portion 112, the surface of the top cover 111 facing away from the frame 211 may be coplanar with the light-emitting surface of the cover plate 101. Alternatively, the surface of the top cover 111 facing away from the frame 211 may protrude from the light-emitting surface of the cover plate 101.

[0098] Similarly, in embodiments where the electronic device 10 includes a protective film 201, the surface of the top cover 111 facing away from the frame 211 may be coplanar with the light-emitting surface of the protective film 201. Alternatively, the surface of the top cover 111 facing away from the frame 211 may protrude from the light-emitting surface of the protective film 201.

[0099] The embodiments of the present application do not limit the material of the top cover 111. Exemplarily, the material of the top cover 111 may be rubber, polyurethane, silica gel, plastic, or the like. The embodiments of the present application also do not limit the shape of the top cover 111. Figure 6 In [the above], the top cover 111 is a sheet-like structure. The top cover 111 is disposed around the outer periphery of the cover plate 101. The projected shape of the extension path of the top cover 111 on the reference plane may be a "匚" shape. The aforementioned reference plane is perpendicular to the thickness direction of the electronic device 10.

[0100] As described above, in some embodiments, the protection structure 110 may cover at least a part of the surface of the cover plate 101 located in the non-display area E and facing away from the light-emitting surface. Figure 6 In an example, the encapsulation portion 112 covers at least a part of the surface of the cover plate 101 located in the non-display area E and facing away from the light-emitting surface. In some embodiments, the encapsulation portion 112 may not cover the surface of the cover plate 101 facing away from the light-emitting surface.

[0101] As described above, the protection structure 110 is connected to the edge of the cover plate 101 and the cover plate 101 through an adhesive layer. In Figure 6 an example, the edge of the top cover 111 facing the cover plate 101 and the cover plate 101 are connected through an adhesive layer. For example, the adhesive layer may be disposed at Figure 6 the position indicated by S in. This adhesive layer can prevent moisture, dust, etc. from entering between the top cover 111 and the cover plate 101. It can be understood that this adhesive layer is not necessary and the adhesive layer may not be provided.

[0102] The present embodiment does not limit the material of the encapsulation portion 112. For example, the encapsulation portion 112 can be made of a thermosetting adhesive or a light-curing adhesive. In embodiments where the encapsulation portion 112 is made of a thermosetting adhesive, a heat-curing process can be used to form the encapsulation portion 112. In embodiments where the encapsulation portion 112 is made of a light-curing adhesive, a light-curing process can be used to form the encapsulation portion 112.

[0103] In embodiments where the electronic device 10 further includes adhesive 213, the encapsulation portion 112 or the display module 100 is connected to the adhesive 213. Alternatively, in embodiments where the encapsulation portion 112 is adhesive, the electronic device 10 may not include the adhesive 213, and the encapsulation portion 112 may be connected to the mid-plate 212.

[0104] In some embodiments, the material of the encapsulation portion 112 includes glue, and the glue in the encapsulation portion 112 is connected to the middle plate 212. The electronic device 10 may not be provided with the adhesive 213, thereby reducing the manufacturing cost of the electronic device 10 and the thickness of the electronic device 10. For example, the material of the encapsulation portion 112 may include foam glue or photosensitive glue.

[0105] As mentioned above, in some embodiments of the present application, the adhesive member 213 is not necessary. Figure 6 In the example, the adhesive member 213 may not be provided.

[0106] Figure 6 In the example shown in FIG. 1 , the display module 100 includes a support layer 302, a light-emitting layer 303, and an optical adhesive layer 304. The support layer 302, the light-emitting layer 303, and the optical adhesive layer 304 are stacked in sequence along the thickness direction (z direction) of the electronic device 10. The optical adhesive layer 304 is connected to the cover plate 101.

[0107] The electronic device 10 may further include a connection layer 301, and the support layer 302 is connected to the middle plate 212 via the connection layer 301. For example, the material of the connection layer 301 may be foam glue or photosensitive glue.

[0108] The support layer 302 is used to support the light-emitting layer 303, which can improve the structural strength of the display module 100. The embodiment of the present application does not limit the structure of the support layer 302. For example, the support layer 302 is a thin plate structure. In some embodiments, the support layer 302 is provided with a through hole penetrating the support layer 302, and the vertical projection of the through hole on the display module 100 overlaps with the bending area of ​​the display module 100. The bending area of ​​the display module 100 is located in the display area of ​​the display module 100. When the electronic device moves from the flat state to the folded state, the bending area of ​​the display module 100 bends.

[0109] In some embodiments of the present application, the bending portion 102 includes a light-emitting layer 303 located in the non-display area. In other words, the light-emitting layer 303 located in the non-display area is bent to form a bending portion. The light-emitting layer 303 located in the non-display area is electrically connected to the flexible circuit board 103. The flexible circuit board 103 provides image display signals to the light-emitting layer 303. In some embodiments, the bending portion 102 may only include a portion of the light-emitting layer 303 located in the non-display area. In other words, the layer structure such as the support layer 302 in the display module 100 may not be bent and may not serve as part of the bending portion. In this way, the bending portion 102 occupies a smaller area, which can provide more space for the top cover 111. The thickness of the top cover 111 can be increased, which is beneficial to improving the strength of the top cover 111.

[0110] In some embodiments of the present application, the bent portion 102 may further include a support layer 302 located in the non-display area. In other words, the support layer 302 located in the non-display area is bent to form the portion of the bent portion 102. Part of the support layer 302 and part of the light-emitting layer 303 are embedded within the encapsulation portion 112. This allows the encapsulation portion 112 to constrain both the support layer 302 and the light-emitting layer 303, reducing friction between the various layers within the display module 100 during the unfolding or folding process of the electronic device.

[0111] Similarly, in some embodiments, the bent portion 102 may further include an optical adhesive layer 304 located in the non-display area. In other words, the optical adhesive layer 304 located in the non-display area is bent to form a portion of the bent portion 102. In some embodiments of the present application, the electronic device 10 further includes a polarizer 305, and the optical adhesive layer 304 is located between the polarizer 305 and the cover plate 101.

[0112] Figure 6 In the example shown in FIG, one end of the polarizer 305 extends into the protective structure 110. For example, the end of the polarizer 305 located in the non-display area extends into the encapsulation portion 112. In this way, the encapsulation portion 112 can fix the polarizer 305, and the connection strength between the protective structure 110 and the polarizer 305 is improved.

[0113] In some embodiments of the present application, the protective structure 110 does not cover the light-emitting surface of the polarizer 305. Compared to a case where the protective structure 110 covers the light-emitting surface of the polarizer 305, this arrangement saves installation space for the protective structure 110 and increases the thickness of the protective structure 110, thereby improving its strength. Furthermore, the protective structure 110 does not cover the light-emitting surface of the polarizer 305. This eliminates the need for the polarizer 305 to extend to the bent portion 102, providing more space for the protective structure 110.

[0114] In some embodiments of the present application, the protective structure 110 may be overlapped on the polarizer 305. In other words, the protective structure 110 covers at least a portion of the light-emitting surface of the polarizer 305.

[0115] For example, in some embodiments, the bending portion 102 may further include a polarizer 305 located in the non-display area. In other words, the polarizer 305 located in the non-display area is bent to form a portion of the bending portion 102. In this way, the encapsulation portion 112 may partially enclose the polarizer 305.

[0116] In some embodiments of the present application, the electronic device 10 further includes a chip 104 . The chip 104 is connected to the flexible circuit board 103 . The chip 104 is used to provide electrical signals to the flexible circuit board 103 .

[0117] In some embodiments of the present application, the electronic device 10 further includes an ink layer 010, which covers the non-display area of ​​the display module 100. This prevents light emitted from the non-display area of ​​the display module 100 from affecting the image displayed by the display module 100. In some embodiments, the ink layer 010 is located between the cover plate 101 and the display module 100. In some embodiments, the ink layer 010 can be located inside the cover plate 101. In other words, the cover plate 101 can be a multi-layer structure, with the ink layer 010 located between any two layers of the multi-layer structure.

[0118] It is understood that in some embodiments of the present application, the aforementioned bent portion 102 may also include the ink layer 010. In other words, the end of the ink layer 010 is bent to form a portion of the bent portion 102. In this way, the encapsulating portion 112 can enclose a portion of the ink layer 010.

[0119] In some embodiments, the chip 104 is located outside the encapsulation portion 112 .

[0120] In some embodiments, at least a portion of the chip 104 is embedded in the encapsulation portion 112 . In this manner, the encapsulation portion 112 can protect the chip 104 .

[0121] Figure 6 In the example, the outer peripheral surface of the protective structure 110 facing away from the cover plate 101 is visible. In other words, when the user is using the electronic device 10, the outer peripheral surface of the protective structure 110 facing away from the cover plate 101 is within the user's visual range. In some embodiments, the outer peripheral surface of the protective structure 110 facing away from the cover plate 101 can be set to be invisible.

[0122] Figure 7 A schematic structural diagram of another protective structure 110 and frame 211 provided in an embodiment of the present application. Figure 7 and Figure 6The differences include: electronic device 10 further includes a barrier 105, which is connected to one end of frame 211 and surrounds the outer periphery of protective structure 110. When electronic device 10 is in the unfolded state, a second gap 003 is defined between barrier 105 and protective structure 110 along the thickness direction of frame 211.

[0123] Thus, the presence of the second gap 003 prevents the enclosure 105 from interfering with the movement of the protective structure 110 relative to the frame 211. Because the enclosure 105 surrounds the periphery of the protective structure 110, it can obscure at least a portion of the outer surface of the protective structure 110, rendering the obscured portion invisible and thereby enhancing the aesthetics of the electronic device 10. Furthermore, the enclosure 105 can partially prevent damage to the outer surface of the protective structure 110 from external forces.

[0124] As the electronic device 10 moves from the flattened state to the folded state, the widths of the second gap 003 and the first gap 002 decrease. The present embodiment does not limit the width d2 of the second gap 003. For example, the width d2 of the second gap 003 can be greater than the width d1 of the first gap 002, or the width d2 of the second gap 003 can be less than or equal to the width d1 of the first gap 002. For example, the width d2 of the second gap 003 is 0.1 mm to 1 mm. The width d2 of the second gap 003 can be, for example, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm, etc.

[0125] Figure 7 In the example, the enclosure 105 and the frame 211 are connected as an integrally formed part. In other words, the enclosure 105 can be considered a part of the first middle frame 210. This ensures a strong connection between the enclosure 105 and the frame 211. Furthermore, the process for forming the enclosure 105 and the frame 211 is relatively simple. In other embodiments of the present application, the enclosure 105 and the frame 211 can be two separate parts connected by a glue layer or a welding layer.

[0126] The embodiment of the present application does not limit the shape of the enclosure 105. In some embodiments, the outer peripheral surface of the enclosure 105 facing away from the protective structure 110 and the surface of the enclosure 105 facing the light emitting surface of the electronic device 10 form a smooth arc transition.

[0127] Figure 7In the example shown, the surface of the enclosure 105 facing away from the frame 211 and the surface of the top cover 111 facing away from the encapsulation portion 112 are coplanar. In other words, the surface of the enclosure 105 facing away from the frame 211 and the surface of the top cover 111 facing away from the encapsulation portion 112 are flush. This improves the aesthetics of the electronic device. In some embodiments, the surface of the enclosure 105 facing away from the frame 211 can protrude beyond the surface of the top cover 111 facing away from the encapsulation portion 112. Alternatively, in some embodiments, the surface of the top cover 111 facing away from the encapsulation portion 112 can protrude beyond the surface of the enclosure 105 facing away from the frame 211.

[0128] Figure 7 For the rest of the structure, please refer to Figure 6 The description in , will not be repeated here.

[0129] Figure 8 This is a structural diagram of another protective structure 110 and frame 211 provided in an embodiment of the present application. Figure 8 , Figure 8 and Figure 6 The difference is that Figure 8 The protective structure 110 further includes a first supporting portion 113 and a second supporting portion 114 .

[0130] Figure 8 In the embodiment, the first supporting portion 113 is connected to the top cover 111 , the first supporting portion 113 is located between the encapsulating portion 112 and the frame 211 , and the first gap 002 is located between the first supporting portion 113 and the frame 211 .

[0131] In this way, the first support portion 113 can support the top cover 111. In addition, the first support portion 113 isolates the first gap 002 from the encapsulation portion 112, preventing the encapsulation portion 112 from deforming and narrowing the first gap 002, thereby making the protective structure 110 move more smoothly relative to the frame 211.

[0132] In addition, in the embodiment where the encapsulating portion 112 includes glue, during the process of forming the encapsulating portion 112 , the first supporting portion 113 can support the glue forming the encapsulating portion 112 to reduce glue overflow.

[0133] Figure 8 In the embodiment of the present invention, the protective structure 110 may further include a second support portion 114, which is connected to the side of the encapsulating portion 112 facing away from the top cover 111 and is connected to the end of the first support portion 113 facing away from the top cover 111. In this way, the second support portion 114 can support the encapsulating portion 112 together with the first support portion 113, thereby preventing the encapsulating portion 112 from deforming and increasing friction between the encapsulating portion 112 and the middle plate 212.

[0134] Figure 8In the example, the first support portion 113 and the second support portion 114 are connected to form an integrally formed part. The first support portion 113 and the second support portion 114 together form an L-shaped structure. In other embodiments, the first support portion 113 and the second support portion 114 can form structural members of other shapes.

[0135] For example, the material of the first support portion 113 may be rubber, polyurethane, silicone or plastic, etc.; the material of the second support portion 114 may be rubber, polyurethane, silicone or plastic, etc.; this embodiment of the present application does not impose any limitation on this.

[0136] In some embodiments of the present application, the first support portion 113 and the top cover 111 are connected as an integrally formed part. This provides a high connection strength between the first support portion 113 and the top cover 111, thereby improving the strength of the protective structure 110.

[0137] In some embodiments, the first support portion 113 and the top cover 111 may be connected by an adhesive layer or a buckle.

[0138] In some embodiments, the encapsulating portion 112 may not wrap around the bent portion 102. In other words, the bent portion 102 does not extend into the encapsulating portion 112. For example, the bent portion 102 is connected to the first support portion 113 via the encapsulating portion 112. In this way, the encapsulating portion 112, the top cover 111, the first support portion 113, and the bent portion 102 can remain relatively stationary.

[0139] In some embodiments of the present application, the first support portion 113 and the second support portion 114 may be two parts, and the two parts are connected by an adhesive layer, a welding layer, or a snap fastener.

[0140] In some embodiments of the present application, the second supporting portion 114 is not necessary, and the protective structure 110 may only be provided with the first supporting portion 113 .

[0141] Figure 8 In the example shown in FIG, one end of the support layer 302 extends into the encapsulation portion 112 to increase the connection strength between the display module 100 and the encapsulation portion 112. It is understood that in other embodiments, the support layer 302 may be located outside the encapsulation portion 112.

[0142] in addition, Figure 8 In an embodiment, the electronic device does not include Figure 7 The enclosure 105 shown. In some embodiments, Figure 8 The example in can also be set Figure 7 The enclosure 105 shown in FIG.

[0143] Figure 9 This is a schematic diagram of another protective structure 110 and frame 211 provided in an embodiment of the present application. Figure 9 , Figure 9 and Figure 6 The difference is that Figure 9 The encapsulation portion 112 and the top cover 111 are connected as a single piece. In other words, the encapsulation portion 112 and the top cover 111 are made of the same material. This ensures a strong connection between the encapsulation portion 112 and the top cover 111, making the joint less susceptible to tearing or cracking. This helps improve the strength of the protective structure 110.

[0144] For example, Figure 9 The forming process of the middle protective structure 110 includes: placing the bent portion 102 in a mold, filling the mold with glue, and forming the encapsulation portion 112 and the top cover 111 after thermal curing or light curing.

[0145] In some embodiments, Figure 9 The example in can also be set Figure 7 Likewise, in some embodiments of the present application, Figure 9 The example in can also be set Figure 8 The first support portion 113 and the second support portion 114 are shown in FIG.

[0146] In addition, the shapes of the encapsulation portion 112 and the top cover 111 provided in the embodiment of the present application are similar to those of the embodiment of the present invention. Figure 6 The shapes of the middle encapsulating portion 112 and the top cover 111 may be the same or different.

[0147] Figure 6 、 Figure 7 、 Figure 8 and Figure 9 Some examples of the protective structure 110 being able to move relative to the frame 211 are shown. Figure 6-Figure 9 In the example, when the electronic device 10 moves from the flat state to the folded state, the part of the laminate of the display away from the first middle frame 210, such as the cover 101, moves relative to the first middle frame 210, and the area of ​​the cover 101 away from the rotation axis 230 moves in the direction away from the rotation axis 230. This movement of the cover 101 pushes the protective structure 110 toward the frame 211 to release the internal stress of the display.

[0148] In some embodiments of the present application, when the electronic device 10 moves from the flat state to the folded state, the protective structure 110 may not move relative to the frame 211. For example, deformation of the protective structure 110 may also release internal stress in the display module 100.

[0149] Figure 10 This is a structural diagram of another protective structure 110 and frame 211 provided in an embodiment of the present application. Figure 10, the protective structure 110 is connected to the frame 211. The protective structure 110 does not cover the light-emitting surface of the cover plate 101. The protective structure 110 is elastic, and the protective structure 110 is deformed during the movement of the electronic device 10 from the flat state to the folded state. In this way, during the movement of the electronic device 10 from the flat state to the folded state, the display module 100 and the cover plate 101 move together close to the frame 211. After the edge of the display module 100 contacts the protective structure 110, the display module 100 applies a force to the protective structure 110 to make the protective structure 110 close to the frame 211, and the protective structure 110 is deformed to release the internal stress of the display module 100.

[0150] When the electronic device 10 moves from the folded state to the flattened state, the display module 100 and the cover 101 move together away from the frame 211. The protective structure 110 recovers from its deformation.

[0151] In the embodiment of the present application, the protective structure 110 and the frame 211 can be connected by a glue layer, a snap fastener or other structures.

[0152] The protective structure 110 is made of an elastic material, such as rubber. The protective structure 110 made of rubber deforms under the force of the display module 100 , effectively releasing the internal stress of the display module 100 .

[0153] In some embodiments, when the display module 100 is in the unfolded state, a third gap 004 is defined between the protective structure 110 and the cover plate 101. By way of example, the width of the third gap 004 can be 0.05 mm to 0.6 mm. Examples of the width of the third gap 004 include 0.05 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, or 0.6 mm. The third gap 004 allows for the cover plate 101 and display module 100 to move relative to the frame 211.

[0154] In some embodiments of the present application, an adhesive layer may be disposed within the aforementioned third gap 004. This adhesive layer connects the protective structure 110 to the cover plate 101. As the electronic device 10 moves from a folded state to a flattened state, the display module 100 and the cover plate 101 move together away from the frame 211. The cover plate 101 pulls on the protective structure 110 through the adhesive layer disposed within the third gap 004, causing the protective structure 110 to be stretched.

[0155] Figure 10 In the example, the protection structure 110 and the display module 100 are not connected. Figure 10 In the example of FIG. 1 , the protective structure 110 may not be provided with the aforementioned encapsulation portion.

[0156] Figure 10For the structure and connection relationship of the display module 100, the rear shell 15a, and the flexible circuit board 103, please refer to the aforementioned Figure 6 The description in , will not be repeated here.

[0157] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0158] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: A display screen, comprising a display module and a cover plate arranged on a light-emitting side of the display module; a protective structure, the protective structure being disposed around the periphery of the display screen and not covering the light-emitting surface of the cover plate, the protective structure covering at least a portion of a non-display area of ​​the display screen; and a frame, the frame being arranged around the periphery of the display screen, and the protective structure at least partially overlapping the frame along the thickness direction of the electronic device; When the electronic device is in a flattened state, a first gap is provided between the protective structure and the frame along the thickness direction of the frame.

2. The electronic device according to claim 1, wherein When the electronic device moves from the flat state to the folded state, the width of the first gap decreases.

3. The electronic device according to claim 1, wherein The electronic device further comprises: a middle plate, the frame being connected to the periphery of the middle plate, and the display module being located between the middle plate and the cover plate; The display module or the protective structure is bonded to the middle plate.

4. The electronic device according to claim 3, wherein: The electronic device further includes: an adhesive component; the display module or the protective structure is bonded to the middle plate via the adhesive component.

5. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further includes a flexible circuit board, the display module includes a bending portion located in the non-display area, and the bending portion is connected to the flexible circuit board; The protective structure includes a connected top cover and an encapsulating portion, wherein the top cover is arranged around the outer periphery of the cover plate; at least a portion of the bent portion is buried in the encapsulating portion, and the first gap is located between the encapsulating portion and the frame.

6. The electronic device according to claim 5, characterized in that The protective structure further includes a first supporting portion connected to the top cover, the first supporting portion is located between the encapsulating portion and the frame, and the first gap is located between the first supporting portion and the frame.

7. The electronic device according to claim 6, wherein: The first support portion and the top cover are connected to form an integrally formed part.

8. The electronic device according to claim 6, wherein: The protective structure further includes a second supporting portion connected to a side of the encapsulating portion facing away from the top cover, and the second supporting portion is connected to an end of the first supporting portion away from the top cover.

9. The electronic device according to claim 5, wherein: The encapsulating portion and the top cover are connected to form an integrally formed part.

10. The electronic device according to claim 5, wherein: The material of the encapsulation portion includes glue.

11. The electronic device according to claim 5, characterized in that The display module includes a light-emitting layer and a supporting layer that are stacked, and the supporting layer is located on the backlight surface of the light-emitting layer; the bending portion includes the light-emitting layer and the supporting layer located in the non-display area.

12. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further includes a fence connected to the frame and arranged around the periphery of the protective structure; When the electronic device is in the unfolded state, a second gap is provided between the enclosure and the protective structure along the thickness direction of the frame.

13. The electronic device according to claim 12, wherein: The enclosure and the frame are connected to form an integrally formed part.

14. The electronic device according to any one of claims 1 to 4, characterized in that: Along the thickness direction of the electronic device, a third gap is provided between the protective structure and the frame.

15. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further includes a polarizer, which is located between the cover plate and the display module, and one end of the polarizer extends into the protective structure.

16. The electronic device according to any one of claims 1 to 4, characterized in that: The electronic device further includes a protective film, wherein the protective film covers the light-emitting surface of the cover plate, and the protective structure does not cover the light-emitting surface of the protective film.

17. The electronic device according to any one of claims 1 to 4, characterized in that: When the electronic device is in a flat state, the width of the first gap is 0.1 mm-1 mm.

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