Magnetron sputtering coating device
By designing parallel upper and lower coating chambers and vacuum components in the magnetron sputtering coating apparatus, the problem of the carrier plate affecting air extraction was solved, thereby improving the uniformity and quality of the coating.
CN223445626UActive Publication Date: 2025-10-17拉普拉斯(西安)科技有限责任公司
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Patent Information
- Application Number
- CN202421928712.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-08-09
AI Technical Summary
Technical Problem
In the existing magnetron sputtering coating device, when coating, the carrier plate affects the vacuum effect of the vacuum pump, resulting in uneven coating and reduced quality.
Method used
The upper and lower coating chambers are arranged side by side, and the first and second vacuum components are respectively configured. The exhaust port of the second vacuum component is located below the lower coating chamber. The gas is discharged through the exhaust pipe to avoid the carrier plate affecting the exhaust and improve the uniformity of the exhaust.
Benefits of technology
This improves the uniformity and quality of the coating, ensuring the stability and consistency of the coating effect.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model belongs to the technical field of vacuum coating, and discloses a magnetron sputtering coating device. The magnetron sputtering coating device comprises an upper coating chamber, a lower coating chamber, a first vacuum assembly and a second vacuum assembly, the upper coating chamber and the lower coating chamber are arranged in parallel, the first vacuum assembly vacuumizes the upper coating chamber and provides a first material conveying space, and the second vacuum assembly vacuumizes the lower coating chamber and provides a second material conveying space. The second vacuum assembly comprises a second vacuum chamber and an extraction opening, the extraction opening is formed in the second vacuum chamber, and the extraction opening is located below the second material transportation space. When the magnetron sputtering coating device is used for coating, the third vacuum assembly is used for vacuumizing the lower part of the lower coating chamber, so that the influence of the support plate during air exhaust can be avoided, the air exhaust uniformity can be improved, the coating effect is further improved, and the coating uniformity is ensured.
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