High-temperature baking support for semiconductor ceramic products

Abstract

The high-temperature baking support for the semiconductor ceramic products comprises the support body and the supporting seat arranged on the support body, the semiconductor ceramic products are placed on the supporting seat, and the support body can be arranged in a stacked mode through the supporting seat, so that the semiconductor ceramic products are stacked, the space in a baking box is effectively utilized, and the baking efficiency is improved. Compared with the prior art, the high-temperature baking support for the semiconductor ceramic products has the advantages that the batch of the ceramic products baked at a time is increased, the baking efficiency of the semiconductor ceramic products is improved, the semiconductor ceramic products can be supported and stacked by the high-temperature baking support for the semiconductor ceramic products, the space in a baking box is effectively utilized, and the baking efficiency of the semiconductor ceramic products is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of semiconductor support, specifically, the utility model relates to a kind of semiconductor ceramic product high-temperature baking support. BACKGROUND

[0002] In semiconductor process, high-temperature baking of ceramic product often appears in process flow, and most semiconductor ceramic products are thin circular rings. Due to the constraint of space in the oven, semiconductor ceramic products can only be laid flat in the oven. The effective baking range in the oven is small, resulting in low baking efficiency of semiconductor ceramic products and reduced production efficiency.

[0003] To solve the above problems, patent document 221259453U discloses a support for baking sheet, which comprises a fixed frame and a support plate. The lower surface of the fixed frame is fixedly connected with universal wheels. The surface of the support plate is provided with an auxiliary device. The auxiliary device comprises a sliding hole. The sliding hole is formed in the surface of the support plate. The inner wall of the sliding hole is slidably connected with a sliding plate. One end of the sliding plate is fixedly connected with a handle. The other end of the support plate is fixedly connected with a sliding block. The upper surface of the sliding block is fixedly connected with a rectangular bar. The surface of the rectangular bar is fixedly connected with a rubber pad. The surface of the sliding block is fixedly connected with a spring. The other end of the spring is fixedly connected with the support plate. The surface of the sliding block is fixedly connected with a guide rod. However, the above problems cannot be solved. SUMMARY

[0004] The utility model is carried out to solve the above problems. The purpose is to provide a semiconductor ceramic product high-temperature baking support that can support semiconductor ceramic products, effectively utilize the space in the baking oven, and improve the baking efficiency of semiconductor ceramic products. To achieve the above purpose, the utility model adopts the following technical scheme:

[0005] The utility model provides a kind of semiconductor ceramic product high-temperature baking support, with such characteristics, including support body and support seat being set on support body, ceramic product is placed on support seat.

[0006] In the semiconductor ceramic product high-temperature baking support provided by the utility model, the support seat can be uniformly arranged on the support body.

[0007] In the semiconductor ceramic product high-temperature baking support provided by the utility model, the support seat can be uniformly arranged on the support body.

[0008] In the semiconductor ceramic product high-temperature baking support provided by the utility model, the support seat can be uniformly arranged on the support body.

[0009] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of semiconductor ceramic products.

[0010] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of semiconductor ceramic products.

[0011] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of semiconductor ceramic products.

[0012] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of semiconductor ceramic products.

[0013] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of semiconductor ceramic products.

[0014] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of semiconductor ceramic products.

[0015] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of semiconductor ceramic products. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present specification includes the following drawings, and the shown contents are respectively:

[0017] Figure 1 is the structure schematic diagram of the semiconductor ceramic product high-temperature baking support in the embodiment of the utility model in the direction of the plan view;

[0018] Figure 2 is the sectional view of the semiconductor ceramic product high-temperature baking support in the embodiment of the utility model. DETAILED DESCRIPTION

[0019] The specific embodiments of the present application are further described in detail below with reference to the drawings, and the purpose is to help the skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solutions of the present application, and to help its implementation.

[0020] Figure 1 It is the structure schematic diagram of the semiconductor ceramic product high-temperature baking support in the embodiment of the utility model in the plan view direction; Figure 2 It is the sectional view of the semiconductor ceramic product high-temperature baking support in the embodiment of the utility model.

[0021] As Figure 1 And Figure 2 The semiconductor ceramic product high-temperature baking support provided by the utility model includes support body 10 and support seat 20 arranged on support body 10, semiconductor ceramic products are placed on support seat 20, and support seat 20 can be stacked on support body 10, so as to stack semiconductor ceramic products, effectively utilize the space in the baking oven, increase the batch of ceramic products in single baking, and improve the baking efficiency of semiconductor ceramic products.

[0022] Support body 10 is circular, is matched with semiconductor ceramic products, and at least three support seats are evenly distributed on support body 10, in the embodiment, six support seats 20 are evenly distributed on support body 10, the distance between adjacent two support seats 20 is same, and six support seats 20 jointly receive semiconductor ceramic products, effectively avoid the shaking of semiconductor ceramic products, and improve the stability of semiconductor ceramic products in the baking process.

[0023] Support seat 20 is provided with receiving boss 21, semiconductor ceramic products abut against receiving boss 21, so as to support semiconductor ceramic products, support seat 20 is also provided with lapping boss 22, lapping boss 22 is located at one side of receiving boss 21, the height of lapping boss 22 is higher than that of receiving boss 21, so as to avoid damaging semiconductor ceramic products in the process of stacking support body 10, and improve the reliability of structure. And receiving boss 21 is located at the inner side of support body 10, and lapping boss 22 is located at the outer side of support body 10, so as to improve the rationality of layout.

[0024] The semiconductor ceramic product high-temperature baking support provided by the utility model also includes lapping structure 30, lapping structure 30 includes lapping boss 31 arranged on lapping boss 22 and lapping groove 32 arranged at the bottom of support body 10, lapping boss 31 is matched with lapping groove 32, so as to conveniently stack the semiconductor ceramic product high-temperature baking support provided by the utility model, and semiconductor ceramic products can be stacked, so as to effectively utilize the space in the baking oven, increase the batch of ceramic products in single baking, and improve the baking efficiency of semiconductor ceramic products.

[0025] Effects of embodiments

[0026] The semiconductor ceramic product high-temperature baking support provided by the utility model can support semiconductor ceramic products, stack the semiconductor ceramic products, effectively utilize the space in the baking oven and improve the baking efficiency of the semiconductor ceramic products.

[0027] The utility model has been described above in conjunction with the drawings. Obviously, the specific implementation of the utility model is not limited by the above method. As long as various non-essential improvements are made by adopting the method concept and technical solution of the utility model, or the above concept and technical solution of the utility model is directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A high temperature bakeout support for a semiconductor ceramic article, characterized by, The support body (10) and the support seat (20) are arranged on the support body (10), and the ceramic product is placed on the support seat (20), The support seat (20) is uniformly arranged on the support body (10), the support body (10) is in a circular ring shape, and at least three support seats (20) are uniformly distributed on the support body (10), The support seat (20) is provided with a receiving boss (21), and the ceramic product abuts against the receiving boss (21), The support seat (20) is further provided with a lap boss (22), and the lap boss (22) is located on one side of the receiving boss (21), The height of the lap boss (22) is higher than that of the receiving boss (21).

2. The semiconductor ceramic article high temperature bakeout rack of claim 1, wherein, Further comprising a lap joint structure (30), the lap joint structure (30) comprises a lap joint boss (31) arranged on the lap boss (22) and a lap joint groove (32) arranged at the bottom of the support body (10), and the lap joint boss (31) is matched with the lap joint groove (32).

3. The semiconductor ceramic article high temperature bakeout rack of claim 2, wherein, Six support seats (20) are uniformly distributed on the support body (10).

4. The semiconductor ceramic article high temperature bakeout rack of claim 3, wherein, The receiving boss (21) is located on the inner side of the support body (10), and the lap joint boss (31) is located on the outer side of the support body (10).

Images