Semiconductor wafer defect detection device

Abstract

The utility model relates to the technical field of wafer defect detection, and discloses a semiconductor wafer defect detection device which comprises a machine body and a fixed sleeve box, and the inner bottom wall of the machine body is connected with a supporting seat in a sliding manner. According to the semiconductor wafer defect detection device, through the arrangement of the adjusting assembly and the hydraulic rod, different defects need different magnification factors for effective detection, when the magnification magnifier needs to be replaced, the hydraulic rod is started to drive the rotating disc to move downwards, so that the detection camera is separated from the existing magnification magnifier, and then the output motor is started; when the other group of magnifying lenses reach the bottom of the detection camera, the hydraulic rod moves upwards, so that the detection camera is inserted into the magnifying lenses, the effect of automatically replacing the magnifying lenses with different magnifying lenses is achieved, and the workload of adjusting and mounting by personnel is reduced; and the efficiency of the semiconductor wafer defect detection device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer defect detection technical field especially relates to a semiconductor wafer defect detection device. BACKGROUND

[0002] The existing semiconductor wafer defect detection device needs to replace different magnifying glasses to adapt to the change of wafer defect size in actual use, and manual replacement increases the workload of workers.

[0003] Through the setting of the threaded rod, when the semiconductor wafers of different sizes are clamped and positioned, the semiconductor wafers are placed in the middle of the object plate, and then the servo motor is started to drive the threaded rod to rotate. When the threaded rod rotates, it can drive the moving plate to move limitly. When the moving plate moves, it can pull the slide plate inwardly through the pull rod. When the slide plate moves, it can move stably under the support of the two side support wheels. At the same time, the slide plate drives the clamping plate to clamp and position the placed semiconductor wafers, improves the positioning and installation efficiency, and can clamp and position the semiconductor wafers of different sizes for detection.

[0004] The above-mentioned patent can clamp and position the semiconductor wafers through the slide plate and the clamping plate, improve the positioning and installation efficiency, and clamp and position the semiconductor wafers of different sizes, but the wafer body is made of silicon material, which has relatively low toughness and strength. When the clamping force of the hard object is too large, it is easy to cause hard damage and affect the detection effect.

[0005] Therefore, it is necessary to invent a semiconductor wafer defect detection device to solve the above-mentioned problems. UTILITY MODEL CONTENTS

[0006] (I) Technical problem solved

[0007] The utility model solves the technical problem of providing a semiconductor wafer defect detection device with high practicability and simple structure, which solves the problem of inconveniently replacing magnifying glasses of different magnifications for observation and detection and directly clamping the wafer body with a hard object, which causes hard damage.

[0008] (II) Technical scheme

[0009] To achieve the above object, the utility model discloses a semiconductor wafer defect detection device through the following technical schemes, a semiconductor wafer defect detection device, including machine body and fixed cover box, the inner bottom wall of machine body is connected with support seat slidingly, the top of support seat is fixedly connected with the placing tray, the bottom of placing tray is fixedly connected with negative pressure ring, the bottom of negative pressure ring is connected with negative pressure component, the inside of placing tray is connected with lifting assembly slidingly, the inside of fixed cover box is rotatably connected with hydraulic rod, the surface of hydraulic rod is sleeved with adjusting assembly, negative pressure component includes the connecting pipe that is connected to the bottom of negative pressure ring, one end of connecting pipe is connected with negative pressure pump, lifting assembly includes four groups of support rods that are connected in the inside of placing tray slidingly, the bottom of support rod is fixedly connected with fixed disc, the bottom of fixed disc is fixedly connected with hydraulic column, adjusting assembly includes the gear ring that is sleeved on the surface of hydraulic rod, the surface of gear ring is engaged with rotating gear, the bottom of rotating gear is fixedly connected with output motor.

[0010] As a further scheme of the utility model, the inner wall of the machine body is connected with a sliding block slidingly, one side of the sliding block is fixedly connected with a moving box, the inside of the moving box and the machine body are rotatably connected with threaded rods, one end of the threaded rods is fixedly connected with a drive motor, the drive motor is convenient for driving the threaded rods to rotate.

[0011] As a further scheme of the utility model, the surface of one of the threaded rods is threadedly connected with a pneumatic slide rail, a threaded hole that is matched with the threaded rod is formed in the inside of one end of the pneumatic slide rail, and the threaded hole is convenient for the threaded rod to rotate.

[0012] As a further scheme of the utility model, the bottom end of the hydraulic rod is fixedly connected with a turntable, three groups of multiple magnifying glasses are annularly arrayed in the inside of the turntable, and the multiple magnifying glasses are convenient for magnifying the detection multiple.

[0013] As a further scheme of the utility model, the bottom of the fixed cover box is provided with a detection camera, one side of the inner top wall of the machine body is fixedly connected with a support block, and the support block is convenient for the rotating rod to rotate.

[0014] As a further scheme of the utility model, the inner top wall of the machine body is fixedly connected with two groups of positioning slide rails, two groups of sliding grooves that are matched with the positioning slide rails are formed in the bottom of the support seat, and the sliding grooves are convenient for the support seat to slide on the positioning slide rails.

[0015] As a further scheme of the utility model, the inside of the support block is rotatably connected with a rotating rod, one end of the rotating rod is fixedly connected with a rotating motor, and the rotating motor is convenient for driving the rotating rod to rotate.

[0016] As a further scheme of the utility model, the front of the machine body is fixedly connected with two groups of fixed frames, the inside of the fixed frame is fixedly connected with a transparent plastic plate, and the transparent plastic plate is convenient for observing the situation inside the machine body.

[0017] As a further scheme of the utility model, the top of the machine body is fixedly connected with two groups of exhaust fans, and the surface of the exhaust fan is provided with a dust screen, so that the exhaust fan is convenient for exhausting the hot air inside.

[0018] As a further scheme of the utility model, the surface of the negative pressure ring is provided with a plurality of groups of air holes, and the side of the machine body is fixedly connected with a placing frame, so that the placing frame is convenient for storing parts.

[0019] As a further scheme of the utility model, the front of the machine body is hingedly connected with a box door through a hinge, and the surface of the box door is provided with a handle, so that the handle is convenient for opening the box door.

[0020] (Three) beneficial effects

[0021] The utility model provides a kind of semiconductor wafer defect detection device, with following beneficial effects:

[0022] 1、The semiconductor wafer defect detection device, by the setting of adjusting assembly and hydraulic rod, different defects need different magnification for effective detection, when the magnification changer needs to be replaced, the hydraulic rod is started to drive the carousel to descend, so that the detection camera is separated from the existing magnification changer, then the output motor is started, the rotating gear is rotated, and the gear ring on the hydraulic rod is rotated, when another set of magnification changer reaches the bottom of the detection camera, the hydraulic rod is raised, so that the detection camera is inserted into the magnification changer, thereby achieving the effect of automatically replacing different magnification changers, reducing the workload of personnel adjustment and installation, and improving the efficiency of semiconductor wafer defect detection device.

[0023] 2、The semiconductor wafer defect detection device, by the setting of negative pressure ring, negative pressure assembly and lifting assembly, when in use, the semiconductor wafer is placed into the placing disc, then the negative pressure pump is started to exhaust the air in the negative pressure ring, so that the negative pressure in the air hole adsorbs the semiconductor wafer to stabilize, then the rotating motor is started to drive the rotating rod to rotate, the rotating rod is rotated to drive the support seat to move under the detection camera, when the detection is finished, the negative pressure pump is stopped, the hydraulic column is started to push the fixed disc, so that the support rod slides in the placing disc and lifts the semiconductor wafer to separate from the placing disc, thereby increasing the stability of the semiconductor wafer, and using the negative pressure adsorption principle to fix, reducing the damage caused by hard clamping, and improving the accuracy of semiconductor wafer defect detection device. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is overall structure schematic view of the utility model;

[0025] Figure 2 It is the split structure schematic view of the utility model;

[0026] Figure 3 It is the rotating assembly structure schematic view of the utility model;

[0027] Figure 4 It is the negative pressure assembly and lifting assembly structure schematic view of the utility model;

[0028] Figure 5 It is the adjusting assembly structure schematic view of the utility model.

[0029] In the drawing: 1, machine body;2, support seat;3, placing disc;4, negative pressure ring;5, negative pressure assembly;501, connecting pipe;502, negative pressure pump;6, lifting assembly;601, support rod;602, fixed disc;603, hydraulic column;7, sliding block;8, moving box;9, threaded rod;10, pneumatic slide rail;11, fixed sleeve box;12, detection camera;13, hydraulic rod;14, rotating disc;15, multiple magnifying glass;16, adjusting assembly;1601, gear ring;1602, rotating gear;1603, output motor;17, positioning slide rail;18, support block;19, rotating rod;20, rotating motor;21, fixed frame;22, transparent plastic plate;23, exhaust fan;24, driving motor;25, placing frame;26, box door. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0031] Please refer to Figures 1 to 5The utility model provides a technical scheme: a semiconductor wafer defect detection device, including machine body 1 and fixed sleeve box 11, the inner bottom wall slidingly connected with support seat 2 of machine body 1, the top fixedly connected with placing tray 3 of support seat 2, the bottom fixedly connected with negative pressure ring 4 of placing tray 3, the bottom of negative pressure ring 4 is connected with negative pressure assembly 5, through the setting of negative pressure ring 4, negative pressure assembly 5 and lifting assembly 6, increase the effect of semiconductor wafer stability, prevent semiconductor wafer sliding, cause damage, improved the security of semiconductor wafer defect detection device, the inside slidingly connected with lifting assembly 6 of placing tray 3, the inside rotatably connected with hydraulic rod 13 of fixed sleeve box 11, the surface of hydraulic rod 13 is connected with adjustment assembly 16, through the setting of adjustment assembly 16, detection camera 12 and hydraulic rod 13, reach the effect of automatic replacement different multiple magnifying glass 15, reduce the workload of personnel adjustment installation, improved the precision of semiconductor wafer defect detection device, negative pressure assembly 5 includes the connecting pipe 501 of communication at the bottom of negative pressure ring 4, one end of connecting pipe 501 is connected with negative pressure pump 502, lifting assembly 6 includes four groups of support rods 601 slidingly connected in the inside of placing tray 3, the bottom fixedly connected with fixed disc 602 of support rod 601, the bottom fixedly connected with hydraulic column 603 of fixed disc 602, adjustment assembly 16 includes the gear ring 1601 of sleeve connection on the surface of hydraulic rod 13, the surface of gear ring 1601 is engaged with rotating gear 1602, the bottom fixedly connected with output motor 1603 of rotating gear 1602.

[0032] The inner wall of machine body 1 is slidingly connected with a sliding block 7, one side of the sliding block 7 is fixedly connected with a moving box 8, the inside of the moving box 8 and the machine body 1 is rotatably connected with a threaded rod 9, one end of the threaded rod 9 is fixedly connected with a drive motor 24, through the setting of the drive motor 24, the threaded rod 9 is driven to rotate.

[0033] One surface of the threaded rod 9 is threadedly connected with a pneumatic slide rail 10, a thread hole adapted to the threaded rod 9 is formed in the inside of one end of the pneumatic slide rail 10, through the setting of the thread hole, the threaded rod 9 is conveniently rotated.

[0034] The bottom end of the hydraulic rod 13 is fixedly connected with a turntable 14, three groups of multiple magnifying glasses 15 are annularly arrayed in the inside of the turntable 14, through the setting of the multiple magnifying glasses 15, the detection multiple is enlarged.

[0035] The bottom of the fixed sleeve box 11 is provided with a detection camera 12, one side of the inner top wall of the machine body 1 is fixedly connected with a support block 18, through the setting of the support block 18, the rotating rod 19 is conveniently rotated.

[0036] The inner top wall of the body 1 is fixedly connected with two groups of positioning slide rails 17, the bottom of the support seat 2 is provided with two groups of sliding grooves matched with the positioning slide rails 17, through the setting of the sliding grooves, the support seat 2 is conveniently slid on the positioning slide rails 17.

[0037] The inside of the support block 18 is rotatably connected with a rotating rod 19, one end of the rotating rod 19 is fixedly connected with a rotating motor 20, through the setting of the rotating motor 20, the rotating rod 19 is driven to rotate.

[0038] The front of the body 1 is fixedly connected with two groups of fixed frames 21, the inside of the fixed frame 21 is fixedly connected with a transparent plastic plate 22, through the setting of the transparent plastic plate 22, the inside of the body 1 is conveniently observed.

[0039] The top of the body 1 is fixedly connected with two groups of exhaust fans 23, the surface of the exhaust fan 23 is provided with a dustproof net, through the setting of the exhaust fan 23, the inside hot air is discharged.

[0040] The surface of the negative pressure ring 4 is provided with a plurality of groups of air holes, one side of the body 1 is fixedly connected with a placing frame 25, through the setting of the placing frame 25, the parts are conveniently stored.

[0041] The front of the body 1 is hingedly connected with a box door 26, the surface of the box door 26 is provided with a handle, through the setting of the handle, the box door 26 is conveniently opened.

[0042] In the utility model, the working steps of the device are as follows:

[0043] The first step is that, in use, the semiconductor wafer is placed into the placing disc 3, then the negative pressure pump 502 is started, the air in the negative pressure ring 4 is extracted, the negative pressure in the air hole is adsorbed to the semiconductor wafer to be stable, then the rotating motor 20 is started to drive the rotating rod 19 to rotate;

[0044] The second step is that the rotating rod 19 is rotated to drive the support seat 2 to move below the detection camera 12, when the detection is finished, the negative pressure pump 502 is stopped, the hydraulic column 603 is started to push the fixed disc 602, the support rod 601 is slid in the placing disc 3, and the semiconductor wafer is lifted to separate from the placing disc 3;

[0045] The third step is that different defects need different magnification to effectively detect, when the magnification of the magnifying glass 15 needs to be changed, the hydraulic rod 13 is started to drive the rotating disc 14 to descend, so that the detection camera 12 is separated from the existing magnification of the magnifying glass 15.

[0046] The fourth step: further start the output motor 1603, drive the rotating gear 1602 to rotate, further drive the gear ring 1601 on the hydraulic rod 13 to rotate, when the other group of multiple magnifying glasses 15 reaches the bottom of the detection camera 12, the hydraulic rod 13 goes up, so that the detection camera 12 is inserted into the multiple magnifying glasses 15.

[0047] It should be noted that the device structure and the drawings of the utility model mainly describe the principle of the utility model, and the setting of the power mechanism, the power supply system and the control system of the device is not completely described in the technical principle of the design, and under the premise that the technical personnel in the field understand the principle of the above-mentioned utility model, the specific of the power mechanism, the power supply system and the control system can be clearly known, and the control mode of the application file is automatically controlled through the controller, and the control circuit of the controller can be realized through simple programming of the technical personnel in the field;

[0048] The standard parts used can be purchased from the market, and can be ordered according to the description and drawings, and the specific connection mode of each part adopts the conventional screw, rivet, welding and other conventional means in the prior art, the mechanical parts and equipment adopt the conventional type in the prior art, and the components known by the technical personnel in the field, the structure and principle are known by the technical personnel in the field through the technical manual or through the conventional experimental method.

[0049] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principle and spirit of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer defect detection device comprising a machine body (1) and a fixed cover box (11), characterized in that: The inner bottom wall of the machine body (1) is slidingly connected with a support seat (2), the top of the support seat (2) is fixedly connected with a placing disc (3), the bottom of the placing disc (3) is fixedly connected with a negative pressure ring (4), the bottom of the negative pressure ring (4) is communicated with a negative pressure assembly (5), the inside of the placing disc (3) is slidingly connected with a lifting assembly (6), the inside of the fixed sleeve box (11) is rotatably connected with a hydraulic rod (13), the surface of the hydraulic rod (13) is sleeved with an adjusting assembly (16), The negative pressure assembly (5) comprises a connecting pipe (501) communicated with the bottom of the negative pressure ring (4), and one end of the connecting pipe (501) is communicated with a negative pressure pump (502). The lifting assembly (6) comprises four groups of support rods (601) slidingly connected in the inside of the placing disc (3), the bottom of the support rod (601) is fixedly connected with a fixed disc (602), and the bottom of the fixed disc (602) is fixedly connected with a hydraulic column (603). The adjusting assembly (16) comprises a gear ring (1601) sleeved on the surface of the hydraulic rod (13), the surface of the gear ring (1601) is engaged with a rotating gear (1602), and the bottom of the rotating gear (1602) is fixedly connected with an output motor (1603).

2. The semiconductor wafer defect detection apparatus of claim 1, wherein: The inner wall of the machine body (1) is slidingly connected with a sliding block (7), one side of the sliding block (7) is fixedly connected with a moving box (8), and the inside of the moving box (8) and the machine body (1) are both rotatably connected with a threaded rod (9), one end of the threaded rod (9) is fixedly connected with a driving motor (24).

3. The semiconductor wafer defect detection apparatus of claim 2, wherein: The surface of one group of the threaded rods (9) is threadedly connected with a pneumatic slide rail (10), and the inside of one end of the pneumatic slide rail (10) is provided with a threaded hole matched with the threaded rod (9).

4. The semiconductor wafer defect detection apparatus of claim 1, wherein: The bottom end of the hydraulic rod (13) is fixedly connected with a rotating disc (14), and the inside of the rotating disc (14) is annularly and arrayedly sleeved with three groups of multiple magnifying glasses (15).

5. The semiconductor wafer defect detection apparatus of claim 1, wherein: The bottom of the fixed sleeve box (11) is provided with a detection camera (12), and one side of the inner top wall of the machine body (1) is fixedly connected with a support block (18).

6. The semiconductor wafer defect detection apparatus of claim 1, wherein: The inner top wall of the machine body (1) is fixedly connected with two groups of positioning slide rails (17), and the bottom of the support seat (2) is provided with two groups of sliding grooves matched with the positioning slide rails (17).

7. The semiconductor wafer defect detection apparatus of claim 5, wherein: The inside of the support block (18) is rotatably connected with a rotating rod (19), and one end of the rotating rod (19) is fixedly connected with a rotating motor (20).

8. The semiconductor wafer defect detection apparatus of claim 1, wherein: The front of the machine body (1) is fixedly connected with two groups of fixed frames (21), and the inside of the fixed frame (21) is fixedly connected with a transparent plastic plate (22).

9. The semiconductor wafer defect detection apparatus of claim 1, wherein: The top of the machine body (1) is fixedly connected with two groups of exhaust fans (23), and the surface of the exhaust fan (23) is provided with a dustproof net.

10. The semiconductor wafer defect detection apparatus of claim 1, wherein: The surface of the negative pressure ring (4) is provided with a plurality of groups of air holes, and one side of the machine body (1) is fixedly connected with a placing frame (25).

11. The semiconductor wafer defect detection apparatus of claim 1, wherein: The front of the machine body (1) is hingedly connected with a box door (26), and the surface of the box door (26) is provided with a handle.

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