Heat exchange device and refrigerator

Abstract

The utility model provides a heat exchange device and a refrigerator, and the heat exchange device comprises a semiconductor chilling plate which is provided with a hot end; the radiator comprises a base; the base comprises a first part and a second part connected with the first part; the first part is arranged on the hot end; the second part extends out of the hot end; the radiator further comprises a plurality of first radiating fins and a plurality of second radiating fins. The plurality of first heat dissipation fins are arranged on the first part at intervals, and a first interval is formed between every two adjacent first heat dissipation fins; the plurality of second heat dissipation fins are arranged on the second part at intervals, and a second interval is formed between every two adjacent second heat dissipation fins; the first spacing is smaller than the second spacing.

Description

Technical Field

[0001] This application relates to the field of refrigerator technology, and particularly to heat exchange devices and refrigerators. Background Art

[0002] Refrigeration in a refrigerator is achieved by a compressor driving the refrigerant to circulate between the condenser and evaporator. However, this method has drawbacks such as large temperature fluctuations and high noise levels. Therefore, in some scenarios, refrigerator refrigeration can also be achieved using semiconductor refrigeration technology. In existing technologies, the hot end of a semiconductor refrigeration chip suffers from poor heat dissipation, which affects refrigeration efficiency. Utility Model Content

[0003] The main objective of this application is to provide a heat exchange device that aims to solve the technical problem that the heat dissipation effect of the hot end of a semiconductor refrigeration chip is poor, thus affecting the refrigeration efficiency.

[0004] In a first aspect, embodiments of this application provide a heat exchange device, comprising:

[0005] A semiconductor refrigeration chip, the semiconductor refrigeration chip having a hot end; and

[0006] A heat sink includes a base; the base includes a first portion and a second portion connected to the first portion; the first portion is disposed on the hot end; the second portion extends out of the hot end.

[0007] The radiator further includes a plurality of first heat dissipation fins and a plurality of second heat dissipation fins; the plurality of first heat dissipation fins are spaced apart on the first portion, and there is a first gap between two adjacent first heat dissipation fins; the plurality of second heat dissipation fins are spaced apart on the second portion, and there is a second gap between two adjacent second heat dissipation fins; the first gap is smaller than the second gap.

[0008] Optionally, the hot end has a central region and an edge region surrounding the central region; the first spacing between two adjacent first heat dissipation fins corresponding to the central region is smaller than the first spacing between two adjacent first heat dissipation fins corresponding to the edge region.

[0009] Optionally, the thickness of the first portion is gradually varied in the width and / or length direction of the base.

[0010] Optionally, the base has at least two second portions, two of which are respectively connected to the two ends of the first portion in the length direction.

[0011] Optionally, the thickness of the first part is 5-10 mm.

[0012] Optionally, the plurality of first heat dissipation fins and the plurality of second heat dissipation fins are spaced apart in the length direction.

[0013] Optionally, the plurality of first heat dissipation fins and the plurality of second heat dissipation fins are flush with the ends away from the base.

[0014] Optionally, the first spacing is 3.5-5.5 mm, and the second spacing is 6-8 mm.

[0015] Optionally, the radiator further includes a fixing plate, which is disposed on the base;

[0016] The heat exchange device also includes a fan, which is mounted on the fixed plate.

[0017] Secondly, this application also proposes a refrigerator, the refrigerator including the heat exchange device as described above; the semiconductor cooling chip has a cold end configured to provide cooling to the storage compartment of the refrigerator.

[0018] In the technical solution of this application embodiment, the base of the heat sink includes a first part and a second part connected to the first part; the first part is provided with a plurality of first heat dissipation fins, and the second part is provided with a plurality of second heat dissipation fins; and the first distance between two adjacent first heat dissipation fins is smaller than the second distance between two adjacent second heat dissipation fins; the first part is located at the hot end of the semiconductor cooling chip; and thus the arrangement density of the heat dissipation fins corresponding to the hot end of the heat sink is higher than the arrangement density of the heat dissipation fins located outside the hot end of the heat sink, so as to improve the heat dissipation efficiency of the hot end and improve the cooling efficiency. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the heat exchange device provided in the embodiments of this application;

[0021] Figure 2 A three-dimensional structural diagram of the radiator in the heat exchange device provided in the embodiment of this application;

[0022] Figure 3 This is a schematic diagram of the radiator in the heat exchange device provided in the embodiment of this application from one perspective.

[0023] Figure 4A schematic diagram of the structure of one type of radiator in the heat exchange device provided in the embodiments of this application from another perspective;

[0024] Figure 5 A schematic diagram of the structure of another type of radiator in the heat exchange device provided in the embodiment of this application from another perspective;

[0025] Figure 6 This is a schematic diagram of the cooling structure of the heat exchange device provided in the embodiments of this application.

[0026] List of reference numerals

[0027] 100 heat exchanger 123 Second heat dissipation fins 110 Semiconductor Refrigeration Chip 124 Fixed plate 111 Hot End 130 fan 112 cold end 140 Cooler 120 heat sink A1 Middle area 121 base A2 Edge area 1211 Part 1 L1 First spacing 1212 Part Two L2 Second spacing 122 First heat dissipation fin H thickness DETAILED DESCRIPTION

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0029] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0030] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0032] Combination Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in the embodiment of this application, a heat exchange device 100 is also proposed, comprising:

[0033] Semiconductor cooling chip 110, the semiconductor cooling chip 110 having a hot end 111; and

[0034] A radiator 120 includes a base 121; the base 121 includes a first portion 1211 and a second portion 1212 connected to the first portion 1211; the first portion 1211 is disposed on the hot end 111; the second portion 1212 extends out of the hot end 111.

[0035] The radiator 120 further includes a plurality of first heat dissipation fins 122 and a plurality of second heat dissipation fins 123; the plurality of first heat dissipation fins 122 are spaced apart on the first portion 1211, and there is a first distance L1 between two adjacent first heat dissipation fins 122; the plurality of second heat dissipation fins 123 are spaced apart on the second portion 1212, and there is a second distance L2 between two adjacent second heat dissipation fins 123; the first distance L1 is smaller than the second distance L2.

[0036] In the technical solution of this application embodiment, the base 121 of the heat sink 120 includes a first part 1211 and a second part 1212 connected to the first part 1211; the first part 1211 is provided with a plurality of first heat dissipation fins 122, and the second part 1212 is provided with a plurality of second heat dissipation fins 123; and the first distance L1 between two adjacent first heat dissipation fins 122 is smaller than the second distance L2 between two adjacent second heat dissipation fins 123; the first part 1211 is located at the hot end 111 of the semiconductor cooling chip 110; thereby, the arrangement density of the heat dissipation fins of the heat sink 120 corresponding to the hot end 111 is higher than the arrangement density of the heat dissipation fins of the heat sink 120 located outside the hot end 111, so as to improve the heat dissipation efficiency of the hot end 111 and improve the cooling efficiency.

[0037] In the embodiment, the first part 1211 is fixedly connected to the hot end 111, for example, by at least one of adhesive connection, threaded connection, snap-fit ​​connection, or riveting.

[0038] like Figure 5 As shown, in an optional implementation of the above embodiment, the hot end 111 has a central region A1 and an edge region A2 surrounding the central region A1; the first spacing L1 between two adjacent first heat dissipation fins 122 corresponding to the central region A1 is smaller than the first spacing L1 between two adjacent first heat dissipation fins 122 corresponding to the edge region A2. That is, in the embodiment, the density of the first heat dissipation fins 122 in the middle of the radiator 120 is higher, and the density of the first heat dissipation fins 122 at the edge is lower, so as to improve the heat dissipation efficiency of the radiator 120 and improve the cooling efficiency.

[0039] In this embodiment, the intermediate region A1 and the edge region A2 are specifically configured based on the cooling capacity required by the semiconductor cooling chip 110, and no specific limitations are imposed. In this embodiment, the region corresponding to the first heat dissipation fins 122 with a higher arrangement density is the intermediate region A1, and the region corresponding to the first heat dissipation fins 122 with a relatively lower arrangement density is the edge region A2.

[0040] As an optional implementation of the above embodiments, the thickness H of the first portion 1211 is gradually varied in the width direction and / or length direction of the base 121. This arrangement helps to improve the heat transfer efficiency from the hot end 111 to the first heat dissipation fin 122 and the second heat dissipation fin 123.

[0041] In some embodiments, the thickness H of the first portion 1211 may gradually increase or decrease from one side to the other in the width direction and / or the thickness H of the first portion 1211 may gradually increase or decrease from one side to the other in the length direction. In other embodiments, the thickness H of the first portion 1211 may first decrease from one side to the middle in the width direction and then increase from the middle to the other side, and / or the thickness H of the first portion 1211 may first decrease from one side to the middle in the length direction and then increase from the middle to the other side.

[0042] As an optional embodiment of the above embodiments, the base 121 has at least two second portions 1212, two of which are respectively connected to the two ends of the first portion 1211 in the length direction. Figure 3 As shown, the two second parts 1212 are located at both ends of the first part 1211 in the length direction, so that when the first part 1211 is set at the hot end 111 of the semiconductor cooling chip 110, the structural force balance is maintained.

[0043] In some embodiments, the thickness H of the second portion 1212 at one end in the length direction is the same as the maximum value of the thickness H of the first portion 1211, and the thickness H of the second portion 1212 at the other end in the length direction is the same as the minimum value of the thickness H of the first portion 1211, so that the base 121 is structurally continuous.

[0044] As an optional implementation of the above embodiments, the thickness H of the first portion 1211 is 5-10 mm. In some embodiments, the thickness H of the first portion 1211 gradually decreases from 10 mm to 5 mm; in some embodiments, the thickness H of the first portion 1211 can also be stepped, for example, in the length direction, the thickness H of the first portion 1211 is divided into multiple segments connected sequentially along the length direction, and the thickness H of each segment is 10 mm, 9 mm, 8 mm, 7 mm, 6 mm, and 5 mm respectively.

[0045] In the embodiment, the thickness H of the second portion 1212 at one end in the length direction is 10 mm, and the thickness H of the second portion 1212 at the other end in the length direction is 5 mm.

[0046] As an optional implementation of the above embodiments, the plurality of first heat dissipation fins 122 and the plurality of second heat dissipation fins 123 are spaced apart in the length direction. In this embodiment, the plurality of first heat dissipation fins 122 and the plurality of second heat dissipation fins 123 extend in the thickness H direction and are spaced apart in the length direction.

[0047] As an optional implementation of the above embodiments, the plurality of first heat dissipation fins 122 and the plurality of second heat dissipation fins 123 are flush with one end away from the base 121. In this embodiment, the plurality of first heat dissipation fins 122 and the plurality of second heat dissipation fins 123 are disposed on the side of the base 121 away from the hot end 111, and extend away from the base 121 in the thickness H direction and are flush with it, thereby reducing interference with airflow and improving heat dissipation efficiency.

[0048] As an optional implementation of the above embodiments, the first spacing L1 is 3.5-5.5 mm, and the second spacing L2 is 6-8 mm. In the embodiments, the first spacing L1 can be 3.5 mm, 4 mm, 4.5 mm, or 5.5 mm. The second spacing L2 can be 6 mm, 6.5 mm, 7 mm, 7.5 mm, or 8 mm. In some embodiments, the first spacing L1 of the middle region A1 can be 3.5 mm, the first spacing L1 of the edge region A2 can be 4.5 mm, and the second spacing L2 can be 6 mm. In some embodiments, the first spacing L1 is 4 mm, and the second spacing L2 is 8 mm.

[0049] As an optional implementation of the above embodiments, the heat sink 120 further includes a fixing plate 124, which is disposed on the base 121. In this embodiment, two fixing plates 124 are disposed at both ends of the base 121 along its length, and a first heat dissipation fin 122 and a second heat dissipation fin 123 are disposed in the space between the two fixing plates 124. The heat exchange device 100 further includes a fan 130, which is mounted on the fixing plate 124. The fan 130 is used to drive the flow of hot air between the heat dissipation fins to improve heat dissipation efficiency.

[0050] like Figure 2 As shown, the fan 130 covers the first heat dissipation fin 122 and the second heat dissipation fin 123. The mounting plate 124 is provided with screw holes, and the fan 130 is fixed to the mounting plate 124 by threaded parts.

[0051] This application also proposes a refrigerator, which includes a heat exchange device 100. The heat exchange device 100 adopts some or all of the technical solutions in the foregoing embodiments, and therefore possesses all or all of the technical advantages of the foregoing embodiments. The semiconductor cooling chip 110 has a cold end 112, which is configured to provide cooling to the storage compartment of the refrigerator.

[0052] Combination Figure 6As shown, the cooling principle of the semiconductor cooling chip 110 is based on the Peltier effect. When a direct current is applied to a circuit composed of two different conductors, in addition to Joule heating, other heat is released at the junction, while the other junction absorbs heat. The end that releases heat is the hot end 111, and the end that absorbs heat is the cold end 112. The heat sink 120 provided in this embodiment is installed on the hot end 111; the cold end 112 can be directly or indirectly connected to the refrigerator compartment, providing cooling capacity to the compartment. The compartment can be a refrigerator compartment, a freezer compartment, or a variable temperature compartment.

[0053] In one embodiment, the cold end 112 can be directly located in the room; in another embodiment, a cooler 140 can be installed on the cold end 112, and the cooler 140 is located in the room; the structure of the cooler 140 can be set with reference to the structure of the radiator 120, and the cooling capacity on the cold end 112 is provided to the room through the cooler 140.

[0054] In this embodiment, the refrigerator can be interpreted broadly as a device that combines refrigeration and storage functions. For example, a refrigerator could be a small beverage cabinet for use in medical environments, bedrooms, or conference rooms; a special mini-fridge for storing cosmetics, baby products, or medicines; or a wine cabinet or cigar cabinet for storing aged wines.

[0055] The heat exchange device 100 provided in this application embodiment helps to enhance and increase the heat exchange efficiency and heat exchange effect of the radiator 120, improves the overall performance of the radiator 120, reduces the temperature rise of the thermopile of the semiconductor refrigerator, helps to improve the overall cooling effect of the semiconductor refrigerator, and also reduces the overall energy consumption of the product, so as to enhance the product's cost performance and market competitiveness.

[0056] The above description is merely an optional embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the content of the specification and drawings of this application under the concept of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A heat exchange device, characterized in that, include: A semiconductor refrigeration chip, the semiconductor refrigeration chip having a hot end; as well as A radiator, the radiator including a base; the base including a first part and a second part connected to the first part; The first portion is disposed on the hot end; the second portion extends out of the hot end. The radiator further includes a plurality of first heat dissipation fins and a plurality of second heat dissipation fins; the plurality of first heat dissipation fins are spaced apart on the first portion, and there is a first gap between two adjacent first heat dissipation fins; the plurality of second heat dissipation fins are spaced apart on the second portion, and there is a second gap between two adjacent second heat dissipation fins; the first gap is smaller than the second gap.

2. The heat exchange device as described in claim 1, characterized in that, The hot end has a central region and an edge region surrounding the central region; the first spacing between two adjacent first heat dissipation fins corresponding to the central region is smaller than the first spacing between two adjacent first heat dissipation fins corresponding to the edge region.

3. The heat exchange device as described in claim 1, characterized in that, The thickness of the first portion is gradually varied in the width and / or length direction of the base.

4. The heat exchange device as described in claim 3, characterized in that, The base has at least two second parts, two of which are respectively connected to the two ends of the first part in the length direction.

5. The heat exchange device as described in claim 3, characterized in that, The thickness of the first part is 5-10mm.

6. The heat exchange device as described in claim 3, characterized in that, The plurality of first heat dissipation fins and the plurality of second heat dissipation fins are spaced apart in the length direction.

7. The heat exchange device as described in claim 3, characterized in that, The plurality of first heat dissipation fins and the plurality of second heat dissipation fins are arranged flush with the ends away from the base.

8. The heat exchange device as described in claim 1, characterized in that, The first spacing is 3.5-5.5mm, and the second spacing is 6-8mm.

9. The heat exchange device as described in claim 1, characterized in that, The radiator also includes a fixing plate, which is disposed on the base; The heat exchange device also includes a fan, which is mounted on the fixed plate.

10. A refrigerator, characterized in that, The refrigerator includes a heat exchange device according to any one of claims 1 to 9; the semiconductor cooling chip has a cold end configured to provide cooling to the storage compartment of the refrigerator.

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