Infrared induction module

Abstract

The utility model discloses an infrared induction module, which relates to the technical field of infrared sensors and comprises a circuit board provided with a plurality of plug-in mounting holes. The phototriode comprises a body and two pins, the body is connected with the upper ends of the two pins, and the lower ends of the two pins are inserted into the two insertion holes respectively; the two pins are respectively provided with a first bending part, and the two first bending parts abut against the circuit board so as to limit the body and the two pins from moving downwards relative to the circuit board. In the process that the circuit board moves in wave soldering equipment, the first bending parts on the two pins can always abut against the circuit board, the two first bending parts play a role in limiting, downward movement of the body and the two pins relative to the circuit board is hindered and limited, the photosensitive triode is prevented from greatly shifting relative to the original design position, and the service life of the photosensitive triode is prolonged. Therefore, the phototriode can accurately receive infrared signals from a specific direction, and the performance of the infrared induction module can be improved.

Description

Technical Field

[0001] This utility model relates to the field of infrared sensor technology, and in particular to an infrared sensing module. Background Technology

[0002] An infrared sensor module in an air conditioner is a sensor module capable of sensing infrared radiation from the human body or other heat sources. The infrared sensor module is typically installed at a location on the indoor unit of the air conditioner to detect the presence of people or human activity indoors, thereby enabling intelligent control of the air conditioner. An infrared sensor module usually includes a phototransistor and a circuit board, with the phototransistor electrically connected to the circuit board.

[0003] In the automated installation process of air conditioners, there is an automatic electronic component insertion process. This process uses a robotic arm to insert electronic components such as phototransistors onto the circuit board to complete the installation of the infrared receiving module. Next, the circuit board and its various electronic components are sent to a wave soldering machine for soldering, ensuring the phototransistors and other electronic components are soldered onto the circuit board, thus completing the production of the infrared sensing module. During the movement of the circuit board within the wave soldering machine, the resulting vibrations cause the phototransistors to shift downwards under their own weight. This can lead to significant changes in the vertical position of the phototransistors relative to the circuit board, resulting in a substantial offset from their original design position. Since the performance of phototransistors is highly sensitive to position, a significant shift in their position will degrade the performance of the infrared sensing module. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an infrared sensing module that can avoid a significant shift in the phototransistor's position relative to its original design, thereby improving the performance of the infrared sensing module.

[0005] An infrared sensing module according to an embodiment of the present invention includes a circuit board with a plurality of insertion holes; a phototransistor, the phototransistor including a body and two pins, the body being connected to the upper ends of the two pins, the lower ends of the two pins being inserted into two of the insertion holes respectively; each of the two pins having a first bend, the two first bends abutting against the circuit board to restrict the body and the two pins from moving downward relative to the circuit board.

[0006] It has at least the following beneficial effects:

[0007] A phototransistor consists of a body and two leads, the upper ends of which are connected to the body. In the automated electronic component insertion process, a robotic arm grasps the phototransistor body and inserts it onto the circuit board. After insertion, the lower ends of the two leads are inserted into two insertion holes on the circuit board, with the first bends on both leads resting against the board. After the infrared receiver module is installed, it is sent to a wave soldering machine for soldering. During the movement of the circuit board within the wave soldering equipment, the first bends on the two pins remain in contact with the circuit board at all times. Since neither of the two first bends can pass through the insertion hole, they act as a limit, preventing the main body and the two pins from moving downwards relative to the circuit board. In other words, the phototransistor will not move downwards relative to the circuit board under the action of the two first bends, thus preventing the phototransistor from moving downwards due to the movement and shaking of the circuit board. This also prevents the phototransistor from shifting significantly from its original design position, allowing it to accurately receive infrared signals from a specific direction, thereby improving the performance of the infrared sensing module.

[0008] According to the infrared sensing module of this utility model embodiment, the main body is provided with an adsorption plane.

[0009] According to the infrared sensing module of this utility model embodiment, both of the first bending portions are V-shaped.

[0010] According to an embodiment of the present invention, in an infrared sensing module, one of the openings of the first bend faces the body, and the other opening of the first bend faces away from the body.

[0011] According to the infrared sensing module of this utility model embodiment, the openings of the two first bends both face the body.

[0012] According to the infrared sensing module of this utility model embodiment, each of the two pins is further provided with a second bend, and the two second bends are respectively located above the two first bends.

[0013] According to the infrared sensing module of this utility model embodiment, both first bending portions are V-shaped, and both second bending portions are V-shaped.

[0014] According to the infrared sensing module of this utility model embodiment, the openings of the two first bends are arranged opposite to each other, the openings of the two second bends are arranged opposite to each other, and the openings of the first bends and the second bends located on the same pin have the same orientation.

[0015] According to the infrared sensing module of this utility model embodiment, the circuit board has multiple mounting holes, all of which are used for screws to pass through.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0018] Figure 1 This is a schematic diagram of the structure of the infrared sensing module in an embodiment of this utility model;

[0019] Figure 2 This is a cross-sectional schematic diagram of the phototransistor and circuit board in the infrared sensing module of this utility model embodiment;

[0020] Figure 3 This is a schematic diagram of the structure of the phototransistor in the first embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the phototransistor according to the second embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the phototransistor according to the third embodiment of the present invention;

[0023] Figure label:

[0024] Circuit board 100; insertion hole 110; mounting hole 120;

[0025] Phototransistor 200; body 210; adsorption plane 211; pin 220; first bend 221; second bend 222. Detailed Implementation

[0026] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0027] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.

[0029] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0030] refer to Figure 1 and Figure 2 The infrared sensing module according to an embodiment of the present invention includes a circuit board 100 and a phototransistor 200.

[0031] The circuit board 100 has multiple insertion holes 110. The phototransistor 200 includes a body 210 and two leads 220. The body 210 is connected to the upper ends of the two leads 220, and the lower ends of the two leads 220 are respectively inserted into two of the insertion holes 110. Each of the two leads 220 has a first bend 221 formed thereon, and both first bends 221 abut against the circuit board 100 to restrict the downward movement of the body 210 and the two leads 220 relative to the circuit board 100.

[0032] It needs to be explained that the function and role of the infrared sensing module in an air conditioner mainly lies in intelligent sensing and adjustment. It can quickly and accurately sense infrared signals in the environment, including human activity and ambient temperature, and convert these signals into electrical signals for processing. Based on this real-time sensed information, the air conditioner can intelligently adjust its operating mode, temperature setting, airflow volume, and airflow direction to provide a more comfortable environment while achieving energy savings. The phototransistor 200 is a crucial electronic component in the infrared sensing module. On one hand, the phototransistor 200 can receive infrared light signals emitted from the remote control, converting these signals into electrical signals for the air conditioner to perform corresponding operations. On the other hand, in some smart air conditioners, the phototransistor 200 senses human movement or presence by monitoring infrared radiation, allowing the air conditioner to perform corresponding operations. If the position of the phototransistor 200 deviates significantly from its designed position, it will be unable to accurately receive infrared signals from a specific direction, resulting in reduced signal strength and a longer response time for the infrared sensing module. On the other hand, inaccurate positioning of the phototransistor 200 can easily cause it to falsely detect signal sources, leading to erroneous responses from the infrared sensing module and causing the air conditioner to malfunction. Therefore, it can be seen that a significant deviation of the phototransistor 200 from its designed position will result in a decrease in the performance of the infrared sensing module.

[0033] The phototransistor 200 includes a body 210 and two pins 220. The body 210 is connected to the upper ends of the two pins 220, and the lower ends of the two pins 220 are respectively inserted into two mounting holes 110 on the circuit board 100. These two mounting holes 110 specifically refer to the two mounting holes 110 on the circuit board 100 that are compatible with the phototransistor 200, allowing the phototransistor 200 to operate normally after its two pins 220 are inserted into these two mounting holes 110. The infrared sensing module also includes multiple electronic components, and the mounting holes 110 in other parts are used for inserting the pins 220 of these other electronic components. In this embodiment of the utility model, the pins 220 of the phototransistor 200 and other electronic components are all inserted into the insertion holes 110 on the circuit board 100, and the pins 220 of the phototransistor 200 and other electronic components are all soldered to the circuit board 100 to ensure that the phototransistor 200 and other electronic components can operate normally.

[0034] In this embodiment of the invention, the phototransistor 200 is a common infrared phototransistor 200, and its specific structure and function will not be further described here. In this embodiment of the invention, the infrared sensing module also includes an infrared emitter, a Fresnel lens, an operational amplifier, a voltage comparator, a photodiode, a rectifier circuit group, a filter, an optical filter, a demodulation circuit group, a power supply circuit group, and an output interface. These electronic components work together to complete the corresponding functions of the infrared sensing module. The infrared sensing module is a commonly used module in electrical appliances, and its specific functions and structure will not be further described here.

[0035] In this embodiment of the invention, the first bent portion 221 on the pin 220 is obtained by bending and shaping a portion of the pin 220 using a shaping device. The first bent portion 221 is a part of the pin 220, in which the pin 220 in this part is bent and deformed, while the remaining part of the pin 220 can remain vertical or horizontal.

[0036] It is understood that the phototransistor 200 includes a body 210 and two leads 220, with the upper ends of the two leads 220 connected to the body 210. In the automated electronic component insertion process, a robotic arm grasps the body 210 of the phototransistor 200 and inserts the phototransistor 200 onto the circuit board 100. After insertion, the lower ends of the two leads 220 of the phototransistor 200 are respectively inserted into two insertion holes 110 on the circuit board 100, and the first bends 221 on both leads 220 abut against the circuit board 100. After the infrared receiving module is installed, it is sent to a wave soldering machine for soldering. During the movement of the circuit board 100 within the wave soldering equipment, the first bends 221 on the two pins 220 remain in contact with the circuit board 100. Since neither of the two first bends 221 can pass through the insertion hole 110, they act as limiters, preventing the body 210 and the two pins 220 from moving downward relative to the circuit board 100. In other words, the phototransistor 200 will not move downward relative to the circuit board 100 under the action of the two first bends 221, thus preventing the phototransistor 200 from moving downward due to the movement and shaking of the circuit board 100. This also prevents the phototransistor 200 from shifting significantly relative to its original design position, allowing the phototransistor 200 to accurately receive infrared signals from a specific direction, thereby improving the performance of the infrared sensing module.

[0037] refer to Figure 2 and Figure 5 The main body 210 is provided with an adsorption surface 211. In this embodiment of the invention, the robotic arm used for inserting electronic components is a suction cup robotic arm. It is understood that the adsorption surface 211 on the main body 210 is used for adsorption by the suction cup robotic arm. Since the surface of the adsorption surface 211 is flat, the suction cup in the suction cup robotic arm can completely adhere to the adsorption surface 211, allowing the main body 210 to be firmly adsorbed by the suction cup in the suction cup robotic arm. This effectively prevents the phototransistor 200 from falling off during transport due to unstable adsorption by the suction cup robotic arm, ensuring that the insertion process can proceed smoothly.

[0038] refer to Figure 1 and Figure 2Both first bends 221 are V-shaped. This means that both pins 220 are K-type pins. Because both pins 220 are bent in the area of ​​the first bends 221, neither bend can pass through the insertion holes 110, causing both bends 221 to abut against the upper surface of the circuit board 100. The two first bends 221 respectively limit the movement of the two pins 220, preventing them from moving downwards within the two insertion holes 110, thus avoiding downward movement relative to the circuit board 100 during transport.

[0039] As a first embodiment of this utility model, refer to Figure 3 In one embodiment of the present invention, the body 210 faces forward, and the opening of one of the first bends 221 faces forward (i.e., the opening of the first bend 221 faces the body 210), while the opening of the other first bend 221 faces backward (i.e., the opening of the first bend 221 faces away from the body 210). It is understood that during the handling of the circuit board 100, or during its movement within the wave soldering equipment, the circuit board 100 may be subjected to vibration, impact, or shaking. The opposite orientation of the openings of the two first bends 221 allows the two pins 220 to form a more stable structure, thereby enhancing their resistance to vibration, impact, or shaking. This prevents the phototransistor 200 from swinging significantly relative to the circuit board 100, ensuring that the phototransistor 200 is securely mounted on the circuit board 100.

[0040] As a second embodiment of this utility model, refer to Figure 4The openings of both first bends 221 face the body 210. In the second embodiment of this utility model, the body 210 faces forward, and the openings of both first bends 221 face forward, that is, the openings of both first bends 221 face the body 210. It can be understood that after the phototransistor 200 is inserted into the circuit board 100, because the heavier body 210 of the phototransistor 200 faces forward, the center of gravity of the phototransistor 200 is forward and has a tendency to tilt forward. In the second embodiment of this utility model, the openings of the first bending portions 221 on the two pins 220 are both facing the body 210, so that the two first bending portions 221 bend away from the body 210, so that the center of gravity of the two pins 220 is back. Therefore, the two pins 220 with the center of gravity back can offset some of the influence brought by the body 210, which to a certain extent reduces the tendency of the phototransistor 200 to tilt forward, reduces the possibility of the phototransistor 200 tilting relative to the circuit board 100, and thus helps to improve the stability of the phototransistor 200 insertion.

[0041] refer to Figure 1 , Figure 2 and Figure 5 Each of the two pins 220 also has a second bent portion 222, which is located above the two first bent portions 221. It should be noted that in this embodiment of the invention, the first bent portions 221 and the second bent portions 222 on the pins 220 are obtained by bending and shaping a portion of the pins 220 using a shaping device. The first bent portions 221 and the second bent portions 222 are both part of the pins 220, where the pin 220 is bent and deformed, while the remaining portion of the pins 220 remains vertical or horizontal. It is understood that the formation of the first bent portions 221 and the second bent portions 222 on both pins 220 increases the mechanical strength of the pins 220, making them more able to withstand external pressure and impact, which is beneficial to improving the stability and reliability of the infrared sensing module during long-term use.

[0042] As a third embodiment of this utility model, refer to Figure 2 and Figure 5Both first bends 221 and both second bends 222 are V-shaped. Specifically, the openings of the two first bends 221 and the two second bends 222 are opposite each other, and the openings of the first bends 221 and the second bends 222 on the same pin 220 face the same direction. In the third embodiment of this utility model, the body 210 faces forward, with one first bend 221 opening to the left and the other first bend 221 opening to the right, i.e., the openings of the two first bends 221 are opposite each other; similarly, one second bend 222 opening to the left and the other second bend 222 opening to the right, i.e., the openings of the two second bends 222 are opposite each other. It can be understood that since both the first bends 221 and the two second bends 222 are V-shaped, and the openings of the two first bends 221 and the two second bends 222 are opposite each other, the two pins 220 as a whole are S-shaped. The mechanical strength of the S-shaped pin 220 can be further improved, making it more capable of withstanding external pressure and impact, which is more conducive to improving the stability and reliability of the infrared sensing module during long-term use.

[0043] In one embodiment of this utility model, the insertion hole 110 includes a guide hole and a fixing hole. The guide hole is located above the fixing hole and communicates with it. The diameter of the guide hole gradually decreases from top to bottom, and the wall of the guide hole can abut against the lower end of the pin 220, so that the lower end of the pin 220 can be inserted into the fixing hole and have an interference fit with the wall of the fixing hole. The diameter of the fixing hole is smaller than the diameter of the pin 220 of the phototransistor 200. It can be understood that during the insertion process of the phototransistor 200, the robotic arm moves the phototransistor 200 from top to bottom towards the circuit board 100. As the phototransistor 200 descends towards the circuit board 100, the lower end of the pin 220 of the phototransistor 200 will first abut against the wall of the guide hole. Since the diameter of the guide hole gradually decreases from top to bottom, the guide hole is a frustum-shaped hole. The guide hole wall guides the lower end of pin 220, allowing it to be inserted into the fixing hole. Since the diameter of the fixing hole is smaller than the diameter of pin 220 of the phototransistor 200, the wall of the fixing hole and pin 220 fit together perfectly, thus fixing the pin 220 in place. After the phototransistor 200 is lowered into position, the first bend 221 on pin 220 rests against the upper surface of circuit board 100, and the lower end of pin 220 extends from the lower surface of circuit board 100, completing the insertion of the phototransistor 200. The wall of the fixing hole serves to fix the pin 220, that is, the wall of the fixing hole serves to fix the phototransistor 200, so that the phototransistor 200 can be stably inserted into the circuit board 100. This prevents the phototransistor 200 from moving downwards due to the movement and shaking of the circuit board 100, further eliminating the possibility of the phototransistor 200 shifting significantly relative to its designed position, which in turn helps to improve the performance of the infrared sensing module.

[0044] refer to Figure 1 The circuit board 100 has multiple mounting holes 120, all for screws to pass through. It is understood that when the circuit board 100 needs to be mounted on a housing or other component, screws can be passed through the mounting holes 120 on the circuit board 100 and tightened, so that the screw head rests against the circuit board 100, thus fixing the circuit board 100 to the housing or other component. Further details are omitted here. Specifically, in this embodiment, the upper ends of both pins 220 are bent at right angles and connected to the body 210. Further details are omitted here. In this embodiment, the pins 220 of other electronic components mounted on the circuit board 100 may also have a first bent portion 221. Further details are omitted here.

[0045] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0046] Of course, this utility model is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. An infrared sensing module, characterized in that, include: A circuit board (100) having a plurality of insertion holes (110); A phototransistor (200) includes a body (210) and two pins (220). The body (210) is connected to the upper ends of the two pins (220), and the lower ends of the two pins (220) are respectively inserted into two of the insertion holes (110). A first bend (221) is formed on each of the two pins (220), and the two first bends (221) abut against the circuit board (100) to restrict the body (210) and the two pins (220) from moving downward relative to the circuit board (100).

2. The infrared sensing module according to claim 1, characterized in that: The body (210) is provided with an adsorption plane (211).

3. The infrared sensing module according to claim 1, characterized in that: Both of the first bends (221) are V-shaped.

4. The infrared sensing module according to claim 3, characterized in that: One of the first bends (221) has an opening facing the body (210), and the other first bend (221) has an opening facing away from the body (210).

5. The infrared sensing module according to claim 3, characterized in that: The openings of both first bends (221) face the body (210).

6. The infrared sensing module according to claim 1, characterized in that: A second bend (222) is also formed on each of the two pins (220), and the two second bends (222) are respectively located above the two first bends (221).

7. The infrared sensing module according to claim 6, characterized in that: Both of the first bends (221) are V-shaped, and both of the second bends (222) are V-shaped.

8. The infrared sensing module according to claim 7, characterized in that: The openings of the two first bends (221) are arranged opposite each other, and the openings of the two second bends (222) are arranged opposite each other. The openings of the first bends (221) and the second bends (222) located on the same pin (220) have the same orientation.

9. The infrared sensing module according to claim 1, characterized in that: The circuit board (100) has a plurality of mounting holes (120), all of which are for screws to pass through.

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