Power-off protection switch

Abstract

The utility model relates to the technical field of power-off protection, in particular to a power-off protection switch, which comprises a base material and a conductive protection layer arranged on the base material, the conductive protection layer can be disconnected along with the damage of the base material, and the conductive protection layer can be electrically connected with external electric control equipment to form a power-on loop. And the conductive protection layer is disconnected, so that the power-on loop is disconnected to trigger power-off protection. According to the utility model, the conductive protection layer which can be broken along with the damage of the base material is arranged on the base material, and the conductive protection layer is connected with the external electric control equipment which is used for triggering power-off protection to form a power-on loop; the conductive protection layer attached to the base material is also disconnected to trigger power-off protection of external electric control equipment, the power-off protection is triggered by using the damage of the base material, the power-off protection can be rapidly implemented when the base material is damaged on the physical level, the triggering process is stable and reliable, the structure is simple, and the size is smaller than that of a traditional circuit breaker protection switch. And users can use conveniently.

Description

Technical Field

[0001] This utility model relates to the field of power failure protection technology, specifically a power failure protection switch. Background Technology

[0002] A power outage protection switch, also known as a residual current device (RCD) or residual current circuit breaker, is an electrical protection structure used to protect homes or businesses from electric shock and fire hazards. Commercially available RCDs are usually quite large and are generally designed to detect excessive current during a short circuit to trigger circuit breaking protection. However, if external forces damage the components during use, they may fail to perform their circuit breaking protection function, making them inconvenient for users.

[0003] To address the above shortcomings, we need to develop a power failure protection switch to meet the needs of a wide range of users. Utility Model Content

[0004] To address the aforementioned problem that existing circuit breakers fail to perform their protective function after components are damaged by external forces during use, the technical solution adopted by this utility model is as follows:

[0005] A power failure protection switch includes a substrate and a conductive protective layer disposed on the substrate. The conductive protective layer can be disconnected when the substrate is damaged. The conductive protective layer can be electrically connected to an external electrical control device for triggering power failure protection to form a power-on circuit. When the substrate is damaged, the conductive protective layer disconnects, causing the power-on circuit to be disconnected and triggering power failure protection.

[0006] Furthermore, the conductive protective layer includes a conductive layer arranged in a surrounding shape, one end of the conductive layer has a first endpoint, the other end of the conductive layer has a second endpoint, a gap G is provided between the first endpoint and the second endpoint, and the first endpoint and the second endpoint are respectively connected to an external electrical control device to form a power circuit.

[0007] Furthermore, the distance between the first endpoint and the center of the substrate is less than the distance between the second endpoint and the center of the substrate. An imaginary straight line k is formed between the second endpoint and the center of the substrate. The first endpoint is offset from the straight line k. The direction of the straight line k toward the first endpoint is direction p. The conductive layer extends from the second endpoint toward direction p and wraps around the center of the substrate at least once before connecting to the first endpoint.

[0008] Furthermore, the substrate is made of a brittle material. When the substrate breaks, the conductive protective layer breaks, causing the power-on circuit to be disconnected and triggering the power-off protection.

[0009] Furthermore, the conductive layer extends from one of the first endpoint and the second endpoint and passes through the region between the other of the first endpoint and the center of the substrate, and the conductive layer surrounds the center of the substrate such that there is at least one enclosing ring structure composed of the conductive layer between the center of the substrate and the outer edge of the substrate.

[0010] Furthermore, it also includes a switch housing for mounting the substrate, wherein each switch housing is independently provided with two electrode components for connecting external electrical control equipment, and the two electrode components are respectively connected to the conductive protective layer.

[0011] Furthermore, it also includes a conductive heating layer disposed on the substrate, wherein the conductive protective layer is located in the region between the outer edge of the substrate and the outer edge of the conductive heating layer, and the conductive protective layer and the conductive heating layer are disposed at intervals.

[0012] Furthermore, the substrate is equipped with a temperature probe for detecting the heating temperature of the conductive heating layer, and the temperature probe is located within the layout area of ​​the conductive heating layer.

[0013] Furthermore, the conductive heating layer includes multiple independently arranged heating areas, which are arranged circumferentially around the temperature measuring probe.

[0014] Furthermore, the conductive protective layer is connected end to end in a ring shape to form a protective area surrounding the conductive heating layer, and conductive leads extend from the conductive protective layer toward the conductive heating layer, and a grounding lead is additionally extended from the conductive protective layer.

[0015] Furthermore, the conductive heating layer is formed into a planar heating layer using one of the following materials: nano-metal oxide, nano-semiconductor oxide, graphene, or carbon paste.

[0016] The beneficial effects of this utility model are as follows:

[0017] 1. This utility model features a conductive protective layer on a substrate that can be disconnected upon damage to the substrate. The conductive protective layer connects to an external electrical control device used to trigger power-off protection, forming a power-on circuit. When the substrate is damaged or broken by external force, the conductive protective layer attached to the substrate also disconnects. The disconnection of the conductive protective layer causes the power-on circuit to break, thereby triggering the power-off protection of the external electrical control device. By utilizing substrate damage to trigger power-off protection, power-off protection can be quickly implemented when physically damaged. The triggering process is stable and reliable, the structure is simple, and it can achieve a smaller size compared to traditional circuit breaker switches, making it convenient for users.

[0018] 2. The substrate of this utility model can be made of brittle material to further enhance the degree of fragmentation and decomposition of the substrate. When subjected to external force, it can disconnect the conductive protective layer at an instant. On this basis, a conductive heating layer is set in the open enclosed area of ​​the conductive protective layer. The conductive heating layer can be used to heat the object. When the heating environment becomes dangerous and causes the substrate to break, it can disconnect the circuit at an instant to avoid continued ineffective heating. Especially when there is liquid in the surrounding environment, it can also avoid the risk of leakage after the danger occurs, thus protecting the user's safety.

[0019] 3. This utility model can enclose the conductive protective layer to form a closed area, and the grounding lead can be led out to achieve the effect of leakage grounding. On this basis, the conductive protective layer extends the conductive lead towards the conductive heating layer, which can guide the leakage of the heating layer to the grounding position, avoid the risk of electric shock caused by accidental contact by the user, and further ensure the user's safety. Attached Figure Description

[0020] Figure 1 This is one of the schematic diagrams of a power failure protection switch according to the present invention.

[0021] Figure 2 This is a second schematic diagram of a power failure protection switch according to the present invention.

[0022] Figure 3 This is the third schematic diagram of a power failure protection switch according to the present invention.

[0023] Figure 4 for Figure 2 3D exploded view.

[0024] Figure 5 This is the fourth schematic diagram of a power failure protection switch according to the present invention.

[0025] Figure 6 This is the fifth schematic diagram of a power failure protection switch according to the present invention.

[0026] Figure 7 This is a schematic diagram showing that the conductive protective layer and the conductive heating layer of this utility model are located on different surfaces.

[0027] Figure 8 This is a schematic diagram of a power failure protection switch according to the present invention, number six.

[0028] Figure 9 This is diagram number seven of a power failure protection switch according to the present invention.

[0029] Figure 10 for Figure 9 3D exploded view.

[0030] Figure 11This is the eighth schematic diagram of a power failure protection switch according to the present invention. Detailed Implementation

[0031] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0032] Optionally, in some embodiments, the substrate 1 may be made of one of the following brittle materials: glass, ceramic, stone, plastic, etc. Preferably, the substrate 1 is made of glass or ceramic. Glass or ceramic has the characteristic of being brittle and easily broken. When it breaks due to external force, the conductive protective layer 2 is disconnected, which leads to the disconnection of the power-on circuit and makes it easier to trigger the power-off protection. Glass has good light transmittance and aesthetics, and is more visually appealing when used in product appearance. Glass or ceramic has good resistance to most chemicals, is not easily corroded, and has high hardness, so it will not easily wear down after long-term use. Glass or ceramic has a low coefficient of thermal expansion at high temperatures, so it is not easy to expand and deform.

[0033] Optionally, in some embodiments, the conductive protective layer 2, the conductive layer 23, or the electrode layer 32 can all be made of one of the following materials with good conductivity: gold, silver, copper, aluminum, tin, etc. Preferably, the conductive protective layer 2, the conductive layer 23, or the electrode layer 32 is laid with silver paste made of silver material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and silver paste is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0034] Optionally, in some embodiments, the electrode 6 can be made of one of the metal materials with good conductivity, such as gold, silver, copper, aluminum, or tin, to form a metal connector. Preferably, the electrode 6 is made of silver material with silver contacts, which has better contact convenience and conductivity.

[0035] Example 1:

[0036] like Figures 1 to 11The power failure protection switch shown includes a substrate 1 and a conductive protective layer 2 disposed on the substrate 1. The substrate 1 is a hard and brittle matrix that supports the conductive protective layer 2, has good structural stability, and is not easily deformed or bent. The conductive protective layer 2 is disposed on the surface of the substrate 1. More specifically, the conductive protective layer 2 is a conductive material formed on the substrate 1 by means of coating, film, or adhesive adhesion. The conductive protective layer 2 can be broken when the substrate 1 is damaged. The thickness of the conductive protective layer 2 is less than 1 mm. The conductive protective layer 2 is arranged in a ring shape on the surface of the substrate 1 near the outer edge of the surface, forming an open ring structure with non-overlapping start and end points. The start and end points are connected to an external electrical control device for triggering power failure protection to form a power circuit. The electrical control device can be an electrical appliance or an electrical system. The external electrical control device can determine whether the substrate 1 has been damaged or broken by detecting the integrity of the power circuit in real time.

[0037] In use, when the substrate 1 is intact, the power-conducting circuit is open, indicating normal operation. When the substrate 1 is damaged or broken, the conductive protective layer 2 is simultaneously disconnected due to the damage to the substrate 1, causing the power-conducting circuit to break, which indicates an abnormal operating condition. Since the conductive protective layer 2 is formed on the substrate 1 by coating, adhesion, screen printing, or physical vapor deposition, and the conductive protective layer 3 itself does not possess toughness or ductility, when the substrate 1 is damaged or broken, the damaged or broken area will inevitably first pass through the surrounding conductive protective layer 2. The breakage of the conductive protective layer 2 also means that the power-conducting circuit is broken. The breakage of the power-conducting circuit can immediately trigger the power-off protection mechanism of the external electrical control equipment, thereby achieving a fast response and high protection efficiency power-off protection effect.

[0038] As another embodiment of Example 1, the surface of the substrate 1 may be divided into at least two or more planes, or curved surfaces, or a combination of planes and curved surfaces, to adapt to different environments or different mounting surfaces.

[0039] As another embodiment of Example 1, the conductive protective layer 2 can also be disposed inside the substrate 1 to form a single-line interconnected surrounding structure covering the interior of the substrate 1. The conductive protective layer 2 is led out to the surface of the substrate 1 and connected to an external electrical control device.

[0040] Example 2:

[0041] Based on Example 1, such as Figures 1 to 7The power failure protection switch shown includes a conductive protective layer 2 comprising a conductive layer 23 arranged in a circumferential manner. The conductive layer 23 is formed on the substrate 1 by means of coating, film or adhesive adhesion, and is a conductive material attachment path arranged circumferentially around the outer edge of the substrate 1. The conductive layer 23 adopts an open ring structure and the thickness of the conductive layer 23 is less than 1 mm. One end of the conductive layer 23 has a first endpoint 21 and the other end has a second endpoint 22. The first endpoint 21 and the second endpoint 22 are both connection terminals for connecting the conductive layer 23 to external electrical control equipment. After connecting to the external electrical control equipment, the first endpoint 21, the conductive layer 23, the second endpoint 22 and the external electrical control equipment form a power-on circuit. When the conductive layer 23 is disconnected due to damage or breakage of the substrate 1, the power-on circuit will be broken, and the power failure protection mechanism of the external electrical control equipment will be triggered after the circuit is broken.

[0042] More specifically, there is a gap G between the first endpoint 21 and the second endpoint 22. The size of the gap G determines the separation distance between the first endpoint 21 and the second endpoint 22. The gap G is set to prevent the power-on circuit from short-circuiting under normal conditions.

[0043] As another embodiment of Example 2, such as Figure 3 and Figure 7 As shown, in actual use, due to the presence of a gap G in the power-conducting circuit, when the substrate 1 is damaged or broken, the path of damage or breakage happens to pass through gap G, making it difficult for the conductive protective layer 2 to break. There is a possibility that the conductive protective layer 2 might be bypassed, preventing the power-off protection from triggering. Therefore, this embodiment further defines the first endpoint 21 as being located between the second endpoint 22 and the center of the substrate 1. By defining the location of the first endpoint 21, it is ensured that the path of damage or breakage will not easily pass directly through gap G. More specifically, the second endpoint 22 and the center of the substrate 1 form a shortest imaginary straight line segment, and the first endpoint 21 is located along this imaginary straight line segment. Furthermore, since both the first endpoint 21 and the second endpoint 22 have a certain outer diameter coverage area, the path of damage or breakage of the substrate 1 is unlikely to directly bypass the conductive protective layer 2 and only pass through gap G, greatly reducing the possibility of bypassing the conductive protective layer 2 and preventing the power-off protection from triggering. This achieves the effect of stable triggering of the power-off protection when the substrate 1 is damaged.

[0044] As another embodiment of Example 2, such as Figure 5 and Figure 6As shown, when the conductive layer 23 is wound clockwise or counterclockwise around the outer edge of the substrate 1 from the first endpoint 21 and connected to the second endpoint 22, the winding path of the conductive layer 23 can adopt a spiral structure to wind around the outer edge of the substrate 1 in multiple layers from the inside out, so as to minimize the possibility that the substrate 1 is damaged or broken and manages to avoid the conductive protective layer 2, thus preventing the power failure protection from being triggered. This achieves the effect that the power failure protection can be triggered more stably when the substrate 1 is damaged.

[0045] In another embodiment 201 of embodiment 2, since there is a gap G in the conductive protective layer 2 of the power-conducting circuit, when the substrate 1 is damaged or broken, the path of damage or breakage happens to pass through the gap G, making it difficult for the conductive protective layer 2 to break. There is a possibility that the conductive protective layer 2 may be bypassed, preventing the power-off protection from being triggered. Figure 11 The power-off protection switch shown has a conductive layer 23 extending from the first endpoint 21 and passing through the area between the second endpoint 22 and the center of the substrate 1. The conductive layer 23 surrounds the center of the substrate 1, so that there is at least one enclosing ring structure composed of the conductive layer 23 between the center of the substrate 1 and the outer edge of the substrate 1. More specifically, by adopting an enclosing ring structure around the center of the substrate 1, the conductive layer 23 can form a protective ring structure without obvious through gaps to the outside. There are no longer straight or nearly straight through gaps between the center of the substrate 1 and the outer edge of the substrate 1. This avoids the situation where the damage or breakage path of the substrate 1 manages to avoid the conductive protective layer 2, thus preventing the power-off protection from being triggered. It can effectively avoid the problem of the breakage path managing to avoid the conductive protective layer 2, and ensure that when the substrate 1 is damaged or broken, the conductive protective layer 2 can be disconnected to trigger the disconnection of the power-on circuit and realize the power-off protection.

[0046] As another embodiment 202 (not shown), which is different from embodiment 201, the conductive layer 23 extends from the second end point 22 and passes through the region between the first end point 21 and the center of the substrate 1. The conductive layer 23 surrounds the center of the substrate 1 so that there is at least one surrounding ring structure composed of the conductive layer 23 between the center of the substrate 1 and the outer edge of the substrate 1.

[0047] Example 3:

[0048] In actual use, since there is a gap G in the conductive protective layer 2 of the power-conducting circuit, when the substrate 1 is damaged or broken, the path of the damage or breakage happens to pass through the gap G, which makes it difficult for the conductive protective layer 2 to break. There may be a situation where the conductive protective layer 2 is bypassed and the power-off protection fails to be triggered.

[0049] Based on Example 2, such as Figure 5 and Figure 6The power failure protection switch shown has a first end 21 at a distance less than the distance between the second end 22 and the center of the substrate 1. An imaginary straight line k is formed between the second end 22 and the center of the substrate 1. The first end 21 is offset from the straight line k. The direction of the straight line k toward the first end 21 is the direction p. The conductive layer 23 extends from the second end 22 toward the direction p and wraps around the center of the substrate 1 at least once before connecting to the first end 21.

[0050] More specifically, after the first endpoint 21 and the second endpoint 22 are misaligned on the surface of the substrate 1, the distance between the first endpoint 21 and the center of the substrate 1 is less than the distance between the second endpoint 22 and the center of the substrate 1. A fictitious straight line k is formed between the second endpoint 22 and the center of the substrate 1 for auxiliary positioning. The first endpoint 21 is located outside the straight line k and does not coincide with it. With the direction p of the straight line k toward the first endpoint 21 as the direction, the conductive layer 23 extends from the second endpoint 22 toward the direction p and wraps around the center of the substrate 1 at least once before connecting to the first endpoint 21, forming a single-line enclosed protective coil structure. Preferably, the first endpoint 21 and the substrate 1 are... The smaller the difference between the distance between the center of material 1 and the distance between the second endpoint 22 and the center of the substrate 1, the lower the probability that the path of damage or breakage of the substrate 1 will accidentally bypass the conductive protective layer 2. Conversely, the larger the difference between the distance between the first endpoint 21 and the center of the substrate 1 and the distance between the second endpoint 22 and the center of the substrate 1, the easier it is for the path of damage or breakage of the substrate 1 to pass through. Based on this, after the conductive layer 23 wraps around the center of the substrate 1 twice, it can effectively prevent the problem of the broken path from accidentally bypassing the conductive protective layer 2, ensuring that when the substrate 1 is damaged or broken, the conductive protective layer 2 can be disconnected to trigger the disconnection of the power-on circuit and achieve power-off protection.

[0051] Example 4:

[0052] Based on any of the above embodiments, such as Figure 9 and Figure 10 The power failure protection switch shown also includes a switch housing 5 for mounting the substrate 1. Since the substrate 1 is preferably made of a brittle material, the switch housing 5 can be easily installed on other equipment or directly on the surface of an object, and can also serve to fix the position. The switch housing 5 is independently provided with two electrode components 6 for connecting external electrical control equipment. The two electrode components 6 are respectively connected to the conductive protective layer 2. The electrode components 6 serve as the connecting parts between the conductive protective layer 2 and the external electrical control equipment, which can easily expand the connection range of the conductive protective layer 2 and reduce the assembly difficulty of circuit connection during the production process. If the external electrical control equipment is directly connected to the conductive protective layer 2, it is necessary to consider processing the connection point on the substrate 1, which may easily lead to damage to the substrate 1 and increase the defect rate. Using the electrode components 6 as the adapter can facilitate installation and connection, and can also improve the stability of the connection.

[0053] In use, the substrate 1 is installed on other equipment or in the place of use through the switch housing 5. Under normal circumstances, the external electrical control equipment is connected to the conductive protective layer 2 through the electrode 6 to form a power circuit. At this time, it can be determined that the equipment or the scene of use is in a safe state. When the substrate 1 is damaged or broken, the conductive protective layer 2 is disconnected, causing the power circuit to be disconnected, triggering the power-off protection mechanism of the external electrical control equipment. The control circuit of the external electrical control equipment is disconnected to prevent the circuit from continuously outputting electrical energy to the outside world and to avoid safety hazards such as electric shock and leakage.

[0054] Example 5:

[0055] Based on any of the above embodiments, such as Figures 1 to 4 The power-off protection switch shown also includes a conductive heating layer 3 disposed on a substrate 1. The conductive heating layer 3 can serve as the heating end of an electric heating product. Objects requiring heating can be placed on the conductive heating layer 3 to be heated and achieve a heating effect. The conductive heating layer 3 includes a heating layer 31 for heating by electricity and an electrode layer 32 for connecting to a power source. The heating layer 31 can be formed into a planar heating layer using one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene, or carbon paste. Preferably, the heating layer 31 uses nano-semiconductor metal oxide as the conductive heating material. The thickness of the heating layer 31 and the electrode layer 32 is less than 1 mm. The nano-semiconductor metal oxide can be one or more of the following materials: tin, antimony, nickel, or ammonium. The combination of materials is used as nanoparticles. During the fabrication process, nano-semiconductor metal oxides can be attached to the surface of the substrate 1 by physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), far-infrared spectroscopy (FI), etc. After high-temperature sintering, a fixed heating area is formed. At least two separate electrode layers 32 are located on both sides of the heating layer 31. The electrode layer 32 includes a first electrode 321 and a second electrode 322. The first electrode 321 and the second electrode 322 are respectively disposed on both sides of the heating layer 31 to facilitate connection to an external power source. Preferably, the electrode layer 32 can also use silver paste as a conductive material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0056] More specifically, the conductive protective layer 2 is located in the area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 3. The conductive protective layer 2 and the conductive heating layer 3 are spaced apart. The conductive protective layer 2 surrounds the outer side of the conductive heating layer 3 to form an open surrounding area with a notch G. When the substrate 1 is damaged or broken, the path of damage or breakage first passes through the conductive protective layer 2 and then enters the conductive heating layer 3. This means that when the conductive heating layer 3 is damaged, the conductive protective layer 2 will also disconnect in advance, which can immediately disconnect the circuit and stop the conductive heating layer 3 from heating, preventing the conductive heating layer 3 from continuing to heat up when damaged, and also avoiding the safety hazards caused by circuit leakage.

[0057] As another embodiment of Example 5, the substrate 1 can be made of one of the following microcrystalline materials: microcrystalline glass or microcrystalline ceramic. Preferably, the substrate 1 is made of microcrystalline glass as the main material. Microcrystalline glass has good vertical thermal conductivity and light transmittance. Vertical thermal conductivity effectively enhances the efficiency and speed of heat transfer, making the overall heating rapid and uniform. Microcrystalline glass has a low coefficient of thermal expansion and hardly deforms when the temperature changes. It is suitable for heating components with frequent temperature changes. Moreover, when microcrystalline glass is damaged, it will break more thoroughly, avoiding breaking into the conductive protective layer 2 to prevent failure to trigger the power-off protection.

[0058] As another embodiment of Example 5, the heating layer 31 can use graphene film as a conductive and heating material. Graphene has a high thermal conductivity and excellent electrical conductivity. During manufacturing, the graphene film is formed on the surface of the insulating layer 3 to form a fixed heating area.

[0059] As another embodiment of Example 5, such as Figure 7 As shown, the conductive protective layer 2 and the conductive heating layer 3 can be located on different surfaces of the substrate 1. The substrate 1 includes at least surface A and surface B, which are independent surfaces on the substrate 1. Surface A is one of the front and back surfaces of the substrate 1, and surface B is the other of the front and back surfaces of the substrate 1. In this embodiment, the conductive protective layer 2 is disposed on surface A of the substrate 1, and the conductive heating layer 3 is disposed on surface B of the substrate 1. The conductive heating layer 3 is located within the axial enclosure of the conductive protective layer 2. When the substrate 1 is damaged or broken, the path of damage or breakage can still pass through the conductive protective layer 2 before entering the conductive heating layer 3. This structure can enrich the placement of the conductive protective layer 2 and also avoid the conductive protective layer 2 being placed on the surface where the conductive heating layer 3 is located, thus affecting the use of the conductive protective layer 2, or the conductive heating layer 3 being placed on the surface where the conductive protective layer 2 is located, thus affecting the use of the conductive heating layer 3.

[0060] As another embodiment of Example 5, the substrate 1 can be made of one of the following microcrystalline materials: microcrystalline glass or microcrystalline ceramic. Preferably, the substrate 1 is made of microcrystalline glass as the main material. At high temperatures, electrostatic ions will appear on the surface of the microcrystalline glass. When the temperature of the microcrystalline glass exceeds 300 degrees, the microcrystalline glass may have conductive properties. Based on this, the first end 21 extends a conductive lead 24 toward the conductive heating layer 3 to shorten the distance between the conductive protective layer 2 and the conductive heating layer 3. When the microcrystalline glass has conductive properties at a specific temperature, the conductive heating layer 3 is connected to the conductive lead 211 through the substrate 1, which can trigger a short circuit in the power-on circuit. The short circuit in the power-on circuit triggers the power-off protection of the external electrical control equipment, thereby achieving power-off protection to prevent the conductive heating layer 3 from overheating.

[0061] As another embodiment of Example 5, such as Figure 10 The first electrode 321 and the second electrode 322 on both sides of the heating layer 31 shown can be connected to an external power supply for heating through different electrode components 6. The external electrical control device controls the start and stop of the external power supply by controlling the on / off state of the power circuit of the conductive protective layer 2. When the power circuit of the conductive protective layer 2 is connected, the power supply continues to supply power to the conductive heating layer 3 for heating. When the power circuit of the conductive protective layer 2 is disconnected, the connection between the external power supply and the electrode layer 32 is disconnected, thereby achieving the effect of power failure protection and stopping heating.

[0062] Example 6:

[0063] Based on Example 5, such as Figure 2 , Figure 9 and Figure 10 The power-off protection switch shown has a base material 1 with a temperature probe installed to detect the heating temperature of the conductive heating layer 3 or the temperature of a heated object. The temperature probe is installed within the area of ​​the conductive heating layer 3 on the surface of the base material 1, so that the temperature probe is closer to the conductive heating layer 3 for easy temperature detection. The base material 1 has a mounting hole 11 for installing the temperature probe. The temperature probe can be installed in the mounting hole 11 by means of plug-in, thread, snap-on, etc. The temperature probe can be one of the following temperature detection devices: NTC thermistor, infrared temperature sensor, thermocouple, etc. The real-time temperature change can be directly known through the temperature probe, and the heating temperature of the conductive heating layer 3 can also be adjusted according to the data of the temperature probe.

[0064] Example 7:

[0065] Based on Example 6, such as Figure 2 and Figure 4The power failure protection switch shown has a conductive heating layer 3 comprising multiple independently arranged heating areas, including at least heating area a, heating area b, heating area c and heating area d, all of which are arranged circumferentially around the mounting hole 11 where the temperature measuring probe is located.

[0066] More specifically, the conductive heating layer 3 includes independently disposed heating regions a, b, c, and d, with heating regions c and d located between heating regions a and b. The electrode layer 32 includes a third electrode 323, which connects heating regions c and d. The third electrode 323 bypasses the mounting hole 11 to ensure the circuit connection between heating regions c and d, thereby ensuring that heating regions c and d can be connected and achieve conductive heating.

[0067] More specifically, the two ends of heating region a are connected to the first electrode 321 and the second electrode 322, respectively. The two ends of heating region b are connected to the first electrode 321 and the second electrode 322, respectively. Heating region c and heating region d are connected by the third electrode 323 to form a middle heating region. The end of heating region c away from the third electrode 323 is connected to one of the first electrode 321 and the second electrode 322. The end of heating region d away from the third electrode 323 is connected to the other of the first electrode 321 and the second electrode 322. At this time, heating region a, heating region b and the middle heating region are connected in parallel.

[0068] As another embodiment of Example 7, heating zones c, d, a and b can also be connected in series. More specifically, current flows into one of the first electrode 221 and the second electrode 222 and passes through heating zones a, c, the third electrode 223, d and b in sequence, and then flows out from the other of the first electrode 221 and the second electrode 222, forming a series circuit.

[0069] As another embodiment of Example 7, the shapes of heating areas a, b, c and d can be the shapes of the area outlines formed by straight lines and / or curves, in order to meet the heating contact surface requirements of different users.

[0070] As another embodiment of Example 7, the length of heating region c and the length of heating region d are added together to equal the length of heating region a. This structural design is more aesthetically pleasing in terms of partitioning.

[0071] As another embodiment of Example 7, the length of heating region c and the length of heating region d are added together to equal the length of heating region b. This structural design is more aesthetically pleasing in terms of partitioning.

[0072] As another embodiment of Example 7, the area of ​​heating region c is the same as the area of ​​heating region d. This structural design is more aesthetically pleasing in terms of partitioning.

[0073] As another embodiment of Example 7, the shape of heating area c is the same as that of heating area d, and this structural design is more aesthetically pleasing in terms of partitioning.

[0074] As another embodiment of Example 7, the shape of heating area c and the shape of heating area d are symmetrically arranged with the mounting hole 11 as the center. This structural design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0075] As another embodiment of Example 7, the shape of heating area a is the same as that of heating area b. This structural design is more aesthetically pleasing in terms of partitioning.

[0076] As another embodiment of Example 7, the shape of heating area a and the shape of heating area b are symmetrically arranged with the mounting hole 11 as the center. This structural design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0077] As another embodiment of embodiment 7, the shape of heating area a is symmetrical to that of heating area b with respect to the mounting hole 11, and the shape of heating area c is symmetrical to that of heating area d with respect to the mounting hole 11. The center line of symmetry of heating area a and heating area b is perpendicular to the center line of symmetry of heating area c and heating area d. This design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0078] Example 8:

[0079] Based on Example 5, such as Figure 8 The power-off protection switch shown differs from embodiment 5 in that the conductive protective layer 2 is arranged in a ring shape, with the ends connected to form a protective area surrounding the conductive heating layer 3. The first end 21 and the second end 22 of the conductive protective layer 2 overlap, causing the conductive layer 23 to form a closed, enclosed area. The conductive heating layer 3 is located within this enclosed area. Furthermore, the substrate 1 is made of materials such as microcrystalline glass or microcrystalline ceramic, which are easily conductive under certain conditions. The conductive protective layer 2 extends a conductive lead 24 towards the conductive heating layer 3, and a grounding lead 25 extends from the conductive protective layer 2 away from the conductive heating layer 3. When the conductive heating layer 3 overheats, causing the substrate 1 to exhibit conductive characteristics at high temperatures, the current in the conductive heating layer 3 can be conducted to the grounding position through the conductive lead 24 and the grounding lead 25, thus avoiding the risk of leakage.

[0080] As another embodiment of Example 8, the conductive protective layer 2 is provided with an open surrounding area outside the closed surrounding area. The conductive heating layer 3 forms two spaced conductive protective layers 2. The conductive protective layer 2 close to the conductive heating layer 3 is closed to form a surrounding ring for grounding and leakage prevention. The conductive protective layer 2 far from the conductive heating layer 3 is open to form a surrounding ring for power-off protection triggered by the breakage of the substrate 1. The grounding lead 25 passes through the notch G and is led to the ground.

[0081] like Figures 1 to 6 As shown, one specific embodiment of this utility model is as follows:

[0082] During manufacturing, the substrate 1 is made of a brittle insulator. The outer shape of the substrate 1 is first processed to form a surface that can be attached to the conductive protective layer 2. Then, the conductive protective layer 2 is formed on the substrate 1 by coating, bonding, screen printing or physical vapor deposition. The conductive layer 23 of the conductive protective layer 2 is formed in a single-line structure around the outer contour of the substrate 1 at the position between the edge and the center of the surface of the substrate 1. The conductive layer 23 has a first end point 21 and a second end point 22 at its two ends, respectively. A notch G is formed between the first end point 21 and the second end point 22. The substrate 1 is installed on the switch housing 5. The switch housing 5 can be installed on other equipment or objects. The first end point 21 and the second end point 22 are respectively connected to two electrode components 6 on the switch housing 5. The electrode components 6 are externally used to trigger the power-off protection electrical control equipment to form a power-on circuit.

[0083] When in use, if the substrate 1 is intact, the conductive protective layer 2 maintains the continuity of the power circuit. The external electrical control equipment uses this to determine that the substrate 1 is in a normal operating state. When the substrate 1 is damaged or broken, the conductive protective layer 2 is simultaneously disconnected due to the damage to the substrate 1, resulting in the disconnection of the power circuit, which can be judged as an abnormal operating state. Since the conductive protective layer 2 is formed on the substrate 1 by adhesion methods such as coating, bonding, screen printing or physical vapor deposition, the conductive protective layer 3 itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken, the damaged or broken part will inevitably pass through the surrounding conductive protective layer 2 first. The breakage of the conductive protective layer 2 also means that the power circuit is broken. The power circuit breakage can immediately trigger the power-off protection mechanism of the external electrical control equipment, thereby achieving a power-off protection effect with fast response speed and high protection efficiency.

[0084] like Figures 1 to 4 As shown, another specific embodiment of this utility model is as follows:

[0085] During fabrication, the substrate 1 is made of a brittle insulator. The outer shape of the substrate 1 is first processed to form a surface that can be attached to the conductive protective layer 2 and the conductive heating layer 3. The heating layer 31 of the conductive heating layer 3 uses nano-semiconductor metal oxide as the conductive and heating material. The heating layer 31 can be attached to the surface of the substrate 1 by physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), far-infrared spectroscopy (FI), etc. After high-temperature sintering, a fixed heating area is formed. The first electrode 321 and the second electrode 322 are respectively set on both sides of the heating layer 31. The conductive protective layer 3 is located in the area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 3, which surrounds the conductive heating layer 3 in an open structure to form a protective area. The conductive heating layer 3 is located in the protective area, and the conductive protective layer 3 and the conductive heating layer 3 are spaced apart.

[0086] In use, the first electrode 221 and the second electrode 222 of the electrode layer 22 are electrically connected to an external power source, so that the current is conducted through the heating layer 21, and the heating layer 21 generates heat to achieve a normal heating effect.

[0087] When the substrate 1 is damaged or broken, the path of damage or breakage first passes through the conductive protective layer 2 and then enters the conductive heating layer 3. The breakage of the attachment layer of the conductive protective layer 2 also means that the power circuit is broken. The power circuit is broken, which can immediately trigger the power-off protection mechanism of the external electrical control equipment, which can immediately disconnect the circuit and stop the conductive heating layer 3 from heating, preventing the conductive heating layer 3 from continuing to heat up in the case of damage, and also avoiding the safety hazards caused by circuit leakage.

[0088] like Figure 7 As shown, the third specific embodiment of this utility model is as follows:

[0089] Based on the second specific implementation method, during manufacturing, the substrate 1 is made of a brittle insulator. The outer shape structure of the substrate 1 is first processed to form surface A and surface B. The conductive heating layer 3 is located on one of surface A and surface B, and the conductive protective layer 3 is located on the other of surface A and surface B.

[0090] like Figure 8 As shown, the fourth specific embodiment of this utility model is as follows:

[0091] The conductive protective layer 2 is connected end to end in a ring shape to form a protective area surrounding the conductive heating layer 3. The conductive layer 23 of the conductive protective layer 2 forms a closed, enclosed area. The conductive heating layer 3 is located within the enclosed area. The substrate 1 is made of materials such as microcrystalline glass or microcrystalline ceramic, which are easily conductive under certain conditions. The conductive protective layer 2 extends a conductive lead 24 towards the conductive heating layer 3, and the conductive protective layer 2 extends a grounding lead 25 away from the conductive heating layer 3. When the conductive heating layer 3 overheats and the substrate 1 becomes conductive at high temperature, the current of the conductive heating layer 3 can be conducted to the grounding position through the conductive lead 24 and the grounding lead 25, avoiding the risk of leakage.

[0092] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A power failure protection switch, characterized in that: It includes a substrate (1) and a conductive protective layer (2) disposed on the substrate (1). The conductive protective layer (2) can be disconnected when the substrate (1) is damaged. The conductive protective layer (2) can be electrically connected to an external electrical control device for triggering power failure protection to form a power-on circuit. When the substrate (1) is damaged, the conductive protective layer (2) is disconnected, causing the power-on circuit to be disconnected to trigger power failure protection.

2. The power failure protection switch according to claim 1, characterized in that: The conductive protective layer (2) includes a conductive layer (23) arranged in a surrounding shape. One end of the conductive layer (23) has a first endpoint (21), and the other end of the conductive layer (23) has a second endpoint (22). There is a gap G between the first endpoint (21) and the second endpoint (22). The first endpoint (21) and the second endpoint (22) are respectively connected to external electrical control equipment to form a power circuit.

3. A power failure protection switch according to claim 2, characterized in that: The distance between the first endpoint (21) and the center of the substrate (1) is less than the distance between the second endpoint (22) and the center of the substrate (1). An imaginary straight line k is formed between the second endpoint (22) and the center of the substrate (1). The first endpoint (21) is offset from the straight line k. The direction of the straight line k toward the first endpoint (21) is direction p. The conductive layer (23) extends from the second endpoint (22) toward direction p and wraps around the center of the substrate (1) at least once before connecting to the first endpoint (21).

4. A power failure protection switch according to claim 2, characterized in that: The conductive layer (23) extends from one of the first endpoint (21) and the second endpoint (22) and passes through the region between the other of the first endpoint (21) and the center of the substrate (1). The conductive layer (23) surrounds the center of the substrate (1) such that there is at least one enclosing ring structure consisting of the conductive layer (23) between the center of the substrate (1) and the outer edge of the substrate (1).

5. A power failure protection switch according to claim 1, characterized in that: The substrate (1) is made of a brittle material. When the substrate (1) breaks, the conductive protective layer (2) is disconnected, causing the power-on circuit to be disconnected and triggering the power-off protection.

6. A power failure protection switch according to any one of claims 1-5, characterized in that: It also includes a switch housing (5) for mounting the substrate (1), wherein each switch housing (5) is independently provided with two electrode components (6) for connecting external electrical control equipment, and the two electrode components (6) are respectively connected to the conductive protective layer (2).

7. A power failure protection switch according to claim 1, characterized in that: It also includes a conductive heating layer (3) disposed on the substrate (1), the conductive protective layer (2) being located in the area between the outer edge of the substrate (1) and the outer edge of the conductive heating layer (3), and the conductive protective layer (2) and the conductive heating layer (3) being disposed at intervals.

8. A power failure protection switch according to claim 7, characterized in that: The substrate (1) is equipped with a temperature probe for detecting the heating temperature of the conductive heating layer (3), and the temperature probe is located within the layout area of ​​the conductive heating layer (3).

9. A power failure protection switch according to claim 8, characterized in that: The conductive heating layer (3) includes multiple heating areas that are independently arranged and are arranged around the temperature probe in a circumferential manner.

10. A power failure protection switch according to claim 7, characterized in that: The conductive protective layer (2) is connected end to end in a ring shape to form a protective area surrounding the conductive heating layer (3). The conductive protective layer (2) extends conductive leads (24) in the direction of the conductive heating layer (3). The conductive protective layer (2) also extends grounding leads (25).

11. A power failure protection switch according to any one of claims 7-10, characterized in that: The conductive heating layer (3) is formed into a planar heating layer using one of the following materials: nano metal oxide, nano semiconductor metal oxide, graphene material, or carbon paste material.

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