Sealing installation structure and air conditioner

Abstract

The utility model relates to a sealing installation structure and an air conditioner, and belongs to the field of household appliances. A sealing installation structure comprises an installation base provided with an installation groove; the limiting assembly is arranged on the mounting base, the limiting assembly and the mounting base are matched to form a mounting cavity, and the mounting cavity communicates with the mounting groove; the heat dissipation assembly is arranged on one end face of the mounting base, part of the heat dissipation assembly is located in the mounting cavity, and the limiting assembly abuts against the heat dissipation assembly; the circuit board assembly is arranged on the other end face of the installation base, and the circuit board assembly abuts against the heat dissipation assembly. The utility model discloses a sealing installation structure, which guarantees good waterproof sealing performance of a circuit board from multiple aspects, and greatly reduces the risks of short circuit, damage and other faults caused by water immersion of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of household appliances, and in particular to a sealed installation structure and an air conditioner. Background Technology

[0002] Most air conditioner outdoor unit panels on the market now have radiators, and these radiators are assembled with the circuit board to form a single unit, which is then installed inside the electrical control box. However, the radiator fins have gaps, which can create gaps in the sealing structure of the electrical control box during installation. Furthermore, because the outdoor unit's fan is close to the circuit board's radiator, rainwater can easily be splashed onto the radiator and then onto the circuit board, causing corrosion and affecting its lifespan. Utility Model Content

[0003] Therefore, it is necessary to provide a sealed installation structure and an air conditioner to address the issue of gaps in the sealing structure between the control box and the radiator.

[0004] A sealed mounting structure includes: a mounting base having a mounting groove; a limiting component disposed on the mounting base, the limiting component and the mounting base cooperating to form a mounting cavity communicating with the mounting groove; a heat dissipation component disposed on one end face of the mounting base with a portion of the heat dissipation component located within the mounting cavity, the limiting component abutting against the heat dissipation component; and a circuit board assembly disposed on the other end face of the mounting base, the circuit board assembly abutting against the heat dissipation component.

[0005] The above-disclosed sealed installation structure ensures excellent waterproof sealing from multiple aspects, bringing many significant benefits. First, the mounting groove of the mounting base provides a basic framework for the entire installation process. Its structural design can initially limit and protect the internal components, reducing the possibility of external moisture directly contacting critical internal parts. It also facilitates installation, allowing the heat dissipation component to be fixed on one end face of the mounting base, and the circuit board component to be mounted on the other end face, then combined with the heat dissipation component to cool the circuit board component. Furthermore, the fit between the limiting component and the mounting base provides a 10mm single-sided space for the heat dissipation component, allowing for a tight fit and effective fixation of the component. This prevents rainwater from easily entering the heat dissipation component and further contacting the circuit board component, potentially corroding it. Moreover, this sealed installation structure effectively resists both minor vibrations during daily use and the intrusion of moisture or water mist in humid environments thanks to its rational design and tight connection. Moisture has difficulty penetrating layers of protection to reach the core circuit board area, thus greatly reducing the risk of short circuits, damage, and other malfunctions caused by water immersion. This ensures the normal and stable operation of the equipment, extends its service life, and reduces maintenance costs and safety hazards caused by poor waterproof sealing. It performs excellently in terms of waterproof sealing performance, laying a solid foundation for the reliable operation of related equipment in various complex environments.

[0006] In one embodiment, the limiting component includes a limiting baffle, limiting protrusions, and a limiting strip. The limiting baffle is disposed on the mounting base and cooperates with the mounting base to form the mounting cavity. The limiting baffle surrounds the mounting groove and is adjacent to the mounting groove. Multiple limiting protrusions are disposed on the limiting baffle and extend towards the mounting cavity. The heat dissipation component abuts against the multiple limiting protrusions. The limiting strip is disposed on the limiting baffle and / or the mounting base. By forming a mounting cavity with the limiting baffle, a relatively independent space is provided for the heat dissipation component, effectively preventing external moisture from directly entering the circuit board assembly from the side of the heat dissipation component, greatly enhancing the overall waterproof sealing performance. Its layout surrounding and adjacent to the mounting groove further ensures the stability of the mounting groove area during installation and subsequent use, preventing water leakage channels caused by structural deformation due to external forces. Meanwhile, multiple limiting protrusions on the limiting baffle, abutting against the heat dissipation component, not only precisely fix the position of the heat dissipation component, preventing displacement due to vibration or other factors during operation and thus protecting the waterproof structure, but also effectively prevent moisture penetration at the tiny gaps where the mounting base and heat dissipation component meet due to their tight contact. The limiting strip, whether on the limiting baffle or the mounting base, further enhances structural stability. It provides additional limiting and support for other components, preventing displacement or wobbling, thereby reducing the risk of waterproof seal failure due to structural instability. It also guides the installation of the heat dissipation component. This multi-component collaborative limiting component design ensures the integrity and stability of the sealed installation structure from all angles, ensuring that the equipment maintains good waterproof sealing performance even in complex operating environments, especially under the threat of moisture, guaranteeing the safety and normal operation of the internal circuits and components.

[0007] In one embodiment, the limiting baffle includes a first limiting baffle, a second limiting baffle, a third limiting baffle, and a fourth limiting baffle. All four baffles are mounted on the mounting base, sequentially connected and adjacent to the mounting groove. Multiple limiting protrusions are disposed on the fourth limiting baffle, and a limiting strip is disposed on the second limiting baffle. By placing the first limiting baffle on the mounting base, from a waterproof sealing perspective, the potential entry range of moisture is initially limited, providing a stable foundation for subsequent baffles to construct a more precise waterproof defense. The second limiting baffle, located on the first limiting baffle and / or the mounting base, further subdivides and reinforces the waterproof area, enhancing protection around the mounting groove and reducing the possibility of moisture intrusion from different angles. The third limiting baffle further enhances the sealing performance, working in conjunction with the first two to form a multi-layered waterproof barrier system, acting like layers of checkpoints to prevent moisture from breaching the defenses and reaching critical internal areas. Multiple limiting protrusions on the fourth limiting baffle abut against the heat dissipation components, not only stabilizing them but also ensuring a tight waterproof seal, preventing moisture from seeping in at this crucial connection point. The limiting strip on the second limiting baffle enhances the stability of the entire baffle structure, preventing waterproofing leaks caused by uneven stress or vibration leading to baffle deformation. This structure, composed of the first, second, third, and fourth limiting baffles, with adjacent surrounding mounting slots, provides installation space for the heat dissipation components while ensuring a tight fit between the components and the mounting base. This comprehensive waterproof seal of the mounting slots and the entire sealed installation structure significantly improves the reliability and durability of the equipment in humid or wet environments, creating a safe and stable operating environment for the delicate circuit board components and heat dissipation components inside the equipment.

[0008] In one embodiment, the first, second, third, and fourth limiting baffles are integrally formed. Connecting these four limiting baffles in an integral form brings several advantages. Regarding waterproofing and sealing, the integral molding eliminates gaps between the baffles, significantly reducing potential channels for moisture leakage and creating a seamless waterproof enclosure that effectively prevents external moisture from entering the mounting cavity. In terms of structural stability, it avoids the risk of waterproofing failure due to loosening or displacement of connections, better withstands external impacts and vibrations, and ensures good sealing performance under various complex operating conditions. This provides durable and reliable waterproof and structural protection for the heat dissipation components and circuit board assemblies within the mounting cavity, extending the equipment's service life and stability.

[0009] In one embodiment, the limiting component and the mounting base are integrally formed. By integrally connecting the limiting component and the mounting base, this connection method completely eliminates any assembly gaps that may exist between the two, preventing moisture from seeping in along the gaps and greatly enhancing the overall waterproof barrier effect of the structure. From the perspective of structural strength and stability, the integral molding makes the entire sealed installation structure a unified whole, which can more effectively resist deformation and displacement under external forces. Whether it is vibration during daily use or accidental impact, it can ensure the stability of internal components, thereby continuously maintaining a good waterproof seal, protecting the internal circuits and related components of the equipment from water damage, and improving the reliability and durability of equipment operation.

[0010] In one embodiment, the mounting base includes a base body and multiple clips. These clips are disposed on the base body, which has mounting grooves and mounting holes. By placing multiple clips on the base body, which serves as the core load-bearing component, the mounting grooves provide a stable foundation for the precise assembly of each component, ensuring a tight fit between parts and effectively improving the overall structural stability and reliability. The multiple clips are evenly distributed on the base body, allowing for rapid engagement with other components during assembly, simplifying the installation process and making the connection between components more secure. This structural design makes the entire mounting base an organic whole, with each part cooperating with the others. When subjected to external forces, it can evenly distribute stress, effectively preventing local deformation or damage, greatly enhancing the structure's durability and impact resistance, and laying a solid foundation for the long-term stable operation of the entire sealed mounting structure. The mounting holes provide mounting points for the heat dissipation components, ensuring they can be securely installed on the mounting base and guaranteeing waterproof sealing.

[0011] In one embodiment, the base body includes a base plate and multiple support plates arranged circumferentially along the base plate. The limiting component and the circuit board assembly are both mounted on the base plate, and the heat dissipation component is mounted on the base plate through mounting holes. By arranging multiple support plates circumferentially along the base plate, the overall strength and stability of the base body are enhanced. When subjected to pressure from the upper components and potential external impacts, the support plates effectively disperse stress, preventing excessive deformation or damage to the base plate. This provides a reliable support platform for the limiting component and circuit board assembly mounted on it, ensuring their operation in a stable structural environment. The heat dissipation component is connected to the base plate through mounting holes. This connection method ensures the secure installation of the heat dissipation component and facilitates efficient heat dissipation, optimizing the heat dissipation path. Furthermore, the limiting component and circuit board assembly are directly mounted on the base plate, simplifying installation and resulting in a compact and rational layout of the components, reducing unnecessary space occupation and creating a more orderly overall structure. This not only helps improve the utilization of internal space in the equipment, but also reduces the risk of unstable connections or seal failures that may occur due to loose component layout at the structural level, ensuring that the entire sealed installation structure maintains good performance and reliability during long-term operation.

[0012] In one embodiment, the support plate includes a support side plate and fixing blocks. The support side plate is disposed on the base plate, and multiple fixing blocks are disposed on the support side plate. The circuit board assembly is disposed on the multiple fixing blocks. By placing the support side plate on the base plate, the lateral support force of the base plate is greatly enhanced, effectively preventing the base plate from bending and deforming when subjected to lateral forces or vibrations, thus laying a solid foundation for the stability of the entire structure. Simultaneously, the multiple fixing blocks on the support side plate provide dedicated mounting points for the circuit board assembly. This design allows the circuit board assembly to be precisely positioned and securely installed, avoiding loose circuit connections or malfunctions that may result from unstable installation. Furthermore, raising the circuit board assembly allows it to make close contact with the heat dissipation components, improving heat dissipation efficiency and facilitating airflow below, thus aiding in heat dissipation and preventing excessive heat accumulation from adversely affecting the performance of the circuit board assembly. Moreover, the combined structure of the fixing blocks and the support side plate further optimizes the internal space layout, making the space allocation between components more reasonable, reducing the possibility of mutual interference, ensuring the reliability and efficiency of the entire sealed installation structure during operation, and improving the overall performance of the equipment.

[0013] In one embodiment, the heat dissipation assembly includes a mounting plate and a heat sink. The mounting plate is disposed on the mounting base and located within the mounting cavity. The mounting plate abuts against the limiting component and seals the mounting groove. The heat sink is disposed on the mounting plate. By placing the mounting plate within the mounting cavity of the mounting base and abutting against the limiting component, a stable and reliable mounting foundation is provided for the heat sink. Furthermore, the close cooperation with the limiting component effectively enhances the stability and shock resistance of the entire structure. Crucially, the mounting plate seals the mounting groove, significantly improving overall waterproof sealing and preventing moisture from entering the mounting groove through gaps between the heat dissipation assembly and the mounting base, thus preventing damage to the circuit board assembly and ensuring normal operation of the equipment in humid environments. The heat sink, mounted on the mounting plate, efficiently conducts and dissipates the heat generated during equipment operation, preventing heat accumulation that could damage critical components such as the circuit board assembly. This ensures stable operation of the equipment within a suitable temperature range, thereby extending the equipment's service life. This design, which combines heat dissipation and sealing functions, enables the equipment to effectively solve heat dissipation problems while ensuring waterproof performance. It optimizes the internal thermal management and waterproof protection mechanisms of the equipment, allowing the entire sealed installation structure to maintain good performance in complex working environments, reducing the risk of failure due to overheating or water ingress, and improving the reliability and durability of the equipment.

[0014] In one embodiment, the heat sink includes a heat sink base and heat sink fins. The heat sink base is disposed on the mounting plate, and there are multiple heat sink fins spaced apart along the length of the heat sink base, forming multiple heat dissipation channels. By tightly fitting the heat sink base to the mounting plate, heat can be quickly conducted from the heat source connected to it, serving as a key medium for heat conduction and laying a good foundation for subsequent heat dissipation. Simultaneously, the multiple heat sink fins spaced apart along the length of the heat sink base significantly increase the heat dissipation surface area. Air can flow smoothly in the heat dissipation channels between these heat sink fins, forming efficient heat exchange channels. When the equipment generates heat during operation, the heat is quickly dispersed from the heat sink base to each heat sink fin, and then rapidly carried away by the air flowing in the heat dissipation channels, thereby achieving efficient heat dissipation, effectively reducing the internal temperature of the equipment, and avoiding problems such as performance degradation of electronic components, shortened lifespan, or even equipment failure caused by overheating. This heat dissipation structure optimizes the heat dissipation path and efficiency, ensures the stability and reliability of the equipment under long-term, high-load operation, and improves the heat dissipation performance of the entire sealed mounting structure.

[0015] In one embodiment, the circuit board assembly includes a circuit board and a circuit module. The circuit board is disposed on the mounting base, and the circuit module is disposed on the circuit board and abuts against the heat dissipation assembly via the mounting slot. By mounting the circuit board on the mounting base, the circuit board is ensured to be on a stable supporting plane, reducing the risk of poor circuit connections caused by shaking or displacement. The circuit module is disposed on the circuit board and abuts against the heat dissipation assembly; this close contact allows the heat generated by the circuit module during operation to be quickly conducted to the heat dissipation assembly. The heat dissipation assembly then efficiently dissipates the heat, preventing the circuit module from experiencing performance degradation or even damage due to overheating, ensuring the stable operation of the circuit system and extending the service life of the circuit module. Simultaneously, this layout optimizes overall space utilization, improves the reliability and efficiency of the entire electrical system, and ensures that the internal circuit components of the sealed mounting structure can operate continuously, safely, and efficiently under various operating conditions.

[0016] The second aspect of this application discloses an air conditioner, which includes: the aforementioned sealed mounting structure; an outdoor unit, wherein the sealed mounting structure is disposed on the outdoor unit; and an air conditioner body, wherein the outdoor unit is disposed on the air conditioner body.

[0017] The second aspect disclosed above discloses an air conditioner in which the components of the sealed installation structure cooperate to form a multi-layered waterproof system. The synergistic effect of the mounting base, limiting components, and heat dissipation components effectively prevents external moisture intrusion. Whether it is rain or a high-humidity environment, it ensures that the circuit board components inside the air conditioner's outdoor unit are protected from water damage, greatly reducing the risk of short circuits, damage, and other malfunctions caused by water ingress, ensuring stable operation of the air conditioner and extending its service life. Meanwhile, the sealed installation structure is ingeniously designed for ease of installation. The circuit board components are assembled first, then the heat dissipation components are installed on one side of the mounting base, and finally the assembled circuit board components are installed on the other side of the mounting base, ensuring tight contact and fixation with the heat dissipation components. This structure simplifies the overall installation process, improves production and assembly efficiency, and makes air conditioner installation easier and more convenient. Its advantages are evident in both production workshops and on-site installation scenarios, enhancing the product's market competitiveness. Attached Figure Description

[0018] Figure 1 First perspective view of the sealed installation structure;

[0019] Figure 2 This is a second perspective view of the sealed installation structure;

[0020] Figure 3 A first perspective view showing the mounting base and limiting components;

[0021] Figure 4A second perspective view showing the mounting base and limiting components;

[0022] Figure 5 A third perspective view showing the mounting base and limiting components;

[0023] Figure 6 Fourth perspective view for mounting the base and limiting components;

[0024] Figure 7 Fifth perspective view showing the installation of the base and limiting components;

[0025] Figure 8 This is a 3D view of the heat dissipation components;

[0026] Figure 9 A perspective view of the mounting base, limit components, and circuit board assembly.

[0027] The correspondence between the reference numerals and the component names is as follows:

[0028] 1. Mounting base, 11. Base body, 111. Base plate, 112. Support plate, 1121. Support side plate, 1122. Fixing block, 12. Buckle, 101. Mounting groove, 102. Mounting hole;

[0029] 2 Limiting components, 21 Limiting baffle, 211 First limiting baffle, 212 Second limiting baffle, 213 Third limiting baffle, 214 Fourth limiting baffle, 22 Limiting protrusion, 23 Limiting strip, 201 Mounting cavity;

[0030] 3 Heat dissipation components, 31 Mounting plate, 32 Heat sink, 321 Heat sink base, 322 Heat sink fin, 301 Heat dissipation channel;

[0031] 4. Circuit board assembly, 41. Circuit board, 42. Circuit module. Detailed Implementation

[0032] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0033] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0034] The sealed mounting structure and air conditioner of some embodiments of this utility model are described below with reference to the accompanying drawings.

[0035] Example 1

[0036] like Figures 1 to 9 As shown, this embodiment discloses a sealed installation structure, including: a mounting base 1, which has a mounting groove 101; a limiting component 2, which is disposed on the mounting base 1, and the limiting component 2 and the mounting base 1 cooperate to form a mounting cavity 201, which communicates with the mounting groove 101; a heat dissipation component 3, which is disposed on one end face of the mounting base 1 and a portion of the heat dissipation component 3 is located in the mounting cavity 201, and the limiting component 2 abuts against the heat dissipation component 3; and a circuit board assembly 4, which is disposed on the other end face of the mounting base 1, and the circuit board assembly 4 abuts against the heat dissipation component 3.

[0037] This application discloses a sealed installation structure that ensures excellent waterproof sealing from multiple aspects, bringing many significant benefits. First, the mounting groove 101 of the mounting base 1 provides a basic framework for the entire installation process. Its structural design can initially limit and protect the internal components, reducing the possibility of external moisture directly contacting critical internal parts. It also facilitates installation, allowing the heat dissipation component 3 to be fixed to one end face of the mounting base 1, and the circuit board assembly 4 to be installed on the other end face of the mounting base 1, while simultaneously cooperating with the heat dissipation component 3 to allow the heat dissipation component 3 to dissipate heat from the circuit board assembly 4. Furthermore, the cooperation between the limiting component 2 and the mounting base 1 provides a 10mm single-sided mounting cavity 201 for the heat dissipation component 3, allowing the heat dissipation component 3 to be tightly integrated with the limiting component 2 and the mounting base 1. This effectively fixes the position of the heat dissipation component and prevents rainwater from easily entering the heat dissipation component 3 and further contacting the circuit board component 4, thus corroding the circuit board. Moreover, this sealed mounting structure effectively resists both minor vibrations during daily use and the potential for moisture or water mist in humid environments due to its reasonable design and tight connection. Moisture has difficulty penetrating the layers of protection to enter the core circuit board area, thereby greatly reducing the risk of short circuits, damage, and other malfunctions caused by water immersion. This ensures the normal and stable operation of the equipment, extends its service life, and reduces maintenance costs and safety hazards caused by poor waterproof sealing. Its excellent waterproof sealing performance lays a solid foundation for the reliable operation of related equipment in various complex environments.

[0038] like Figure 1 , Figure 3 and Figure 6As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the limiting component 2 includes a limiting baffle 21, limiting protrusions 22, and limiting strips 23. The limiting baffle 21 is disposed on the mounting base 1 and cooperates with the mounting base 1 to form a mounting cavity 201. The limiting baffle 21 surrounds the mounting groove 101 and is adjacent to the mounting groove 101. There are multiple limiting protrusions 22, which are disposed on the limiting baffle 21 and extend towards the mounting cavity 201. The heat dissipation component 3 abuts against the multiple limiting protrusions 22. The limiting strips 23 are disposed on the limiting baffle 21 and / or the mounting base 1. By cooperating with the mounting base 1 to form the mounting cavity 201, a relatively independent space is provided for the heat dissipation component 3, effectively preventing external moisture from directly entering the circuit board component 4 from the side of the heat dissipation component 3, greatly enhancing the waterproof sealing of the overall structure. The layout of the mounting groove 101 and its adjacent arrangement further ensures the stability of the mounting groove 101 area during installation and subsequent use, preventing water leakage channels caused by structural deformation due to external forces. Meanwhile, the multiple limiting protrusions 22 on the limiting baffle 21 and abutting against the heat dissipation component 3 not only precisely fix the position of the heat dissipation component 3, preventing displacement due to vibration or other factors during operation and damage to the waterproof structure, but also effectively prevent moisture penetration at the tiny gaps where the mounting base 1 contacts the heat dissipation component 3 due to their tight abutment. The limiting strip 23, whether on the limiting baffle 21 or the mounting base 1, further enhances the structural stability. It provides additional limiting and support for other components, preventing component displacement or shaking, thereby reducing the risk of waterproof seal failure due to structural instability, and also serves as a guide for the installation of the heat dissipation component 3. This multi-component collaborative limiting component design ensures the integrity and stability of the sealed installation structure from all angles, ensuring that the equipment can maintain good waterproof sealing performance even in complex operating environments, especially when there is a threat of moisture, thus protecting the safety and normal operation of the internal circuits and components.

[0039] like Figure 1 , Figure 3 , Figure 6 and Figure 7As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the limiting baffle 21 includes a first limiting baffle 211, a second limiting baffle 212, a third limiting baffle 213, and a fourth limiting baffle 214. The first limiting baffle 211, the second limiting baffle 212, the third limiting baffle 213, and the fourth limiting baffle 214 are all disposed on the mounting base 1. The first limiting baffle 211, the second limiting baffle 212, the third limiting baffle 213, and the fourth limiting baffle 214 are connected sequentially and are all adjacent to the mounting groove 101. Multiple limiting protrusions 22 are disposed on the fourth limiting baffle 214, and limiting strips 23 are disposed on the second limiting baffle 212. By placing the first limiting baffle 211 on the mounting base 1, from a waterproof sealing perspective, the potential range of moisture entry is initially limited, providing a stable foundation for the subsequent construction of a more precise waterproof defense line by the baffle. The second limiting baffle 212, positioned on the first limiting baffle 211 and / or the mounting base 1, further subdivides and reinforces the waterproof area, enhancing protection around the mounting groove 101 and reducing the possibility of moisture intrusion from different angles. The third limiting baffle 213 further strengthens the sealing performance, working in conjunction with the first two to form a multi-layered waterproof barrier system, acting like layers of checkpoints to prevent moisture from breaching the defenses and reaching critical internal areas. Multiple limiting protrusions 22 on the fourth limiting baffle 214 abut against the heat dissipation component 3, not only stabilizing the component but also ensuring waterproof tightness at this point, preventing moisture from seeping in at this critical junction. The limiting strip 23 on the second limiting baffle 212 enhances the stability of the entire limiting baffle structure, preventing waterproof leaks caused by uneven local stress or vibration leading to baffle deformation. This structure, composed of the first, second, third, and fourth limiting baffles, provides installation space for the heat dissipation component 3 by setting adjacent surrounding mounting grooves 101. At the same time, it also enables the heat dissipation component 3 to fit tightly with the mounting base 1, ensuring the waterproof sealing of the mounting groove 101 and the entire sealed installation structure in all aspects. This greatly improves the reliability and durability of the equipment in humid or watery environments, and creates a safe and stable operating environment for the precision circuit board components 4 and heat dissipation components 3 inside the equipment.

[0040] like Figure 3 , Figure 6 and Figure 7As shown, in addition to the features of the above embodiments, this embodiment further defines that the first limiting baffle 211, the second limiting baffle 212, the third limiting baffle 213, and the fourth limiting baffle 214 are integrally formed. By integrally forming and connecting the first limiting baffle 211, the second limiting baffle 212, the third limiting baffle 213, and the fourth limiting baffle 214, many beneficial effects are achieved. In terms of waterproof sealing, the integral forming eliminates the gaps between the baffles, greatly reducing potential channels for water leakage, and creating a seamless waterproof enclosure that effectively prevents external moisture from intruding into the installation cavity. In terms of structural stability, it avoids the risk of waterproof failure due to loosening or displacement of the connection points, better withstands external impacts and vibrations, and ensures good sealing performance under various complex working conditions. This provides durable and reliable waterproof protection and structural protection for the heat dissipation assembly 3 and the circuit board assembly 4 within the installation cavity 201, extending the service life and stability of the equipment.

[0041] like Figure 2 and Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further specifies that the limiting component 2 and the mounting base 1 are integrally formed. By integrally forming and connecting the limiting component 2 and the mounting base 1, this connection method completely eliminates any possible assembly gaps between the two in terms of waterproof sealing, preventing water from seeping in along the gaps and greatly enhancing the waterproof barrier effect of the overall structure. From the perspective of structural strength and stability, integral forming makes the entire sealed installation structure a unified whole, which can more effectively resist deformation and displacement under external forces. Whether it is vibration during daily use or accidental collision, it can ensure the stability of internal components, thereby continuously maintaining a good waterproof sealing state, protecting the internal circuits and related components of the equipment from water damage, and improving the reliability and durability of equipment operation.

[0042] like Figure 3 and Figure 4As shown, in addition to the features of the above embodiments, this embodiment further defines: the mounting base 1 includes a base body 11 and buckles 12, with multiple buckles 12 disposed on the base body 11. The base body 11 has mounting grooves 101 and mounting holes 102. By disposing of multiple buckles 12 on the base body 11, the base body 11, as the core load-bearing part, provides a stable foundation for the precise assembly of each component through its mounting grooves 101, ensuring a tight fit between the components and effectively improving the stability and reliability of the overall structure. The multiple buckles 12 are evenly distributed on the base body 11, allowing for rapid engagement with other components during assembly, simplifying the installation process and making the connection between components more secure. This structural design makes the entire mounting base an organic whole, with each part cooperating with the others. When subjected to external forces, it can evenly distribute stress, effectively preventing local deformation or damage, greatly enhancing the durability and impact resistance of the structure, and laying a solid foundation for the long-term stable operation of the entire sealed mounting structure. Mounting hole 102 provides mounting points for heat dissipation component 3, ensuring that heat dissipation component 3 can be securely mounted on mounting base 1 and guaranteeing waterproof sealing.

[0043] like Figure 3 and Figure 4 As shown, in addition to the features of the above embodiments, this embodiment further defines: the base body 11 includes a base plate 111 and support plates 112. Multiple support plates 112 are arranged circumferentially along the base plate 111. The limiting component 2 and the circuit board assembly 4 are both mounted on the base plate 111. The heat dissipation component 3 is mounted on the base plate 111 through mounting holes 102. By arranging multiple support plates 112 circumferentially along the base plate 111, the overall strength and stability of the base body 11 are enhanced. When subjected to pressure from the upper components and possible external impacts, the support plates 112 can effectively disperse stress, preventing excessive deformation or damage to the base plate 111, and providing a reliable support platform for the limiting component 2 and the circuit board assembly 4 mounted thereon, ensuring their operation in a stable structural environment. The heat dissipation component 3 is connected to the base plate 111 through mounting holes 102. This connection method ensures the firmness of the heat dissipation component 3 installation and facilitates efficient heat dissipation from the heat dissipation component 3, optimizing the heat dissipation path. Meanwhile, the limiting component 2 and the circuit board component 4 are directly mounted on the base plate 111, which not only simplifies the installation process but also makes the layout of each component compact and reasonable, reducing unnecessary space occupation and making the overall structure more regular. This not only helps to improve the utilization rate of the internal space of the equipment but also reduces the risk of unstable connection or sealing failure that may occur due to loose component layout at the structural level, ensuring that the entire sealed installation structure maintains good performance and reliability during long-term operation.

[0044] like Figure 2 and Figure 5As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the support plate 112 includes a support side plate 1121 and fixing blocks 1122. The support side plate 1121 is disposed on the base plate 111, and there are multiple fixing blocks 1122 disposed on the support side plate 1121. The circuit board assembly 4 is disposed on the multiple fixing blocks 1122. By placing the support side plate 1121 on the base plate 111, the lateral support force of the base plate 111 is greatly enhanced, effectively preventing the base plate 111 from bending and deforming when subjected to lateral forces or vibrations, thus laying a solid foundation for the stability of the entire structure. At the same time, the multiple fixing blocks 1122 located on the support side plate 1121 provide dedicated mounting points for the circuit board assembly 4. This design allows the circuit board assembly 4 to be accurately positioned and firmly installed, avoiding loose circuit connections or malfunctions that may result from unstable installation. Simultaneously, raising the circuit board assembly 4 allows it to make close contact with the heat dissipation assembly 3, improving heat dissipation efficiency and facilitating airflow below, thus aiding in heat dissipation and preventing excessive heat accumulation from adversely affecting the performance of the circuit board assembly 4. Furthermore, the combination of the fixing block 1122 and the supporting side plate 1121 further optimizes the internal space layout, making the space allocation between components more rational, reducing the possibility of mutual interference, ensuring the reliability and efficiency of the entire sealed installation structure during operation, and improving the overall performance of the equipment.

[0045] like Figure 1 , Figure 3 and Figure 8As shown, in addition to the features of the above embodiments, this embodiment further defines: the heat dissipation assembly 3 includes a mounting plate 31 and a heat sink 32. The mounting plate 31 is disposed on the mounting base 1 and located in the mounting cavity 201. The mounting plate 31 abuts against the limiting component 2 and seals the mounting groove 101. The heat sink 32 is disposed on the mounting plate 31. By placing the mounting plate 31 in the mounting cavity 201 of the mounting base 1 and abutting against the limiting component 2, not only is a stable and reliable mounting foundation provided for the heat sink 3, but also the tight cooperation with the limiting component 2 effectively enhances the stability and shock resistance of the entire structure. Crucially, the mounting plate 31 can seal the mounting groove 101, greatly improving the overall waterproof sealing performance, preventing moisture from entering the mounting groove 101 from the gap between the heat dissipation assembly 3 and the mounting base 1 and damaging the circuit board assembly 4, thus ensuring the normal operation of the equipment in a humid environment. The heat sink 32 is mounted on the mounting plate 31, which can efficiently conduct and dissipate the heat generated during equipment operation, preventing heat accumulation from damaging critical components such as the circuit board assembly 4, ensuring that the equipment can operate stably within a suitable temperature range, thereby extending the service life of the equipment. This design, which combines heat dissipation and sealing functions, enables the equipment to effectively solve the heat dissipation problem while ensuring waterproof performance. It optimizes the internal thermal management and waterproof protection mechanism of the equipment, allowing the entire sealed mounting structure to maintain good performance in complex working environments, reducing the risk of failure due to overheating or water ingress, and improving the reliability and durability of the equipment.

[0046] like Figure 8 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the heat sink 32 includes a heat sink base 321 and heat sink fins 322. The heat sink base 321 is disposed on the mounting plate 31, and there are multiple heat sink fins 322. The multiple heat sink fins 322 are spaced apart along the length direction of the heat sink base 321 and form multiple heat dissipation channels 301. By tightly fitting the heat sink base 321 to the mounting plate 31, heat can be quickly conducted from the heat source connected to it, serving as a key medium for heat conduction and laying a good foundation for subsequent heat dissipation. At the same time, the multiple heat sink fins 322 spaced apart along the length direction of the heat sink base 321 greatly increase the heat dissipation surface area. Air can flow smoothly in the heat dissipation channels 301 between these heat sink fins 322, forming an efficient heat exchange channel. When the equipment generates heat during operation, the heat is rapidly dispersed from the heat sink base 321 to each heat sink 322, and then quickly carried away by the air flowing through the heat dissipation channel 301. This achieves efficient heat dissipation, effectively reducing the internal temperature of the equipment and preventing problems such as performance degradation of electronic components, shortened lifespan, or even equipment failure caused by overheating. This heat dissipation structure optimizes the heat dissipation path and efficiency, ensuring the stability and reliability of the equipment under long-term, high-load operation, and improving the heat dissipation performance of the entire sealed installation structure.

[0047] like Figure 1 , Figure 2 and Figure 9 As shown, in addition to the features of the above embodiments, this embodiment further defines that: the circuit board assembly 4 includes a circuit board 41 and a circuit module 42. The circuit board 41 is disposed on the mounting base 1, and the circuit module 42 is disposed on the circuit board 41 and abuts against the heat dissipation assembly 3 through the mounting groove 101. By mounting the circuit board 41 on the mounting base 1, it is ensured that the circuit board 41 is on a stable supporting plane, reducing the risk of poor circuit connection caused by shaking or displacement. The circuit module 42 is disposed on the circuit board 41 and abuts against the heat dissipation assembly 3. This close contact allows the heat generated by the circuit module 42 during operation to be quickly conducted to the heat dissipation assembly 3. The heat dissipation assembly 3 can then efficiently dissipate the heat, preventing the circuit module 42 from experiencing performance degradation or even damage due to overheating, ensuring the stable operation of the circuit system, and extending the service life of the circuit module 42. At the same time, this layout optimizes the overall space utilization, improves the reliability and working efficiency of the entire electrical system, and ensures that the internal circuit components of the sealed mounting structure can operate continuously, safely, and efficiently under various operating conditions.

[0048] Example 2

[0049] like Figures 1 to 9 As shown, this embodiment discloses an air conditioner, including: the above-mentioned sealed mounting structure; an air conditioner outdoor unit, the sealed mounting structure being disposed on the air conditioner outdoor unit; and an air conditioner body, the air conditioner outdoor unit being disposed on the air conditioner body.

[0050] The second aspect of this application discloses an air conditioner in which the components of a sealed installation structure cooperate to form a multi-layered waterproof system. The synergistic effect of the mounting base 1, the limiting component 2, and the heat dissipation component 3 effectively prevents external moisture intrusion. Whether subjected to rain or in high humidity environments, it ensures that the circuit board assembly 4 inside the outdoor unit of the air conditioner is protected from water damage, greatly reducing the risk of short circuits, damage, and other malfunctions caused by water ingress, ensuring stable operation of the air conditioner and extending its service life. Furthermore, the sealed installation structure is ingeniously designed for ease of installation. The circuit board assembly 4 is assembled first, then the heat dissipation component 3 is installed on one side of the mounting base 1, and finally, the assembled circuit board assembly 4 is installed on the other side of the mounting base 1, ensuring close contact and fixation with the heat dissipation component 3. This structure simplifies the overall installation process, improves production and assembly efficiency, and makes air conditioner installation easier and more convenient. Its advantages are evident in both production workshops and on-site installation scenarios, enhancing the product's market competitiveness.

[0051] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A sealed installation structure, characterized in that, The sealed mounting structure includes: Mounting base (1), wherein the mounting base (1) is provided with mounting groove (101); A limiting component (2) is disposed on the mounting base (1). The limiting component (2) and the mounting base (1) cooperate to form a mounting cavity (201). The mounting cavity (201) is connected to the mounting groove (101). Heat dissipation component (3), wherein the heat dissipation component (3) is disposed on one end face of the mounting base (1) and a portion of the heat dissipation component (3) is located in the mounting cavity (201), and the limiting component (2) abuts against the heat dissipation component (3); Circuit board assembly (4) is disposed on the other end face of the mounting base (1) and abuts against the heat dissipation assembly (3).

2. The sealing installation structure according to claim 1, characterized in that, The limiting component (2) includes a limiting baffle (21), a limiting protrusion (22), and a limiting strip (23). The limiting baffle (21) is disposed on the mounting base (1) and cooperates with the mounting base (1) to form the mounting cavity (201). The limiting baffle (21) surrounds the mounting groove (101) and is disposed adjacent to the mounting groove (101). There are multiple limiting protrusions (22). Multiple limiting protrusions (22) are disposed on the limiting baffle (21) and extend towards the mounting cavity (201). The heat dissipation component (3) abuts against the multiple limiting protrusions (22). The limiting strip (23) is disposed on the limiting baffle (21) and / or the mounting base (1).

3. The sealing installation structure according to claim 2, characterized in that, The limiting baffle (21) includes a first limiting baffle (211), a second limiting baffle (212), a third limiting baffle (213), and a fourth limiting baffle (214). The first limiting baffle (211), the second limiting baffle (212), the third limiting baffle (213), and the fourth limiting baffle (214) are all disposed on the mounting base (1). The first limiting baffle (211), the second limiting baffle (212), the third limiting baffle (213), and the fourth limiting baffle (214) are connected in sequence and are all disposed adjacent to the mounting groove (101). A plurality of limiting protrusions (22) are disposed on the fourth limiting baffle (214), and the limiting strip (23) is disposed on the second limiting baffle (212).

4. The sealing installation structure according to claim 3, characterized in that, The first limiting baffle (211), the second limiting baffle (212), the third limiting baffle (213) and the fourth limiting baffle (214) are integrally formed; And / or the limiting component (2) and the mounting base (1) are integrally formed.

5. The sealing installation structure according to claim 1, characterized in that, The mounting base (1) includes a base body (11) and buckles (12). There are multiple buckles (12), and multiple buckles (12) are disposed on the base body (11). The base body (11) is provided with mounting grooves (101) and mounting holes (102).

6. The sealing installation structure according to claim 5, characterized in that, The base body (11) includes a base plate (111) and a support plate (112). There are multiple support plates (112), which are arranged around the base plate (111). The limiting component (2) and the circuit board component (4) are both arranged on the base plate (111). The heat dissipation component (3) is arranged on the base plate (111) through the mounting hole (102).

7. The sealing installation structure according to claim 6, characterized in that, The support plate (112) includes a support side plate (1121) and a fixing block (1122). The support side plate (1121) is disposed on the base plate (111). There are multiple fixing blocks (1122), which are disposed on the support side plate (1121). The circuit board assembly (4) is disposed on the multiple fixing blocks (1122).

8. The sealing installation structure according to claim 1, characterized in that, The heat dissipation assembly (3) includes a mounting plate (31) and a heat sink (32). The mounting plate (31) is disposed on the mounting base (1) and located in the mounting cavity (201). The mounting plate (31) abuts against the limiting assembly (2). The mounting plate (31) seals the mounting groove (101). The heat sink (32) is disposed on the mounting plate (31).

9. The sealing installation structure according to claim 8, characterized in that, The heat sink (32) includes a heat sink base (321) and heat sink fins (322). The heat sink base (321) is disposed on the mounting plate (31). There are multiple heat sink fins (322). The multiple heat sink fins (322) are spaced apart along the length direction of the heat sink base (321) and form multiple heat dissipation channels (301). And / or the circuit board assembly (4) includes a circuit board (41) and a circuit module (42), the circuit board (41) being disposed on the mounting base (1), and the circuit module (42) being disposed on the circuit board (41) and abutting against the heat dissipation assembly (3) through the mounting slot (101).

10. An air conditioner, characterized in that, The air conditioner includes: The sealing installation structure according to any one of claims 1 to 9; An air conditioner outdoor unit, wherein the sealed mounting structure is installed on the air conditioner outdoor unit; The air conditioner body, wherein the outdoor unit of the air conditioner is mounted on the air conditioner body.

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