Light reflecting plate, printed circuit board, LED lamp and display device
By setting a non-conductive metal film light-reflecting layer on the wiring layer, the problems of complex production and large thickness of existing mirror reflective panels are solved, achieving cost reduction and gloss improvement.
Patent Information
- Application Number
- CN202422838187.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-11-20
AI Technical Summary
Existing mirror reflective panels have complex production processes, high costs, and large thicknesses, and their assembly is subject to certain limitations.
The structure design adopts a substrate layer, wiring layer, and non-conductive metal film light reflection layer, eliminating the process of pressing or bonding the substrate and mirror aluminum, and directly setting the light reflection layer on the wiring layer.
It reduced production costs, decreased board thickness, and improved gloss and light reflection.
Smart Images
Figure CN223681279U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of lighting devices, in particular to a light reflection plate, a printed circuit board, an LED lamp and a display device. BACKGROUND
[0002] The mirror reflection plate is a kind of plate with high reflectivity surface, which is usually used in application scenarios that require efficient reflection of light. Its surface is specially treated to have very smooth and smooth characteristics, so as to reflect light like a mirror.
[0003] The existing mirror reflection plate is made by pressing or bonding mirror aluminum on the surface of the substrate, which has high cost, long production process, thick substrate and certain limitations in assembly. CONTENT OF THE UTILITY MODEL
[0004] Therefore, the present application provides a light reflection plate, a printed circuit board, an LED lamp and a display device to solve one of the technical problems in the prior art.
[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:
[0006] In a first aspect, the present application provides a light reflection plate, comprising:
[0007] a substrate layer;
[0008] a wiring layer arranged on at least part of the substrate layer;
[0009] a light reflection layer arranged on the side of the wiring layer away from the substrate layer, the light reflection layer completely covers the wiring layer, and the light reflection layer is a non-conductive metal film.
[0010] In one embodiment of the first aspect, the thickness of the light reflection layer is 3-200 microns.
[0011] In one embodiment of the first aspect, the light reflection layer is made of indium or tin.
[0012] In one embodiment of the first aspect, the thickness of the substrate layer is 10-300 microns.
[0013] In one embodiment of the first aspect, the substrate layer is made of at least one of copper, aluminum and glass.
[0014] In one embodiment of the first aspect, the thickness of the wiring layer is 5-300 microns.
[0015] In one embodiment of the first aspect, the wiring layer is made of at least one of copper and silver.
[0016] In a second aspect, the embodiments of the present application further provide a printed circuit board, comprising at least one wiring layer, and a surface of each of the wiring layers is provided with a light reflection layer, and the light reflection layer is a non-conductive metal film.
[0017] In a third aspect, the embodiments of the present application further provide an LED lamp, comprising the printed circuit board in any of the above embodiments and one or more LEDs mounted on the printed circuit board.
[0018] In a fourth aspect, the embodiments of the present application further provide a display device, comprising the light reflection board in any of the above embodiments.
[0019] Compared with the prior art, the beneficial effects of the present application are as follows: the present application provides a light reflection board, comprising a substrate layer, a wiring layer and a light reflection layer, the wiring layer is arranged on at least part of the substrate layer, the light reflection layer is arranged on a side of the wiring layer away from the substrate layer, the light reflection layer completely covers the wiring layer, and the light reflection layer is a non-conductive metal film. The present application directly arranges a non-conductive metal film on the wiring layer to form a mirror effect light reflection layer, thereby improving the glossiness and emission light enhancement effect of the light reflection board. In addition, the production process of pressing or bonding the substrate and the mirror aluminum in the related art is not needed, thereby reducing the cost and reducing the thickness of the light reflection board. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.
[0021] Figure 1 A structure schematic diagram of a light reflection board in the related art is shown;
[0022] Figure 2 A structure schematic diagram of a light reflection board in some embodiments of the present application is shown.
[0023] Main element symbol explanation: 100-light reflection board; 110-substrate layer; 120-wiring layer; 130-light reflection layer. DETAILED DESCRIPTION
[0024] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation on the present application.
[0025] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0026] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.
[0027] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0028] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.
[0029] As Figure 1As shown, the light reflection plate in the related art includes, from bottom to top, a substrate layer, a wiring layer, a protective layer, and a reflection layer. The protective layer is made of ink material, and the reflection layer is mirror aluminum. Mirror aluminum is a kind of aluminum material that has been specially treated, and its surface has very high smoothness and flatness, and can reflect light like a mirror. The ink separates the wiring layer and the mirror aluminum to avoid short circuit. Such a light reflection plate structure is complex, has high manufacturing cost, and has large product thickness.
[0030] To solve the above problems, as shown in Figure 2 Embodiments of the present application provide a light reflection plate 100, which includes a substrate layer 110, a wiring layer 120, and a light reflection layer 130.
[0031] The wiring layer 120 is arranged on at least part of the substrate layer 110. The size of the light reflection layer 130 and the wiring layer 120 is related to the application scenario of the light reflection plate 100.
[0032] For example, when the light reflection plate 100 is used to connect an LED or an LED chip, the size of the wiring layer 120 is not less than that of the LED or the LED chip; when the light reflection plate 100 is used to make a lampshade to reflect light, the area of the light reflection layer 130 should be greater than that of the wiring layer 120.
[0033] The light reflection layer 130 is arranged on the side of the wiring layer 120 away from the substrate layer 110, and the light reflection layer 130 completely covers the wiring layer 120 to avoid the wiring layer 120 from being exposed.
[0034] In some embodiments, at least part of the light reflection layer 130 is directly arranged on the substrate layer 110.
[0035] The light reflection layer 130 is a non-conductive metal film. The present application improves the glossiness and light emission of the light reflection plate 100 by directly arranging the light reflection layer 130 with mirror effect on the wiring layer 120. In addition, by replacing the protective layer and the reflection layer in the related art with the light reflection layer 130, the pressing or bonding production process of the substrate and the protective layer and mirror aluminum in the related art is not needed, thereby reducing the cost and the thickness of the light reflection plate 100.
[0036] In some embodiments, the light reflection rate of the light reflection layer 130 to visible light (wavelength of 400-760 nm) is above 95%.
[0037] In some embodiments, the thickness of the light reflection layer 130 is 3-200 microns.
[0038] The thickness of the light reflection layer 130 is not limited to the examples, and can be 3 microns, 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns, 110 microns, 120 microns, 130 microns, 140 microns, 150 microns, 160 microns, 170 microns, 180 microns, 190 microns, 200 microns, etc.
[0039] When the thickness of the light reflection layer 130 is less than 3 microns, the processing precision is too high, and the light reflection layer 130 is too thin, which weakens the light reflection effect. When the thickness of the light reflection layer 130 is greater than 200 microns, the light reflection layer 130 may crack and have uneven thickness, which causes the mirror effect to deteriorate.
[0040] In some embodiments, the light reflection layer 130 is made of indium or tin.
[0041] In the present embodiment, the light reflection layer 130 is formed by electroplating. The electroplating process is as follows:
[0042] A corresponding electrolyte is prepared; the combined structure of the substrate layer and the wiring layer 120 is used as a cathode, and indium or tin is used as an anode and placed in an electrolytic cell, ensuring that the distance between the two is appropriate to ensure uniform deposition; a direct current power supply is turned on, and the voltage and current density are adjusted.
[0043] In some embodiments, the thickness of the substrate layer 110 is 10-300 microns.
[0044] The thickness of the substrate layer 110 is not limited to the examples, and can be 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns, 110 microns, 120 microns, 130 microns, 140 microns, 150 microns, 160 microns, 170 microns, 180 microns, 190 microns, 200 microns, 210 microns, 220 microns, 230 microns, 240 microns, 250 microns, 260 microns, 270 microns, 280 microns, 290 microns, 300 microns, etc.
[0045] When the thickness of the substrate layer 110 is less than 10 microns, it is not conducive to the arrangement of the wiring layer 120. When the thickness of the substrate layer 110 is greater than 300 microns, the product thickness is too large.
[0046] In some embodiments, the substrate layer 110 is made of at least one of copper, aluminum, and glass. The material of the substrate layer is selected according to the practical scenario of the light reflection plate.
[0047] In some embodiments, the thickness of the wiring layer 120 is 5-300 microns.
[0048] The thickness of the wiring layer 120 is not limited to the examples and can be 5 microns, 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 60 microns, 70 microns, 80 microns, 90 microns, 100 microns, 110 microns, 120 microns, 130 microns, 140 microns, 150 microns, 160 microns, 170 microns, 180 microns, 190 microns, 200 microns, 210 microns, 220 microns, 230 microns, 240 microns, 250 microns, 260 microns, 270 microns, 280 microns, 290 microns, 300 microns, etc.
[0049] When the thickness of the wiring layer 120 is less than 5 microns, the resistance of the wiring layer 120 is too large, and when the thickness of the wiring layer 120 is greater than 300 microns, the amount of material is too large, increasing the cost.
[0050] In some embodiments, the wiring layer 120 is made of at least one of copper and silver. The wiring layer 120 is embedded in the surface of the substrate layer 110, or the wiring layer 120 is protruding from the surface of the substrate layer 110.
[0051] The present application also provides a printed circuit board comprising at least one wiring layer 120, and the surface of each wiring layer 120 is provided with a light reflecting layer 130, which is a non-conductive metal film.
[0052] In an example, when the printed circuit board is a single-layer printed circuit board, only one side of the substrate is provided with a wiring layer 120, and the surface of the wiring layer 120 is provided with a light reflecting layer 130, which is a non-conductive metal film.
[0053] In an example, when the printed circuit board is a double-layer printed circuit board, both sides of the substrate are provided with a wiring layer 120, and the surface of each wiring layer 120 is provided with a light reflecting layer 130, which is a non-conductive metal film.
[0054] In an example, when the printed circuit board is a multi-layer printed circuit board, the wiring space is increased by embedding additional conductive layers in the substrate, and a plurality of independent wiring layers 120 are provided, and the surface of each wiring layer 120 is provided with a light reflecting layer 130, which is a non-conductive metal film.
[0055] The present application also provides an LED lamp comprising the printed circuit board of any of the above embodiments and one or more LEDs mounted on the printed circuit board.
[0056] In the LED lamp, the printed circuit board is a circuit board for mounting and connecting LED chips, and the printed circuit board not only provides mechanical support but also is responsible for heat dissipation and electrical connection.
[0057] The substrate of the printed circuit board is made of any one of metal, ceramic, FR4. Among them, the FR4 substrate is made of glass fiber and reinforced epoxy resin, has the advantage of lower cost, and is suitable for low-power LED applications.
[0058] The present application also provides a display device comprising the light-reflecting plate 100 of any one of the above embodiments, thus having all the advantages of the light-reflecting plate 100 of any one of the above embodiments, which will not be repeated here.
[0059] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples without contradiction.
[0060] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.
Claims
1. A light-reflecting plate, characterized in that, The printed circuit board comprises: a substrate layer; a wiring layer arranged on at least a part of the substrate layer; a light-reflecting layer arranged on a side of the wiring layer away from the substrate layer, the light-reflecting layer completely covering the wiring layer, the light-reflecting layer being a non-conductive metal film.
2. The light-reflecting sheeting of claim 1, wherein The thickness of the light-reflecting layer is 3-200 microns.
3. The light-reflecting sheeting of claim 2, wherein, The light-reflecting layer is made of indium or tin.
4. The light-reflecting sheeting of claim 2, wherein The thickness of the substrate layer is 10-300 microns.
5. The light-reflecting sheeting of claim 1, wherein The substrate layer is made of copper, aluminum or glass.
6. The light-reflecting sheeting of claim 5, wherein, The thickness of the wiring layer is 5-300 microns.
7. The light-reflecting sheeting according to any one of claims 1 to 6, wherein The wiring layer is made of copper or silver.
8. A printed circuit board, characterized by The printed circuit board comprises at least one wiring layer, and a light-reflecting layer is arranged on the surface of each wiring layer, the light-reflecting layer being a non-conductive metal film.
9. An LED lamp, characterized in that The printed circuit board comprises one or more LEDs mounted thereon.
10. A display device, characterized by comprising: The printed circuit board comprises the light-reflecting plate according to any one of claims 1-7.