Die bonder

Abstract

The utility model discloses a die bonder which comprises a rack outer cover and a functional assembly, the functional assembly is arranged at the top of the rack outer cover, and the functional assembly comprises a substrate feeding module, a substrate carrying track, a dispensing module, a binding vision, a binding module, a pickup module, a transfer table vision, a substrate discharging module, a wafer module, an ejector pin module and a wafer feeding module. A substrate carrying track is arranged on the right side of the substrate feeding module, a dispensing module is arranged on the right side of the substrate carrying track, a binding vision is arranged on the right side of the dispensing module, and a binding module is arranged on the right side of the binding vision. Automatic feeding and discharging of the substrate, automatic glue drawing, automatic feeding and discharging of a wafer disc, automatic chip picking and secondary positioning, visual positioning and automatic chip binding can be achieved, automatic chip attaching can be achieved, the zoom visual system is adopted to be compatible with chips of different sizes, the binding head pressure is controllable, and the attaching quality can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonder, and particularly relates to a die bonder. BACKGROUND

[0002] The die bonder is mainly used for the lead cabinet frame pressing plate of various gold wire ultrasonic welding devices, various suction nozzles, ejector pins, dispensing heads, porcelain nozzles, through pins, motors, carbon brushes, encoders, transmission belts of various chip mounting devices, various spare parts of automatic equipment, instruments and meters, etc.

[0003] Some die bonders on the market cannot realize automatic feeding and discharging of substrates, automatic dispensing, automatic feeding and discharging of wafer plates, automatic picking of chips and secondary positioning, visual positioning and automatic binding of chips, so as to realize automatic chip bonding, and cannot be compatible with different sizes of chips, and cannot guarantee the bonding quality.

[0004] Therefore, the prior art has defects and needs to be improved. SUMMARY

[0005] The present application provides a die bonder to solve the problem that some die bonders on the market cannot realize automatic feeding and discharging of substrates, automatic dispensing, automatic feeding and discharging of wafer plates, automatic picking of chips and secondary positioning, visual positioning and automatic binding of chips, so as to realize automatic chip bonding, and cannot be compatible with different sizes of chips, and cannot guarantee the bonding quality.

[0006] In a first aspect, the present application provides a die bonder, comprising a rack cover and a functional assembly, the functional assembly is arranged on the top of the rack cover, and the functional assembly comprises a substrate feeding module, a substrate conveying track, a dispensing module, a binding vision, a binding module, a picking module and a transfer table vision, a substrate discharging module, a wafer module, an ejector pin module and a wafer feeding module.

[0007] Optionally, the right side of the substrate feeding module is provided with the substrate conveying track, the right side of the substrate conveying track is provided with the dispensing module, the right side of the dispensing module is provided with the binding vision, the right side of the binding vision is provided with the binding module, the front of the binding module is provided with the picking module and the transfer table vision, the right side of the binding module is provided with the substrate discharging module, the front end of the substrate discharging module is provided with the wafer feeding module, the left side of the wafer feeding module is provided with the ejector pin module, and the left side of the ejector pin module is provided with the wafer module.

[0008] Optionally, the substrate feeding module comprises a magazine feeding conveying track, an empty magazine buffer platform, a lifting clamp and a substrate pushing structure, the left side of the lifting clamp is provided with the substrate pushing structure, the lower side of the lifting clamp is provided with the magazine feeding conveying track, and the upper side of the magazine feeding conveying track is provided with the empty magazine buffer platform.

[0009] Optionally, the substrate conveying track comprises a substrate conveying gripper, a substrate track width adjusting mechanism, a substrate suction platform, a suction platform height adjusting mechanism, a transfer platform and a chip bottom vision, the left end of the top of the substrate suction platform is provided with the substrate conveying gripper, the left front end of the top of the substrate suction platform is provided with the substrate track width adjusting mechanism, the top of the substrate suction platform and the front end of the substrate track width adjusting mechanism are provided with the suction platform height adjusting mechanism, the right front end of the top of the substrate suction platform is provided with the transfer platform, and the top of the substrate suction platform and the right end of the transfer platform are provided with the chip bottom vision.

[0010] Optionally, the dispensing module is a double dispensing head structure, comprising an XYZ three-axis driving module, a dispensing vision, a dispensing head and a laser height measuring structure, the front end of the XYZ three-axis driving module is provided with the laser height measuring structure, the left end of the laser height measuring structure is provided with the dispensing vision, the right end of the laser height measuring structure is provided with the dispensing head, the binding vision comprises an XY two-axis driving module and a variable magnification vision system, and the XY two-axis driving module is located at the rear end of the variable magnification vision system.

[0011] Optionally, the binding module comprises an XYZ three-axis driving module and a binding head assembly, the XYZ three-axis driving module is arranged at the rear end of the binding head assembly, the pickup module and the transfer table vision comprise an arm swing pickup head, a wafer vision and a transfer table top vision, the rear end of the arm swing pickup head is provided with the transfer table top vision, and the front end of the arm swing pickup head is provided with the wafer vision.

[0012] Optionally, the substrate feeding module comprises a magazine feeding conveying track, a full magazine buffer platform and a lifting gripper, the rear end of the magazine feeding conveying track is provided with the lifting gripper, and the front end of the lifting gripper is provided with the full magazine buffer platform.

[0013] Optionally, the wafer module comprises an XY two-axis driving module, a wafer tensioning mechanism and a wafer feeding and discharging gripper, the right end of the wafer tensioning mechanism is provided with the XY two-axis driving module, and the rear end of the wafer tensioning mechanism is provided with the wafer feeding and discharging gripper.

[0014] Optionally, the pin module comprises an XYZ three-axis driving module and a pin assembly, and the XYZ three-axis driving module is arranged at the right side of the pin assembly.

[0015] Optionally, the wafer feeding module comprises a Z-axis driving module, a wafer magazine and an anti-collision assembly, the right side of the Z-axis driving module is provided with the anti-collision assembly, and the right side of the anti-collision assembly is provided with the wafer magazine.

[0016] The above technical solutions provided by the embodiments of the present application have the following advantages compared with the prior art:

[0017] The embodiment of the application sets the substrate feeding module, the worker puts the substrate magazine into the magazine feeding conveying track, the conveying belt conveys the magazine to the lifting clamp, the lifting clamp clamps the magazine, and the lifting clamp rises to the pushing position of the substrate pushing structure, the substrate pushing structure pushes the substrate to the substrate conveying track, and when the substrate in the magazine is used up, the lifting clamp places the empty magazine on the empty magazine buffer platform, and the worker takes away the empty magazine.

[0018] The substrate conveying track is set, the substrate is pushed to the conveying track by the feeding module, the substrate is clamped by the substrate conveying clamp, the substrate is transplanted to the substrate position, the corresponding track width is adjusted by the substrate track width adjusting mechanism according to different widths of the substrate, the substrate is sucked and fixed by the substrate suction platform after being transplanted to the working position, the height of the suction platform is adjusted by the suction platform height adjusting mechanism, the transfer platform is used for temporarily storing the chip taken out from the wafer by the pickup head, and the bottom vision is used for visually detecting the bottom of the chip before the chip is bound and can also be used for bottom vision positioning.

[0019] The dispensing module is set, the substrate suction platform sucks and fixes the substrate after the substrate is conveyed to the position by the substrate conveying clamp, the laser height measuring mechanism tests the height of the substrate from the dispensing needle, the dispensing vision visually positions the dispensing position, dispensing is performed after positioning is completed, the dispensing vision takes a photo of the glue path to detect whether the dispensing is qualified, the binding vision is set, and the variable magnification vision system can adjust the magnification according to different chip sizes to achieve the best visual resolution effect.

[0020] The binding module is set, the binding head assembly includes a chip suction nozzle, a rotating shaft and a binding Z-axis, the chip suction nozzle sucks the chip from the transfer platform and binds the chip to the substrate, the rotating shaft is used for adjusting the angle of the chip, and the binding Z-axis is used for controlling the pressure when the chip is bound, the pickup module and the transfer platform vision are set, the wafer vision takes a photo of the chip on the wafer film to position the chip, the swing arm pickup head sucks the chip on the film and places the chip on the transfer platform, and the top vision of the transfer platform takes a photo of the chip on the transfer platform to position the chip, so that the binding head assembly accurately moves to the material taking position to take the material.

[0021] The substrate unloading module is set, the worker puts the substrate magazine into the magazine feeding conveying track, the conveying belt conveys the magazine to the lifting clamp, the lifting clamp clamps the magazine, and the lifting clamp rises to the substrate conveying track height, the substrate conveying clamp sends the substrate into the magazine, when the substrate in the magazine is full, the lifting clamp places the full magazine on the full magazine buffer platform, and the worker takes away the full magazine, the wafer module is set, the wafer tensioning mechanism is composed of a wafer pressing plate and a tensioning ring lifting part, when the wafer pressing plate rises to the highest position and the tensioning ring descends to the lowest position, the wafer feeding and taking clamp can put the wafer into or take the wafer out of the wafer box, after the wafer feeding and taking clamp takes the wafer out and puts the wafer into the tensioning position, the wafer pressing plate descends and the tensioning ring rises to realize tensioning of the wafer film, so that the suction nozzle of the pickup head can suck the chip from the film.

[0022] The top pin module is provided, and the top pin assembly is composed of a top pin driving motor, a top pin driving cam, a top pin, a top pin cap and a vacuum system. The XYZ three-axis driving module moves the top pin assembly to a working position to make the top pin cap tightly contact the wafer film. The vacuum opens the top pin cap to tightly suck the film. The driving motor rotates, and the top pin driving cam converts the rotary motion of the motor into the up-down motion of the top pin to realize the lifting of the chip from the film, thereby facilitating the separation of the chip from the film.

[0023] The wafer loading module is provided. The wafer ring is placed in a wafer box. The Z-axis driving module drives the lifting motion of the box. After moving to the set position, the wafer loading and unloading are realized by the wafer in-out clamping jaw. The anti-collision assembly prevents the collision between the box and the wafer module, so that the substrate automatic loading and unloading, automatic drawing glue, wafer plate automatic loading and unloading, automatic picking chip and secondary positioning, visual positioning, automatic binding chip can be realized, and the chip automatic bonding can be realized. The variable magnification vision system can be compatible with different sizes of chips, and the binding head pressure is controllable, so that the bonding quality can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] The drawings incorporated into the specification and constituting a part of the specification show embodiments consistent with the present application and, together with the specification, serve to explain the principles of the present application.

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiment or prior art description will be briefly introduced below. Obviously, for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0026] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings, which do not constitute a limitation on the embodiments. The elements with the same reference numerals in the drawings represent similar elements, unless otherwise specified. The drawings in the drawings do not constitute a proportional limitation.

[0027] Figure 1 It is a three-dimensional structural schematic view of the die bonding machine of the present application;

[0028] Figure 2 It is a three-dimensional structural schematic view of the functional assembly of the present application;

[0029] Figure 3 It is a three-dimensional structural schematic view of the substrate loading module of the present application;

[0030] Figure 4 It is a three-dimensional structural schematic view of the substrate carrying track of the present application;

[0031] Figure 5A three-dimensional structure schematic view of the dispensing module of the utility model is shown in the figure;

[0032] Figure 6 A three-dimensional structure schematic view of the binding vision of the utility model is shown in the figure;

[0033] Figure 7 A three-dimensional structure schematic view of the binding module of the utility model is shown in the figure;

[0034] Figure 8 A three-dimensional structure schematic view of the pickup module and the transfer table vision of the utility model is shown in the figure;

[0035] Figure 9 A three-dimensional structure schematic view of the substrate blanking module of the utility model is shown in the figure;

[0036] Figure 10 A three-dimensional structure schematic view of the wafer module of the utility model is shown in the figure;

[0037] Figure 11 A three-dimensional structure schematic view of the thimble module of the utility model is shown in the figure;

[0038] Figure 12 A three-dimensional structure schematic view of the wafer feeding module of the utility model is shown in the figure.

[0039] Mark explanation:

[0040] Rack cover 1, functional assembly 2, substrate feeding module 2-1, magazine feeding conveying track 2-1-1, empty magazine buffer platform 2-1-2, lifting clamping jaw 2-1-3, substrate pushing structure 2-1-4, substrate carrying track 2-2, substrate carrying clamping jaw 2-2-1, substrate track width adjusting mechanism 2-2-2, substrate adsorption platform 2-2-3, adsorption platform height adjusting mechanism 2-2-4, transfer platform 2-2-5, chip bottom vision 2-2-6, dispensing module 2-3, XYZ three-axis driving module 2-3-1, dispensing vision 2-3-2, dispensing head 2-3-3, laser height measuring structure 2-3-4, binding vision 2-4, XY two-axis driving module 2-4-1, variable magnification vision system 2-4-2, binding module 2-5, XYZ three-axis driving module 2-5-1, binding head assembly 2-5-2, picking module and transfer table vision 2-6, swing arm picking head 2-6-1, wafer vision 2-6-2, transfer table top vision 2-6-3, substrate unloading module 2-7, magazine feeding conveying track 2-7-1, full magazine buffer platform 2-7-2, lifting clamping jaw 2-7-3, wafer module 2-8, XY two-axis driving module 2-8-1, wafer tensioning mechanism 2-8-2, wafer in-out clamping jaw 2-8-3, thimble module 2-9, XYZ three-axis driving module 2-9-1, thimble assembly 2-9-2, wafer feeding module 2-10, Z-axis driving module 2-10-1, wafer magazine 2-10-2, anti-collision assembly 2-10-3. DETAILED DESCRIPTION

[0041] In order to make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, any other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0042] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. For the purpose of simplicity, the description of each of the specific examples will be presented in the following description with reference made to the attached drawings. It is noted that these are merely examples and are not intended to limit the application in any way. Furthermore, the present application can repeat reference numerals and / or letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or configurations discussed.

[0043] For the convenience of description, spatial relative terms can be used in the specification to describe the relative position relationship or movement condition of one element or feature with respect to another element or feature as shown in the drawings, such as "inner", "outer", "inboard", "outboard", "under", "below", "on", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over or the posture is changed or the movement state is changed, the directional indications will also change accordingly, for example: the element described as "under" or "below" another element or feature will be oriented as "above" or "above" another element or feature. Therefore, the example term "below" can include both up and down positions. The device can be additionally oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used in the specification are interpreted accordingly.

[0044] Figures 1-12 A die bonder provided for the embodiment of the present application comprises a rack cover 1 and a functional assembly 2, the functional assembly 2 is arranged on the top of the rack cover 1, and the functional assembly 2 comprises a substrate feeding module 2-1, a substrate conveying track 2-2, a dispensing module 2-3, a binding vision 2-4, a binding module 2-5, a pickup module and a transfer station vision 2-6, a substrate unloading module 2-7, a wafer module 2-8, a pin module 2-9 and a wafer feeding module 2-10.

[0045] Further, the right side of the substrate feeding module 2-1 is provided with the substrate conveying track 2-2, the right side of the substrate conveying track 2-2 is provided with the dispensing module 2-3, the right side of the dispensing module 2-3 is provided with the binding vision 2-4, the right side of the binding vision 2-4 is provided with the binding module 2-5, the front of the binding module 2-5 is provided with the pickup module and the transfer station vision 2-6, the right side of the binding module 2-5 is provided with the substrate unloading module 2-7, the front end of the substrate unloading module 2-7 is provided with the wafer feeding module 2-10, the left side of the wafer feeding module 2-10 is provided with the pin module 2-9, and the left side of the pin module 2-9 is provided with the wafer module 2-8.

[0046] Please refer to Figure 3, the substrate loading module 2-1 includes a magazine feeding track 2-1-1, an empty magazine buffer platform 2-1-2, a lifting clamp 2-1-3, and a substrate pushing structure 2-1-4, the left side of the lifting clamp 2-1-3 is provided with the substrate pushing structure 2-1-4, the lower side of the lifting clamp 2-1-3 is provided with the magazine feeding track 2-1-1, and the upper side of the magazine feeding track 2-1-1 is provided with the empty magazine buffer platform 2-1-2, the substrate magazine is put into the magazine feeding track 2-1-1 by artificial, the magazine is conveyed to the position by the conveying belt, then the lifting clamp 2-1-3 clamps the magazine and rises to the pushing position, the substrate is pushed out to the substrate conveying track 2-2 by the substrate pushing structure 2-1-4, and when the substrate in the magazine is used up, the empty magazine is placed on the empty magazine buffer platform 2-1-2 by the lifting clamp 2-1-3 and taken away by artificial.

[0047] Please refer to Figure 4 , the substrate conveying track 2-2 includes a substrate conveying clamp 2-2-1, a substrate track width adjusting mechanism 2-2-2, a substrate adsorption platform 2-2-3, an adsorption platform height adjusting mechanism 2-2-4, a transfer platform 2-2-5, and a chip bottom vision 2-2-6, the left end of the top of the substrate adsorption platform 2-2-3 is provided with the substrate conveying clamp 2-2-1, the left front end of the top of the substrate adsorption platform 2-2-3 is provided with the substrate track width adjusting mechanism 2-2-2, the top of the substrate adsorption platform 2-2-3 and the front end of the substrate track width adjusting mechanism 2-2-2 are provided with the adsorption platform height adjusting mechanism 2-2-4, the right front end of the top of the substrate adsorption platform 2-2-3 is provided with the transfer platform 2-2-5, and the top of the substrate adsorption platform 2-2-3 and the right end of the transfer platform 2-2-5 are provided with the chip bottom vision 2-2-6, the substrate is pushed to the conveying track by the loading module, then the substrate is clamped and moved by the substrate conveying clamp 2-2-1, the corresponding track width is adjusted by the substrate track width adjusting mechanism 2-2-2 according to the substrate of different widths, the substrate is moved to the working position, then the substrate is adsorbed and fixed by the substrate adsorption platform 2-2-3, the adsorption platform height is adjusted by the adsorption platform height adjusting mechanism 2-2-4, the transfer platform 2-2-5 is used for temporarily storing the chip taken out from the wafer by the pick-up head, and the chip bottom vision 2-2-6 is used for visually detecting the chip bottom before the chip is bound and can also be used for bottom vision positioning.

[0048] Please refer to Figure 5The utility model discloses a double point glue head structure, including XYZ three -axis drive module 2 3 1, point glue vision 2 3 2, point glue head 2 3 3 and laser height measuring structure 2 3 4, the front end of XYZ three -axis drive module 2 3 1 is provided with laser height measuring structure 2 3 4, the left end of laser height measuring structure 2 3 4 is provided with point glue vision 2 3 2, the right end of laser height measuring structure 2 3 4 is provided with point glue head 2 3 3, after the substrate is carried to the position by substrate handling clamp jaw 2 2 1, substrate suction platform 2 2 3 will substrate suction flat and fixed, laser height measuring mechanism 2 3 4 tests substrate distance point glue needle height, point glue vision 2 3 2 carries out visual positioning to point glue position, after positioning, carry out point glue, after point glue, point glue vision 2 3 2 detects whether point glue is qualified or not by taking photo to glue road, and the binding vision 2 4 includes XY two -axis drive module 2 4 1 and variable magnification vision system 2 4 2, and XY two -axis drive module 2 4 1 is located at the rear end of variable magnification vision system 2 4 2, and the variable magnification vision system can adjust magnification according to different chip size and reach the best visual resolution effect.

[0049] Further, the binding module 2 5 includes XYZ three -axis drive module 2 5 1 and binding head assembly 2 5 2, and the XYZ three -axis drive module 2 5 1 is arranged at the rear end of the binding head assembly 2 5 2, and the binding head assembly 2 5 2 includes a chip suction nozzle, a rotating shaft and a binding Z-axis, the chip suction nozzle sucks the chip from the transfer table and binds the chip to the substrate, the rotating shaft is used for adjusting the angle of the chip, and the binding Z-axis is used for controlling the pressure when the chip is bound.

[0050] Please refer to Figure 9, the substrate blanking module 2-7 includes a magazine feeding conveying track 2-7-1, a full magazine buffer platform 2-7-2 and a lifting clamp 2-7-3, the rear end of the magazine feeding conveying track 2-7-1 is provided with the lifting clamp 2-7-3, and the front end of the lifting clamp 2-7-3 is provided with the full magazine buffer platform 2-7-2, the substrate magazine is manually placed into the magazine feeding conveying track 2-7-1, the magazine is conveyed to the position by the conveying belt, the magazine is clamped and lifted to the substrate conveying track height by the lifting clamp 2-7-3, the substrate is sent into the magazine by the substrate carrying clamp 2-2-1, and when the substrate in the magazine is full, the full magazine is placed on the full magazine buffer platform 2-7-2 by the lifting clamp 2-7-3 and is manually taken away.

[0051] Please refer to Figure 10 , the wafer module 2-8 includes an XY two-axis driving module 2-8-1, a wafer tensioning mechanism 2-8-2 and a wafer feeding and discharging clamp 2-8-3, the right end of the wafer tensioning mechanism 2-8-2 is provided with the XY two-axis driving module 2-8-1, and the rear end of the wafer tensioning mechanism 2-8-2 is provided with the wafer feeding and discharging clamp 2-8-3, the wafer tensioning mechanism 2-8-2 is composed of a wafer pressing plate and a tensioning ring lifting part, when the wafer pressing plate is lifted to the highest tensioning ring and is lowered to the lowest, the wafer feeding and discharging clamp 2-8-3 can put or take the wafer into or out of the wafer magazine, after the wafer feeding and discharging clamp 2-8-3 takes or puts the wafer into the tensioning position, the wafer pressing plate is lowered and the tensioning ring is lifted to realize the tensioning of the wafer film, so that the suction nozzle of the pick-up head can suck the chip from the film.

[0052] Please refer to Figure 11 , the ejector pin module 2-9 includes an XYZ three-axis driving module 2-9-1 and an ejector pin assembly 2-9-2, and the XYZ three-axis driving module 2-9-1 is arranged at the right side of the ejector pin assembly 2-9-2, the ejector pin assembly 2-9-2 is composed of an ejector pin driving motor, an ejector pin driving cam, an ejector pin, an ejector pin cap and a vacuum system, the XYZ three-axis driving module 2-9-1 moves the ejector pin assembly to the working position to make the ejector pin cap tightly contact the wafer film, the vacuum opens the ejector pin cap to tightly suck the film, the driving motor rotates, the ejector pin driving cam converts the rotary motion of the motor into the up-down motion of the ejector pin to realize the lifting of the chip from the film, so that the chip is separated from the film.

[0053] Please refer to Figure 12The wafer feeding module 2-10 includes a Z-axis driving module 2-10-1, a wafer magazine 2-10-2 and a collision prevention assembly 2-10-3. The collision prevention assembly 2-10-3 is arranged on the right side of the Z-axis driving module 2-10-1, and the wafer magazine 2-10-2 is arranged on the right side of the collision prevention assembly 2-10-3. A wafer ring is placed in the wafer magazine 2-10-2. The Z-axis driving module 2-10-1 drives the wafer magazine to move up and down. When the wafer magazine moves to a set position, the wafer feeding and taking gripper 2-8-3 is used to take and place the wafer ring. The collision prevention assembly 2-10-3 prevents the wafer magazine from colliding with the wafer module 2-8.

[0054] In the above embodiments, the description of each embodiment focuses on different aspects. The parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0055] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, and are only used for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0056] In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0057] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood broadly, for example, it can be connected, or detachable, or integrated; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0058] In the present application, unless specifically defined otherwise, the expression "on" or "under" of a first feature with respect to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the expression "on", "above" and "over" of a first feature with respect to a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The expression "under", "below" and "underneath" of a first feature with respect to a second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0059] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific feature, structure, material or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In the present specification, the illustrative expression of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific feature, structure, material or characteristic described can be combined in any one or more embodiments or examples in a suitable manner. In addition, a person skilled in the art can combine and combine different embodiments or examples described in the present specification.

[0060] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, these modifications and variations of the present application, which are within the scope of the claims of the present application and their equivalents, are intended to be included in the present application.

[0061] The above is a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A die bonder, characterized by: The device comprises a rack cover and functional components arranged on the top of the rack cover, and the functional components include a substrate feeding module, a substrate conveying track, a dispensing module, a binding vision, a binding module, a pickup module and a transfer station vision, a substrate discharging module, a wafer module, a pin module and a wafer feeding module.

2. The die bonder of claim 1, wherein: The right side of the substrate feeding module is provided with the substrate conveying track, the right side of the substrate conveying track is provided with the dispensing module, the right side of the dispensing module is provided with the binding vision, the right side of the binding vision is provided with the binding module, the front of the binding module is provided with the pickup module and the transfer station vision, the right side of the binding module is provided with the substrate discharging module, the front end of the substrate discharging module is provided with the wafer feeding module, the left side of the wafer feeding module is provided with the pin module, and the left side of the pin module is provided with the wafer module.

3. The die bonder of claim 1, wherein: The substrate feeding module comprises a magazine feeding conveying track, an empty magazine buffer platform, a lifting clamp and a substrate pushing structure, the left side of the lifting clamp is provided with the substrate pushing structure, the lower side of the lifting clamp is provided with the magazine feeding conveying track, and the upper side of the magazine feeding conveying track is provided with the empty magazine buffer platform.

4. The die bonder of claim 1, wherein: The substrate conveying track comprises a substrate conveying clamp, a substrate track width adjusting mechanism, a substrate adsorption platform, an adsorption platform height adjusting mechanism, a transfer platform and a chip bottom vision, the left end of the top of the substrate adsorption platform is provided with the substrate conveying clamp, the left front end of the top of the substrate adsorption platform is provided with the substrate track width adjusting mechanism, the top of the substrate adsorption platform and located at the front end of the substrate track width adjusting mechanism is provided with the adsorption platform height adjusting mechanism, the right front end of the top of the substrate adsorption platform is provided with the transfer platform, and the top of the substrate adsorption platform and located at the right end of the transfer platform is provided with the chip bottom vision.

5. The die bonder of claim 1, wherein: The dispensing module is a double dispensing head structure, comprising an XYZ three-axis driving module, a dispensing vision, a dispensing head and a laser height measuring structure, the front end of the XYZ three-axis driving module is provided with the laser height measuring structure, the left end of the laser height measuring structure is provided with the dispensing vision, and the right end of the laser height measuring structure is provided with the dispensing head.

6. The die bonder of claim 1, wherein: The binding vision comprises an XY two-axis driving module and a variable magnification vision system, and the XY two-axis driving module is located at the rear end of the variable magnification vision system.

7. The die bonder of claim 1, wherein: The binding module comprises an XYZ three-axis driving module and a binding head assembly, the XYZ three-axis driving module is arranged at the rear end of the binding head assembly, the pickup module and the transfer station vision comprise an arm pickup head, a wafer vision and a transfer station top vision, the rear end of the arm pickup head is provided with the transfer station top vision, and the front end of the arm pickup head is provided with the wafer vision.

8. The die bonder of claim 1, wherein: The substrate discharging module comprises a magazine feeding conveying track, a full magazine buffer platform and a lifting clamp, the rear end of the magazine feeding conveying track is provided with the lifting clamp, and the front end of the lifting clamp is provided with the full magazine buffer platform. The wafer module comprises an XY two-axis driving module, a wafer tensioning mechanism and a wafer in-out clamp, the right end of the wafer tensioning mechanism is provided with the XY two-axis driving module, and the rear end of the wafer tensioning mechanism is provided with the wafer in-out clamp.

9. The die bonder of claim 1, wherein: The ejector needle module comprises an XYZ three-axis driving module and an ejector needle assembly, and the XYZ three-axis driving module is arranged at the right side of the ejector needle assembly.

10. The die bonder of claim 1, wherein: The wafer feeding module comprises a Z-axis driving module, a wafer magazine and a collision prevention assembly, the right side of the Z-axis driving module is provided with the collision prevention assembly, and the right side of the collision prevention assembly is provided with the wafer magazine.

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