Earphone jack sealing test tool and test equipment

Abstract

The utility model relates to an earphone hole sealing test tool and test equipment. In the tool, a supporting seat supports an earphone to be tested; the sealing module comprises at least one sealing module, the sealing module is provided with a flexible part, and the flexible part is used for sealing a corresponding microphone hole of the earphone to be tested; the fixing module is used for abutting against the to-be-tested earphone so as to fix the to-be-tested earphone, thereby achieving the fixation of the to-be-tested earphone and the efficient sealing of the microphone hole of the to-be-tested earphone, and facilitating the air tightness test of the to-be-tested earphone. According to the application, the to-be-tested earphone is fixed by arranging the supporting seat, and the to-be-tested earphone is abutted through the fixing module, so that the to-be-tested earphone is fixed, and the to-be-tested earphone is prevented from generating displacement in a sealing test process; by arranging the sealing module and sealing the microphone hole of the to-be-tested earphone through the flexible part of the sealing module, the microphone hole formed in the cambered surface of the shell can be effectively sealed, the installation convenience of sealing the microphone hole of the to-be-tested earphone is improved, and the test efficiency and the test reliability are improved.

Description

Technical Field

[0001] This application relates to the field of headphone technology, and in particular to a headphone jack sealing test fixture and test equipment. Background Technology

[0002] With the development of headphone technology, headphone types have become increasingly diverse, and headphones have become an indispensable part of our daily lives. The microphone jack, also known as the MIC jack, is a small hole on the headphone used to receive sound signals. It transmits external sound through the microphone jack to the microphone inside the headphone, where the sound signal is converted into an electrical signal for processing user calls or recordings.

[0003] Currently, the microphone is usually located on the curved surface of the headphone shell. In existing tests for the airtightness of the headphone microphone, it is difficult to seal and fix the microphone. The poor sealing of the microphone during the test results in low test efficiency and low test reliability. Utility Model Content

[0004] Based on this, a testing fixture and testing equipment for testing the sealing of headphone jacks are provided.

[0005] Firstly, this application provides a headphone jack sealing test fixture, comprising:

[0006] Support base, used to support the earphone under test;

[0007] A sealing module, comprising at least one sealing module, wherein the sealing module is provided with a flexible element for sealing the corresponding microphone of the earphone under test;

[0008] The fixing module is used to support the earphone under test and fix it in place.

[0009] In one embodiment, the support base is provided with a limiting groove, which is used to limit the headphone stem of the headphone to be tested.

[0010] In one embodiment, the fixing module is provided with a rotating rod and a fixing member;

[0011] The fixing component is set on the rotating rod, which drives the fixing component to rotate, so that the fixing component is inserted into the limiting groove to fix the headphone rod.

[0012] In one embodiment, the headphone jack sealing test fixture also includes a support plate;

[0013] The support base is mounted on the support plate, which is used to adjust the tilt angle of the support base.

[0014] In one embodiment, the fixing module further includes a first driving module;

[0015] The first drive module is connected to the rotating rod and is used to drive the rotating rod to rotate.

[0016] In one embodiment, the sealing module includes a connecting block;

[0017] The flexible component is located in the connecting block, which is used to move the flexible component so that it abuts against the corresponding microphone of the earphone under test to seal the corresponding microphone of the earphone under test.

[0018] In one embodiment, the sealing module further includes a second drive module;

[0019] The second drive module is connected to the connecting block and is used to drive the connecting block to move.

[0020] In one embodiment, the headphone jack sealing test fixture further includes a signal acquisition unit, and the support base further includes a first through hole;

[0021] The signal acquisition unit is configured with a corresponding first through hole, which is used to insert the sound output end of the earphone under test so that the signal acquisition unit can receive the sound signal output from the sound output end of the earphone under test.

[0022] In one embodiment, the headphone jack sealing test fixture also includes a base;

[0023] The support base, sealing module, and fixing module are mounted on the base.

[0024] Secondly, this application provides a headphone jack sealing test device, including a controller and a headphone jack sealing test fixture as described in any of the above, wherein the controller is connected to the headphone jack sealing test fixture.

[0025] One of the above technical solutions has the following advantages and beneficial effects:

[0026] The aforementioned headphone jack sealing test fixture includes a support base, a sealing module, and a fixing module. The support base supports the headphone under test; the sealing module includes at least one sealing element with a flexible component for sealing the corresponding microphone hole of the headphone under test; the fixing module abuts against the headphone under test to fix it, thus achieving both fixation and efficient sealing of the microphone hole for airtightness testing. This application uses a support base to fix the headphone under test and a fixing module to abut against it, preventing displacement during the sealing test. By using a sealing module with its flexible component to seal the microphone hole, the fixture effectively seals the microphone hole on the curved surface of the housing, improving the ease of installation, enhancing the sealing performance during testing, and increasing testing efficiency and reliability. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the first orientation structure of the headphone jack sealing test fixture in an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of the second direction structure of the headphone jack sealing test fixture in an embodiment of this application;

[0029] Figure 3 for Figure 2 Enlarged structural diagram at point A;

[0030] Figure 4 This is a schematic diagram of the second structure of the headphone jack sealing test fixture in the embodiments of this application.

[0031] Figure label:

[0032] 10. Support base; 110. Limiting groove; 120. First through hole; 20. Sealing module; 200. Sealing module; 210. Flexible component; 220. Connecting block; 230. Second drive module; 30. Fixing module; 310. Rotating rod; 320. Fixing component; 330. First drive module; 40. Support plate; 50. Signal collector; 60. Base. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover inclusions not explicitly listed. For example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0036] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0037] In addition, the term "multiple" should mean two or more.

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0039] In one embodiment, such as Figure 1 and Figure 4 As shown, a headphone jack sealing test fixture is provided, including a support base 10, a sealing module 20, and a fixing module 30. The support base 10 is used to support the headphone under test; the sealing module 20 includes at least one sealing module 200, and the sealing module 200 is provided with a flexible element 210, which is used to seal the corresponding microphone hole of the headphone under test; the fixing module 30 is used to abut against the headphone under test to fix the headphone under test.

[0040] The earphone under test refers to a wireless earphone, such as a Bluetooth earphone, an infrared earphone, or a 2.4G earphone. The earphone housing has a microphone port, and a microphone is located inside the housing. The microphone is positioned corresponding to the microphone port, enabling the microphone to collect external sound signals and perform signal conversion processing. The earphone housing has one or more microphone ports; for example, the earphone housing has two microphone ports, located on the curved surface of the earphone housing. For instance, the earphone may consist of an earphone stem and an earphone head, with the stem connected to the head. The outer surface of the stem is a regular or irregular curved surface, and the outer surface of the head is also a regular or irregular curved surface. One microphone port may be located near the first end of the stem, and the other near the second end.

[0041] The support base 10 is used to support the earphone under test. The support base 10 can be made of metal or non-metal. The fixing module 30 can be used to apply pressure to the earphone under test, thereby fixing the earphone under test. For example, when the earphone under test is placed on the support base 10, the fixing module 30 moves downward so that it abuts against the earphone under test, thereby fixing the earphone under test.

[0042] The sealing module 20 may include at least one sealing module 200, the number of which is determined by the number of microphones in the earphone under test. For example, if the earphone under test has two microphones, then the sealing module 20 includes two sealing modules 200. The sealing module 200 is provided with a flexible member 210, which is a component made of a flexible material. The flexible member 210 can deform under pressure; it is also an elastic component that can recover its deformation when released from pressure. For example, the flexible member 210 may be soft silicone.

[0043] By abutting the flexible part 210 of the sealing module 200 against the corresponding pore of the earphone under test, the flexible part 210 can completely seal the pores on the arc surface of different angles, so as to conduct an airtightness test on the pore of the earphone under test and avoid inaccurate airtightness test results due to poor sealing stability of the pore of the earphone under test.

[0044] In the above embodiments, the support base 10 is used to support the earphone under test; the sealing module 20 includes at least one sealing module 200, the sealing module 200 is provided with a flexible element 210, the flexible element 210 is used to seal the corresponding microphone of the earphone under test; the fixing module 30 is used to abut against the earphone under test to fix the earphone under test, thereby achieving the fixation of the earphone under test and the efficient sealing of the microphone of the earphone under test, so as to perform airtightness testing on the earphone under test. This application fixes the earphone under test by setting the support base 10 and abuts against the earphone under test by the fixing module 30, thereby achieving the fixation of the earphone under test and avoiding displacement during the sealing test of the earphone under test; by setting the sealing module 20 and sealing the microphone of the earphone under test by the flexible element 210 of the sealing module 20, the microphone set on the arc surface of the shell can be effectively sealed, improving the installation convenience of the microphone sealing of the earphone under test, improving the sealing performance of the earphone microphone during the test, and improving the test efficiency and test reliability.

[0045] In one embodiment, such as Figure 1 and Figure 3 As shown, the support base 10 is provided with a limiting groove 110, which is used to limit the headphone stem of the headphone to be tested.

[0046] The limiting groove 110 can be a recess, which can limit the position of the earphone stem of the earphone under test. For example, the earphone under test is placed horizontally on the support base 10, and the earphone stem of the earphone under test is located in the limiting groove 110 so that the fixing module 30 abuts and fixes the earphone stem of the earphone under test.

[0047] In one embodiment, the fixing module 30 is provided with a rotating rod 310 and a fixing member 320; the fixing member 320 is disposed on the rotating rod 310, and the rotating rod 310 is used to drive the fixing member 320 to rotate, so that the fixing member 320 is inserted into the limiting groove 110 to fix the earphone rod.

[0048] The fixing component 320 can be a plastic part, such as a hard silicone material, so that it can securely hold the headphone stem of the earphone under test and prevent the earphone from moving during the test. In another example, the fixing surface of the fixing component 320 can be provided with a cushioning pad to prevent the fixing component 320 from scratching the earphone under test when it abuts against the headphone stem.

[0049] The rotating rod 310 can be used to drive the fixing member 320 to rotate, thereby causing the fixing member 320 to apply pressure to the earphone stem of the earphone under test, achieving the abutment and fixation of the earphone under test. For example, the rotation angle of the rotating rod 310 can be from 0 to 90 degrees. When an airtightness test is required on the earphone under test, the earphone under test is placed on the support base 10, and the earphone stem of the earphone under test is limited in the limiting groove 110. The fixing member 320 is rotated by the rotating rod 310, so that the fixing member 320 abuts against the earphone stem of the earphone under test, thereby fixing the earphone stem of the earphone under test, so that the corresponding microphone of the earphone under test can be sealed by the flexible member 210 on the sealing module 200. After the airtightness test of the microphone of the earphone under test is completed, the flexible member 210 on the sealing module 200 is disengaged from the corresponding microphone of the earphone under test, and the fixing member 320 is disengaged from the earphone stem of the earphone under test by the rotating rod 310, so that the earphone under test can be taken out after the test is completed. This improves the ease of installation of the microphone seal of the earphone under test and improves the efficiency of the earphone microphone seal test.

[0050] In one embodiment, such as Figure 1 As shown, the headphone jack sealing test fixture also includes a support plate 40; a support seat 10 is disposed on the support plate 40, and the support plate 40 is used to adjust the tilt angle of the support seat 10.

[0051] The support plate 40 can be made of metal or non-metal. The support plate 40 supports the support base 10 and also adjusts the tilt angle of the support base 10. For example, the support base 10 can be mounted on the support plate 40 by screws or other means. By adjusting the tilt angle of the support plate 40, the tilt angle of the support base 10 can be adjusted, thus enabling pore sealing tests on headphones of different shapes and sizes, improving the versatility of the testing fixture.

[0052] In one embodiment, such as Figure 1 As shown, the fixing module 30 also includes a first driving module 330; the first driving module 330 is connected to the rotating rod 310 and is used to drive the rotating rod 310 to rotate.

[0053] The first drive module 330 can be a motor module. The first end of the rotating rod 310 is connected to the first drive module 330, and the second end of the rotating rod 310 is provided with a fixing member 320. When the earphone to be tested needs to be airtight, the earphone to be tested is placed on the support base 10, and the earphone stem of the earphone to be tested is limited in the limiting groove 110. The first drive module 330 drives the rotating rod 310 to rotate, and the rotating rod 310 drives the fixing member 320 to rotate, so that the fixing member 320 abuts against the earphone stem of the earphone to be tested, thereby realizing the airtightness test of the earphone to be tested. The earphone stem of the device is fixed so that the corresponding microphone hole of the earphone under test can be sealed by the flexible part 210 on the sealing module 200. After the airtightness test of the microphone hole of the earphone under test is completed, the flexible part 210 on the sealing module 200 is detached from the corresponding microphone hole of the earphone under test, and the rotating rod 310 is driven to rotate in the opposite direction by the first driving module 330. Then the rotating rod 310 drives the fixing part 320 to detach from the earphone stem of the earphone under test so that the earphone under test can be taken out after the test is completed. This improves the ease of installation of the microphone hole seal of the earphone under test and improves the efficiency of the earphone microphone hole seal test.

[0054] In one embodiment, such as Figure 1 As shown, the sealing module 200 includes a connecting block 220; a flexible member 210 is disposed on the connecting block 220, and the connecting block 220 is used to drive the flexible member 210 to move, so that the flexible member 210 abuts against the corresponding microphone of the earphone under test, so as to seal the corresponding microphone of the earphone under test.

[0055] The connecting block 220 is used to move the flexible component 210, and the first end of the connecting block 220 is provided with the flexible component 210. When the earphone under test needs to be tested for air tightness, the earphone under test is first placed on the support base 10 and fixed by the fixing module 30. Then, the connecting block 220 drives the flexible component 210 to move, so that the flexible component 210 abuts against the corresponding pore of the earphone under test, thereby effectively sealing the pore set on the arc surface of the shell, so as to conduct the air tightness test on the earphone under test. After the air tightness test of the pore of the earphone under test is completed, the connecting block 220 drives the flexible component 210 to move in the opposite direction, so that the flexible component 210 disengages from the corresponding pore of the earphone under test. Then, the fixing module 30 is disengaged from the earphone under test, so as to remove the earphone under test after the test is completed. This improves the ease of installation of the pore sealing of the earphone under test, and enhances the efficiency and reliability of the earphone pore sealing test.

[0056] In one embodiment, such as Figure 1 and Figure 2 As shown, the sealing module 200 also includes a second drive module 230; the second drive module 230 is connected to the connecting block 220 and is used to drive the connecting block 220 to move.

[0057] The second drive module 230 can be a cylinder, and the second drive module 230 is used to drive the connecting block 220 to move laterally.

[0058] For example, when an airtightness test is required on the earphone under test, the earphone under test is first placed on the support base 10 and fixed by the fixing module 30. Then, the connecting block 220 is moved by the second drive module 230, which in turn drives the flexible part 210 to move toward the corresponding pore of the earphone under test, so that the flexible part 210 abuts against the corresponding pore of the earphone under test, effectively sealing the pore set on the arc surface of the shell, so as to conduct an airtightness test on the earphone under test. After the airtightness test of the pore of the earphone under test is completed, the connecting block 220 is moved in the opposite direction by the second drive module 230, which in turn drives the flexible part 210 to move in the opposite direction, so that the flexible part 210 is disengaged from the corresponding pore of the earphone under test. Then, the fixing module 30 is disengaged from the earphone under test, so that the tested earphone can be taken out. This improves the ease of installation of the pore sealing of the earphone under test, and enhances the efficiency and reliability of the earphone pore sealing test.

[0059] In one embodiment, such as Figure 1 As shown, the headphone jack sealing test fixture also includes a signal acquisition unit 50, and the support base 10 also includes a first through hole 120; the signal acquisition unit 50 is set corresponding to the first through hole 120, and the first through hole 120 is used to insert the sound output end of the headphone under test, so that the signal acquisition unit 50 can receive the sound signal output from the sound output end of the headphone under test.

[0060] The signal acquisition unit 50 is used to acquire the sound signal from the output end of the headphone under test; the signal acquisition unit 50 determines the test result of the pore airtightness of the headphone under test based on the sound signal.

[0061] The first through hole 120 can be a circular hole. The signal acquisition device 50 can be positioned below the support base 10, with its acquisition end corresponding to the first through hole 120. This allows the sound output end of the earphone under test to be inserted into the first through hole 120, so that the sound output end of the earphone under test can be adjacent to the acquisition end of the signal acquisition device 50. For example, after the sound output end of the earphone under test is inserted into the first through hole 120, the sound output end of the earphone under test is in contact with the acquisition end of the signal acquisition device 50, further improving the accuracy of the sound signal acquisition from the sound output end of the earphone under test. In one example, the acquisition end of the signal acquisition device 50 can be in the shape of a groove, so that after the sound output end of the earphone under test is inserted into the first through hole 120, the sound output end of the earphone under test can be embedded in the acquisition end of the signal acquisition device 50, improving the sound signal acquisition effect.

[0062] In one embodiment, such as Figure 1 , Figure 2 and Figure 4 As shown, the headphone jack sealing test fixture also includes a base 60; the support base 10, the sealing module 20 and the fixing module 30 are disposed on the base 60.

[0063] The base 60 can be made of metal or non-metal and is used to support and mount the support base 10, the sealing module 20, and the fixing module 30. For example, the base 60 can be a plate-like structure, and the sealing module 20 and the fixing module 30 can be mounted on the base 60 by screwing. The support base 10 can be mounted on the base 60 indirectly, for example, by placing the support base 10 on a support plate 40, which is mounted on the base 60 by screwing or other means. This modular design of the test fixture facilitates its installation in the test equipment and improves the ease of test installation.

[0064] It should be noted that the support base 10, the sealing module 20 and the fixing module 30 form a set of test components. One or more sets of test components can be set on the base 60. For example, two sets of test components can be set on the base 60, so that two earphones under test can be tested simultaneously for pore sealing, thereby further improving the testing efficiency.

[0065] In one embodiment, a headphone jack sealing test device is also provided, including a controller and a headphone jack sealing test fixture as described in any of the above embodiments, wherein the controller is connected to the headphone jack sealing test fixture.

[0066] The specific description of the headphone jack sealing test fixture can be found in the above embodiment, and will not be repeated here.

[0067] The headphone jack sealing test fixture includes a support base, a sealing module, and a fixing module. A controller connects the sealing module and the fixing module. The controller can be used to control the fixing module to abut against the headphone under test, thereby fixing the headphone under test. The controller can also be used to control the flexible part of the sealing module to seal against the corresponding microphone of the headphone under test, thereby effectively sealing the microphone located on the arc surface of the housing, so as to conduct airtightness testing on the headphone under test. This application uses a support base to fix the headphone under test and controls the fixing module to abut against the headphone under test through the controller, thereby fixing the headphone under test and avoiding displacement during the sealing test. By setting up a sealing module and controlling the flexible part of the sealing module to seal the microphone of the headphone under test through the controller, the microphone located on the arc surface of the housing can be effectively sealed, improving the ease of installation of the headphone microphone seal, improving the sealing performance of the headphone microphone during the test, and enhancing the test efficiency and reliability.

[0068] It should be noted that the headphone jack sealing test equipment may also include components such as a display. The specific headphone jack sealing test equipment may include more components than those described in the above embodiments, or combine certain components, or have different component arrangements.

[0069] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A testing fixture for headphone jack sealing, characterized in that, include: A support base is provided for supporting the earphone under test. The support base is provided with a limiting groove for limiting the earphone stem of the earphone under test. A sealing module, comprising at least one sealing module, wherein the sealing module is provided with a flexible element for sealing the corresponding microphone hole of the earphone under test; A fixing module is used to abut against the earphone under test to fix the earphone under test.

2. The headphone jack sealing test fixture according to claim 1, characterized in that, The fixing module is equipped with a rotating rod and a fixing component; The fixing member is disposed on the rotating rod, and the rotating rod is used to drive the fixing member to rotate, so that the fixing member is inserted into the limiting groove to fix the earphone rod.

3. The headphone jack sealing test fixture according to claim 1, characterized in that, It also includes a support plate; The support base is disposed on the support plate, and the support plate is used to adjust the tilt angle of the support base.

4. The headphone jack sealing test fixture according to claim 2, characterized in that, The fixing module also includes a first driving module; The first drive module is connected to the rotating rod, and the first drive module is used to drive the rotating rod to rotate.

5. The headphone jack sealing test fixture according to claim 1, characterized in that, The sealing module includes a connecting block; The flexible component is disposed in the connecting block, and the connecting block is used to drive the flexible component to move, so that the flexible component abuts against the corresponding microphone of the earphone under test, so as to seal the corresponding microphone of the earphone under test.

6. The headphone jack sealing test fixture according to claim 5, characterized in that, The sealing module also includes a second drive module; The second drive module is connected to the connecting block, and the second drive module is used to drive the connecting block to move.

7. The headphone jack sealing test fixture according to claim 1, characterized in that, It also includes a signal acquisition device, and the support base also includes a first through hole; The signal acquisition device is configured with a first through hole, which is used to insert the sound output end of the earphone under test, so that the signal acquisition device can receive the sound signal output from the sound output end of the earphone under test.

8. The headphone jack sealing test fixture according to any one of claims 1 to 7, characterized in that, It also includes a base; The support base, the sealing module, and the fixing module are mounted on the base.

9. A testing device, characterized in that, It includes a controller and a headphone jack sealing test fixture as described in any one of claims 1 to 8, wherein the controller is connected to the headphone jack sealing test fixture.

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