Camera PCB capable of reducing coupling noise and improving image quality
By arranging power lines along the edge of the photosensitive area on the camera PCB board and using a shielding layer to shield the signal lines, the coupling noise problem of digital power supply to the sensor chip was solved, improving image quality and optimizing trace space.
Patent Information
- Application Number
- CN202520134602.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-20
AI Technical Summary
As the pixel count of mobile phone cameras increases, the power consumption of digital power supplies also increases, leading to increased coupling noise between the digital power supply and the sensor chip, resulting in poor image quality issues such as shadows and noise.
Power lines are arranged at the edge of the photosensitive area of the image sensor, and a shielding layer is used to shield signal line interference. The signal lines are placed in the inner layer to avoid the power lines crossing the photosensitive area. The power lines are connected through vias to reduce coupling noise.
It effectively reduces coupling noise, improves camera image quality, and balances wiring space and production efficiency.
Smart Images
Figure CN223859337U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a camera PCB board field, concretely relates to a camera PCB board of reducing coupling noise and improving picture quality. BACKGROUND
[0002] With the evolution of mobile phone camera to high pixel, compared with before, the digital power consumption is also higher and higher, the market mainstream mobile phone camera PCB board digital power supply wiring is under the PCB board surface layer circuit of sensor chip photosensitive area projection area, resulting in the coupling noise of digital power supply to sensor chip itself circuit is also more and more big, thereby the picture of camera product is easy to appear shadow, noise point and various picture quality defects. UTILIT Y MODEL CONTENT
[0003] The utility model intends to provide a camera PCB board of reducing coupling noise and improving picture quality, thereby reducing coupling noise and improving picture quality.
[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a camera PCB board of reducing coupling noise and improving picture quality, including surface layer, the surface layer is equipped with photosensitive area, digital power supply foot and first power line, photosensitive area is the installation position of image sensor, digital power supply foot is used for connecting first power line and provides working voltage for image sensor, and first power line is arranged along the edge of photosensitive area.
[0005] The beneficial effects of the present application are as follows:
[0006] Image sensor has a photoelectric tube that is very sensitive to noise interference, and the market mainstream mobile phone camera has a digital power supply wiring in the projection area of the image sensor photosensitive area on the PCB substrate, which can cause the coupling noise of the digital power supply to the sensor chip to be larger and larger, thereby causing various picture quality disturbances such as shadows, noise points and other picture quality disturbances in the camera product.
[0007] In the present application, the first power line is wired in the non-photosensitive area of the image sensor, which avoids the coupling noise of the digital power supply to the image sensor and improves the picture quality of the camera product caused by the coupling noise of the digital power supply to the image sensor.
[0008] Further, it further comprises an inner layer and a via hole, the via hole is arranged outside the photosensitive area, the via hole vertically penetrates the inner layer and the surface layer, the inner layer is provided with a second power line, one end of the second power line is connected with the power supply pin of the connector, and the other end of the second power line is connected with the first power line through the via hole.
[0009] Further, it further comprises a signal line, and the signal line is arranged on the inner layer.
[0010] Furthermore, a shielding layer is provided between the surface layer and the inner layer to shield the signal lines from interfering with the photosensitive area of the surface layer.
[0011] Furthermore, the signal lines include MIPI signal lines, I2C bus, clock lines, and reset signal lines.
[0012] This solution also has the following effects:
[0013] 1. The power cable comes out from the power supply pin of the connector, passes through the inner layer, the through hole, the edge of the photosensitive area of the surface layer and the digital power pin in sequence, and finally provides voltage to the image sensor;
[0014] 2. When routing the power cord, avoid the photosensitive area to reduce coupling noise and improve image quality; however, this will also compress the routing space of other components; therefore, the power cord should not be too far from the photosensitive area, and it can be arranged along the edge of the photosensitive area to balance noise reduction and other routing space.
[0015] 3. Since the power lines are arranged along the edge of the photosensitive area, a large number of signal lines cannot be arranged without crossing the power lines. In order to further reduce coupling noise and improve image quality, the signal lines are placed in the inner layer and the interference of the signal lines to the photosensitive area is shielded by the shielding layer. Therefore, the signal lines can pass through the projection area of the photosensitive area on the inner layer, so as to reduce the routing distance and improve production efficiency. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the surface layer of an embodiment;
[0017] Figure 2 This is a schematic diagram of the shielding layer in an embodiment;
[0018] Figure 3 This is a schematic diagram of the inner layer of an embodiment. Detailed Implementation
[0019] The following detailed description illustrates the specific implementation method:
[0020] The reference numerals in the accompanying drawings include: photosensitive area 1, digital power pin 2, first power line 3, via 4, second power line 5, and power supply pin 6.
[0021] Example
[0022] The implementation examples are basically as follows Figures 1-3 As shown: A camera PCB board for reducing coupling noise and improving image quality includes a surface layer, a shielding layer, and an inner layer arranged sequentially from top to bottom, such as... Figure 1As shown in the drawings, the surface layer is provided with a photosensitive area 1, a digital power pin 2 and a first power line 3, the photosensitive area 1 is the mounting position of the image sensor, the digital power pin 2 is used for connecting the first power line 3 and providing working voltage for the image sensor, and the first power line 3 is arranged along the edge of the photosensitive area 1.
[0023] A via hole 4 is arranged between the surface layer and the inner layer, the via hole 4 is arranged outside the projection area of the photosensitive area 1, and the via hole 4 vertically penetrates the inner layer and the surface layer. Figure 3 As shown in the drawings, the inner layer is provided with a second power line 5, one end of the second power line 5 is connected with a power supply pin 6 of a connector, and the other end of the second power line 5 is connected with the first power line 3 through the via hole 4.
[0024] The inner layer is provided with a signal line, as shown in the drawings. Figure 2 The material of the shielding layer is copper, the shielding layer is used for shielding the interference of the signal line to the photosensitive area 1 of the surface layer, and the signal line includes a Mipi signal line, an I2C bus, a clock line and a reset signal line.
[0025] The above is only the embodiment of the present application, and the specific technical scheme and / or common knowledge of the scheme are not described in detail. It should be noted that, for those skilled in the art, without departing from the technical scheme of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, and these will not affect the effect and practicability of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.
Claims
1. A camera PCB board for reducing coupling noise and improving image quality, characterized in that: The surface layer is provided with a photosensitive area, a digital power pin and a first power line, the photosensitive area is a mounting position of an image sensor, the digital power pin is used for connecting the first power line and providing working voltage for the image sensor, and the first power line is arranged along an edge of the photosensitive area.
2. The camera PCB board for reducing coupling noise and improving image quality of claim 1, wherein: The inner layer and a via hole are further included, the via hole is arranged outside the photosensitive area, the via hole vertically penetrates the inner layer and the surface layer, the second power line is arranged on the inner layer, one end of the second power line is connected with a power supply pin of the connector, and the other end of the second power line is connected with the first power line through the via hole.
3. The camera PCB board for reducing coupling noise and improving image quality of claim 2, wherein: A signal line is further included and arranged on the inner layer.
4. The camera PCB board for reducing coupling noise and improving image quality of claim 3, wherein: A shielding layer is arranged between the surface layer and the inner layer, and is used for shielding the signal line from interfering with the photosensitive area of the surface layer.
5. The camera PCB board for reducing coupling noise and improving image quality of claim 4, wherein: The signal line includes an Mipi signal line, an I2C bus, a clock line and a reset signal line.