Electronic equipment

Abstract

The utility model provides electronic equipment, and relates to the technical field of terminal equipment. The method and the device are used for solving the problem that the connection of a display module grounding point of the electronic equipment is unstable, the RSE is possibly increased, and then a radio frequency signal of the electronic equipment is influenced. The electronic equipment comprises a middle frame, a display module, a metal plate, a first conductive layer and a first electric connecting piece, the middle frame comprises a metal part and a non-metal part. The display module is fixedly connected with the middle frame. The metal plate is fixed to the non-display side of the display module. The first conductive layer is attached to the surface, away from the display module, of the metal plate. One end of the first electric connecting piece is connected with the metal part of the middle frame, and the other end of the first electric connecting piece is connected with the first conductive layer.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and more particularly to an electronic device. Background Technology

[0002] In electronic devices, such as mobile phones and tablets, the display module is used to display images and needs to be grounded. However, an unstable grounding connection of the display module may lead to an increase in RSE (Radiated Spurious Emission), which in turn affects the radio frequency signals of the electronic device. Utility Model Content

[0003] This application provides an electronic device to address the problem that unstable grounding connection of the display module of the electronic device may lead to increased RSE, thereby affecting the radio frequency signal of the electronic device.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, an electronic device is provided, comprising a mid-frame, a display module, a metal plate, a first conductive layer, and a first electrical connector. The mid-frame includes a metal portion and a non-metal portion. The display module is fixedly connected to the mid-frame. The metal plate is fixed to the non-display side of the display module. The first conductive layer is attached to the surface of the metal plate away from the display module. One end of the first electrical connector is connected to the metal portion of the mid-frame, and the other end of the first electrical connector is connected to the first conductive layer.

[0006] The electronic device provided in the first aspect of this application covers at least a portion of the surface of a metal plate with a first conductive layer, thereby forming a surface-to-surface contact between the first conductive layer and the metal plate. This increases the contact area between the two, thereby reducing the probability that the entire surface of the metal plate covered by the first conductive layer will be oxidized. This allows at least a portion of the surface of the metal plate to be stably electrically connected to the first conductive layer, enabling current to flow through the area, which helps to reduce the risk of exceeding the RSE standard.

[0007] In one possible implementation of the first aspect of this application, the first conductive layer has multiple conductive particles, and the metal plate and the first electrical connector are electrically connected through the conductive particles. In this structure, the multiple conductive particles can form multiple parallel conductive paths, thereby shunting the current and reducing the current flowing through each conductive path, which helps to further reduce the risk of exceeding the RSE limit.

[0008] In one possible implementation of the first aspect of this application, the first conductive layer includes a conductive adhesive.

[0009] In one possible implementation of the first aspect of this application, the first electrical connector has a first surface that is in contact with the surface of the first conductive layer away from the metal plate. In this structure, a surface-to-surface contact is formed between the first electrical connector and the first conductive layer, which helps to further ensure a stable electrical connection between the middle frame and the metal plate.

[0010] In one possible implementation of the first aspect of this application, the first electrical connector includes a first part, a connecting part, and a second part. The surface of the first part facing the first conductive layer is a first surface. The connecting part is connected between the first part and the second part. The second part is connected to the metal part. In this structure, the second part of the first electrical connector can be directly welded to the metal part of the middle frame, thereby achieving electrical connection between the metal plate and the metal part of the middle frame, i.e., grounding of the metal plate.

[0011] In one possible implementation of the first aspect of this application, the electronic device further includes a first adhesive layer disposed between the first portion and the metal plate. The vertical projection of the first adhesive layer on the display module at least partially overlaps with the vertical projection of the connecting portion on the display module. In this structure, when misalignment occurs between the middle frame and the metal plate, the first adhesive layer can withstand a larger tensile force, thereby reducing the risk of the first conductive layer being stretched and facilitating a stable electrical connection between the metal plate and the middle frame.

[0012] In one possible implementation of the first aspect of this application, the electronic device further includes a second conductive layer, through which the second part and the metal part are fixedly connected. In this structure, the first electrical connector is connected to the metal part of the mid-frame via the second conductive layer, thereby forming a surface-to-surface contact between the second conductive layer and the metal part, which helps to further reduce the risk of exceeding RSE limits.

[0013] In one possible implementation of the first aspect of this application, the electronic device further includes a second adhesive layer disposed between the second portion and the metal portion. The vertical projection of the second adhesive layer on the display module overlaps at least partially with the vertical projection of the connecting portion on the display module. In this structure, when misalignment occurs between the middle frame and the metal plate, the second adhesive layer can withstand a larger tensile force, reducing the risk of the second conductive layer being stretched and thus better ensuring a stable electrical connection between the metal plate and the middle frame.

[0014] In one possible implementation of the first aspect of this application, the second conductive layer contains multiple conductive particles, and the second part and the metal part are electrically connected through the conductive particles. In this structure, the conductive particles in the second conductive layer form multiple parallel conductive paths, thereby shunting the current and helping to reduce the risk of exceeding the RSE limit.

[0015] In one possible implementation of the first aspect of this application, the second conductive layer includes a conductive adhesive.

[0016] In one possible implementation of the first aspect of this application, the electronic device further includes a second electrical connector disposed on the side of the first electrical connector away from the first surface, and the second electrical connector connecting the first electrical connector to the metal portion. Exemplarily, the second electrical connector may abut against the first electrical connector and the mid-frame.

[0017] In one possible implementation of the first aspect of this application, the second electrical connector includes a metal spring or conductive foam.

[0018] In one possible implementation of the first aspect of this application, the material of the first electrical connector includes copper foil.

[0019] In one possible implementation of the first aspect of this application, the coverage area of ​​the first conductive layer on the metal plate is greater than or equal to 2 mm². 2 .

[0020] In one possible implementation of the first aspect of this application, the thickness of the first conductive layer is greater than or equal to 3 μm and less than or equal to 300 μm. Attached Figure Description

[0021] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0022] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0023] Figure 3 A partial structural diagram of the display module and mid-frame provided in an embodiment of this application;

[0024] Figure 4 A schematic diagram of current flow on a metal plate provided in an embodiment of this application;

[0025] Figure 5 A partial structural diagram of a metal plate and a middle frame provided in an embodiment of this application;

[0026] Figure 6 for Figure 5 A schematic diagram of current flow on the provided metal plate;

[0027] Figure 7 This is a simulation test diagram of the first conductive layer provided in an embodiment of this application;

[0028] Figure 8 A schematic diagram of simulation test results for the first conductive layer provided in the embodiments of this application;

[0029] Figure 9 Equivalent circuit diagram of the first conductive layer provided in the embodiments of this application;

[0030] Figure 10 A partial structural diagram of another metal plate and middle frame provided in an embodiment of this application;

[0031] Figure 11 A partial structural diagram of a metal plate and a middle frame provided in an embodiment of this application;

[0032] Figure 12 This is a partial structural diagram of another metal plate and middle frame provided in an embodiment of this application.

[0033] Reference numerals: 10-Electronic device; 100-Display module; 110-Light-transmitting cover; 120-Display screen; 200-Housing shell; 210-Back cover; 220-Middle frame; 221-Border; 222-Middle plate; 300-Circuit board; 400-Metal plate; 500-First conductive layer; 510-Conductive particles; 600-First electrical connector; 610-First part; 620-Second part; 630-Connecting part; 700-Second electrical connector; 700a-Metal spring; 800-Second conductive layer; 900-First adhesive layer; 910-Second adhesive layer. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0035] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0036] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0037] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0038] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), monitor, camera, personal computer, laptop computer, wearable device, etc. For ease of explanation, the following description uses a mobile phone as an example.

[0039] Please see Figure 1 and Figure 2 , Figure 1 This is a structural diagram of the electronic device 10 provided in the embodiments of this application. Figure 2 This is an exploded view of the electronic device 10 provided in an embodiment of this application. As can be seen from the above, in this embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 can have an approximately rectangular plate-like structure. The electronic device 10 may include a display module 100, a housing 200, and a circuit board 300.

[0040] For ease of description below, an XYZ coordinate system is established, defining the width direction of electronic device 10 as the X-axis, the length direction of electronic device 10 as the Y-axis, and the thickness direction of electronic device 10 as the Z-axis. It is understood that the coordinate system of electronic device 10 can be flexibly set according to actual needs; this application only provides an example and should not be considered a specific limitation thereof. Figure 1 and Figure 2 The electronic device 10 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 Restrictions.

[0041] The aforementioned display module 100 is used to display images, videos, etc. The display module 100 may include a light-transmitting cover 110 and a display screen 120 (also known as a display panel), with the light-transmitting cover 110 and the display screen 120 stacked together. The material of the light-transmitting cover 110 includes, but is not limited to, glass. For example, the light-transmitting cover 110 can be a common light-transmitting cover 110, used to protect the display screen 120 from damage caused by external forces and to provide dust protection. Alternatively, the light-transmitting cover 110 can also be a touch-enabled light-transmitting cover 110, enabling the electronic device 10 to have touch functionality, thus making it more convenient for users. Therefore, this application does not impose any special limitations on the specific material of the light-transmitting cover 110.

[0042] For example, the display screen 120 described above can be a flexible display screen or a rigid display screen. For instance, the display screen 120 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (MLED) display screen, a micro light-emitting diode (LED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0043] The aforementioned housing 200 is used to protect the electronic components inside the electronic device 10. The housing 200 may include a back cover 210 and a frame 221. The back cover 210 is located on the side of the display screen 120 away from the light-transmitting cover plate 110 and is stacked with the light-transmitting cover plate 110 and the display screen 120. The frame 221 is located between the light-transmitting cover plate 110 and the back cover 210. The frame 221 is fixed to the back cover 210. Exemplarily, the frame 221 can be fixed to the back cover 210 by means of adhesive bonding, threaded connection, welding, snap-fit, etc.; alternatively, the frame 221 can also be integrally formed with the back cover 210, that is, the frame 221 and the back cover 210 form a single structural component. The light-transmitting cover plate 110 can be glued to the frame 221, so that the light-transmitting cover plate 110, the back cover 210, and the frame 221 form a receiving cavity inside the electronic device 10, within which the aforementioned circuit board 300 and electronic components are disposed.

[0044] In some embodiments, the housing 200 may further include a middle plate 222, which is disposed within the accommodating cavity and located on the side of the display screen 120 away from the light-transmitting cover 110. The middle plate 222 is fixedly connected to the frame 221 to form the middle frame 220 of the electronic device 10. Exemplarily, the middle plate 222 and the frame 221 can be fixedly connected by adhesive, threaded connection, welding, snap-fit, or other methods; alternatively, the middle plate 222 and the frame 221 can be an integrally formed structure, i.e., the middle plate 222 and the frame 221 form a single structural component. The middle plate 222 divides the accommodating cavity into two independent spaces. One space is located between the light-transmitting cover 110 and the middle plate 222, and the display screen 120 is located within this space. The other space is located between the middle plate 222 and the rear cover 210, and the circuit board 300 is located within this space.

[0045] The aforementioned circuit board 300 is used to house electronic components inside the electronic device 10 and to achieve electrical connections between these components. The circuit board 300 can be fixed to the middle plate 222 by means of adhesive bonding, threaded connection, soldering, snap-fit, etc. Therefore, this application does not impose any special limitations on the fixing method of the circuit board 300.

[0046] The aforementioned electronic components are used to implement various functions of the electronic device 10. For example, the electronic components may be control chips (e.g., system-on-chip, SOC), graphics processing units (GPUs), universal flash storage (UFS), camera modules, flash modules, and capacitors, resistors, inductors, etc.

[0047] Based on this, please refer to Figure 3 , Figure 3 This is a partial structural diagram of the display module 100 and the mid-frame 220 provided in the embodiments of this application. To improve the strength of the display module 100, the electronic device 10 may further include a metal plate 400, which is disposed on the non-display surface of the display module 100, i.e., the metal plate 400 is disposed on... Figure 2 The display screen 120 shown is located on the side away from the light-transmitting cover 110. The metal plate 400 is made of a metal material, for example, stainless steel, which can provide support for the display module 100 to enhance its strength.

[0048] When the metal plate 400 is disposed on the non-display surface of the display module 100, the display module 100 and the metal plate 400 are equivalent to a single piece of metal. Therefore, an electrical connection is required with the metal ground of the electronic device 10, i.e., an electrical connection between the metal plate 400 and the metal portion of the middle frame 220. In some examples, the metal plate 400 and the middle frame 220 can be connected by a metal spring clip 700a, i.e., the metal spring clip 700a abuts against the metal plate 400 and the middle plate 222 of the middle frame 220. It is understood that the middle frame 220 may include a metal portion and a non-metal portion (i.e., a plastic portion). The metal portion can be equivalent to a metal ground, i.e., the metal plate 400 is grounded by abutting against the metal portion through the metal spring clip 700a.

[0049] Since the metal plate 400 is made of metal, prolonged exposure to air will cause oxidation on its surface, thus affecting its electrical conductivity. Therefore, please refer to [further details needed]. Figure 3 and in conjunction with reference Figure 4 , Figure 4 This is a schematic diagram of current flow on the metal plate 400 provided in an embodiment of this application. When oxidation occurs at the location where the surface of the metal plate 400 abuts against the metal spring 700a, it will cause oxidation at that location (e.g. Figure 4 The PIM (Passive Intermodulation) level at location A (as shown) is significantly reduced, thus causing the RSE problem.

[0050] It should be noted that RSE refers to interference caused by frequency components outside the operating frequency band during radio frequency operation. It is a regulatory test item, and products that meet the standards should have RSE test values ​​below the regulatory limits. PIM refers to the mixing interference signal caused by the nonlinear characteristics of passive components between two or more radio frequency signals in the radio frequency signal path, which is the root cause of RSE problems at electrical connection points.

[0051] Furthermore, the interface PIM level refers to the ability of an interface to generate resistance surface area (RSE) at the point where two devices come into contact, where relative motion may occur between them. The RSE varies depending on factors such as the material, surface roughness, and contact impedance of the devices. Therefore, with the same current flowing through, an interface with a stronger RSE has a poorer PIM level, while an interface with a weaker RSE has a better PIM level. For the same interface, the greater the current flowing through, the stronger the RSE.

[0052] Therefore, please continue reading. Figure 3 and Figure 4If oxidation occurs at the contact point between the metal plate 400 and the metal spring 700a, the conductivity of the metal plate 400 will decrease, the contact resistance will increase, and the PIM level will deteriorate. Furthermore, since the current flowing through the electrical connection point between the metal spring 700a and the metal plate 400 remains constant, the RSE (Resistance to Sequence) is prone to exceed the limit.

[0053] Based on this, an electronic device 10 is provided in this application embodiment. The electronic device 10 includes the aforementioned display module 100, housing 200, and metal plate 400. Please refer to... Figure 5 and Figure 6 , Figure 5 This is a partial structural diagram of a metal plate 400 and a middle frame 220 provided in an embodiment of this application. Figure 6 for Figure 5 A schematic diagram of current flow on the provided metal plate 400.

[0054] Furthermore, the electronic device 10 also includes a first conductive layer 500 and a first electrical connector 600. The first conductive layer 500 is attached to the surface of the metal plate 400 away from the display module 100, and covers at least a portion of the surface of the metal plate 400. One end of the first electrical connector 600 is connected to a metal portion of the housing 200, and the other end of the first electrical connector 600 abuts against the first conductive layer 500. For example, the first electrical connector 600 has a first surface, and the first surface of the first electrical connector 600 is attached to the surface of the first conductive layer 500 away from the metal plate 400.

[0055] For example, the first electrical connector can be made of metal foil, such as copper foil. Alternatively, it can be made of conductive cloth, non-woven fabric, or other materials plated with copper, gold, or nickel. Therefore, this application does not impose any special limitations on this.

[0056] In this way, surface-to-surface contact is formed between the first conductive layer 500 and the metal plate 400, as well as between the first conductive layer 500 and the first electrical connector 600. This increases the contact area and reduces the probability that the entire surface of the metal plate 400 covered by the first conductive layer 500 will oxidize. Figure 6 As shown, location A represents the oxidized area, while the other locations represent areas without oxidation. This ensures a stable electrical connection between the first electrical connector 600 and the metal plate 400 via the first conductive layer 500, allowing current to flow through the unoxidized areas of the metal plate 400. This helps reduce the risk of contact resistance and PIM level deterioration, thereby reducing the risk of RSE exceeding the limit.

[0057] In some embodiments, please continue reading Figure 5 and Figure 6 and in conjunction with reference Figure 7 , Figure 7 This is a simulation test diagram of the first conductive layer 500 provided in the embodiments of this application. The first conductive layer 500 may have multiple conductive particles 510, and the metal plate 400 and the first electrical connector 600 are electrically connected through the multiple conductive particles 510. That is, the multiple conductive particles 510 in the first conductive layer 500 can form multiple conductive paths, and the multiple conductive paths are connected in parallel to each other, so that the current flowing through the first conductive layer 500 is diverted, thereby helping to reduce the current flowing through each conductive path, and thus helping to optimize the problem of RSE exceeding the standard.

[0058] In some examples, the first conductive layer 500 can be a conductive adhesive, allowing it to adhere to the surface of the metal plate 400 and be fixedly bonded to the first surface of the first electrical connector 600. That is, the first conductive layer 500 formed by the conductive adhesive is bonded between the metal plate 400 and the first electrical connector 600, which helps to increase the contact area, allowing the first conductive layer 500 to form multiple parallel conductive paths between the metal plate 400 and the first electrical connector 600. Furthermore, the larger the coverage area of ​​the first conductive layer 500 on the metal plate 400, the more conductive paths are formed. For example, the coverage area of ​​the first conductive layer 500 on the surface of the metal plate 400 can be greater than or equal to 2 mm². 2 The thickness of the first conductive layer 500 can be greater than or equal to 3 μm and less than or equal to 300 μm.

[0059] Therefore, since the first conductive layer 500 has a large coverage area on the surface of the metal plate 400, it is beneficial to reduce the risk of RSE problems caused by oxidation in the area where the metal plate 400 and the first conductive layer 500 are in contact, which would lead to deterioration of contact impedance and PIM level.

[0060] For example, taking a first conductive layer 500 containing 64 conductive particles 510 distributed in an 8*8 array, the first conductive layer 500 has 64 possible conductive paths. During signal transmission, due to the skin effect of high-frequency signals, the shunting capacity of conductive particles 510 at different positions is also different.

[0061] Please see Figure 8 and Figure 9 , Figure 8 This is a schematic diagram of simulation test results for the first conductive layer 500 provided in an embodiment of this application. Figure 9 The equivalent circuit diagram of the first conductive layer 500 provided in the embodiments of this application. In the conductive paths formed by the plurality of conductive particles 510, the main conductive paths are concentrated on the outer side. This is due to the grounding impedance (e.g., in the central region) in the middle region. Figure 9 The middle R2) is higher than the grounding impedance of the outer region (e.g., Figure 9In the case of R1), the low-impedance conduction path can receive a larger current. Furthermore, Figure 8 The larger the number in the path, the lower the impedance and the greater the current flowing through it.

[0062] Therefore, even with the skin effect present, a significant number of the 64 conduction paths can still shunt current. Thus, even if the PIM level deteriorates in some individual conduction paths, the current is already shunted by multiple paths, resulting in a smaller current flowing through the deteriorated path and a lower RSE value. This helps maintain a good PIM level at the electrical connection points on the metal plate 400 surface, reducing the risk of RSE problems.

[0063] In other words, since the first conductive layer 500 has multiple conductive paths formed by multiple conductive particles 510, oxidation in a local area of ​​the metal plate 400 may cause individual conductive paths to experience PIM level deterioration. However, since the multiple conductive paths are connected in parallel, they shunt the current. Therefore, the deterioration of the PIM level in individual conductive paths will not cause RSE exceeding the limit, thus helping to optimize the RSE exceeding the limit of the electronic device 10.

[0064] Based on this, please refer back to the previous section. Figure 5 The first electrical connector 600 can be indirectly connected to the middle plate 222. For example, the electronic device 10 may also include a second electrical connector 700, such as the aforementioned metal spring 700a. The first electrical connector 600 can be bonded and fixed to the first conductive layer 500, and the second electrical connector 700 abuts against the metal portion of the housing 200. This achieves electrical connection between the metal plate 400 and the metal portion of the housing 200, i.e., the metal plate 400 is grounded.

[0065] Alternatively, the second electrical connector 700 can also be conductive foam or other conductive electrical connection medium, so that the first electrical connector and the metal part of the middle frame 220 can be electrically connected through the second electrical connector. Therefore, the specific structural form of the second electrical connector 700 is not particularly limited in the embodiments of this application.

[0066] In other examples, the first electrical connector 600 may directly contact the metal portion of the middle frame 220 to establish an electrical connection. For example, the first electrical connector 600 may be welded to the metal portion. See also... Figure 10 , Figure 10 This is a partial structural diagram of another metal plate 400 and middle frame 220 provided in an embodiment of this application.

[0067] Specifically, the first electrical connector 600 may include a first portion 610, a connecting portion 630, and a second portion 620. The surface of the first portion 610 facing the first conductive layer 500 is the aforementioned first surface. The connecting portion 630 is connected between the first portion 610 and the second portion 620. The second portion 620 is welded and fixed to the metal portion of the middle frame 220 (e.g., Figure 10 (as shown in position B). In this way, the first electrical connector 600 is directly welded and fixed to the metal part of the middle frame 220, which helps to save parts and reduce costs.

[0068] In some embodiments, please refer to Figure 11 , Figure 11 This is a partial structural diagram of another metal plate 400 and middle frame 220 provided in an embodiment of this application. Figure 1 The illustrated electronic device 10 may further include a second conductive layer 800, which is disposed between the second portion 620 and the metal portion of the middle frame 220. Specifically, the middle frame 220 and the second portion 620 are bonded and fixedly connected via the second conductive layer 800. For example, the second conductive layer 800 can be the aforementioned conductive adhesive, enabling electrical connection between the metal portion of the middle frame 220 and the second portion 620 of the first electrical connector 600. This allows the formation of multiple parallel conductive channels between the first electrical connector 600 and the metal portion of the middle frame 220, thereby further reducing the risk of RSE exceeding the limit in the electronic device 10.

[0069] It is understood that the portion of the first electrical connector 600 directly bonded and fixed to the first conductive layer 500 is the first portion 610, the area where the first electrical connector 600 is fixedly connected to the metal portion of the middle frame 220 is the second portion 620, and the area connecting the first portion 610 and the second portion 620 is the connecting portion 630. Exemplarily, the first portion 610 may be parallel to the metal plate 400, the second portion 620 may be parallel to the first portion 610, and the connecting portion 630 may be vertically disposed between the first portion 610 and the second portion 620. Therefore, the specific shape of the first electrical connector 600 is not specifically limited in this embodiment.

[0070] In other embodiments, please refer to Figure 12 , Figure 12This is a partial structural diagram of another metal plate 400 and mid-frame 220 provided in an embodiment of this application. The electronic device 10 may further include a first adhesive layer 900 and a second adhesive layer 910. For example, the first adhesive layer 900 and the second adhesive layer 910 are non-conductive adhesives. The first adhesive layer 900 is disposed between the first portion 610 and the metal plate 400, that is, the first portion 610 of the first electrical connector 600 and the metal plate 400 are bonded and fixed together by the first adhesive layer 900 and the aforementioned first conductive layer 500. Furthermore, the vertical projection of the first adhesive layer 900 on the display module 100 at least partially overlaps with the vertical projection of the connecting portion 630 on the display module 100.

[0071] The second adhesive layer 910 is disposed between the second portion 620 and the metal portion of the middle frame 220, that is, the second portion 620 of the first electrical connector 600 and the metal portion of the middle frame 220 are bonded and fixed together by the second adhesive layer 910 and the second conductive layer 800. Furthermore, the projection of the second adhesive layer 910 onto the display module 100 and the vertical projection of the connecting portion 630 onto the display module at least partially overlap.

[0072] That is, along the thickness direction of the electronic device 10, both ends of the connecting portion 630 are bonded and fixed to the metal plate 400 and the metal part of the middle frame 220 through the first adhesive layer 900 and the second adhesive layer 910, respectively. Since the first part 610 and the second part 620 of the first electrical connector 600 are connected by the connecting portion 630, there will be relative movement between the metal plate 400 and the middle frame 220 during the assembly process, which may cause tension on the first electrical connector 600.

[0073] During the installation process described above, the connection points between the connecting portion 630 and the first portion 610, and between the connecting portion 630 and the second portion 620 of the first electrical connector 600, are the locations subject to the greatest stress. Therefore, by bonding and fixing the two ends of the connecting portion 630 to the metal plate 400 and the metal portion of the middle frame 220 respectively through the first adhesive layer 900 and the second adhesive layer 910, the first electrical connector 600 can withstand the tensile force when it is pulled, thereby reducing the risk of the first conductive layer 500 and the second conductive layer 800 being pulled. This ensures a stable electrical connection between the first electrical connector 600 and the metal portion of the middle frame 220, further reducing the risk of RSE problems.

[0074] In some other examples, the second part 620 of the first electrical connector 600 is welded and fixed to the metal part of the middle frame 220, or the first electrical connector 600 is electrically connected to the metal part of the middle frame 220 through the second electrical connector 700. In this case, the first adhesive layer 900 can be provided only between the first part 610 and the metal plate 400 to reduce the risk of the first conductive layer 500 being pulled.

[0075] It is understood that the vertical projections of the first adhesive layer 900 and the second adhesive layer 910 onto the display module 100 can completely cover the vertical projection of the connecting portion 630 onto the display module 100. Alternatively, the vertical projections of the first adhesive layer 900 and the second adhesive layer 910 onto the display module 100 can cover a portion of the vertical projection of the connecting portion 630 onto the display module 100.

[0076] Furthermore, the coverage areas of the first adhesive layer 900 and the second adhesive layer 910 may be exactly the same or not exactly the same. For example, the vertical projection of the first adhesive layer 900 may completely cover the vertical projection of the connecting portion 630, while the vertical projection of the second adhesive layer 910 may only cover a portion of the vertical projection of the connecting portion 630. Therefore, this application does not impose any special limitations on this.

[0077] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0078] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: The middle frame includes a metal portion and a non-metal portion; The display module is fixedly connected to the middle frame; A metal plate, the metal plate being fixed to the non-display side of the display module; The first conductive layer is attached to the surface of the metal plate away from the display module; A first electrical connector, one end of which is connected to the metal portion, and the other end of which is connected to the first conductive layer.

2. The electronic device according to claim 1, characterized in that, The first conductive layer contains a plurality of conductive particles, and the metal plate is electrically connected to the first electrical connector through the conductive particles.

3. The electronic device according to claim 1 or 2, characterized in that, The first conductive layer includes conductive adhesive.

4. The electronic device according to any one of claims 1-3, characterized in that, The first electrical connector has a first surface that is in contact with the surface of the first conductive layer away from the metal plate.

5. The electronic device according to claim 4, characterized in that, The first electrical connector includes a first part, a connecting part, and a second part. The surface of the first part facing the first conductive layer is the first surface. The connecting part is connected between the first part and the second part. The second part is connected to the metal part.

6. The electronic device according to claim 5, characterized in that, The electronic device further includes a first adhesive layer disposed between the first portion and the metal plate, wherein the vertical projection of the first adhesive layer on the display module and the vertical projection of the connecting portion on the display module at least partially overlap each other.

7. The electronic device according to claim 5 or 6, characterized in that, The electronic device further includes a second conductive layer, through which the second part and the metal part are fixedly connected.

8. The electronic device according to claim 7, characterized in that, The electronic device further includes a second adhesive layer disposed between the second portion and the metal portion, wherein the vertical projection of the second adhesive layer on the display module overlaps at least partially with the vertical projection of the connecting portion on the display module.

9. The electronic device according to claim 7, characterized in that, The second conductive layer contains a plurality of conductive particles, and the second part and the metal part are electrically connected through the conductive particles.

10. The electronic device according to claim 9, characterized in that, The second conductive layer includes conductive adhesive.

11. The electronic device according to claim 4, characterized in that, The electronic device further includes a second electrical connector disposed on the side of the first electrical connector away from the first surface, and the second electrical connector is connected between the first electrical connector and the metal part.

12. The electronic device according to claim 11, characterized in that, The second electrical connector includes a metal spring or conductive foam.

13. The electronic device according to any one of claims 1-12, characterized in that, The material of the first electrical connector includes copper foil.

14. The electronic device according to any one of claims 1-13, characterized in that, The first conductive layer covers an area of ​​2 mm or more on the metal plate. 2 .

15. The electronic device according to any one of claims 1-14, characterized in that, The thickness of the first conductive layer is greater than or equal to 3 μm and less than or equal to 300 μm.

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