Digital pyrography printing system

Abstract

The utility model discloses a digital pyrograph printing system, and relates to the technical field of digital printing, and the digital pyrograph printing system comprises a printing main body and a baking mechanism; the substrate is arranged on one side of the printing main body, the plurality of lamp sources are arranged on the substrate, and the plurality of lamp sources are used for projecting light beams to a printing pattern on the printing medium, so that the hot melt adhesive liquid or the hot melt adhesive powder on the printing pattern absorbs the light beams and is cured. According to the technical scheme, the problem that local overheating or insufficient heat is likely to be caused can be solved.

Description

Technical Field

[0001] This application relates to the field of digital printing technology, and in particular to a digital heat transfer printing system. Background Technology

[0002] In digital printing, a film material is usually used as a carrier. First, the printing ink and hot melt adhesive powder are cured on the film material, and then the printing on the film material is transferred to the clothing by hot pressing.

[0003] In related technologies, multiple infrared heating tubes are typically used to heat the baking area. The printed film carrier is heated through the baking area for a period of time, so that the print is cured on the film. However, the distance and angle between the infrared heating tube and the object can affect the heat distribution, which can easily cause local overheating or insufficient heat. Utility Model Content

[0004] The main objective of this application is to propose a digital heat transfer printing system that aims to improve the problem of localized overheating or insufficient heat.

[0005] To achieve the above objectives, this application proposes a digital heat transfer printing system, comprising:

[0006] A printing body for printing a pattern on a printing medium;

[0007] A baking mechanism includes a substrate and multiple light sources. The substrate is disposed on one side of the printing body, and the multiple light sources are disposed on the substrate. The multiple light sources are used to project light beams onto the printing pattern on the printing medium so that the hot melt adhesive liquid or hot melt adhesive powder on the printing pattern absorbs the light beams and solidifies.

[0008] In one embodiment, the printing body is used to print the hot melt adhesive onto the printing medium, so that the printed pattern on the printing medium has the hot melt adhesive; or,

[0009] The digital heat transfer printing system also includes a powder-spreading mechanism, which is located between the printing body and the baking mechanism. The powder-spreading mechanism is used to spread the hot melt adhesive powder onto the printing medium so that the hot melt adhesive powder adheres to the printed pattern on the printing medium.

[0010] In one embodiment, the wavelength of the light beam projected by the lamp source is less than 440 nm.

[0011] In one embodiment, the light beam projected by the lamp source is ultraviolet light.

[0012] In one embodiment, the distance s between the light source and the printing medium satisfies the condition: 30mm ≤ s ≤ 70mm.

[0013] In an embodiment, the printing body prints the ink or hot-melt glue solution on the printing medium, and the ink or hot-melt glue solution contains light-absorbing material, or the hot-melt glue powder mixed with light-absorbing material, and the light-absorbing material has an absorption rate of greater than 75% to the light beam.

[0014] In an embodiment, the baking mechanism projects a light spot formed on the printing medium, and the size b of the light spot satisfies the condition: 370 mm * 3 mm≤b≤360 mm * 35 mm; and / or,

[0015] The distance between two adjacent light sources is a, and a satisfies the condition: 7 mm≤a≤12 mm.

[0016] In an embodiment, the plurality of light sources are arranged on the substrate in an arrangement mode of N rows and M columns, where N≥2 and M≥N, and the row direction is perpendicular to the moving direction of the printing medium, and the column direction is parallel to the moving direction of the printing medium.

[0017] In an embodiment, the light beam is perpendicular to the printing medium; and / or,

[0018] The light source is an LED lamp bead or a laser.

[0019] In an embodiment, the baking mechanism further comprises a heat dissipation member, and the substrate is arranged on the heat dissipation member; and / or,

[0020] The baking mechanism further comprises a light homogenizing lens arranged on the light emitting side of the plurality of light sources to homogenize the light beams projected by the plurality of light sources; and / or,

[0021] The digital iron-on printing system further comprises a straightening mechanism connected to both ends of the printing medium in the width direction and / or acting on the printing medium in the length direction to straighten the printing medium.

[0022] The technical solution of the present application prints a pattern on the printing medium by using a printing body, and heats and bakes the area by using a baking mechanism comprising a substrate and a plurality of light sources, so that the plurality of light sources project light beams onto the printed pattern on the printing medium, so that the hot-melt glue solution or hot-melt glue powder on the printed pattern absorbs the light beams and solidifies, so that the printed pattern is fixed on the printing medium under the solidification of the hot-melt glue solution or hot-melt glue powder; since the light sources project light beams by heat radiation, the light beams projected by the plurality of light sources can uniformly irradiate the hot-melt glue solution or hot-melt glue powder on the printed pattern, thereby uniformly baking the hot-melt glue powder or hot-melt glue solution on the printing medium. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings described below only illustrate some of the embodiments of the present application, and all other drawings obtained by those of ordinary skill in the art without creative effort based on these drawings also belong to the protection scope of the present application.

[0024] Figure 1 Structure schematic diagram of an embodiment of the digital iron-on printing system provided by the present application;

[0025] Figure 2 Structure schematic diagram of another embodiment of the digital iron-on printing system provided by the present application;

[0026] Figure 3 Structure schematic diagram of an embodiment of the baking mechanism in the digital iron-on printing system provided by the present application;

[0027] Figure 4 Bottom view of an embodiment of the baking mechanism in the digital iron-on printing system provided by the present application;

[0028] Figure 5 Side view of an embodiment of the baking mechanism in the digital iron-on printing system provided by the present application.

[0029] Explanation of the reference signs:

[0030]

[0031] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0033] It should be noted that if the directionality indication (such as up, down, left, right, front, back, etc.) is involved in the embodiments of the present application, the directionality indication is only used to explain the relative position relationship, movement condition, etc. between the components in a certain specific posture, and if the specific posture changes, the directionality indication also changes accordingly.

[0034] In addition, if the description of "first", "second" and the like is involved in the embodiments of the present application, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, nor in the protection scope claimed by the present application.

[0035] In the digital printing process, a film material is usually used as a carrier, and the transfer printing ink and hot melt glue powder are first printed and solidified on the film material, and then the printing on the film material is transferred to the clothes by ironing.

[0036] In the related art, a plurality of infrared heating pipes are usually used to heat the baking area, and the film material carrier with printing is heated for a period of time through the baking area, so that the printing is solidified on the film material. However, the distance and angle of the infrared heating pipe from the object will affect the heat distribution, which is easy to cause local overheating or insufficient heat.

[0037] In addition, the baking method in the related art has the following defects: it needs to carry a plurality of infrared heating pipes, and the power required by the equipment is high when the plurality of infrared heating pipes work at the same time; due to the high power of the equipment, the power consumption of the equipment is large during long time work, which is not energy-saving; in order to avoid the problem of easy local overheating or insufficient heat, the infrared heating pipe used is usually placed in a water bottle, which causes the equipment to occupy a large space; if not properly controlled, a high temperature area is easy to appear near the infrared heating pipe, which will cause the film material to melt; and the infrared heating pipe is easy to age and needs to be replaced regularly, which has high maintenance cost.

[0038] Based on the above problems, the present application provides a digital transfer printing system 1000, which aims to at least improve the problem of easy local overheating or insufficient heat. The specific drawings and embodiments will be described in detail below.

[0039] Please refer to Figures 1 to 5In an embodiment of the present application, the digital iron-on printing system 1000 comprises a printing main body 200 and a baking mechanism 100; the printing main body 200 is used for printing a pattern on a printing medium 400; the baking mechanism 100 comprises a substrate 10 and a plurality of light sources 20; the substrate 10 is arranged on one side of the printing main body 200; the plurality of light sources 20 are arranged on the substrate 10; the plurality of light sources 20 are used for projecting light beams to the printed pattern on the printing medium 400, so that the hot melt glue liquid or hot melt glue powder on the printed pattern absorbs the light beams and solidifies.

[0040] The substrate 10 refers to a plate-shaped structure for fixedly mounting the plurality of light sources 20, and also has a control circuit for controlling the plurality of light sources 20 to be turned on or turned off, also known as a circuit board. The substrate 10 can control the plurality of light sources 20 to operate at a preset time and a preset power according to the preset time and the preset power.

[0041] The light source 20 refers to a lamp bead capable of emitting light beams, which can be a laser lamp or an LED lamp, etc. In some embodiments, one side of the substrate 10 has a mounting plate surface 11; when the light source 20 is mounted on the mounting plate surface 11 of the substrate 10, it can be electrically connected with the control circuit on the substrate 10 to control the light source 20 to operate through the control circuit board on the substrate 10.

[0042] In some embodiments, the plurality of light sources 20 can be arranged in an array, can be arranged in a whole row in a horizontal direction, can be arranged in a whole column in a vertical direction, and can be arranged in other ways as long as a uniform irradiation area can be formed.

[0043] In actual application, the light source 20 can be embedded into the substrate 10 from the mounting plate surface 11 of the substrate 10, or can be directly mounted on the mounting plate surface 11 of the substrate 10. Specifically, the light source 20 can be fixedly mounted on the substrate 10 by means of bonding, screw connection, clamping, adsorption, etc., to improve the mounting reliability of the light source 20.

[0044] In summary, the technical scheme of the present application prints a pattern on a printing medium 400 by using a printing main body 200, and heats and bakes the area by using a baking mechanism 100 comprising a substrate 10 and a plurality of light sources 20, so that the plurality of light sources 20 project light beams to the printed pattern on the printing medium 400, so that the hot melt glue liquid or hot melt glue powder on the printed pattern absorbs the light beams and solidifies, so that the printed pattern is fixed on the printing medium 400 under the solidification of the hot melt glue liquid or hot melt glue powder; since the light source 20 projects light beams by means of heat radiation, the light beams projected by the plurality of light sources 20 can uniformly irradiate the hot melt glue liquid or hot melt glue powder on the printed pattern, so that the hot melt glue powder or hot melt glue liquid on the printing medium 400 is uniformly baked.

[0045] In addition, the surface temperature of the printing medium 400 is generally not too high in this baking mode, low-temperature baking can be achieved, and the problem of local overheating or insufficient heat can be effectively improved.

[0046] In addition, the surface temperature of the printing medium 400 is generally not too high in this baking mode, low-temperature baking can be achieved, and the problem of local overheating or insufficient heat can be effectively improved.

[0047] In this embodiment, the digital ironing print system 1000 can further include a conveying mechanism configured to convey the printing medium 400, and the baking mechanism 100 is arranged on one side of the printing body 200 in the conveying direction of the printing medium 400, so that the printing medium 400 automatically flows through the printing body 200 and the baking mechanism 100.

[0048] Please refer to Figure 1 In an embodiment of the present application, the printing body 200 is used to print hot melt glue liquid onto the printing medium 400, so that the printing pattern of the printing medium 400 has hot melt glue liquid.

[0049] In this way, the printing body 200 can be used to print the printing pattern on the printing medium 400, and at the same time, the printing body 200 can be used to print hot melt glue liquid on the printing medium 400, so that the printing pattern of the printing medium 400 has hot melt glue liquid. At this time, when the light beams of the plurality of lamp sources 20 are projected onto the printing pattern, the hot melt glue liquid on the printing pattern can be cured by absorbing the light beams.

[0050] Alternatively, please refer to Figure 2 In another embodiment of the present application, the digital ironing print system 1000 further includes a powder scattering mechanism 300 arranged between the printing body 200 and the baking mechanism 100, and used to scatter hot melt glue powder onto the printing medium 400, so that the printing pattern of the printing medium 400 has hot melt glue powder adhered thereto.

[0051] In this way, after the printing body 200 is used to print the printing pattern on the printing medium 400, the printing medium 400 can be scattered with hot melt glue powder by the powder scattering mechanism 300 before moving to the baking mechanism 100, so that the printing pattern of the printing medium 400 has hot melt glue powder. At this time, when the light beams of the plurality of lamp sources 20 are projected onto the printing pattern, the hot melt glue powder on the printing pattern can be cured by absorbing the light beams.

[0052] The hot melt glue powder absorbing the light beams and being cured mentioned in the embodiments of the present application can specifically be that the hot melt glue powder melts and solidifies after absorbing the light beams.

[0053] Please refer to Figures 3 to 5In an embodiment of the present application, the wavelength of the light beam projected by the light source 20 is less than 440 nm.

[0054] Since the hot melt glue liquid or hot melt glue powder has a good absorption rate for light beams with a wavelength less than 440 nm, by making the wavelength of the light beam projected by the light source 20 less than 440 nm, the light beam emitted by the light source 20 can be absorbed by the hot melt glue liquid or hot melt glue powder on the printed pattern when it is irradiated, so that the baking process can be completed in the shortest possible time, thereby improving the baking efficiency.

[0055] As some examples, the wavelength of the light beam projected by the light source 20 can be 320 nm, 360 nm, 370 nm, 380 nm, 385 nm, 390 nm, 398 nm, 400 nm, 420 nm, 440 nm, etc.

[0056] Please refer to Figures 3 to 5 In an embodiment of the present application, the light beam projected by the light source 20 is ultraviolet light.

[0057] In this way, since the hot melt glue liquid or hot melt glue powder has a better absorption rate for light beams with a wavelength of ultraviolet light, by making the light beam projected by the light source 20 ultraviolet light, the light beam emitted by the light source 20 can be absorbed by the hot melt glue liquid or hot melt glue powder on the printed pattern when it is irradiated, thereby further improving the baking efficiency.

[0058] For example, the power of the light source 20 can be set so that the light beam with a wavelength of 395 nm emitted by the light source 20 can achieve good baking effect after being irradiated for about 10 s.

[0059] Please refer to Figure 1 , Figure 2 In an embodiment of the present application, the distance s between the light source 20 and the printing medium 400 satisfies the condition: 30 mm≤s≤70 mm.

[0060] Therefore, by controlling the distance s between the lamp source 20 and the printing medium 400 to be between 30 mm and 70 mm, the light beam projected by the lamp source 20 can not burn the printing medium 400 or accidentally burn the user's fingers, and the baking efficiency of the hot-melt adhesive liquid or powder on the printing pattern can be improved.

[0061] As some examples, the distance s between the lamp source 20 and the printing medium 400 can be 30 mm, 35 mm, 40 mm, 45 mm, 50 mm, 55 mm, 60 mm, 65 mm, 70 mm, etc.

[0062] Please refer to Figure 1 , Figure 2 In an embodiment of the present application, the ink or hot-melt adhesive liquid printed by the printing body 200 on the printing medium 400 contains light-absorbing material, or the hot-melt adhesive powder contains light-absorbing material, and the light-absorbing material has an absorption rate of greater than 75% to the light beam.

[0063] Therefore, by mixing light-absorbing material in the ink or hot-melt adhesive liquid or hot-melt adhesive powder, and the light-absorbing material has an absorption rate of greater than 75% to the light beam, the light beam emitted by the lamp source 20 can be more absorbed by the hot-melt adhesive liquid or powder when it irradiates the hot-melt adhesive liquid or powder on the printing pattern, so that the baking process can be completed in a shorter time, thereby further improving the baking efficiency.

[0064] In actual application, the light-absorbing material can include but is not limited to zinc oxide, titanium dioxide, barium sulfate, etc., and organic absorbents such as benzophenone and benzotriazole.

[0065] As some examples, the absorption rate of the light-absorbing material to the light beam can be 76%, 77%, 78%, 79%, 80%, 81%, 82%, 83%, 84%, 85%, 90%, 95%, etc.

[0066] Please refer to Figure 1 , Figure 2 In an embodiment of the present application, the size b of the light spot formed by the baking mechanism 100 on the printing medium 400 satisfies the condition: 370 mm * 3 mm ≤ b ≤ 360 mm * 35 mm.

[0067] In this way, if the spot size b formed by the baking mechanism 100 on the printing medium 400 is too small, the spot cannot completely cover the hot-melt glue liquid or powder on the printing pattern, thereby affecting the baking effect of the hot-melt glue liquid or powder. If the spot size b formed by the baking mechanism 100 on the printing medium 400 is too large, the spot will exceed the printing medium 400, which not only causes waste but also may accidentally cause burns to the user.

[0068] As some examples, the spot size b formed by the baking mechanism 100 on the printing medium 400 can be 370 mm * 3 mm, 370 mm * 4 mm, 370 mm * 10 mm, 365 mm * 8 mm, 365 mm * 10 mm, 365 mm * 12 mm, 363 mm * 10 mm, 360 mm * 15 mm, 363 mm * 15 mm, 362 mm * 20 mm, 360 mm * 25 mm, 360 mm * 35 mm, and the like.

[0069] In some embodiments, when the distance between the baking mechanism 100 and the printing medium 400 is 20 mm, the spot size b formed by the baking mechanism 100 on the printing medium 400 is 370 mm * 3 mm; when the distance between the baking mechanism 100 and the printing medium 400 is 30 mm, the spot size b formed by the baking mechanism 100 on the printing medium 400 is 370 mm * 4 mm; when the distance between the baking mechanism 100 and the printing medium 400 is 40 mm, the spot size b formed by the baking mechanism 100 on the printing medium 400 is 360 mm * 15 mm; and when the distance between the baking mechanism 100 and the printing medium 400 is 50 mm, the spot size b formed by the baking mechanism 100 on the printing medium 400 is 360 mm * 35 mm.

[0070] In other embodiments, the spot size b formed by the baking mechanism 100 on the printing medium 400 can also be other values, which can be determined based on the width of the printing medium 400 and the distance between the baking mechanism 100 and the printing medium 400.

[0071] Please refer to Figure 4 In an embodiment of the present application, the distance between the two adjacent light sources 20 is a, and 7 mm≤a≤12 mm is satisfied.

[0072] Thus, when the distance between the two adjacent light sources 20 is too small, it is inconvenient to install multiple light sources 20, and the cost is high. When the distance between the two adjacent light sources 20 is too large, the light power density is too low, which can cause the light spot emitted by the multiple light sources 20 to have insufficient illumination uniformity, thereby affecting the curing efficiency of the hot melt glue liquid or hot melt glue powder on the printed pattern. Therefore, by controlling the distance between the two adjacent light sources 20 to be 7mm-12mm, the above problems can be effectively improved.

[0073] As some examples, the distance a between the two adjacent light sources 20 can be 7mm, 7.5mm, 8mm, 8.5mm, 9mm, 9.5mm, 10mm, 10.5mm, 11mm, 11.5mm, 12mm, etc.

[0074] Please refer to Figures 3 to 5 In an embodiment of the present application, the multiple light sources 20 are arranged on the substrate 10 in an arrangement mode of N rows and M columns, where N≥2 and M≥N, and the row direction is perpendicular to the movement direction of the printing medium 400, and the column direction is parallel to the movement direction of the printing medium 400. It can be understood that the multiple light sources 20 can be distributed on the substrate 10 in an arrangement mode of two rows, three rows, four rows, five rows, etc., and the arrangement mode of the multiple light sources 20 in each row is consistent.

[0075] Thus, when the multiple light sources 20 are arranged on the substrate 10 in the arrangement mode of N rows and M columns, the light beams projected by the multiple light sources 20 can form a more uniform illumination area during the working process, so that the heat distribution of the baking area heated by the multiple light sources 20 is more uniform.

[0076] In some embodiments, 50x2=100 light sources 20 can be used, and the distance between the two adjacent light sources 20 is 9mm, and the total power is 80W. In some embodiments, at a position 30mm away from the laser baking mechanism 100, the light spot size formed by the multiple light sources 20 can be 400x20mm, and the light power density reaches 0.98w / cm 2 , and the light output uniformity reaches more than 90%.

[0077] Please refer to Figure 1 , Figure 2 In an embodiment of the present application, the light beam is perpendicular to the printing medium 400. Thus, the light beam projected by the light source 20 can directly irradiate the hot melt glue liquid or hot melt glue powder on the printed pattern, which can reduce the loss of the light beam during propagation, thereby improving the utilization rate of the light beam.

[0078] Please refer to Figures 3 to 5 In an embodiment of the present application, the light source 20 is an LED lamp bead or a laser.

[0079] In this way, when the LED lamp bead is used as the lamp source 20, the lamp source 20 has the advantages of small size, energy saving, environmental protection, low power requirement, fast response speed, high brightness, long service life, good stability, and the like.

[0080] When the laser is used as the lamp source 20, the light beam projected by the lamp source 20 is a laser beam, and the absorption rate of the hot melt glue liquid or hot melt glue powder is high by using the laser irradiation mode, which can effectively shorten the baking time, improve the baking efficiency, and reduce the power consumption.

[0081] Please refer to Figures 3 to 5 In an embodiment of the present application, the baking mechanism 100 further comprises a heat dissipation member 30, and the substrate 10 is arranged on the heat dissipation member 30.

[0082] The heat dissipation member 30 refers to a structure capable of effectively cooling the substrate 10 and the lamp source 20. The substrate 10 can be embedded on the heat dissipation member 30 or directly mounted on the surface of the heat dissipation member 30. Specifically, the substrate 10 can be fixedly mounted on the heat dissipation member 30 by means of bonding, screw connection, clamping, adsorption, or the like, so as to improve the mounting reliability of the substrate 10 and the heat dissipation member 30. In actual application, the heat dissipation member 30 can cool the substrate 10 and the lamp source 20 by means of a cooling water channel, or can cool the substrate 10 and the lamp source 20 by means of an aluminum plate, a heat dissipation fin 32, or the like.

[0083] In this way, during the working process of the substrate 10 and the lamp source 20, the heat dissipation member 30 can be used to cool the substrate 10 and the lamp source 20, so as to prevent the substrate 10 and the lamp source 20 from being too high in temperature, thereby prolonging the service life.

[0084] In some embodiments, one side of the heat dissipation member 30 is provided with a mounting groove 31, and the substrate 10 is at least partially embedded in the mounting groove 31.

[0085] In this way, by embedding the substrate 10 at least partially in the mounting groove 31 of the heat dissipation member 30, on the one hand, the contact area between the substrate 10 and the heat dissipation member 30 can be improved, so as to improve the cooling effect of the substrate 10 and the lamp source 20, and on the other hand, the mounting reliability between the substrate 10 and the heat dissipation member 30 can be improved.

[0086] For example, the heat dissipation member 30 can be an aluminum plate, so as to absorb the heat generated by the substrate 10 and the lamp source 20, thereby cooling the substrate 10 and the lamp source 20.

[0087] Please refer to Figure 3 , Figure 5 In an embodiment of the present application, a plurality of heat dissipation fins 32 are arranged at intervals on the side of the heat dissipation member 30 away from the substrate 10.

[0088] In this way, the plurality of heat dissipation fins 32 can increase the heat dissipation area of the heat dissipation member 30 to the substrate 10 and the light source 20, so as to further improve the heat dissipation effect of the substrate 10 and the light source 20.

[0089] In another embodiment, a cooling channel can also be formed in the heat dissipation member 30, and a cooling medium (such as water, refrigerant, etc.) can be introduced into the cooling channel to take away the heat absorbed by the heat dissipation member 30 under the circulation of the cooling medium, thereby cooling and dissipating heat of the substrate 10 and the light source 20.

[0090] In yet another embodiment, a fan can also be provided on the periphery of the heat dissipation member 30, and the air inlet of the fan is arranged towards the heat dissipation member 30. When the fan is working, it can take away the heat absorbed by the heat dissipation member 30, thereby cooling and dissipating heat of the substrate 10 and the light source 20.

[0091] Please refer to Figures 3 to 5 In an embodiment of the present application, the baking mechanism 100 further comprises a light homogenizing lens 40 arranged on the light emitting side of the light source 20 to homogenize the light beams projected by the plurality of light sources 20.

[0092] The light homogenizing lens 40 refers to a lens structure capable of adjusting the passing light beams to improve the uniformity of the light beams. In actual application, the light homogenizing lens 40 can be a convex lens, a concave lens, or a structure combining convex lens and concave lens. The number of lens pieces of the light homogenizing lens 40 can be one or at least two, which can be determined according to actual use and is not limited herein. Specifically, one light homogenizing lens 40 can be shared by a plurality of light sources 20, or one light homogenizing lens 40 can be arranged corresponding to one light source 20, which is not limited herein.

[0093] In this way, the light homogenizing lens 40 can improve the light emitting uniformity of the light source 20, so that the plurality of light sources 20 can form a more uniform irradiation area, and the heat distribution of the baking area heated by the plurality of light sources 20 is more uniform.

[0094] In an embodiment of the present application, the digital iron-on printing system 1000 further comprises a straightening mechanism connected with both ends of the printing medium 40 in the width direction and / or acting on the printing medium 40 in the length direction to straighten the printing medium 40.

[0095] In this way, the straightening mechanism is used to straighten the printing medium 400, so that the two sides of the printing medium 400 have a straightening tension, which can avoid the problem of uneven baking caused by deformation of the printing medium 400.

[0096] The width direction can be the direction perpendicular to the conveying direction of the print medium 400, and the length direction can be the conveying direction of the print medium 400. The straightening mechanism can be arranged on the conveying structure conveying the print medium 400, or can be arranged on the baking mechanism 100. The straightening mechanism can be a common straightening structure, for example, a structure of a cylinder cooperating with a clamping jaw, or a structure of a cylinder cooperating with a clamping plate, etc. For another example, the straightening mechanism can also be a conveying mechanism with buckles, which can cooperate with the holes on both sides of the print medium 400 in the width direction to realize the tensioning of the print medium 400. For another example, the straightening mechanism can also be a traction stretching mechanism, for example, a synchronous belt or a chain is used as a traction element, and a clamp or a clip is installed on the synchronous belt or the chain to clamp the edges on both sides of the print medium 400 in the width direction. In some embodiments, the straightening mechanism can also include a spring, which can directly or indirectly act on both sides of the print medium 400 in the width direction, thereby realizing the straightening of the print medium 400. In some embodiments, the straightening mechanism can also include rollers, generally consisting of two groups of traction rollers, which can traction and stretch the print medium in two mutually perpendicular directions, respectively. For example, there are two groups of rollers in the width direction and the length direction, or two groups of rollers inclined at a certain angle, by accurately controlling the speed and stretching ratio of the two groups of rollers, the uniform stretching of the print medium in the two directions can be realized. The straightening mechanism can also include a group of traction rollers to realize the traction and straightening in the width direction or the length direction.

[0097] The above description is only exemplary embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made according to the technical concept of the present application, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A digital heat transfer printing system, characterized in that, include: A printing body for printing patterns on a printing medium; A baking mechanism includes a substrate and multiple light sources. The substrate is disposed on one side of the printing body, and the multiple light sources are disposed on the substrate. The multiple light sources are used to project light beams onto the printing pattern on the printing medium so that the hot melt adhesive liquid or hot melt adhesive powder on the printing pattern absorbs the light beams and solidifies.

2. The digital heat transfer printing system as described in claim 1, characterized in that, The printing body is used to print the hot melt adhesive onto the printing medium, so that the printed pattern on the printing medium has the hot melt adhesive; or, The digital heat transfer printing system also includes a powder-spreading mechanism, which is located between the printing body and the baking mechanism. The powder-spreading mechanism is used to spread the hot melt adhesive powder onto the printing medium so that the hot melt adhesive powder adheres to the printed pattern on the printing medium.

3. The digital heat transfer printing system as described in claim 1, characterized in that, The wavelength of the light beam projected by the light source is less than 440nm.

4. The digital heat transfer printing system as described in claim 3, characterized in that, The light source projects ultraviolet light.

5. The digital heat transfer printing system as described in claim 1, characterized in that, The distance s between the light source and the printing medium satisfies the condition: 30mm≤s≤70mm.

6. The digital heat transfer printing system as described in claim 1, characterized in that, The ink or hot melt adhesive liquid printed onto the printing medium by the printing body contains light-absorbing material, or the hot melt adhesive powder is mixed with light-absorbing material, and the light-absorbing material has an absorption rate of more than 75% for the light beam.

7. The digital heat transfer printing system as described in any one of claims 1 to 6, characterized in that, The size b of the light spot projected onto the printing medium by the baking mechanism satisfies the condition: 370 mm * 3 mm ≤ b ≤ 360 mm * 35 mm; and / or, The distance between two adjacent light sources is a, and a satisfies the condition: 7mm≤a≤12mm.

8. The digital heat transfer printing system as described in any one of claims 1 to 6, characterized in that, The plurality of light sources are arranged on the substrate in an N-row, M-column configuration, where N ≥ 2 and M ≥ N, wherein the row direction is perpendicular to the moving direction of the printing medium and the column direction is parallel to the moving direction of the printing medium.

9. The digital heat transfer printing system as described in any one of claims 1 to 6, characterized in that, The light beam is perpendicular to the printing medium; and / or, The light source is an LED light bead or a laser.

10. The digital heat transfer printing system as described in any one of claims 1 to 6, characterized in that, The baking mechanism further includes a heat dissipation component, and the substrate is disposed on the heat dissipation component; and / or The baking mechanism further includes a light-diffusing lens disposed on the light-emitting side of the plurality of lamp sources to uniformly distribute the light beams projected by the plurality of lamp sources; and / or, The digital heat transfer printing system further includes a straightening mechanism, which is connected to both ends of the printing medium in the width direction and / or acts on the printing medium in the length direction to straighten the printing medium.

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