LED light source structure

Abstract

The utility model discloses an LED light source structure comprising a substrate, the substrate is connected with a light emitting unit and a first light blocking ring surrounding the outer side of the light emitting unit, and the light emitting unit comprises a purple light LED wafer, a blue light LED wafer, an ultraviolet light LED wafer, a red light generating structure and an infrared light generating structure. The surface of the blue light LED wafer is provided with first fluorescent powder or first fluorescent conversion glue capable of converting part of blue light into yellow light, purple light, blue light, yellow light, ultraviolet light, red light and infrared light are integrated, the light source structure can generate wider spectral distribution, and the color quality and the color rendering index of light are improved. The lighting quality can be improved, and the requirements of specific application fields such as plant growth lamps, special lighting in medical equipment and the like can be met. Through the design of the multi-wavelength LED wafer combination, spectral components are controlled more accurately, so that the energy conversion efficiency is optimized, unnecessary energy loss is reduced, higher luminous efficiency is achieved, and meanwhile energy consumption is reduced.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, and in particular to an LED light source structure. Background Technology

[0002] In recent years, with the development of semiconductor technology, LEDs have been widely used in various lighting and display devices due to their advantages such as high efficiency, long lifespan, and environmental friendliness. Traditional white LEDs are usually achieved by combining blue LED chips with yellow phosphors. However, the white light produced by this structure has problems such as a cool color temperature, a low color rendering index, and is also lacking in color reproduction.

[0003] How to obtain a broader spectral distribution, thereby improving light quality, color temperature, color rendering, and the stability and reliability of light sources, is a problem that those skilled in the art have been exploring.

[0004] This utility model is based on the above-mentioned circumstances. Utility Model Content

[0005] This invention overcomes the shortcomings of the prior art and provides an LED light source structure with good color temperature, color rendering, stability and reliability.

[0006] This utility model is achieved through the following technical solution:

[0007] An LED light source structure includes a substrate, on which a light-emitting unit and a first light-blocking ring surrounding the light-emitting unit are connected. The light-emitting unit includes a violet LED chip, a blue LED chip, an ultraviolet LED chip, a red light generating structure, and an infrared light generating structure. The surface of the blue LED chip is provided with a first phosphor or a first phosphor conversion adhesive that can convert part of the blue light into yellow light.

[0008] As described above, in one LED light source structure, the infrared light generating structure includes an infrared LED chip, and the red light generating structure includes a red LED chip.

[0009] In one LED light source structure as described above, a transparent protective layer for encapsulating the light-emitting unit is connected to the inner side or open end of the first light-blocking ring.

[0010] In the LED light source structure described above, the transparent protective layer comprises a transparent colloid or a transparent glass.

[0011] In the LED light source structure described above, a second light-blocking ring is connected to the substrate. The second light-blocking ring is disposed inside the first light-blocking ring. The second light-blocking ring divides the inner cavity of the first light-blocking ring into a first receiving groove and a second receiving groove. The first receiving groove surrounds the outer side of the second receiving groove. The violet LED chip and the blue LED chip are disposed in the first receiving groove, and the violet LED chip is disposed in the second receiving groove.

[0012] As described above, in an LED light source structure, the red light generating structure and the infrared light generating structure include a second phosphor or a second phosphor conversion adhesive disposed on the surface of a violet LED chip and / or a blue LED chip and converting a portion of the violet light and / or blue light into red light and infrared light.

[0013] In the LED light source structure described above, the blue LED chip is connected to a first phosphor conversion adhesive, and the surface of the violet LED chip is connected to a second phosphor conversion adhesive. The first phosphor conversion adhesive and the second phosphor conversion adhesive constitute an encapsulating phosphor adhesive, and the first phosphor conversion adhesive and the second phosphor conversion adhesive are an integral structure.

[0014] In the LED light source structure described above, the encapsulating phosphor contains a first phosphor and a second phosphor.

[0015] In the LED light source structure described above, both the first and second light-blocking rings are circular.

[0016] In the LED light source structure described above, the substrate is further provided with conductive circuits and positive and negative pins.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] 1. This design integrates violet, blue, yellow, ultraviolet, red, and infrared light, enabling the light source structure to produce a broader spectral distribution and improving the color quality and color rendering index. This not only helps improve lighting quality but also meets the needs of specific applications, such as plant grow lights and special lighting in medical equipment. The multi-wavelength LED chip combination design allows for more precise control of the spectral composition, thereby optimizing energy conversion efficiency, reducing unnecessary energy loss, achieving higher luminous efficiency, and lowering energy consumption.

[0019] 2. This solution integrates multiple wavelength LED chips into a single package, reducing the number of external circuits and optical components. This results in a simpler and more compact overall design for the lighting or display system, reducing complexity and production costs. The integrated package allows for more diverse spectral output within a limited space, effectively saving installation space. Within the same package, different wavelengths of light can be more easily and efficiently coupled optically, ensuring effective mixing of various colors and improving the quality and uniformity of the final output light. Attached Figure Description

[0020] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, wherein:

[0021] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this utility model;

[0022] Figure 2 This is a cross-sectional schematic diagram of Embodiment 1 of this utility model;

[0023] Figure 3 This is a cross-sectional schematic diagram of Embodiment 2 of this utility model;

[0024] Figure 4 This is a schematic diagram of the structure of Embodiment 2 of this utility model. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings:

[0026] Example 1:

[0027] like Figures 1 to 2 The LED light source structure shown includes a substrate 1, on which a light-emitting unit 2 and a first light-blocking ring 31 surrounding the outside of the light-emitting unit 2 are connected. The light-emitting unit 2 includes a violet LED chip 21, a blue LED chip 22, an ultraviolet LED chip 23, a red light generating structure, and an infrared light generating structure. The surface of the blue LED chip 22 is provided with a first phosphor or a first phosphor conversion adhesive 41 that can convert part of the blue light into yellow light.

[0028] This design integrates violet, blue, yellow, ultraviolet, red, and infrared light, enabling the light source structure to produce a broader spectral distribution. This improves the color quality and color rendering index, making the colors of illuminated objects appear more realistic and vibrant. This not only enhances lighting quality but also meets the needs of specific applications, such as plant grow lights and specialized lighting in medical equipment. The multi-wavelength LED chip combination design allows for more precise control of the spectral composition, optimizing energy conversion efficiency, reducing unnecessary energy loss, achieving higher luminous efficiency, and lowering energy consumption.

[0029] Specifically, the infrared light generating structure includes an infrared LED chip 24, and the red light generating structure includes a red LED chip 25.

[0030] Furthermore, a transparent protective layer 5 for encapsulating the light-emitting unit 2 is connected to the inner side or open end of the first light-blocking ring 31. The transparent protective layer 5 not only serves a sealing function, preventing the entry of moisture, dust, and other contaminants from the external environment, but also provides physical protection, avoiding the LED chip from external impacts or vibrations, thus increasing the stability and reliability of the product. The first light-blocking ring 31 can be connected to the substrate 1 by adhesive bonding or threaded fasteners or other connection methods.

[0031] In one embodiment, the first phosphor may be a YAG:Ce phosphor, or any other phosphor that can convert blue light into yellow light.

[0032] The aforementioned transparent protective layer 5 can be a transparent colloid, transparent glass, or other transparent material. The transparent protective layer 5 can be attached to the first light-blocking ring 31 by adhesive or other bonding methods.

[0033] Example 2:

[0034] like Figures 3 to 4 The LED light source structure shown in Embodiment 2 differs from Embodiment 1 in that:

[0035] A second light-blocking ring 32 is connected to the substrate 1. The second light-blocking ring 32 is disposed inside the first light-blocking ring 31. The second light-blocking ring 32 divides the inner cavity of the first light-blocking ring 31 into a first receiving groove 61 and a second receiving groove 62. The first receiving groove 61 surrounds the outer side of the second receiving groove 62. The ultraviolet LED chip 21 and the blue LED chip 22 are disposed in the first receiving groove 61, and the ultraviolet LED chip 23 is disposed in the second receiving groove 62.

[0036] The second receiving slot 62 eliminates the need for encapsulating adhesive, reducing light absorption and allowing more ultraviolet light to be emitted directly, thus improving the efficiency of the light source. Simultaneously, the absence of encapsulating adhesive means fewer additional thermal resistance layers, facilitating more direct heat dissipation. This is particularly beneficial given the typically high heat generation of the ultraviolet LED chip 23, helping to maintain a lower operating temperature, extend LED lifespan, and ensure stable performance. Eliminating the use of encapsulating adhesive simplifies the manufacturing process, reduces material costs and processing steps, thereby lowering overall manufacturing costs.

[0037] Furthermore, the red light generating structure and the infrared light generating structure include a second phosphor or a second phosphor conversion adhesive attached to the surface of the violet LED chip 21 and / or the blue LED chip 22, which converts a portion of the violet and / or blue light into red and infrared light. By integrating violet, blue, yellow, ultraviolet, red, and infrared light, the light source structure can produce a broader spectral distribution, improving the color quality and color rendering index of the light, making the colors of the illuminated objects appear more realistic and vibrant.

[0038] Furthermore, the blue LED chip 22 is connected to a first phosphor conversion adhesive 41, and the surface of the purple LED chip 21 is connected to a second phosphor conversion adhesive. The first phosphor conversion adhesive 41 and the second phosphor conversion adhesive constitute an encapsulating phosphor adhesive 40, which is an integral structure. The encapsulating phosphor adhesive 40 contains a first phosphor and a second phosphor.

[0039] The integrated encapsulation phosphor 40 reduces the need for separate processing of two phosphor conversion adhesives, simplifying the manufacturing process. This not only reduces production complexity but also increases automation and efficiency, thereby lowering manufacturing costs. Simultaneously, it ensures a seamless connection between the two, avoiding optical performance differences caused by delamination or uneven application. This contributes to more consistent color output and higher light quality. The integrated structure allows for better mixing of light from the blue LED chip 22 and the violet LED chip 21 within the same package, resulting in a more uniform and smooth spectral distribution. This is particularly important for applications requiring high-quality white light or other composite light sources. The integrated encapsulation phosphor 40 provides better mechanical protection, reducing the impact of external environmental factors on the internal LED chips. Furthermore, it prevents the ingress of moisture and other contaminants, enhancing the stability and durability of the entire system.

[0040] In one embodiment, the second phosphor is a mixture of a red phosphor and a rare-earth ion-doped phosphor capable of converting blue light into infrared light. The red phosphor may be (Gd1-xEux)6(Te1-yMoy)O12.

[0041] Both the first light-blocking ring 31 and the second light-blocking ring 32 are circular. This effectively concentrates light within the first receiving groove 61 and the second receiving groove 62, forming two distinct light spots. The circular design helps achieve a more uniform light distribution and reduces the brightness difference between the edges and the center.

[0042] The substrate 1 is also provided with conductive circuitry and positive and negative pins 7. These pins 7 serve as standardized interfaces, allowing users or technicians to quickly identify and connect power lines, simplifying the installation and maintenance process. If an LED chip malfunctions, it can be easily tested and replaced through these pins without affecting other components.

Claims

1. An LED light source structure, characterized in that: The system includes a substrate (1), on which a light-emitting unit (2) and a first light-blocking ring (31) surrounding the outside of the light-emitting unit (2) are connected. The light-emitting unit (2) includes a purple LED chip (21), a blue LED chip (22), an ultraviolet LED chip (23), a red light generating structure, and an infrared light generating structure. The surface of the blue LED chip (22) is provided with a first phosphor or a first phosphor conversion adhesive (41) that can convert part of the blue light into yellow light.

2. The LED light source structure according to claim 1, characterized in that: The infrared light generating structure includes an infrared LED chip (24), and the red light generating structure includes a red LED chip (25).

3. The LED light source structure according to claim 2, characterized in that: The inner side or open end of the first light-blocking ring (31) is connected to a transparent protective layer (5) for encapsulating the light-emitting unit (2).

4. The LED light source structure according to claim 3, characterized in that: The transparent protective layer (5) includes a transparent colloid or a transparent glass.

5. The LED light source structure according to claim 1, characterized in that: A second light-blocking ring (32) is connected to the substrate (1). The second light-blocking ring (32) is disposed inside the first light-blocking ring (31). The second light-blocking ring (32) divides the inner cavity of the first light-blocking ring (31) into a first receiving groove (61) and a second receiving groove (62). The first receiving groove (61) surrounds the outside of the second receiving groove (62). The purple LED chip (21) and the blue LED chip (22) are disposed in the first receiving groove (61), and the ultraviolet LED chip (23) is disposed in the second receiving groove (62).

6. The LED light source structure according to claim 5, characterized in that: The red light generating structure and the infrared light generating structure include a second phosphor or a second phosphor conversion adhesive attached to the surface of the violet LED chip (21) and / or the blue LED chip (22) to convert part of the violet light and / or blue light into red light and infrared light.

7. The LED light source structure according to claim 6, characterized in that: The blue LED chip (22) is connected to a first phosphor conversion adhesive (41), and the surface of the purple LED chip (21) is connected to a second phosphor conversion adhesive. The first phosphor conversion adhesive (41) and the second phosphor conversion adhesive constitute an encapsulating phosphor adhesive (40), and the first phosphor conversion adhesive (41) and the second phosphor conversion adhesive are an integral structure.

8. The LED light source structure according to claim 7, characterized in that: The encapsulating fluorescent adhesive (40) contains a first fluorescent powder and a second fluorescent powder.

9. The LED light source structure according to claim 5, characterized in that: Both the first light-blocking ring (31) and the second light-blocking ring (32) are circular.

10. An LED light source structure according to any one of claims 1-9, characterized in that: The substrate (1) is also provided with conductive circuits and positive and negative pins (7).

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