Display device

Abstract

Embodiments provide a display device. The display device includes a display layer and a light control layer disposed on the display layer, and the light control layer includes a bank, an intermediate bank portion directly adjacent to the bank, and a color conversion layer. The light control layer includes an opening in which the bank and the intermediate bank portion are not disposed. The color conversion layer may include a base color conversion layer disposed in at least a portion of the opening and a protruding color conversion layer overlapping the middle bank portion in a plan view.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0029720, filed on February 29, 2024, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] Embodiments relate to a display device and a method of manufacturing a display device. BACKGROUND

[0004] Recently, as interest in information displays is increasing, research and development on display devices continue to be conducted. SUMMARY

[0005] Embodiments provide a display device capable of improving process convenience and a method of manufacturing the display device.

[0006] Embodiments provide a display device capable of reducing process costs and a method of manufacturing the display device.

[0007] Embodiments provide a display device having high resolution and improved display quality and a method of manufacturing the display device.

[0008] Embodiments provide a display device including a display layer; and a light control layer disposed on the display layer and including a bank, an intermediate bank portion directly adjacent to the bank, and a color conversion layer. The light control layer can include an opening in which the bank and the intermediate bank portion are not disposed. The color conversion layer can include a base color conversion layer disposed in at least a portion of the opening and a protruding color conversion layer overlapping the intermediate bank portion in a plan view.

[0009] The bank can have a height higher than a height of the intermediate bank portion.

[0010] The base color conversion layer and the protruding color conversion layer can be integral with each other and can include the same material. The bank and the intermediate bank portion can be integral with each other and include the same material. The base color conversion layer can have a volume greater than a volume of the protruding color conversion layer.

[0011] The display device can include a sub-pixel region in which light of one color is provided, and a non-sub-pixel region adjacent to the sub-pixel region. The sub-pixel region can include a first sub-pixel region in which light of a first color is provided, a second sub-pixel region in which light of a second color is provided, and a third sub-pixel region in which light of a third color is provided. The opening can include a first opening overlapping the first sub-pixel region in a plan view, a second opening overlapping the second sub-pixel region in a plan view, and a third opening overlapping the third sub-pixel region in a plan view. The protruding color conversion layer can overlap the non-sub-pixel region in a plan view.

[0012] The first opening and the second opening can be spaced apart from each other by a first distance. The second opening and the third opening can be spaced apart from each other by a second distance smaller than the first distance.

[0013] The protruding color conversion layer can include a first protruding color conversion layer adjacent to the first sub-pixel region, and a second protruding color conversion layer adjacent to the second sub-pixel region. The first sub-pixel region, the second sub-pixel region, and the third sub-pixel region can be adjacent to each other in a first direction. The first protruding color conversion layer and the second protruding color conversion layer can overlap in a second direction different from the first direction.

[0014] The intermediate bank portion can include an upper surface forming a height lower than a height of the bank, and a sloped surface facing the base color conversion layer.

[0015] The intermediate bank portion can include a sloped surface having one end portion adjacent to the bank, and another end portion adjacent to an upper surface of the display layer.

[0016] The intermediate bank portion can include a sloped surface having one end portion adjacent to the bank, and another end portion adjacent to an upper surface of the display layer.

[0017] The intermediate bank portion can include a first intermediate bank portion disposed on one side of the base color conversion layer, and a second intermediate bank portion disposed on another side of the base color conversion layer.

[0018] The display apparatus can include first, second, and third sub-pixels providing light of first, second, and third colors, respectively, and a scattering layer included in the third sub-pixel. The color conversion layer can include a first color conversion layer forming the first sub-pixel and a second color conversion layer forming the second sub-pixel. The bulk color conversion layer can include a first bulk color conversion layer included in the first color conversion layer and a second bulk color conversion layer included in the second color conversion layer. The protruding color conversion layer can include a first protruding color conversion layer included in the first color conversion layer and a second protruding color conversion layer included in the second color conversion layer.

[0019] The display apparatus can include first, second, and third sub-pixels providing light of first, second, and third colors, respectively, and a scattering layer included in the third sub-pixel. The protruding color conversion layer can be formed in the second sub-pixel and not formed in the first sub-pixel.

[0020] The first sub-pixel can be disposed between the second sub-pixel and the third sub-pixel. The protruding color conversion layer can include a plurality of protruding color conversion layers. Some of the plurality of protruding color conversion layers can be disposed on one side of the bulk color conversion layer, and other of the plurality of protruding color conversion layers can be disposed on another side of the bulk color conversion layer.

[0021] The display apparatus can include a plurality of pixels each including a plurality of sub-pixels forming a plurality of sub-pixel regions. The plurality of sub-pixel regions can be spaced apart from each other in a first direction. The plurality of pixels can include first and second pixels spaced apart from each other in a second direction different from the first direction. The intermediate bank portion can be disposed between the opening of the light control layer for the first pixel and the opening of the light control layer for the second pixel.

[0022] The display apparatus can include a fluid channel formed between the opening of the light control layer for the first pixel and the opening of the light control layer for the second pixel, and the intermediate bank portion is not disposed in the fluid channel.

[0023] The display apparatus can further include a color filter layer disposed on the light control layer and including a color filter. The display layer can include a light emitting element providing light to a light emitting region. The light emitting region can overlap the color filter and the color conversion layer in a plan view.

[0024] The display device can include a sub-pixel region in which light of a color is provided and a non-sub-pixel region adjacent to the sub-pixel region. The sub-pixel region can include a first sub-pixel region in which light of a first color is provided, a second sub-pixel region in which light of a second color is provided, and a third sub-pixel region in which light of a third color is provided. The light emitting element can emit light including a light component of the third color.

[0025] Another embodiment provides a method of manufacturing a display device, the method including manufacturing a display layer and forming a light control layer on the display layer. The forming of the light control layer can include patterning bank and intermediate bank portions on the display layer and patterning a color conversion layer and a scattering layer on the display layer. The patterning of the bank and the intermediate bank portions can include forming openings in which the bank and the intermediate bank portions are not disposed. The color conversion layer can include a bulk color conversion layer and a protruding color conversion layer. The patterning of the color conversion layer can include disposing the bulk color conversion layer in the openings and disposing the protruding color conversion layer to overlap the intermediate bank portions in a plan view.

[0026] The patterning of the bank and the intermediate bank portions can include forming an inkjet margin region that overlaps the intermediate bank portions in a plan view. The patterning of the color conversion layer can include providing ink to an ink-providing region formed across the openings and the inkjet margin region.

[0027] The patterning of the color conversion layer can include moving the ink provided in the ink-providing region to a region within the openings.

[0028] The protruding color conversion layer can include a plurality of protruding color conversion layers. Some of the plurality of protruding color conversion layers can be disposed on one side of the bulk color conversion layer and other of the plurality of protruding color conversion layers can be disposed on another side of the bulk color conversion layer.

[0029] The openings can include openings that can be included in different pixels, respectively. The inkjet margin region can be disposed between the openings.

[0030] The ink-providing region can have an ink region length and the openings can have an opening width. The ink region length can be greater than the opening width.

[0031] The patterning of the banks and the intermediate bank portions can include forming the banks and the intermediate bank portions using a mask including half-tone regions or a slit mask.

[0032] According to embodiments of the disclosure, a display device having improved process convenience and a method of manufacturing the display device can be provided.

[0033] According to embodiments, a display device capable of reducing process costs and a method of manufacturing the display device can be provided.

[0034] According to embodiments, a display device having high resolution and improved display quality and a method of manufacturing the display device can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 A schematic top plan view of a display device according to an embodiment is shown.

[0036] Figure 2 A schematic cross-sectional view of a display device according to an embodiment is shown.

[0037] Figure 3 A schematic view of a display layer according to an embodiment is shown.

[0038] Figure 4 、 Figure 5 and Figure 6 A schematic top plan view of a display device according to an embodiment is shown.

[0039] Figure 7 A schematic cross-sectional view taken along the line A-A’ of Figures 4 to 6 is shown.

[0040] Figure 8 and Figure 10 、 Figure 11 、 Figure 12 and Figure 13 A schematic cross-sectional view of a structure formed by banks and intermediate bank portions according to an embodiment is shown.

[0041] Figure 9 A schematic top plan view of a step in a method of manufacturing a display device according to an embodiment is shown, in which an inkjet printing process is performed.

[0042] Figure 14 、 Figure 15 and Figure 16 A schematic top plan view of a display device according to another embodiment is shown.

[0043] Figure 17 A schematic cross-sectional view taken along the line B-B’ of Figures 14 to 16 is shown.

[0044] Figure 18 、 Figure 19 and Figure 20 shows a schematic top plan view of a display device according to another embodiment.

[0045] Figure 21 and Figure 23 shows a schematic cross-sectional view taken along the line C-C’ of Figures 18 to 20 .

[0046] Figure 22 and Figure 24 shows a schematic cross-sectional view taken along the line D-D’ of Figures 18 to 20 .

[0047] Figure 25 shows a flow chart illustrating a method of manufacturing a display device according to an embodiment.

[0048] Figure 26 shows a flow chart illustrating a step of forming a light control layer on a display layer of Figure 25 .

[0049] Figure 27 、 Figure 28 、 Figure 29 、 Figure 30 、 Figure 31 and Figure 32 shows a schematic view of process steps of a method of manufacturing a display device according to an embodiment.

[0050] Figure 33 shows a schematic top plan view of a step of performing an inkjet printing process among process steps of a method of manufacturing a display device according to another embodiment.

[0051] Figure 34 shows a schematic top plan view of a step of performing an inkjet printing process among process steps of a method of manufacturing a display device according to another embodiment. DETAILED DESCRIPTION

[0052] As the present disclosure can be varied in various ways and have various forms, embodiments will be shown and described in the following detailed description. It is however not intended to limit the present application to the described embodiments, and it should be understood that the present application includes all changes, equivalents, and substitutes that come within the spirit and scope of the present disclosure.

[0053] Terms such as "first" and "second" will be used only to describe various constituent elements, and should not be construed as limiting the constituent elements. The terms are used only to distinguish one constituent element from another constituent element. For example, a first constituent element can be referred to as a second constituent element, and similarly, a second constituent element can be referred to as a first constituent element, without departing from the scope of the present disclosure. Singular forms are intended to include plural forms unless the context clearly indicates otherwise.

[0054] In the present disclosure, it will be understood that the terms "comprise", "include", "have", or "configure" indicate that there is the feature, number, step, operation, constituent element, part, or combination described in the description, but do not exclude the possibility of pre-existing or additionally one or more other features, numbers, steps, operations, constituent elements, parts, or combinations. It will be understood that when an element such as a layer, film, region, area, or substrate is referred to as "on" another element, the element can be directly on the other element, or an intervening element can also be present. In the description, when an element such as a layer, film, region, area, or plate is referred to as formed "on" another element, the formation direction is not limited to the upward direction but includes the lateral direction or the downward direction. Conversely, when an element such as a layer, film, region, area, or plate is referred to as "under" another element, the element can be directly under the other element, or an intervening element can be present.

[0055] The present disclosure relates to a display device and a method of manufacturing a display device. Hereinafter, a display device and a method of manufacturing a display device according to an embodiment will be described with reference to the accompanying drawings.

[0056] Figure 1 A schematic top plan view of a display device according to an embodiment is shown.

[0057] Referring to Figure 1 The display device DD can include a base layer BSL and pixels PXL disposed on the base layer BSL. The display device DD can further include a driving circuit portion (e.g., a scan driver and a data driver) for driving the pixels PXL, a wiring, and a pad.

[0058] The display device DD (or the base layer BSL) can include a display area DA and a non-display area NDA. The non-display area NDA can be an area other than the display area DA. The non-display area NDA can surround at least a portion of the display area DA.

[0059] The base layer BSL can form a base surface of the display device DD. In some embodiments, the base layer BSL can be a lower substrate for disposing layers forming the display device DD. The base layer BSL can be a rigid substrate or a rigid film or a flexible substrate or a flexible film. For example, the base layer BSL can include a glass material. In another example, the base layer BSL can include a silicon material. In another example, the base layer BSL can include a polyimide. However, embodiments are not limited thereto.

[0060] The display area DA can be an area in which the pixel PXL is disposed. The non-display area NDA can be an area in which the pixel PXL is not disposed. In the non-display area NDA, a driving circuit portion, a wiring, and a pad connected to the pixel PXL of the display area DA can be disposed.

[0061] According to an embodiment, the pixel PXL (or the sub-pixel SPX) can be arranged according to a stripe or a five-wafer The arrangement structure, but embodiments are not limited thereto, and various examples can be applied thereto.

[0062] According to an embodiment, the pixel PXL (or the sub-pixel SPX) can include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 can be a sub-pixel. At least one of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 can form a pixel unit capable of emitting light of various colors.

[0063] Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 can emit light of one color.

[0064] For example, the first sub-pixel SPX1 can be a red pixel emitting red (e.g., a first color) light, and the second sub-pixel SPX2 can be a green pixel emitting green (e.g., a second color) light, and the third sub-pixel SPX3 can be a blue pixel emitting blue (e.g., a third color) light. The red pixel can provide light in a wavelength band of about 600 nm to about 750 nm. The green pixel can provide light in a wavelength band of about 480 nm to about 560 nm. The blue pixel can provide light in a wavelength band of about 370 nm to about 460 nm.

[0065] According to an embodiment, the number of the second sub-pixel SPX2 can be greater than the number of the first sub-pixel SPX1 and the number of the third sub-pixel SPX3. However, the color, the type, and / or the number of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 forming each of the above-described pixel units are not limited thereto.

[0066] Reference will be made to Figure 2 and Figure 3 A general structure including a cross-sectional structure of a display device DD according to an embodiment will be described.

[0067] Figure 2 A schematic cross-sectional view of a display device according to an embodiment is shown. Figure 3 A schematic view of a display layer according to an embodiment is shown.

[0068] Reference will be made to Figure 2 and Figure 3 , the display device DD can include a display layer DL, a light control layer LCL, a color filter layer CFL, and an upper layer UL.

[0069] The display layer DL can emit light. The display layer DL can form a base on which the light control layer LCL is disposed.

[0070] The display layer DL can include a pixel circuit layer PCL including a base layer BSL, and a light emitting element layer LEL including light emitting elements LD to enable formation of pixels PXL (see Figure 1 ).

[0071] The base layer BSL can form a base on which pixel circuits PXC are disposed. The pixel circuits PXC can be disposed on the base layer BSL and can drive the light emitting elements LD. The pixel circuit layer PCL can include conductive layers and insulating layers, and the conductive layers can form the pixel circuits PXC. The pixel circuits PXC can include circuit elements that can drive sub-pixels SPX (see Figure 1 ) (or light emitting elements LD). The circuit elements can include drive transistors, and can also include additional transistors and capacitors.

[0072] The light emitting element layer LEL can be disposed on the pixel circuit layer PCL. In some embodiments, the light emitting element layer LEL can include light emitting elements LD.

[0073] For example, the light emitting elements LD can include organic light emitting diodes (OLEDs) including organic materials. Figure 3 An embodiment in which the light emitting elements LD are organic light emitting diodes and a cross-sectional structure of the display device DD in a display area DA are schematically shown, Figure 3 A cross-sectional structure of the display layer DL including the pixel circuit layer PCL and the light emitting element layer LEL is schematically shown.

[0074] In some embodiments, the light emitting element layer LEL can also include a pixel defining layer PDL, a capping layer CPL, and a thin film encapsulation layer TFE.

[0075] In some embodiments, the light emitting element LD can be disposed on the pixel circuit layer PCL. The light emitting element LD can include a first light emitting element included in the first sub-pixel SPX1, a second light emitting element included in the second sub-pixel SPX2, and a third light emitting element included in the third sub-pixel SPX3.

[0076] In some embodiments, the light emitting element LD can include a first electrode EL1, a light emitting part EL, and a second electrode EL2. In some embodiments, the light emitting part EL can be disposed in an area defined by the pixel defining layer PDL. One surface of the light emitting part EL can be electrically connected to the first electrode EL1, and the other surface of the light emitting part EL can be electrically connected to the second electrode EL2.

[0077] In some embodiments, the light emitting element LD can form a light emitting area EMA. The light emitting area EMA can be an area in which light emitted by the light emitting element LD is provided. In some embodiments, the light emitting area EMA can correspond to (or overlap with) an area in which the first electrode EL1 is exposed by the pixel defining layer PDL. However, embodiments are not limited thereto.

[0078] The first electrode EL1 can be an anode electrode for the light emitting part EL, and the second electrode EL2 can be a cathode electrode for the light emitting part EL. In some embodiments, the first electrode EL1 and the second electrode EL2 can include a conductive material. For example, the conductive material can include one or more of gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt). In some embodiments, the conductive material can include one or more of silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), antimony zinc oxide (AZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, and graphene. However, embodiments are not limited thereto.

[0079] The light emitting part EL can emit light based on an electrical signal provided from the anode electrode (e.g., the first electrode EL1) and the cathode electrode (e.g., the second electrode EL2).

[0080] The light emitting part EL can include a multi-layer structure. For example, each light emitting part EL can include a light emitting structure including a hole transport part, a light emitting layer (or a light generating layer), and an electron transport part. Each layer forming the light emitting structure can include an organic material, and in some embodiments, the each layer can further include an inorganic material such as a quantum dot or a metal-containing compound.

[0081] In some embodiments, the light-emitting portion EL can not include a light component of the second color, and can emit light of a third color including a light component of the third color. For example, the light-emitting structure can include a multilayer structure that emits light of the third color. Thus, the light emitted by the light-emitting portion EL can be light of the third color.

[0082] In some embodiments, the light-emitting portion EL can include a tandem structure. For example, the light-emitting portion EL can emit light of one color including a light component of the second color and a light component of the third color. For example, the light-emitting structure can include a first light-emitting structure and a second light-emitting structure. The first light-emitting structure can include a multilayer structure that emits light of the second color. The second light-emitting structure can include a multilayer structure that emits light of the third color. Thus, the light emitted by the light-emitting portion EL can be a mixture of light of the second color and light of the third color.

[0083] The hole-transporting portion can include a multilayer structure having a plurality of layers each including a different material. For example, the hole-transporting portion can include at least one of a hole-injection layer and a hole-transporting layer, and in some embodiments, the hole-transporting portion can further include a light-emitting auxiliary layer and an electron-blocking layer. For example, the hole-transporting portion can have a multilayer structure such as a hole-injection layer / hole-transporting layer, a hole-injection layer / hole-transporting layer / light-emitting auxiliary layer, a hole-transporting layer / light-emitting auxiliary layer, an electron-blocking layer / hole-injection layer / hole-transporting layer, a plurality of hole-transporting layers sequentially disposed and including different materials, or a hole-injection layer / hole-transporting layer / electron-blocking layer. However, embodiments are not limited thereto.

[0084] The light-emitting layer can include a material that emits light of one color. The light-emitting layer can include a host and a dopant. The host of the light-emitting layer is a light-emitting material that traps carriers (electrons and holes) for light generation, and can induce excitons to be efficiently generated. The dopant can include a phosphorescent dopant or a fluorescent dopant. In some embodiments, examples of the dopant are not particularly limited. In some embodiments, the dopant can include an organic material or a metal complex.

[0085] The electron-transporting portion can include a multilayer structure having a plurality of layers each including a different material. The electron-transporting portion can include at least one of an electron-injection layer and an electron-transporting layer, and in some embodiments, the electron-transporting portion can further include an electron-buffering layer, an electron-controlling layer, and a hole-blocking layer. For example, the electron-transporting portion can have a multilayer structure such as an electron-transporting layer / electron-injection layer, a hole-blocking layer / electron-transporting layer / electron-injection layer, an electron-controlling layer / electron-transporting layer / electron-injection layer, or an electron-buffering layer / electron-transporting layer / electron-injection layer. However, embodiments are not limited thereto.

[0086] A pixel definition layer PDL can be provided on the pixel circuit layer PCL to define a position where the light emitting portion EL is provided. The pixel definition layer PDL can include an organic material. For example, the pixel definition layer PDL can include one or more of an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin. However, embodiments are not limited thereto. In another embodiment, the pixel definition layer PDL can include an inorganic material. For example, the pixel definition layer PDL can include one or more of silicon oxide (SiO x ) and silicon nitride (SiN x ). In some embodiments, the pixel definition layer PDL can have a multi-layer structure in which a layer including silicon oxide (SiO x ) and a layer including silicon nitride (SiN x ) are stacked.

[0087] A capping layer CPL can be provided on the second electrode EL2. The capping layer CPL can cap the second electrode EL2. The capping layer CPL can include an inorganic material.

[0088] A sealing layer TFE can be provided on the light emitting element LD (e.g., the second electrode EL2). The sealing layer TFE can offset a horizontal difference generated by the light emitting element LD and the pixel definition layer PDL. The sealing layer TFE can include an insulating film that covers the light emitting element LD. In some embodiments, the sealing layer TFE can have a structure in which an inorganic film and an organic film are alternately stacked with each other. In some embodiments, the sealing layer TFE can be a thin sealing film.

[0089] In some embodiments, the light emitting element LD can be an inorganic light emitting diode including an inorganic material. For example, as described above, the light emitting element LD can emit light of a third color, and in some embodiments, the light emitting element LD can emit light including a light component of a second color and a light component of a third color.

[0090] A light control layer LCL can be provided on the display layer DL (e.g., the light emitting element layer LEL). For example, the light control layer LCL can be provided on an upper side of the display layer DL in a display direction (e.g., the third direction DR3).

[0091] In some embodiments, the light control layer LCL can change a color of the applied light and can be a layer that scatters the applied light. For example, the light control layer LCL can include a color conversion layer CCL (see Figure 5 ) and a scattering layer SCL (see Figure 5 ).

[0092] A color filter layer CFL can be provided on the light control layer LCL. For example, the color filter layer CFL can be provided on an upper side of the light control layer LCL in a display direction (e.g., the third direction DR3).

[0093] In some embodiments, the color filter layer CFL can comprise a color filter CF that selectively transmits light of a color (see Figure 7 ).

[0094] The upper layer UL can be disposed on the color filter layer CFL. For example, the upper layer UL can be disposed on an upper side of the color filter layer CFL in a display direction (e.g., the third direction DR3).

[0095] In some embodiments, the upper layer UL can comprise an upper substrate (e.g., a glass substrate). In another example, the upper layer UL can comprise an upper film layer. However, embodiments are not limited thereto.

[0096] A display device DD according to embodiments will be described with reference to Figures 4 to 13 . For the sake of convenience, simplicity, or redundancy of description, not all redundant descriptions will be repeated.

[0097] Figures 4 to 6 A schematic top plan view of a display device according to embodiments is shown. Figure 7 A schematic cross-sectional view taken along the line A-A’ of Figures 4 to 6 is shown. Figures 4 to 6 A pixel PXL is shown and the same regions are shown. Figure 4 A bank BNK and an intermediate bank portion BNK_M are schematically shown. Figure 5 A bank BNK, a color conversion layer CCL, and a scattering layer SCL are schematically shown. Figure 6 A light blocking member LBS is schematically shown. Based on Figures 4 to 6 , the disposition relationship of the components will be more clearly understood.

[0098] Figure 8 and Figures 10 to 13 A schematic cross-sectional view of a structure formed by a bank and an intermediate bank portion according to embodiments is shown. Figure 9 A schematic top plan view of a step of performing an inkjet printing process among steps of a method of manufacturing a display device according to embodiments is shown.

[0099] With reference to Figures 4 to 8 , a display device DD (e.g., a pixel PXL) can comprise a bank BNK and an intermediate bank portion BNK_M.

[0100] The bank BNK and the intermediate bank portion BNK_M can be patterned in the display area DA. The bank BNK and the intermediate bank portion BNK_M can not be disposed in a partial area of the display area DA. For example, the bank BNK and the intermediate bank portion BNK_M can form an opening OPN. The bank BNK and the intermediate bank portion BNK_M can protrude in a thickness direction (e.g., the third direction DR3) of the base substrate layer BSL and can surround the opening OPN. The bank BNK and the intermediate bank portion BNK_M can expose the display layer DL (e.g., the encapsulation layer TFE) in the opening OPN. The bank BNK and the intermediate bank portion BNK_M can not be disposed in the opening OPN.

[0101] The bank BNK and the intermediate bank portion BNK_M can be adjacent to (e.g., directly adjacent to) each other. The bank BNK and the intermediate bank portion BNK_M can be integral to each other. The bank BNK and the intermediate bank portion BNK_M can be formed by the same process and can include the same material. For example, the bank BNK and the intermediate bank portion BNK_M can include one or more of an acrylic resin, an epoxy resin, a phenol resin, a polyamide resin, and a polyimide resin. In some embodiments, the bank BNK can include a light blocking material (e.g., a black matrix). However, embodiments are not limited thereto.

[0102] In some cases, an ink ejection margin area IMA can be formed in the display area DA. The ink ejection margin area IMA can correspond to a location of the intermediate bank portion BNK_M. The ink ejection margin area IMA can overlap the intermediate bank portion BNK_M in a plan view. The ink ejection margin area IMA can not overlap the bank BNK in a plan view.

[0103] The plan view defined in the description is a direction extending in the first direction DR1 and the second direction DR2, and can be defined based on a plane on which the base substrate layer BSL is disposed. In some embodiments, the third direction DR3 can be a thickness direction of the base substrate layer BSL, and the third direction DR3 can be a light emitting direction of the display device DD.

[0104] The opening OPN can include a first opening OPN1, a second opening OPN2, and a third opening OPN3. In some embodiments, the first opening OPN1 can be included in the first sub-pixel SPX1 and can overlap the first sub-pixel area SPXA1 in a plan view. The second opening OPN2 can be included in the second sub-pixel SPX2 and can overlap the second sub-pixel area SPXA2 in a plan view. The third opening OPN3 can be included in the third sub-pixel SPX3 and can overlap the third sub-pixel area SPXA3 in a plan view.

[0105] The intermediate bank portion BNK_M can include a first intermediate bank portion BNK_M1 and a second intermediate bank portion BNK_M2. In some embodiments, the first intermediate bank portion BNK_M1 can not be included in the first sub-pixel SPX1 and can not overlap the first sub-pixel area SPXA1 in a plan view. The second intermediate bank portion BNK_M2 can not be included in the second sub-pixel SPX2 and can not overlap the second sub-pixel area SPXA2 in a plan view.

[0106] The ink ejection margin area IMA can include a first ink ejection margin area IMA1 and a second ink ejection margin area IMA2. In some embodiments, the first ink ejection margin area IMA1 can be adjacent (e.g., directly adjacent) to the first opening OPN1 and can overlap the first intermediate bank portion BNK_M1 in a plan view. The second ink ejection margin area IMA2 can be adjacent (e.g., directly adjacent) to the second opening OPN2 and can overlap the second intermediate bank portion BNK_M2 in a plan view.

[0107] The openings OPN and the ink ejection margin area IMA can be adjacent (e.g., directly adjacent) to each other. In some embodiments, the first and second openings OPN1 and OPN2 and the ink ejection margin area IMA can be areas in which ink INK is supplied during / while an inkjet process of forming the color conversion layer CCL (see Figure 9 ) is performed.

[0108] In some embodiments, the first to third openings OPN1 to OPN3 can be disposed along a first direction DR1. In some embodiments, the first and second intermediate bank portions BNK_M1 and BNK_M2 can overlap each other along a second direction DR2 different from the first direction DR1. The first and second ink ejection margin areas IMA1 and IMA2 can overlap each other along the second direction DR2 different from the first direction DR1. The first and second ink ejection margin areas IMA1 and IMA2 can overlap the first to third openings OPN1 to OPN3, respectively, along the first direction DR1.

[0109] In some embodiments, the first and second openings OPN1 and OPN2 can be spaced apart from each other by a first distance L1 in the first direction DR1 in a plan view. The second and third openings OPN2 and OPN3 can be spaced apart from each other by a second distance L2 in the first direction DR1 in a plan view. The first distance L1 can be greater than the second distance L2. This structure can be defined by forming the ink ejection margin area IMA between the first and second openings OPN1 and OPN2. For example, the first and second ink ejection margin areas IMA1 and IMA2 can be disposed in an area between some of the openings OPN and can reduce the risk of overextension of the spacing (or distance) between the openings OPN.

[0110] The display device DD (e.g., the pixel PXL) can include a color conversion layer CCL and a scattering layer SCL disposed in the display area DA.

[0111] The color conversion layer CCL can be patterned in the display area DA. The color conversion layer CCL can be disposed in an area surrounded by the bank BNK. In a plan view, the color conversion layer CCL can not overlap the bank BNK. In a plan view, the color conversion layer CCL can overlap the intermediate bank portion BNK_M. A portion of the color conversion layer CCL can be disposed in the opening OPN. A portion of the color conversion layer CCL can be disposed in the inkjet margin area IMA.

[0112] The color conversion layer CCL can change a color of light. For example, the color conversion layer CCL can include a first color conversion layer CCL1 and a second color conversion layer CCL2.

[0113] The first color conversion layer CCL1 can be a layer for forming the first sub-pixel SPX1. The first color conversion layer CCL1 can include first color conversion particles that convert light (e.g., light including a light component of a third color) provided by the light emitting element LD into light of a first color. For example, the first color conversion layer CCL1 can include first quantum dots that convert light of the third color into light of the first color. The first quantum dots can absorb light of the third color and shift a wavelength according to an energy transition to emit light of the first color. The first quantum dots can be dispersed and provided in a matrix layer including an organic material, etc., included in the first color conversion layer CCL1.

[0114] The second color conversion layer CCL2 can be a layer for forming the second sub-pixel SPX2. The second color conversion layer CCL2 can include second color conversion particles that convert light (e.g., light including a light component of a third color) provided by the light emitting element LD into light of a second color. For example, the second color conversion layer CCL2 can include second quantum dots that convert light of the third color into light of the second color. The second quantum dots can absorb light of the third color and shift a wavelength according to an energy transition to emit light of the second color. The second quantum dots can be dispersed and provided in a matrix layer including an organic material, etc., included in the second color conversion layer CCL2.

[0115] The color conversion layer CCL can include a base color conversion layer CCL_B and a protruding color conversion layer CCL_P. The base color conversion layer CCL_B and the protruding color conversion layer CCL_P can be integral with each other. The base color conversion layer CCL_B and the protruding color conversion layer CCL_P can be formed by the same inkjet process and can include the same material.

[0116] The bulk color conversion layer CCL B can be disposed in the opening OPN. In plan view, the bulk color conversion layer CCL B can not overlap the bank BNK and the intermediate bank portion BNK M.

[0117] The protruding color conversion layer CCL P can be disposed in the inkjet margin area IMA. In plan view, the protruding color conversion layer CCL P can not overlap the bank BNK, but can overlap the intermediate bank portion BNK M.

[0118] In some embodiments, in plan view, an area of the protruding color conversion layer CCL P can be less than an area of the bulk color conversion layer CCL B.

[0119] The bulk color conversion layer CCL B can include a first bulk color conversion layer CCL1 B included in the first color conversion layer CCL1 and a second bulk color conversion layer CCL2 B included in the second color conversion layer CCL2.

[0120] The protruding color conversion layer CCL P can include a first protruding color conversion layer CCL1 P included in the first color conversion layer CCL1 and a second protruding color conversion layer CCL2 P included in the second color conversion layer CCL2.

[0121] In some embodiments, the first protruding color conversion layer CCL1 P can be formed on a first side of the first bulk color conversion layer CCL1 B. The second protruding color conversion layer CCL2 P can be formed on a second side of the second bulk color conversion layer CCL2 B. The first side and the second side can be oriented in opposite directions. In some embodiments, the first protruding color conversion layer CCL1 P and the second protruding color conversion layer CCL2 P can overlap each other in a second direction DR2 in plan view.

[0122] In some embodiments, the first bulk color conversion layer CCL1 B and the second bulk color conversion layer CCL2 B can be spaced apart from each other by a first distance L1 in a first direction DR1 in plan view. In plan view, the second bulk color conversion layer CCL2 B and the scattering layer SCL can be spaced apart from each other by a second distance L2 in the first direction DR1. The first distance L1 can be greater than the second distance L2.

[0123] The scattering layer SCL can be patterned in the display area DA. The scattering layer SCL can be disposed in an area surrounded by the bank BNK. In plan view, the scattering layer SCL can not overlap the bank BNK.

[0124] The scattering layer SCL can be a layer for improving light emission efficiency of the display device DD and improving viewing angle characteristics. The scattering layer SCL can include scatterers. The scatterers can be dispersed and provided in a matrix layer including, for example, an organic material (e.g., a transparent organic material) in the scattering layer SCL. In some embodiments, the scatterers can include various light scattering particles. For example, the scatterers can include one or more of titanium oxide (TiO x ), silicon dioxide (SiO x ) (e.g., silicon dioxide beads or hollow silicon dioxide, etc.), zirconium oxide (ZrO x ), aluminum oxide (Al x O y ), indium oxide (In x O y ), zinc oxide (ZnO x ), tin oxide (SnO x ), and antimony oxide (Sb x O y ). However, embodiments are not limited thereto.

[0125] In some embodiments, the display device DD can include a sub-pixel area SPXA in which light of one color is provided and a non-sub-pixel area NSPA in which light of one color is not provided. The display device DD can include a light blocking member LBS.

[0126] The sub-pixel area SPXA can overlap the opening OPN in a plan view. In the plan view, the sub-pixel area SPXA can not overlap the ink ejection margin area IMA. In the plan view, the non-sub-pixel area NSPA can overlap the ink ejection margin area IMA.

[0127] In some embodiments, the sub-pixel area SPXA can include a first sub-pixel area SPXA1 to a third sub-pixel area SPXA3. The first sub-pixel area SPXA1 can be an area in which light of a first color is provided, and can be an area in which a first base color conversion layer CCL1_B is disposed. The second sub-pixel area SPXA2 can be an area in which light of a second color is provided, and can be an area in which a second base color conversion layer CCL2_B is disposed. The third sub-pixel area SPXA3 can be an area in which light of a third color is provided, and can be an area in which a scattering layer SCL is disposed.

[0128] A portion of the color conversion layer CCL and the scattering layer SCL can be disposed in the sub-pixel area SPXA. For example, the base color conversion layer CCL_B can be disposed in the sub-pixel area SPXA, and the protruding color conversion layer CCL_P can not be disposed in the sub-pixel area SPXA.

[0129] In some embodiments, the first sub-pixel region SPXA1 and the second sub-pixel region SPXA2 can be spaced apart from each other by a first distance L1 in the first direction DR1 in a plan view. In the plan view, the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3 can be spaced apart from each other by a second distance L2 in the first direction DR1. The first distance L1 can be greater than the second distance L2.

[0130] In the plan view, the light blocking member LBS can not overlap the sub-pixel region SPXA and can be disposed in the non-sub-pixel region NSPA. Due to the formation of the light blocking member LBS, the risk of color mixing between the sub-pixels SPX can be reduced.

[0131] In some embodiments, the color conversion layer CCL can be formed by an inkjet process. At least a portion of the color conversion layer CCL can be provided in the opening OPN to form the sub-pixel region SPXA, and at least another portion of the color conversion layer CCL can be provided in the inkjet margin region IMA to be formed in the non-sub-pixel region NSPA. According to an embodiment, in order to perform the inkjet process, the inkjet margin region IMA can be formed, which forms a margin in which an ink droplet is provided, but the inkjet margin region IMA can not correspond to (or can not overlap) the sub-pixel region SPXA. For example, an intermediate bank portion BNK_M can be formed in the inkjet margin region IMA, which forms a relatively small accommodation space than that of the bank BNK. Accordingly, the amount of ink required to perform the inkjet process can be reduced, and process margin can be guaranteed or ensured, so that process convenience can be improved, and process cost can be reduced.

[0132] In some embodiments, the light control layer LCL, the color filter layer CFL, and the upper layer UL can be disposed on the display layer DL.

[0133] The light emitting element LD formed in the display layer DL can be disposed in each of the plurality of sub-pixel regions SPXA. For example, the light emitting element LD can include a first light emitting element LD1 included in a first sub-pixel SPX1 disposed in the first sub-pixel region SPXA1, a second light emitting element LD2 included in a second sub-pixel SPX2 disposed in the second sub-pixel region SPXA2, and a third light emitting element LD3 included in a third sub-pixel SPX3 disposed in the third sub-pixel region SPXA3.

[0134] In some embodiments, the first to third light emitting elements LD1 to LD3 can emit light including a light component of a third color. For example, the first to third light emitting elements LD1 to LD3 can emit light of the third color in the same manner. In some embodiments, the first to third light emitting elements LD1 to LD3 can emit light including a light component of a second color and a light component of a third color. For example, the first to third light emitting elements LD1 to LD3 can emit light of one color that is a mixture of the light component of the second color and the light component of the third color.

[0135] In some embodiments, the light emitting area EMA formed by the light emitting elements LD can overlap with the sub-pixel area SPXA in a plan view.

[0136] The light emitting area EMA (or the light emitting element LD) can overlap with the base color conversion layer CCL_B and the color filter CF in a plan view. The light emitting area EMA (or the light emitting element LD) can overlap with the scattering layer SCL and the color filter CF in a plan view. The light emitting area EMA (or the light emitting element LD) can not overlap with the protruding color conversion layer CCL_P in a plan view.

[0137] In some embodiments, light provided by the first light emitting element LD1 can pass through the first base color conversion layer CCL1_B and the first color filter CF1 to be provided as light of a first color, and an area corresponding to the first light emitting element LD1 can form a first sub-pixel area SPXA1. Light provided by the second light emitting element LD2 can pass through the second base color conversion layer CCL2_B and the second color filter CF2 to be provided as light of a second color, and an area corresponding to the second light emitting element LD2 can form a second sub-pixel area SPXA2. Light provided by the third light emitting element LD3 can pass through the scattering layer SCL and the third color filter CF3 to be provided as light of a third color, and an area corresponding to the third light emitting element LD3 can form a third sub-pixel area SPXA3.

[0138] The light control layer LCL can be disposed on the display layer DL (e.g., the encapsulation layer TFE). As described above, the light control layer LCL can include the color conversion layer CCL including the base color conversion layer CCL_B and the protruding color conversion layer CCL_P, the scattering layer SCL, the bank BNK, and the intermediate bank portion BNK_M, and can further include the lower cap layer CPL_Q.

[0139] The bank BNK and the intermediate bank portion BNK_M can expose an upper surface of the display layer DL (e.g., an upper surface of the encapsulation layer TFE).

[0140] The bank BNK can have a height higher than a height of the intermediate bank portion BNK_M. In the description, a height of a component can be defined in a thickness direction (e.g., the third direction DR3) of the base substrate layer BSL. Thus, as described above, a volume of the protruding color conversion layer CCL_P disposed in the inkjet margin area IMA can not be excessively consumed.

[0141] In some embodiments, a first protruding color conversion layer CCL1_P can be disposed in a first inkjet margin area IMA1 defined in the non-sub-pixel area NSPA. A second protruding color conversion layer CCL2_P can be disposed in a second inkjet margin area IMA2 defined in the non-sub-pixel area NSPA.

[0142] In some embodiments, a volume of the protruding color conversion layer CCL_P can be smaller than a volume of the base color conversion layer CCL_B. For example, a volume of the first protruding color conversion layer CCL1_P can be smaller than a volume of the first base color conversion layer CCL1_B. A volume of the second protruding color conversion layer CCL2_P can be smaller than a volume of the second base color conversion layer CCL2_B.

[0143] As described above, the inkjet margin area IMA can be formed in the display device DD, and process convenience of an inkjet process of forming the color conversion layer CCL can be improved. Reference will be made to Figure 9 This will be described.

[0144] In some embodiments, to perform the inkjet process, an inkjet printer PRI can be prepared, the inkjet printer PRI providing ink INK including a material for forming the color conversion layer CCL and including a nozzle portion for ejecting the ink INK.

[0145] In some embodiments, the inkjet printer PRI can eject the ink INK to an area. For example, an area in which the ink INK provided by the inkjet printer PRI is ejected can be defined as an ink-provided area INKA. In a case where the inkjet process is performed, the ink-provided area INKA can be formed across the inkjet margin area IMA and the opening OPN. For example, the ink-provided area INKA can be formed across the inkjet margin area IMA and the opening OPN, and the ink INK supplied to the ink-provided area INKA can spread to be disposed throughout the opening OPN and the inkjet margin area IMA. Thus, the base color conversion layer CCL_B and the protruding color conversion layer CCL_P can be formed.

[0146] Referring back to Figure 7 , the lower capping layer CPL_Q can cap other layers of the light control layer LCL. The lower capping layer CPL_Q can passivate the bank BNK, the color conversion layer CCL, and the scattering layer SCL. The lower capping layer CPL_Q can include an inorganic material.

[0147] In some embodiments, the display device DD can further include a filler layer FIL interposed between the light control layer LCL and the color filter layer CFL. The filler layer FIL can include various transparent organic materials, examples of which are not particularly limited. In some embodiments, a first panel in which the light control layer LCL is disposed on the display layer DL including the base substrate layer BSL can be manufactured, a second panel in which the color filter layer CFL is disposed on the upper layer UL can be manufactured, and the filler layer FIL can be interposed between the first panel and the second panel so that the first panel and the second panel can be coupled to manufacture the display device DD. However, embodiments are not limited thereto.

[0148] The color filter layer CFL can be disposed on the light control layer LCL (e.g., on the filler layer FIL). The color filter layer CFL can be formed under the upper layer UL. The color filter layer CFL can include color filters CF, an optical layer LRL, and an upper cap layer CPL_U.

[0149] According to embodiments, the color filters CF can include a first color filter CF1 for forming a first sub-pixel SPX1, a second color filter CF2 for forming a second sub-pixel SPX2, and a third color filter CF3 for forming a third sub-pixel SPX3.

[0150] The first color filter CF1 can be disposed in the first sub-pixel area SPXA1. The first color filter CF1 can include a color filter material (e.g., a dye or a pigment) that selectively transmits light of a first color (e.g., red).

[0151] The second color filter CF2 can be disposed in the second sub-pixel area SPXA2. The second color filter CF2 can include a color filter material (e.g., a dye or a pigment) that selectively transmits light of a second color (e.g., green).

[0152] The third color filter CF3 can be disposed in the third sub-pixel area SPXA3. The third color filter CF3 can include a color filter material (e.g., a dye or a pigment) that selectively transmits light of a third color (e.g., blue).

[0153] In some embodiments, a non-sub-pixel area NSPA in which light of one color is not visually recognized can be formed between the sub-pixel areas SPXA. For example, in a plan view, in the non-sub-pixel area NSPA, a light blocking member LBS in which the first color filter CF1, the second color filter CF2, and the third color filter CF3 overlap can be formed.

[0154] The optical layer LRL can have a refractive index greater than a refractive index of the layer forming the color filter CF. The optical layer LRL can have a refractive index less than a refractive index of the color conversion layer CCL, and can form an optical recycling structure.

[0155] The optical layer LRL can include various materials to have a refractive index. For example, the optical layer LRL can include various resins and hollow silica. In another example, the optical layer LRL can include zirconium oxide (ZrO x ). However, embodiments are not limited thereto. The optical layer LRL can have a refractive index lower than a refractive index of the color conversion layer CCL, and can form an optical recycling structure. In some embodiments, the optical layer LRL can be referred to as a low refractive index layer.

[0156] The upper capping layer CPL_U can be disposed on the optical layer LRL. The upper capping layer CPL_U can be disposed across the sub-pixel area SPXA and the non-sub-pixel area NSPA. The upper capping layer CPL_U can passivate the optical layer LRL. The upper capping layer CPL_U can include an inorganic material.

[0157] The upper layer UL can be disposed on the color filter layer CFL. The upper layer UL can be a substrate on which the color filter layer CFL is disposed, and in some embodiments, the upper layer UL can include a functional film layer (e.g., an anti-reflection film or a polarizing film layer, etc.).

[0158] In some embodiments, the structure of the middle bank portion BNK_M can be defined in various ways.

[0159] Referring to Figure 10 , the middle bank portion BNK_M can have a trapezoidal cross-section. For example, the middle bank portion BNK_M can have a height lower than a height of the bank BNK, and can include a substantially planar upper surface PLS and an inclined surface ICS. The upper surface PLS can be oriented toward the third direction DR3, and the inclined surface ICS can be oriented toward the bulk color conversion layer CCL_B.

[0160] Referring to Figure 11 , the middle bank portion BNK_M can have a triangular cross-section. For example, the middle bank portion BNK_M can include the inclined surface ICS without including a planar upper surface. One end of the inclined surface ICS can be adjacent to the bank BNK, and the other end of the inclined surface ICS can be adjacent to an upper surface of the display layer DL.

[0161] Referring to Figure 12The intermediate bank portion BNK M can have a trapezoidal cross-section. For example, the intermediate bank portion BNK M can include an inclined surface ICS and a side surface SIS. The side surface SIS can be oriented toward the base color conversion layer CCL B, and the inclined surface ICS can also be substantially oriented toward the base color conversion layer CCL B. An end of the inclined surface ICS can be adjacent to the bank BNK. The side surface SIS can include a surface extending in the third direction DR3.

[0162] Referring to Figure 13 The intermediate bank portion BNK M can include a plurality of intermediate bank portions BNK M. For example, a portion of the plurality of intermediate bank portions BNK M can be disposed on one side of the base color conversion layer CCL B, and another portion of the plurality of intermediate bank portions BNK M can be disposed on another side of the base color conversion layer CCL B.

[0163] A display device DD according to another embodiment will be described with reference to Figures 14 to 17 For the convenience of description, simplification, or redundancy of description will not be repeated.

[0164] Figures 14 to 16 A schematic top plan view of a display device according to another embodiment is illustrated. Figure 17 A schematic cross-sectional view taken along the line B-B’ of Figures 14 to 16 is illustrated. Figures 14 to 16 A pixel PXL is illustrated and the same regions are illustrated. Figure 14 The bank BNK and the intermediate bank portion BNK M are schematically illustrated. Figure 15 The bank BNK, the color conversion layer CCL, and the scattering layer SCL are schematically illustrated. Figure 16 The light blocking member LBS is schematically illustrated. Based on Figures 14 to 16 The disposition relationship of the components will be more clearly understood.

[0165] Referring to Figures 14 to 17 A display device DD according to another embodiment differs from the display device DD according to the above-described embodiments in that only a first base color conversion layer CCL1 B is formed in a region corresponding to the first sub-pixel SPX1.

[0166] In some embodiments, the intermediate bank portion BNK M can be formed in a region adjacent (e.g., directly adjacent) to the first opening OPN1, and thus, an inkjet margin area IMA adjacent (e.g., directly adjacent) to the first opening OPN1 can be formed. The intermediate bank portion BNK M can not be formed in a region adjacent (e.g., directly adjacent) to the second opening OPN2, and the second opening OPN2 can be surrounded (e.g., completely surrounded) by the bank BNK in a plan view.

[0167] In some embodiments, the first color conversion layer CCL1 can be disposed in the first opening OPN1 and the ink ejection margin area IMA. For example, the first color conversion layer CCL1 can include a first bulk color conversion layer CCL1_B in the first opening OPN1 and a first protruding color conversion layer CCL1_P in the ink ejection margin area IMA. The second color conversion layer CCL2 can be disposed in the second opening OPN2 without being disposed in the ink ejection margin area IMA. The scattering layer SCL can be disposed in the third opening OPN3.

[0168] In some embodiments, the ink ejection margin area IMA adjacent to the first opening OPN1 can overlap with the non-sub-pixel area NSPA in a plan view.

[0169] In some embodiments, the first to third sub-pixel areas SPXA1 to SPXA3 can be spaced apart from each other in the first direction DR1. The first sub-pixel area SPXA1 can be disposed between the second sub-pixel area SPXA2 and the third sub-pixel area SPXA3.

[0170] For example, the middle bank portion BNK_M can include a plurality of middle bank portions BNK_M, and the plurality of middle bank portions BNK_M can be respectively disposed on one side and the other side of the first opening OPN1. Accordingly, the ink ejection margin area IMA can be formed on one side and the other side of the first opening OPN1. Accordingly, the first protruding color conversion layer CCL1_P can include a plurality of first protruding color conversion layers CCL1_P. Some of the plurality of first protruding color conversion layers CCL1_P can be disposed on one side of the first bulk color conversion layer CCL1_B, and others of the plurality of first protruding color conversion layers CCL1_P can be disposed on the other side of the first bulk color conversion layer CCL1_B.

[0171] According to the embodiments, the ink ejection margin area IMA can be formed only in an area in which the first color conversion layer CCL1 among the first and second color conversion layers CCL1 and CCL2 is formed. For example, the first sub-pixel area SPXA1 corresponding to the first opening OPN1 in which the ink ejection margin area IMA is selectively formed can be formed between the second sub-pixel area SPXA2 and the third sub-pixel area SPXA3. Accordingly, in the embodiments, since the ink ejection margin area IMA can be effectively formed on both sides (e.g., opposite sides) of the first opening OPN1, the ink providing area INKA can be further increased to provide a technical effect of further improving process convenience.

[0172] A display device DD according to another embodiment will be described with reference to Figures 18 to 24 A display device DD according to another embodiment will be described with reference to

[0173] Figures 18 to 20 A schematic top plan view of a display device according to another embodiment is shown. Figure 21 and Figure 23 A schematic cross-sectional view taken along the line C-C’ of Figures 18 to 20 is shown. Figure 22 and Figure 24 A schematic cross-sectional view taken along the line D-D’ of Figures 18 to 20 is shown. Figures 18 to 20 A pixel PXL is shown and the same regions are shown. Figure 18 A bank BNK and an intermediate bank portion BNK_M are schematically shown. Figure 19 A bank BNK, a color conversion layer CCL and a scattering layer SCL are schematically shown. Figure 20 A light blocking member LBS is schematically shown. Based on Figures 18 to 20 The arrangement relationship of the components will be more clearly understood.

[0174] With reference to Figures 18 to 24 A display device DD according to another embodiment differs from the display device DD according to the above-described embodiments in that an ink ejection margin area IMA is formed between the openings OPN respectively corresponding to different pixels PXL.

[0175] In some embodiments, the first to third openings OPN1-3 can be adjacent to each other in the first direction DR1, and the first to third sub-pixel areas SPXA1-3 can be adjacent to each other in the first direction DR1. In some embodiments, the pixel PXL can include a first pixel PXL1 and a second pixel PXL2 adjacent to each other along a second direction DR2 different from the first direction DR1.

[0176] In some embodiments, the intermediate bank portion BNK_M can be arranged between the openings OPN respectively corresponding to pixels PXL different from each other with respect to the second direction DR2. The ink ejection margin area IMA can be arranged between the opening OPN of the first pixel PXL1 and the opening OPN of the second pixel PXL2 with respect to the second direction DR2. For example, a first ink ejection margin area IMA1 can be arranged between the first opening OPN1 of the first pixel PXL1 and the first opening OPN1 of the second pixel PXL2. A second ink ejection margin area IMA2 can be arranged between the second opening OPN2 of the first pixel PXL1 and the second opening OPN2 of the second pixel PXL2.

[0177] In some embodiments, the ink ejection margin area IMA arranged between the openings OPN can overlap the non-sub-pixel area NSPA in a plan view.

[0178] In some embodiments, a prominent color conversion layer CCL_P may be disposed between the base color conversion layer CCL_B of the first pixel PXL1 and the base color conversion layer CCL_B of the second pixel PXL2. A first prominent color conversion layer CCL1_P may be disposed between the first base color conversion layer CCL1_B of the first pixel PXL1 and the first base color conversion layer CCL1_B of the second pixel PXL2. A second prominent color conversion layer CCL2_P may be disposed between the second base color conversion layer CCL2_B of the first pixel PXL1 and the second base color conversion layer CCL2_B of the second pixel PXL2.

[0179] In some embodiments, a first protruding color conversion layer CCL1_P may protrude from a first substrate color conversion layer CCL1_B toward one side relative to the first direction DR1. A second protruding color conversion layer CCL2_P may protrude from a second substrate color conversion layer CCL2_B toward the other side relative to the first direction DR1.

[0180] According to an embodiment, ink INK is provided in the inkjet margin region IMA (see [reference]). Figure 9 The ink can be moved to each of the different pixels PXL1 and PXL2. For example, since the inkjet margin region IMA can be adjacent (e.g., directly adjacent) to the opening OPN corresponding to the different pixels PXL1 and PXL2, when ink INK is supplied to the inkjet margin region IMA, the ink INK can be moved to the opening OPN corresponding to the different pixels PXL. Therefore, the process steps can be simplified, and process convenience can be improved to reduce process costs.

[0181] According to the embodiment, although the openings OPN are formed relatively adjacent to each other, inkjet printing can be appropriately performed. As described above, since the range of the openings OPN can correspond to the range of the sub-pixel region SPXA (or overlap with the range of the sub-pixel region SPXA), the display device DD according to the embodiment can be manufactured to have high resolution display quality.

[0182] Reference Figure 23 and Figure 24 In this embodiment, a fluid channel EUR can be further formed to allow the ink INK to move more precisely.

[0183] Fluid channels EUR can be formed in non-subpixel regions (NSPA). Fluid channels EUR can be formed between different pixels PXL1 and PXL2. Fluid channels EUR can be formed in the second direction DR2 (see...). Figures 18 to 20 Extending upwards.

[0184] The fluidic channel EUR can be formed in the ink ejection margin area IMA as part of the non-sub-pixel area NSPA and can be defined in an area in which the intermediate bank portion BNK_M is not formed. For example, the fluidic channel EUR can be surrounded by the bank BNK and the intermediate bank portion BNK_M and can overlap the light blocking member LBS in a plan view.

[0185] As described above, in embodiments, the ink INK supplied to the ink ejection margin area IMA can move to the openings OPN corresponding to different pixels PXL1 and PXL2. Since the fluidic channel EUR according to embodiments can be defined in a relatively narrow area surrounded by the bank BNK and the intermediate bank portion BNK_M, the ink INK supplied to the ink ejection margin area IMA can be more effectively supplied to the openings OPN corresponding to different pixels PXL1 and PXL2 as the fluidic channel EUR is formed.

[0186] Reference will be made to Figures 25 to 34 A method of manufacturing the display device DD according to embodiments will be described. For ease of description, simplification, or redundancy will not be repeated.

[0187] First, reference will be made to Figures 25 to 32 A method of manufacturing the display device DD according to embodiments will be described. Figures 25 to 32 A method of manufacturing the display device DD according to embodiments is shown. Figures 4 to 13 A method of manufacturing the display device DD according to embodiments is shown.

[0188] Figure 25 A flowchart showing a method of manufacturing a display device according to embodiments is shown. Figure 26 A flowchart showing a step of forming a light control layer on a display layer is shown. Figure 25 A flowchart showing a step of forming a light control layer on a display layer is shown. Figures 27 to 32 A schematic diagram of process steps of a method of manufacturing a display device according to embodiments is shown. Figure 27 , Figure 28 , Figure 30 and Figure 32 A schematic cross-sectional view showing respective process steps in a method of manufacturing a display device according to embodiments based on the cross-sectional structure shown in Figure 7 A schematic cross-sectional view showing respective process steps in a method of manufacturing a display device according to embodiments based on the cross-sectional structure shown in Figure 29 and Figure 31 A schematic plan view showing a step in which an inkjet printing process is performed among a plurality of process steps of a method of manufacturing a display device according to embodiments is shown.

[0189] Reference will be made to Figure 25 A method of manufacturing the display device DD according to embodiments can comprise manufacturing a display layer (step S100), forming a light control layer on the display layer (step S200), and disposing a color filter layer on the light control layer (step S300).

[0190] Referring to Figure 26 forming the light control layer on the display layer (step S200) can include patterning the bank and the intermediate bank portion (step S2100) and patterning the color conversion layer and the scattering layer (step S2200).

[0191] Referring to Figure 25 and Figure 27 in manufacturing the display layer (step S100), other layers forming the display layer DL can be disposed on the base layer BSL.

[0192] In some embodiments, the conductive layer or the insulating layer on the base layer BSL can be formed by a process of manufacturing a semiconductor device. For example, the conductive layer or the insulating layer on the base layer BSL can be formed by a photolithography process, etched by various methods (e.g., a wet etching process and a dry etching process, etc.), and deposited by various methods (e.g., a sputtering process and a chemical vapor deposition process, etc.). However, embodiments are not limited to the specific examples.

[0193] In step S100, the pixel circuit PXC can be patterned on the base layer BSL, and the light emitting element LD can be disposed. In some embodiments, in step S100, the light emitting element LD can be disposed on the base layer BSL by various methods. For example, referring to Figure 3 together, the light emitting element LD can include an organic light emitting diode, and the light emitting element LD can be manufactured on the base layer BSL by a deposition process. However, embodiments are not limited thereto.

[0194] In step S100, the first light emitting element LD1 forming the first sub-pixel SPX1 and forming the light emitting area EMA, the second light emitting element LD2 forming the second sub-pixel SPX2 and forming the light emitting area EMA, and the third light emitting element LD3 forming the third sub-pixel SPX3 and forming the light emitting area EMA can be disposed, and the encapsulation layer TFE can be formed on the light emitting element LD.

[0195] Referring to Figure 25 , Figure 26 , Figure 28 and Figure 29 in forming the light control layer on the display layer (step S200), the patterning of the bank and the intermediate bank portion (step S2100) can be performed.

[0196] In step S2100, the bank BNK and the intermediate bank portion BNK_M forming the opening OPN can be formed on the display layer DL. The intermediate bank portion BNK_M forming the ink ejection margin area IMA can be formed on the display layer DL.

[0197] In some embodiments, the bank BNK and the intermediate bank portion BNK_M can be formed by the same process. For example, after forming layers for manufacturing the bank BNK and the intermediate bank portion BNK_M, a positive photoresist layer can be disposed. For example, an etching mask can be provided by etching the disposed positive photoresist layer using a mask including a half-tone region and a full-tone region, and a process of etching at least a portion of the layers for manufacturing the bank BNK and the intermediate bank portion BNK_M using the etching mask can be performed, so that the bank BNK and the intermediate bank portion BNK_M can be manufactured. However, embodiments are not limited thereto. In some embodiments, the bank BNK and the intermediate bank portion BNK_M can be manufactured using a slit-type mask, and the type of the photoresist layer is not limited thereto.

[0198] In step S2100, the first intermediate bank portion BNK_M1 can be patterned to form a first inkjet margin region IMA1. The second intermediate bank portion BNK_M2 can be patterned to form a second inkjet margin region IMA2. For example, the first to third openings OPN1 to OPN3 can be formed, the first inkjet margin region IMA1 can be formed to be adjacent (e.g., directly adjacent) to the first opening OPN1, and the second inkjet margin region IMA2 can be formed to be adjacent (e.g., directly adjacent) to the second opening OPN2.

[0199] In some embodiments, the first opening OPN1 and the second opening OPN2 can have an opening width L_SP in the first direction DR1. The opening width L_SP can be a width defined in the first opening OPN1 and the second opening OPN2 in a direction in which the first to third openings OPN1 to OPN3 are spaced apart from each other.

[0200] Referring to Figure 25 , Figure 26 , Figure 30 and Figure 31 , in forming the light control layer on the display layer (step S200), patterning the color conversion layer and the scattering layer (step S2200) can be performed.

[0201] In step S2200, the color conversion layer CCL can be formed by an inkjet process. For example, the inkjet printer PRI can discharge ink INK for forming the color conversion layer CCL into the openings OPN and the inkjet margin regions IMA, and thus, the color conversion layer CCL can be formed in a region surrounded by the bank BNK and the intermediate bank portion BNK_M.

[0202] In some embodiments, a first inkjet process can be performed to provide (or form) a first base color conversion layer CCL1_B in the first opening OPN1 and to provide (or form) a first protruding color conversion layer CCL1_P in the first inkjet margin area IMA1. A second inkjet process can be performed to provide (or form) a second base color conversion layer CCL2_B in the second opening OPN2 and to provide (or form) a second protruding color conversion layer CCL2_P in the second inkjet margin area IMA2.

[0203] In some embodiments, the second color conversion layer CCL2 can be formed after the first color conversion layer CCL1 is formed, and in some embodiments, the first color conversion layer CCL1 can be formed after the second color conversion layer CCL2 is formed.

[0204] In step S2200, the scattering layer SCL can be formed by a photolithography process. The scattering layer SCL can be formed in the third opening OPN3.

[0205] In some embodiments, the scattering layer SCL can be formed after the color conversion layer CCL is formed, and in some embodiments, the color conversion layer CCL can be formed after the scattering layer SCL is formed.

[0206] According to embodiments, as described above, the ink supply area INKA into which the ink INK is discharged can be formed across the inkjet margin area IMA and the opening OPN. Accordingly, in order to perform the inkjet process, the range of ink INK discharge can be more effectively defined, so that the process margin of the inkjet process can be guaranteed or ensured.

[0207] In some embodiments, the ink supply area INKA can have an ink area length L_INK. The ink area length L_INK can be the longest length defined in the ink supply area INKA. For example, in the case where the ink supply area INKA has an elliptical shape, the ink area length L_INK can be the major radius.

[0208] In some embodiments, the ink area length L_INK can be greater than the opening width L_SP. Experimentally, in the case where the inkjet margin area IMA is not formed, since the ink area length L_INK is greater than the opening width L_SP, the ink INK can leak (or overflow) to an area outside the opening OPN. However, according to embodiments, the inkjet margin area IMA adjacent (e.g., directly adjacent) to the opening OPN is formed, so that the ink INK can be supplied to the opening OPN without leaking (or overflowing).

[0209] In some embodiments, after the color conversion layer CCL and the scattering layer SCL are disposed, the lower cap layer CPL Q can be formed, and the color conversion layer CCL and the scattering layer SCL can be passivated.

[0210] Referring to Figure 25 and Figure 32 In disposing the color filter layer on the light control layer (step S300), the color filter CF can be formed on the light control layer LCL.

[0211] In step S300, the layer for forming the color filter layer CFL on the upper layer UL can be patterned, and the fill layer FIL can be interposed between the layers including the upper layer UL and the color filter layer CFL and the light control layer LCL. However, embodiments are not limited thereto.

[0212] In step S300, the first to third color filters CF1 to CF3 can be patterned on the upper layer UL. The color filters CF can be formed by various processes such as a photolithography process. In some embodiments, the formation order of the color filters CF is not limited thereto.

[0213] In step S300, the optical layer LRL can be formed (or deposited) to cover the color filters CF, and the upper cap layer CPL U can be formed on the optical layer LRL.

[0214] Referring to Figure 33 A method of manufacturing a display device DD according to another embodiment will be described focusing on technical features different from the above-described method of manufacturing a display device DD. Figure 33 A method of manufacturing a display device DD according to another embodiment is shown. Figures 14 to 17 A method of manufacturing a display device DD according to another embodiment is shown. Figure 33 A schematic top plan view showing a step of performing an inkjet printing process among process steps of a method of manufacturing a display device according to another embodiment is shown.

[0215] Referring to Figure 33 In forming the light control layer on the display layer (step S200), the patterning of the color conversion layer and the scattering layer (step S2200) can be performed, but the ink providing area INKA can be formed across the inkjet margin areas IMA and the first openings OPN1 spaced apart from each other.

[0216] For example, inkjet margin areas IMA can be formed adjacent to (e.g., directly adjacent to) the first openings OPN1, and can be formed on each of two sides (e.g., opposite sides) of the first openings OPN1, respectively. Thus, in a case where an inkjet process is performed, an ink-providing area INKA can be formed across the inkjet margin area IMA formed on one side of the first openings OPN1, the first openings OPN1, and the inkjet margin area IMA formed on the other side of the first openings OPN1. Also in the embodiment, the ink region length L INK can be greater than the opening width L SP, and a process margin for a range of ink INK discharge can be guaranteed or ensured.

[0217] Referring to Figure 34 A method of manufacturing a display device DD according to another embodiment will be described, focusing on technical features different from the above-described method of manufacturing a display device DD. Figure 34 A method of manufacturing Figures 18 to 24 A method of manufacturing a display device DD according to another embodiment is shown. Figure 34 A schematic top plan view showing a step of performing an inkjet printing process among process steps of a method of manufacturing a display device according to another embodiment is shown.

[0218] Referring to Figure 25 , Figure 26 and Figure 34 In forming a light control layer on the display layer (step S200), a patterned color conversion layer and a scattering layer can be formed (step S2200), but an ink-providing area INKA can be formed across the opening OPN and the inkjet margin area IMA of each of the different pixels PXL1 and PXL2 spaced apart from each other.

[0219] Thus, although the inkjet printer PRI provides ink INK to the inkjet margin area IMA, the inkjet printer PRI can move to the opening OPN of each of the different pixels PXL1 and PXL2. For example, also in the embodiment, the ink region length L INK can be greater than the opening width L SP, and a process margin for a range of ink INK discharge can be guaranteed or ensured.

[0220] While the disclosure has been illustrated and described with reference to certain embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims and their equivalents.

[0221] Thus, the technical scope of the disclosure can be determined based on the technical scope of the appended claims.

Claims

1. A display device, characterized by comprising: The display device comprises: a display layer; and a light control layer disposed on the display layer, the light control layer comprising: a bank, an intermediate bank portion directly adjacent to the bank, and a color conversion layer, wherein the light control layer comprises an opening, the bank and the intermediate bank portion are not disposed in the opening, and the color conversion layer comprises: a bulk color conversion layer disposed in at least a portion of the opening, and a protruding color conversion layer overlapping the intermediate bank portion in plan view.

2. The display device according to claim 1, wherein the bank has a height higher than a height of the intermediate bank portion, the bulk color conversion layer and the protruding color conversion layer are integral with each other, the bank and the intermediate bank portion are integral with each other, and the bulk color conversion layer has a volume larger than a volume of the protruding color conversion layer.

3. The display device according to claim 1, wherein The display device further comprises: a sub-pixel region in which light of one color is provided, and a non-sub-pixel region adjacent to the sub-pixel region, wherein the sub-pixel region comprises: a first sub-pixel region in which light of a first color is provided, a second sub-pixel region in which light of a second color is provided, and a third sub-pixel region in which light of a third color is provided, the opening comprises: a first opening overlapping the first sub-pixel region in plan view, a second opening overlapping the second sub-pixel region in plan view, and a third opening overlapping the third sub-pixel region in plan view, and the protruding color conversion layer overlaps the non-sub-pixel region in plan view, and the first opening and the second opening are spaced apart from each other by a first distance, and the second opening and the third opening are spaced apart from each other by a second distance smaller than the first distance.

4. The display device according to claim 3, wherein the protruding color conversion layer comprises: a first protruding color conversion layer adjacent to the first sub-pixel region, and a second protruding color conversion layer adjacent to the second sub-pixel region, the first sub-pixel region, the second sub-pixel region, and the third sub-pixel region are adjacent to each other in a first direction, and the first protruding color conversion layer and the second protruding color conversion layer overlap in a second direction different from the first direction.

5. The display device according to claim 1, wherein the intermediate bank portion comprises: an upper surface forming a height lower than a height of the bank, and an inclined surface facing the bulk color conversion layer, or the intermediate bank portion comprises: an inclined surface having one end portion adjacent to the bank, and another end portion adjacent to an upper surface of the display layer, or the intermediate bank portion comprises: an inclined surface having an end portion adjacent to the bank, and a side surface facing the bulk color conversion layer, or the intermediate bank portion comprises: a first intermediate bank portion disposed on one side of the bulk color conversion layer, and a second intermediate bank portion disposed on another side of the bulk color conversion layer.

6. The display device according to claim 1, wherein The display device further includes: a first sub-pixel providing light of a first color, a second sub-pixel providing light of a second color, and a third sub-pixel providing light of a third color; and a scattering layer included in the third sub-pixel, wherein the protruding color conversion layer is formed in the second sub-pixel and not formed in the first sub-pixel. 8.The display device of claim 7, wherein the first sub-pixel is disposed between the second sub-pixel and the third sub-pixel, the protruding color conversion layer includes a plurality of protruding color conversion layers, and some of the plurality of protruding color conversion layers are disposed on one side of the base color conversion layer, and other of the plurality of protruding color conversion layers are disposed on another side of the base color conversion layer. The display device further includes: a plurality of pixels each including a plurality of sub-pixels forming a plurality of sub-pixel regions, wherein 7. The display device according to claim 1, wherein the plurality of sub-pixel regions are spaced apart from each other in a first direction, the plurality of pixels include a first pixel and a second pixel spaced apart from each other in a second direction different from the first direction, and the intermediate bank portion is disposed between the opening of the light control layer for the first pixel and the opening of the light control layer for the second pixel. The display device further includes: a fluid channel formed between the opening of the light control layer for the first pixel and the opening of the light control layer for the second pixel, and the intermediate bank portion is not disposed in the fluid channel. The display device further includes: a color filter layer disposed on the light control layer and including a color filter, wherein the display layer includes a light emitting element providing light to a light emitting region, and 9. The display device according to claim 1, wherein the light emitting region overlaps the color filter and the color conversion layer in a plan view, and The display device further includes: a sub-pixel region in which light of a color is provided; and a non-sub-pixel region adjacent to the sub-pixel region, wherein the sub-pixel region includes:

10. The display device according to claim 9, wherein a first sub-pixel region in which light of a first color is provided, a second sub-pixel region in which light of a second color is provided, and 11. The display device according to claim 1, wherein a third sub-pixel region in which light of a third color is provided. ​ ​ ​ ​ ​ ​ ​ ​ ​ a third sub-pixel region, light of a third color is provided in the third sub-pixel region, and the light emitting element emits light including a light component of the third color. the light emitting element emits light including a light component of the third color.

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