Integrated multi-band signal amplification device

Abstract

The utility model relates to the technical field of signal amplification devices, and discloses an integrated multi-band signal amplification device which comprises a shell, a resonant cavity is formed in the shell, the inner wall of the resonant cavity is coated with a silver coating, the left side and the right side of the shell are respectively and fixedly connected with a collecting hopper, the inner wall of each collecting hopper is fixedly connected with a probe, and the probe is fixedly connected with the shell. A resonant cavity is formed in the shell, a plurality of reflectors are fixedly connected to the interior of the shell, the surfaces of the reflectors are coated with anti-reflection coatings, a support is fixedly connected to the inner wall of the bottom of the resonant cavity, a signal receiver is detachably connected to the top of the support, and an induction block is fixedly connected to the right side of the signal receiver. According to the utility model, complete, accurate, efficient and low-loss collection and transmission of microwave signals, multiple reflection of the microwave signals and multiple resonance modes are realized, the resonance effect is obviously enhanced, the signal quality and intensity are improved, and signal amplification is efficiently completed.

Description

Technical Field

[0001] This utility model relates to the field of signal amplification device technology, and in particular to an integrated multi-band signal amplification device. Background Technology

[0002] Integrated multi-band signals refer to a signal form that integrates signals from multiple different frequency bands into one device or equipment for processing and transmission. It enables the coexistence and collaborative operation of multiple frequency band signals, covers multiple frequency bands on the same device, enhances the adaptability and coverage of signals, meets the diverse needs of different application scenarios for signal frequency bands, and integrates the advantages of different frequency bands through integration technology to improve communication efficiency, anti-interference capabilities and other performance. It is widely used in wireless communication, radar detection and other fields.

[0003] An integrated multi-band signal amplifier is a device that can amplify signals of multiple different frequency bands. It integrates the amplification functions of multiple frequency bands into one unit. Through its internal amplification circuit, it identifies and matches signals of different frequency bands, and then uses components such as transistors to amplify the power of the signals.

[0004] In existing technologies, some integrated multi-band signal amplification devices have several shortcomings when dealing with multi-band signals. Signals are easily affected by various interferences and losses during amplification. In complex electromagnetic environments, external electromagnetic interference can mix into the signal to be amplified, leading to signal distortion. Simultaneously, energy loss is inevitable during transmission and amplification due to factors such as the transmission medium and circuit components, reducing signal strength and quality. For example, in some wireless communication devices, signals are very weak by the time they reach the amplifier after long-distance transmission. Traditional amplifiers struggle to effectively suppress noise interference when amplifying these weak signals, resulting in a low signal-to-noise ratio after amplification, which fails to meet practical communication requirements. Therefore, integrated multi-band signal amplification devices are proposed to address these problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides an integrated multi-band signal amplification device, which aims to improve the problem that the existing technology is difficult to meet the actual communication needs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An integrated multi-band signal amplification device includes a housing, an internal resonant cavity with a silver-plated coating on its inner wall, collection containers fixedly connected to the left and right sides of the housing, probes fixedly connected to the inner walls of the collection containers, multiple reflectors fixedly connected inside the housing with anti-reflective coatings on their surfaces, a bracket fixedly connected to the bottom inner wall of the resonant cavity, a signal receiver detachably connected to the top of the bracket, a sensing block fixedly connected to the right side of the signal receiver, and multiple portable components for easy disassembly, installation, and maintenance of the signal receiver fixedly connected to the top inner wall of the housing.

[0008] As a further description of the above technical solution:

[0009] The portable component includes a fixing block, the fixing block has a driven groove inside, a spring is fixedly connected to the top inner wall of the driven groove, and the driven block is fixedly connected to the bottom of the spring.

[0010] As a further description of the above technical solution:

[0011] The bottom of the plurality of driven blocks is fixedly connected to a U-shaped frame, and the outside of the driven blocks is slidably connected to the inside of the driven groove;

[0012] As a further description of the above technical solution:

[0013] The U-shaped frame has multiple connecting slots inside, and the top of the bracket is rotatably connected to multiple T-shaped blocks;

[0014] As a further description of the above technical solution:

[0015] The outer side of the T-shaped block is in contact with the inner wall of the connecting groove, the bottom of the U-shaped frame is in contact with the top of the signal receiver, and the tops of the plurality of fixing blocks are fixedly connected to the top inner wall of the resonant cavity.

[0016] As a further description of the above technical solution:

[0017] The collecting hopper is shaped like a truncated cone and is made of ceramic.

[0018] As a further description of the above technical solution:

[0019] The collecting hopper is cylindrical in shape, and the probe is made of tungsten.

[0020] As a further description of the above technical solution:

[0021] The top of the housing has two connection ports, and the front of the housing is rotatably connected to a rotating door.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this utility model, external microwave signals are collected over a large area by a collecting bucket. The collected signals are transmitted to the resonant cavity efficiently and with low loss through a cylindrical tungsten probe, which has a uniform electromagnetic field distribution and high melting point characteristics. The microwave signals in the cavity interact with a specific electromagnetic field structure and achieve multiple efficient reflections with the help of the high conductivity of the silver-plated coating on the inner wall. Then, the signals are guided by reflections from multiple mirrors with anti-reflective coatings. This achieves complete, accurate, efficient, and low-loss collection and transmission of microwave signals. The multiple reflections and multiple resonance modes of the microwave signals significantly enhance the resonance effect, improve signal quality and strength, and efficiently complete signal amplification.

[0024] 2. In this utility model, the T-shaped block is rotated by moving the toggle block, causing it to disengage from the connecting groove inside the U-shaped frame, thus releasing the restriction on the U-shaped frame. The spring inside the driven groove then exerts its elasticity, pulling the driven block back to its original position, which in turn causes the U-shaped frame fixed at the bottom of the driven block to rise. This allows the signal receiver to be removed from the bracket. As a result, the restriction on the U-shaped frame can be quickly released by simply moving the toggle block, greatly simplifying the disassembly preparation work for the signal receiver. The signal receiver can be easily removed, significantly improving the efficiency of daily maintenance and repair of the device. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of the integrated multi-band signal amplification device proposed in this utility model.

[0026] Figure 2 This is a schematic diagram of the structure of the collection bucket of the integrated multi-band signal amplification device proposed in this utility model;

[0027] Figure 3 This is a schematic diagram of the support structure for the integrated multi-band signal amplification device proposed in this utility model;

[0028] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0029] Legend:

[0030] 1. Housing; 2. Resonant cavity; 3. Silver-plated coating; 4. Collection hopper; 5. Probe; 6. Reflector; 7. Anti-reflective coating; 8. Support; 9. Signal receiver; 10. Sensing block; 11. Fixing block; 12. Follower slot; 13. Spring; 14. Follower block; 15. U-shaped frame; 16. Connecting slot; 17. T-shaped block; 18. Connection port; 19. Rotating door. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 1 to 3 This utility model provides an embodiment of an integrated multi-band signal amplification device, including a housing 1. The housing 1 provides installation space and protection for the internal devices. A resonant cavity 2 is formed inside the housing 1. The resonant cavity 2 causes the microwave signal transmitted by the probe 5 to resonate. The microwave signal interacts with a specific electromagnetic field structure in the resonant cavity 2. Through continuous reflection by the reflector 6, multiple different resonant modes are formed in the cavity. The inner wall of the resonant cavity 2 is coated with a silver-plated coating 3. The silver-plated coating 3 has extremely high conductivity. When the microwave signal propagates to the inner wall of the resonant cavity 2, the silver-plated coating 3 can minimize the absorption and scattering loss of the signal, allowing the microwave signal to undergo multiple efficient reflections in the cavity, thereby further enhancing the resonance effect, improving the signal quality and strength, and helping to achieve a more efficient signal amplification function. The left and right sides of the housing 1 are respectively fixedly connected to a collection bucket 4. The collection bucket 4 is used to collect the externally transmitted microwave signal and at the same time provides fixation and support for the probe 5.

[0033] The inner wall of the collecting hopper 4 is fixedly connected to a probe 5. When the collecting hopper 4 collects external microwave signals, the probe 5 can efficiently and with low loss transmit these microwave signals to the resonant cavity 2, ensuring that the signal maintains high integrity and intensity during transmission so as to successfully excite the resonant mode in the resonant cavity 2. The inside of the shell 1 is fixedly connected to multiple reflectors 6. The reflectors 6 play the role of reflecting and guiding microwave signals in the resonant cavity 2. The surface of the reflectors 6 is coated with an anti-reflection coating 7. The presence of the anti-reflection coating 7 greatly reduces the reflection loss of microwave signals on the surface of the reflectors 6. The bottom inner wall of the resonant cavity 2 is fixedly connected to a bracket 8, which provides fixation and support for the signal receiver 9.

[0034] A signal receiver 9 is detachably connected to the top of the bracket 8. The signal receiver 9 is responsible for receiving the microwave signal after it has been processed and amplified by the resonant cavity 2, and converting it into an electrical signal that can be processed by subsequent circuits. A sensing block 10 is fixedly connected to the right side of the signal receiver 9. The sensing block 10 is specifically used to sense and receive the microwave signal after it has been processed and amplified in the resonant cavity 2. A number of portable components that facilitate the disassembly, installation and maintenance of the signal receiver 9 are fixedly connected to the top inner wall of the housing 1.

[0035] Reference Figure 3 and Figure 4 The portable component includes a fixing block 11, which provides space for the driven groove 12. The driven groove 12 is provided inside the fixing block 11. The driven groove 12 provides fixation and support for the spring 13, and also provides limiting and guiding functions for the driven block 14. The spring 13 is fixedly connected to the top inner wall of the driven groove 12. The spring 13 has an elastic function and provides elastic support for its driven block 14. The driven block 14 is fixedly connected to the bottom of the spring 13. The driven block 14 provides fixation and support for the U-shaped frame 15.

[0036] Reference Figures 2 to 4 A U-shaped frame 15 is fixedly connected to the bottom of multiple driven blocks 14. The U-shaped frame 15 is used to cooperate with the bracket 8 to fix the signal receiver 9. The external part of the driven block 14 is slidably connected to the inside of the driven groove 12. The driven groove 12 provides fixation and support for the driven block 14. Multiple connecting grooves 16 are opened inside the U-shaped frame 15. The connecting grooves 16 are used to cooperate with the T-shaped block 17 to complete the connection and fixation between the U-shaped frame 15 and the bracket 8, thereby fixing the clamps on the front and rear sides of the signal receiver 9. Multiple T-shaped blocks 17 are rotatably connected to the top of the bracket 8. Similarly, when it is necessary to disassemble the signal receiver 9, the T-shaped block 17 is rotated by the lever, thereby disengaging the T-shaped block 17 from the inside of the connecting groove 16, thereby releasing the limit on the U-shaped frame 15. Then, the elastic action of the spring 13 pulls the driven block 14 to reset, thereby pulling the U-shaped frame 15 to reset and rise, so that the signal receiver 9 can be removed for maintenance.

[0037] The outer side of the T-shaped block 17 contacts the inner wall of the connecting groove 16. Similarly, the connecting groove 16 and the T-shaped block 17 cooperate to complete the connection and fixation of the U-shaped frame 15 and the bracket 8, thereby fixing the clamps on the front and rear sides of the signal receiver 9. The bottom of the U-shaped frame 15 contacts the top of the signal receiver 9. The U-shaped frame 15 is inserted into the interior of the connecting groove 16 through the T-shaped block 17, thereby fixing the U-shaped frame 15 and achieving the limiting and fixing of the signal receiver 9. The tops of the multiple fixing blocks 11 are fixedly connected to the top inner wall of the resonant cavity 2. The resonant cavity 2 provides fixing and support for the fixing blocks 11. The shape of the collecting bucket 4 is a truncated cone. The large opening end of the truncated cone can receive microwave signals from the outside over a large area, and then the signal is gathered through the gradually narrowing small opening end, which effectively improves the collection efficiency of microwave signals and allows more signals to be guided to the probe 5.

[0038] The collecting hopper 4 is made of ceramic, which has good insulation properties, effectively preventing signal leakage or short circuits during microwave signal collection and ensuring signal integrity and accuracy. The probe 5 is cylindrical, which has high symmetry. This symmetry allows the probe 5 to uniformly distribute the electromagnetic field when transmitting microwave signals. When the microwave signal propagates along the probe 5, the uniform electromagnetic field distribution can effectively reduce signal loss and distortion. The probe 5 is made of tungsten. During microwave signal transmission, the probe 5 will generate heat due to the current passing through it. If the melting point of the material is low, it will melt or deform at high temperatures, affecting the quality of signal transmission. Tungsten's high melting point of approximately 3422℃ ensures that the probe 5 can still work normally in high-temperature environments and will not be damaged by temperature rise. The top of the housing 1 has two connection ports 18 for connecting external devices to the signal receiver 9 for power supply. The front of the housing 1 is rotatably connected to a rotating door 19, which facilitates the operator's inspection and maintenance of the internal devices.

[0039] Working principle: When collecting microwave signals, the external microwave signal is collected over a large area by the collecting bucket 4. Its ceramic material ensures the integrity and accuracy of signal collection. The collected signal is transmitted to the resonant cavity 2 efficiently and with low loss through the cylindrical tungsten probe 5, which has a uniform electromagnetic field distribution and high melting point characteristics. The microwave signal in the cavity interacts with the specific electromagnetic field structure and achieves multiple efficient reflections with the help of the high conductivity of the silver-plated coating 3 on the inner wall. Then, it is guided by the reflection of multiple reflectors 6 with anti-reflection coatings 7 to form multiple resonance modes, enhance the resonance effect, and improve the signal quality and intensity, thereby achieving efficient signal amplification. Finally, the amplified signal is sensed and received by the sensing block 10 on the right side of the signal receiver 9, completing the signal amplification process.

[0040] When the signal receiver 9 needs to be disassembled for maintenance, the T-block 17 is rotated by moving the toggle block, causing it to disengage from the connecting groove 16 inside the U-shaped frame 15, thus releasing the restriction on the U-shaped frame 15. At this time, the spring 13 inside the driven groove 12 exerts its elastic effect, which in turn pulls the driven block 14 to reset, thereby causing the U-shaped frame 15 fixed at the bottom of the driven block 14 to rise, so that the signal receiver 9 can be removed from the bracket 8 for maintenance. The operation is convenient and efficient, facilitating the daily maintenance and repair of the device.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated multi-band signal amplification device comprising a housing (1), characterized in that: The inside of the shell (1) is provided with a resonant cavity (2), the inner wall of the resonant cavity (2) is coated with a silver coating (3), the left and right sides of the shell (1) are respectively fixedly connected with a collecting hopper (4), the inner wall of the collecting hopper (4) is fixedly connected with a probe (5), the inside of the shell (1) is fixedly connected with a plurality of mirrors (6), the surface of the mirror (6) is coated with an anti-reflection coating (7), the bottom inner wall of the resonant cavity (2) is fixedly connected with a support (8), the top of the support (8) is detachably connected with a signal receiver (9), the right side of the signal receiver (9) is fixedly connected with an induction block (10), the top inner wall of the shell (1) is fixedly connected with a plurality of portable components facilitating the disassembly, installation and maintenance of the signal receiver (9).

2. The integrated multi-band signal amplification device of claim 1, wherein: The portable component comprises a fixed block (11), the inside of the fixed block (11) is provided with a driven groove (12), the top inner wall of the driven groove (12) is fixedly connected with a spring (13), the bottom of the spring (13) is fixedly connected with a driven block (14).

3. The integrated multi-band signal amplification device of claim 2, wherein: The bottom of the plurality of driven blocks (14) is fixedly connected with a U-shaped frame (15), the driven block (14) is slidably connected in the inside of the driven groove (12).

4. The integrated multi-band signal amplification device of claim 3, wherein: The inside of the U-shaped frame (15) is provided with a plurality of connecting grooves (16), the top of the support (8) is rotatably connected with a plurality of T-shaped blocks (17).

5. The integrated multi-band signal amplification device of claim 4, wherein: The outside of the T-shaped block (17) and the inner wall of the connecting groove (16) are in contact, the bottom of the U-shaped frame (15) and the top of the signal receiver (9) are in contact, and the top of the plurality of fixed blocks (11) is fixedly connected to the top inner wall of the resonant cavity (2).

6. The integrated multi-band signal amplification device of claim 1, wherein: The shape of the collecting hopper (4) is a conical frustum, and the material of the collecting hopper (4) is ceramic.

7. The integrated multi-band signal amplification device of claim 1, wherein: The shape of the collecting hopper (4) is a cylinder, and the material of the probe (5) is tungsten.

8. The integrated multi-band signal amplification device of claim 1, wherein: The top of the shell (1) is provided with two connecting ports (18), and the front side of the shell (1) is rotatably connected with a rotating door (19).

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