Sealed air-cooled low-noise subrack

Abstract

The utility model discloses a sealed air-cooled low-noise plug-in box, relates to the technical field of mobile communication, and aims to solve the problem that the requirements of electromagnetic shielding, water resistance, rain resistance and low noise of equipment cannot be met because cooling air of the plug-in box is directly blown to a heating chip to dissipate heat in the prior art. A heat dissipation substrate is arranged in the middle of the case body and divides the case body into a sealing cavity and a heat dissipation cavity, a module group is arranged in the sealing cavity, heat dissipation fins are arranged on the heat dissipation substrate in the heat dissipation cavity, a fan is arranged at one end of the case body, a wiring block is arranged on the heat dissipation substrate, the exterior of the wiring block is located in the heat dissipation cavity, and the interior of the wiring block is communicated with the sealing cavity. According to the utility model, the environmental adaptability and reliability of the module group in the case main body are enhanced through the sealing cavity and the heat dissipation cavity; the radiating fins are combined with the chip to control the speed of the fan, so that the fan can work under low load and low noise all the time.

Description

Technical Field

[0001] This utility model relates to the field of mobile communication technology, specifically a sealed, air-cooled, low-noise plug-in box. Background Technology

[0002] With the development of communication technology, the integration, miniaturization, and high performance of equipment in various information platforms are becoming increasingly sophisticated, which places higher demands on the active heat dissipation capabilities of the chassis. Traditional plug-in chassis, which use air cooling to blow cooling air directly onto heat-generating chips to achieve heat dissipation, cannot meet the requirements of electromagnetic shielding, dustproofing, waterproofing, and rainproofing. At the same time, due to the limitations of heat sink and air duct design, simply increasing the airflow will lead to increased equipment noise. If a fully sealed design is adopted, the heat generated by high-power devices or chips during operation will quickly accumulate in the sealed cavity. If it cannot be quickly dissipated outside the chassis, the performance of the equipment will be greatly reduced.

[0003] Therefore, solving the heat dissipation problem of sealed enclosures is a challenge we need to address. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the existing defects and provide a sealed air-cooled low-noise insert box, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, this utility model discloses a sealed, air-cooled, low-noise enclosure. The technical solution includes a main enclosure body. A heat dissipation substrate is located in the middle of the main enclosure body, dividing it into a sealed cavity and a heat dissipation cavity. A module assembly is located within the sealed cavity, and a top cover plate is located above the module assembly. Heat dissipation fins are provided on the heat dissipation substrate inside the heat dissipation cavity. A fan is located at one end of the main enclosure body inside the heat dissipation cavity. A wiring block is provided on the heat dissipation substrate in the middle of the heat dissipation fins. The outside of the wiring block is located inside the heat dissipation cavity, and the inside of the wiring block is connected to the sealed cavity. A plug-in mechanism is provided on the wiring block, and the fan is electrically connected to the module assembly through the plug-in mechanism. A bottom cover plate is located below the heat dissipation fins, and the fan is an IP-rated waterproof fan.

[0006] As a preferred embodiment of this utility model, a heat pipe is pre-embedded inside the heat dissipation substrate inside the sealed cavity. The high thermal conductivity of the heat pipe is used to quickly conduct heat to the entire heat dissipation substrate, thereby reducing the temperature of the module assembly.

[0007] As a preferred embodiment of this utility model, the module group includes a battery, a temperature sensor, and a chip. The temperature sensor and the chip are electrically connected to the battery. The lower surface of the module group is a heat-conducting plate, and there is a thermally conductive insulating pad between the heat-conducting plate and the chip. The temperature sensor is used to sense the temperature inside the sealed cavity. When the temperature is too high, the chip controls the fan to dissipate heat. The thermally conductive insulating pad can reduce thermal resistance and also play a role in vibration damping.

[0008] As a preferred embodiment of this utility model, the heat-conducting plate is attached to and fixed to the surface of the heat-dissipating substrate, and thermal grease is provided between the heat-conducting plate and the heat-dissipating substrate to fill the gap and effectively improve the heat conduction efficiency.

[0009] As a preferred technical solution of this utility model, an air inlet is provided on the chassis body at the fan location, the fan is fixed to the air inlet, and air outlets are provided on the chassis body opposite and to the side of the air inlet. The lower cover is detachably connected to the chassis body, and the air outlet is provided on the lower cover to allow the hot air inside the heat dissipation cavity to be quickly discharged.

[0010] As a preferred technical solution of this utility model, the upper cover plate is detachably connected to the chassis body, and a flexible conductive sealing strip is provided between the upper cover plate and the chassis body to enhance the seal between the upper cover plate and the chassis body.

[0011] As a preferred technical solution of this utility model, the plug-in mechanism includes a socket, one end of which is located inside the sealed cavity and electrically connected to the module group, and the other end is located inside the heat dissipation cavity. There is a sealing ring between the socket and the wiring block. A plug is plugged into one end of the socket, and the other end of the plug is electrically connected to the fan. Both the socket and the plug are made of high temperature resistant material.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model transfers heat to the heat dissipation substrate and the heat dissipation fins through the thermally conductive insulating pad and the thermally conductive plate, and then the heat is carried away by the convection formed by the air blown by the fan. The sealed cavity and the heat dissipation cavity are completely separated, and the sealed environment enhances the environmental adaptability and reliability of the module group inside the chassis body; the heat dissipation fins combined with the chip to control the speed of the fan can enable the fan to work at low load and low noise. Attached Figure Description

[0013] Figure 1 This is a cross-sectional view of the structure of this utility model;

[0014] Figure 2 This is an exploded view of the structure of this utility model;

[0015] Figure 3 This is an enlarged view of section A of this utility model;

[0016] Figure 4 This is a schematic diagram of the interior of the heat dissipation cavity of this utility model;

[0017] Figure 5 This is a cross-sectional view of the insertion mechanism of this utility model.

[0018] In the diagram: 1. Chassis body; 101. Air outlet; 102. Air inlet; 2. Top cover; 3. Bottom cover; 4. Heat dissipation base plate; 5. Module group; 501. Chip; 502. Heat-conducting plate; 503. Thermally conductive insulating pad; 6. Sealed cavity; 7. Heat dissipation cavity; 8. Fan; 9. Heat dissipation fins; 10. Terminal block; 11. Plug-in mechanism; 12. Heat pipe; 13. Flexible conductive sealing strip; 14. Socket; 15. Sealing ring; 16. Plug. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0020] like Figures 1 to 5As shown, this utility model discloses a sealed air-cooled low-noise enclosure. The technical solution includes a chassis body 1, with a heat dissipation substrate 4 in the middle of the chassis body 1. The heat dissipation substrate 4 divides the chassis body 1 into a sealed cavity 6 and a heat dissipation cavity 7. A heat pipe 12 is pre-embedded inside the heat dissipation substrate 4 inside the sealed cavity 6. A module group 5 is located inside the sealed cavity 6 and is fixed to the heat dissipation substrate 4 by bolts. The module group 5 includes a battery, a temperature sensor, and a chip 501. The temperature sensor and the chip 501 are electrically connected to the battery. The lower surface of the module group 5 is a heat-conducting plate 502. A thermally conductive insulating pad 503 is placed between the heat-conducting plate 502 and the chip 501. The heat-conducting plate 502 is attached to and fixed to the surface of the heat dissipation substrate 4. Thermally conductive grease is placed between the heat-conducting plate 502 and the heat dissipation substrate 4. A top cover 2 is located above the module group 5 and is bolted to the chassis body 1. A flexible conductive sealing strip 13 is placed between the top cover 2 and the chassis body 1. The heat dissipation substrate 4 inside the heat dissipation cavity 7 is... The chassis body 1 inside the heat dissipation cavity 7 has heat dissipation fins 9 and a fan 8 at one end. An air inlet 102 is provided on the chassis body 1 at the location of the fan 8, and the fan 8 is fixed to the air inlet 102. Air outlets 101 are provided on the chassis body 1 opposite and to the side of the air inlet 102. A wiring block 10 is provided on the heat dissipation base plate 4 in the middle of the heat dissipation fins 9. The wiring block 10 is located outside the heat dissipation cavity 7 and communicates with the sealed cavity 6. The wiring block 10 has a plug-in mechanism 11. 8 is electrically connected to module group 5 through plug-in mechanism 11. Plug-in mechanism 11 includes socket 14. One end of socket 14 is located inside sealed cavity 6 and electrically connected to module group 5, and the other end is located inside heat dissipation cavity 7. There is a sealing ring 15 between socket 14 and wiring block 10. One end of socket 14 is plugged into plug 16, and the other end of plug 16 is electrically connected to fan 8. There is a lower cover plate 3 below heat dissipation fins 9. The lower cover plate 3 is bolted to chassis body 1. An air outlet 101 is opened on the lower cover plate 3.

[0021] The working principle of this utility model is as follows: During long-term operation, the chip 501 heats up, causing the temperature inside the sealed cavity 6 to rise. When the temperature sensor detects that the temperature has risen to the set value, the chip 501 controls the start of the fan 8. The high temperature of the chip 501 is transferred to the heat dissipation substrate 4 through the thermally conductive insulating pad 503 and the heat-conducting plate 502. The heat dissipation substrate 4 transfers the heat to the heat dissipation fins 9. The fan 8 blows air onto the heat dissipation fins 9 for heat exchange. The warm air is discharged from the air outlet 101, achieving cooling. When used in a rainy environment, since the sealed cavity 6 is completely sealed and the module group 5 is inside the sealed cavity 6, rainwater will not touch the module group 5, thus achieving sealing without affecting heat dissipation.

[0022] The circuits and mechanical connections involved in this utility model are common practices used by those skilled in the art, and technical inspiration can be obtained through a limited number of experiments. They are common knowledge.

[0023] Components not described in detail in this article are existing technologies.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A sealed air-cooled low-noise plug-in box comprising a box body (1), characterized in that: The middle of the case body (1) is provided with a heat dissipation base plate (4), the heat dissipation base plate (4) separates the case body (1) into a sealed cavity (6) and a heat dissipation cavity (7), the sealed cavity (6) is provided with a module group (5), the upper part of the module group (5) is provided with an upper cover plate (2), the heat dissipation base plate (4) inside the heat dissipation cavity (7) is provided with a heat dissipation fin (9), one end of the case body (1) inside the heat dissipation cavity (7) is provided with a fan (8), the heat dissipation base plate (4) in the middle of the heat dissipation fin (9) is provided with a wiring block (10), the wiring block (10) is located outside the heat dissipation cavity (7), the inside of the wiring block (10) is connected with the sealed cavity (6), the wiring block (10) is provided with a plug-in mechanism (11), the fan (8) is electrically connected with the module group (5) through the plug-in mechanism (11), and the lower part of the heat dissipation fin (9) is provided with a lower cover plate (3).

2. The sealed air-cooled low-noise plug-in box according to claim 1, characterized in that: The heat dissipation base plate (4) inside the sealed cavity (6) is pre-buried with a heat pipe (12).

3. The sealed, air-cooled, low-noise enclosure of claim 1, wherein: The module group (5) comprises a battery, a temperature sensor and a chip (501), the temperature sensor and the chip (501) are electrically connected with the battery, the lower surface of the module group (5) is a heat conduction plate (502), and the heat conduction plate (502) and the chip (501) are provided with a heat conduction insulating pad (503) therebetween.

4. The sealed, air-cooled, low-noise patch panel of claim 3, wherein: The heat conduction plate (502) is attached to the surface of the heat dissipation base plate (4) and is fixed with each other, and the heat conduction plate (502) and the heat dissipation base plate (4) are provided with heat conduction silicone grease therebetween.

5. The sealed, air-cooled, low-noise enclosure of claim 1, wherein: The case body (1) at the fan (8) is provided with an air inlet (102), and the fan (8) is fixed to the air inlet (102); and the case body (1) opposite to the air inlet (102) and the side of the case body (1) is provided with an air outlet (101).

6. The sealed, air-cooled, low-noise enclosure of claim 5, wherein: The lower cover plate (3) is detachably connected with the case body (1), and the lower cover plate (3) is provided with the air outlet (101).

7. The sealed, air-cooled, low-noise enclosure of claim 6, wherein: The upper cover plate (2) is detachably connected with the case body (1), and the upper cover plate (2) and the case body (1) are provided with a flexible conductive sealing strip (13) therebetween.

8. The sealed, air-cooled, low-noise enclosure of claim 1, wherein: The plug-in mechanism (11) comprises a socket (14), one end of the socket (14) is located in the sealed cavity (6) and is electrically connected with the module group (5), the other end of the socket (14) is located in the heat dissipation cavity (7), the socket (14) and the wiring block (10) are provided with a sealing ring (15) therebetween, one end of the socket (14) is provided with a plug (16), and the other end of the plug (16) is electrically connected with the fan (8).

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