Wireless temperature measurement module system taking induction electrode slice as antenna
By using the sensing electrode as an antenna and combining it with a nanowatt-level energy harvesting chip and a wireless transceiver SOC chip, the problem of wireless temperature measurement systems relying on external power supplies has been solved, achieving efficient wireless communication and low-cost operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-25
- Publication Date
- 2026-03-13
AI Technical Summary
Existing wireless temperature measurement systems rely on external power supplies, resulting in high operating costs and a large workload for maintenance. Furthermore, the antenna is affected by the power extraction electrodes, leading to a short communication distance.
Using inductive electrode sheets as antennas, combined with nanowatt-level energy harvesting chips and wireless transceiver SOC chips, energy harvesting and signal transmission are integrated. Intelligent power management is achieved through logic conversion modules and voltage regulation modules to avoid electromagnetic shielding problems.
This system enables efficient radiative communication in open spaces for wireless temperature measurement, improves antenna performance and system energy efficiency, reduces the frequency of power supply replacement, and lowers operating costs.
Smart Images

Figure CN223992646U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a wireless temperature measurement module system with an inductive electrode sheet as an antenna, belonging to the field of wireless temperature measurement technology. Background Technology
[0002] In critical industries such as power, chemical, petroleum, and metallurgy, wireless temperature measurement technology has become a core measure to ensure the safe operation of equipment and prevent accidents. Particularly in the power sector, real-time monitoring of temperature anomalies at power line joints is crucial, helping to provide early warning and rapid handling of potential overheating risks, thereby ensuring a continuous and stable power supply. With continuous technological evolution, wireless temperature measurement systems are developing towards smaller and more integrated designs to cope with more complex and demanding application environments. Wireless temperature measurement technology is mainly used in the power industry to monitor temperature anomalies at power line joints, thus providing an important guarantee for a stable power supply. However, currently available passive wireless temperature measurement products using electric field energy harvesting technology typically place their built-in antennas below the harvesting electrodes. Because the harvesting electrodes, as conductors, affect the antenna's radiation performance, the actual communication distance of such products is usually short, generally only reaching a range of tens of meters.
[0003] Patent application CN108760062A discloses a temperature sensor. The problem with this solution is that it relies on an external power source (such as a battery) and lacks a built-in energy harvesting mechanism. When the battery is depleted, it needs to be manually replaced, increasing operating costs and maintenance workload. Utility Model Content
[0004] In order to solve the problems existing in the prior art, this utility model proposes a wireless temperature measurement module system with an inductive electrode sheet as an antenna.
[0005] The technical solution of this utility model is as follows:
[0006] A wireless temperature measurement module system with an inductive electrode sheet as an antenna includes a temperature conversion and forwarding module, a temperature acquisition module, an energy harvesting and signal transmission module, a logic conversion module, and a voltage regulation module.
[0007] The output terminals of the energy harvesting and signal transmission module and the temperature conversion and forwarding module are connected to the input terminal of the logic conversion module. The output terminals of the logic conversion module and the energy harvesting and signal transmission module are connected to the input terminal of the voltage regulator module. The output terminal of the voltage regulator module is connected to the input terminal of the temperature conversion and forwarding module.
[0008] The output of the temperature acquisition module is connected to the input of the temperature conversion and forwarding module, and the output of the temperature conversion and forwarding module is connected to the input of the energy harvesting and signal transmission module.
[0009] The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module based on the measured temperature. The temperature conversion and forwarding module is used to convert the electrical signal into a temperature measurement result and forward it to the energy harvesting and signal transmission module.
[0010] The energy harvesting and signal transmission module is used for power supply and for transmitting the temperature measurement results to the receiving device through the electrodes of the energy harvesting and signal transmission module;
[0011] The logic conversion module is used to control whether the voltage regulator module outputs a stable power supply.
[0012] In a preferred embodiment, the energy harvesting and signal transmission module includes a nanowatt-level energy harvesting chip U3, an input capacitor module, and an output energy harvesting capacitor module.
[0013] The input capacitor module includes a third capacitor C72 and a fourth capacitor C75;
[0014] The output power harvesting capacitor module includes a fifth capacitor C38, a sixth capacitor C37, a seventh capacitor C36, an eighth capacitor C35, a ninth capacitor C34, a tenth capacitor C33, an eleventh capacitor C39, a twelfth capacitor C40, a thirteenth capacitor C41, and a fourteenth capacitor C42.
[0015] The input terminal PZ1 of the first piezoelectric element of the nanowatt-level energy harvesting chip U3 is connected to the first electrode, the input terminal PZ2 of the second piezoelectric element of the nanowatt-level energy harvesting chip U3 is connected to the second electrode, and the power good terminal PGOOD of the nanowatt-level energy harvesting chip U3 is connected to the input terminal of the logic conversion module.
[0016] The first output voltage selection terminal D0 and the second output voltage selection terminal D1 of the nanowatt-level energy harvesting chip U3 are grounded through the first capacitor. The second input voltage terminal VIN2 of the nanowatt-level energy harvesting chip U3 is grounded through the first capacitor. The output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3 is connected to the input terminal of the voltage regulator module and the input terminal of the logic conversion module, and is grounded through the fifth capacitor, the sixth capacitor, the seventh capacitor, the eighth capacitor, the ninth capacitor, the tenth capacitor, the eleventh capacitor, the twelfth capacitor, the thirteenth capacitor, and the fourteenth capacitor, respectively.
[0017] The switch output terminal SW of the nanowatt-level energy harvesting chip U3 is connected to the output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3 through the first inductor L22. The built-in power rail generator connection terminal CAP of the nanowatt-level energy harvesting chip U3 is connected to the first input voltage terminal VIN of the nanowatt-level energy harvesting chip U3 through the fifteenth capacitor C62. The first input voltage terminal VIN of the nanowatt-level energy harvesting chip U3 is grounded through the third capacitor and the fourth capacitor, respectively.
[0018] In a preferred embodiment, the voltage regulator module includes a low-dropout linear regulator U11;
[0019] The input terminal VIN of the low dropout linear regulator is connected to the output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3, and grounded through the sixteenth capacitor C65.
[0020] The ground terminal VSS of the low dropout linear regulator is grounded, the enable terminal EN of the low dropout linear regulator is connected to the input terminal of the logic conversion module, and the output terminal VOUT of the low dropout linear regulator outputs power and is grounded.
[0021] In a preferred embodiment, the logic conversion module includes logic gate chips;
[0022] The first input terminal A of the logic gate chip is connected to the power good terminal PGOOD of the nanowatt-level energy harvesting chip U3, the second input terminal B of the logic gate chip is connected to the temperature conversion and forwarding module through the first resistor R27, and the ground terminal GND of the logic gate chip is grounded.
[0023] The output terminal Y of the logic gate chip is grounded through the second resistor R22, and the output terminal Y of the logic gate chip is connected to the enable terminal EN of the low dropout linear regulator.
[0024] The power input terminal VCC of the logic gate chip is grounded through the seventeenth capacitor C68, and the power input terminal VCC of the logic gate chip is connected to the output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3.
[0025] In a preferred embodiment, the temperature acquisition module includes a negative temperature coefficient thermistor;
[0026] One end of the negative temperature coefficient thermistor R8 is grounded, and the other end is connected to one end of the third resistor R6 and one end of the fourth resistor R7, respectively.
[0027] The other end of the third resistor R6 and the other end of the fourth resistor R7 are connected to the temperature conversion and forwarding module.
[0028] In a preferred embodiment, the temperature conversion and forwarding module includes a wireless transceiver SOC chip;
[0029] The first ADC channel terminal PB3 of the wireless transceiver SOC chip is connected to the other end of the fourth resistor R7.
[0030] The second ADC channel terminal PB4 and the general input / output terminal PB5 of the wireless transceiver SOC chip are connected to the other end of the third resistor R6.
[0031] The second input terminal B of the logic gate chip is connected to the general-purpose input / output terminal PA1 of the wireless transceiver SOC chip through the first resistor;
[0032] The first internal digital section power supply terminal VDD1 of the wireless transceiver SOC chip is grounded through the eighteenth capacitor C56 and connected to the power supply VCC.
[0033] The internal real-time clock power supply terminal VBAT of the wireless transceiver SOC chip is grounded through the nineteenth capacitor C59 and connected to the power supply.
[0034] The internal analog power supply terminal VDDA of the wireless transceiver SOC chip is grounded through the twentieth capacitor C51 and connected to the power supply.
[0035] The power supply terminal VDD2 of the second internal digital section of the wireless transceiver SOC chip is grounded through the twenty-first capacitor C55 and connected to the power supply.
[0036] The feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip is grounded through the 22nd capacitor C52 and connected to the switching terminal VLXSMPS of the internal switching power supply of the wireless transceiver SOC chip through the 2nd inductor L21.
[0037] The power supply terminal VDDSMPS of the internal switching power supply of the wireless transceiver SOC chip is grounded through the twenty-third capacitor C54 and connected to the power supply, respectively. The twenty-fourth capacitor C69 is connected in parallel across the twenty-third capacitor C54.
[0038] The grounding terminal VSSMPS of the internal switching power supply of the wireless transceiver SOC chip and the heat dissipation terminal EXP of the wireless transceiver SOC chip are grounded.
[0039] The power supply terminal VDDRF1V55 of the first internal radio frequency section of the wireless transceiver SOC chip is grounded through the twenty-fifth capacitor C57.
[0040] The power supply terminal VDDRF of the second internal radio frequency section of the wireless transceiver SOC chip is connected to one end of the twenty-sixth capacitor C53 and one end of the twenty-seventh capacitor C66, and is connected to the power supply. The other end of the twenty-sixth capacitor C53 and the other end of the twenty-seventh capacitor C66 are grounded.
[0041] The power supply terminal VDDPA of the internal radio frequency amplifier of the wireless transceiver SOC chip is grounded through the twenty-eighth capacitor C61 respectively, and is connected to the power supply terminal VDDRF1V55 of the first internal radio frequency part of the wireless transceiver SOC chip and the feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip;
[0042] The input terminal OSC_IN of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency input terminal 1 of the four-pin passive crystal oscillator X3, the output terminal OSC_OUT of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency output terminal 3 of the four-pin passive crystal oscillator, and the first grounding terminal 2 and the second grounding terminal 4 of the four-pin passive crystal oscillator are grounded;
[0043] The upgrade configuration terminal BOOOT0 of the wireless transceiver SOC chip is grounded through the fifth resistor R11. The upgrade configuration terminal of the wireless transceiver SOC chip is used to receive the upgrade signal <<BOOT, and the reset terminal NRST of the wireless transceiver SOC chip is grounded through the twenty-ninth capacitor C58;
[0044] The output terminal VR_PA of the internal radio frequency amplifier power supply of the wireless transceiver SOC chip is grounded through the thirtieth capacitor C43 and the thirty-first capacitor C44 respectively, and is connected to one end of the fourth inductor L18 through the third inductor L19. The radio frequency signal output terminal RFO_LP of the line transceiver SOC chip is connected to one end of the fourth inductor L18. The other end of the fourth inductor L18 is connected to one end of the thirty-second capacitor C45 respectively, and is grounded through the thirty-third capacitor C29. The thirty-fourth capacitor C46 is connected in parallel at both ends of the fourth inductor L18. The other end of the thirty-second capacitor C45 is connected to one end of the thirty-sixth capacitor C47 through the fifth inductor L15 respectively, and is grounded through the thirty-fifth capacitor C21 and grounded through the sixth inductor L20 respectively. The other end of the thirty-sixth capacitor C47 is connected to the first electrode respectively, and is connected to the second electrode through the seventh inductor L23.
[0045] The utility model has the following beneficial effects:
[0046] 1. Through innovative design, the utility model successfully integrates the energy harvesting electrode and the radiation antenna into one, and巧妙地实现了将取能电极同时作为辐射天线的功能。这一开创性的设计不仅简化了装置的结构,更在显著提升天线辐射性能方面表现出色。
[0047] 2. With this novel integrated structure, the antenna can radiate in a completely open space environment, thus perfectly avoiding the electromagnetic shielding problem caused by the temperature measuring device body in the traditional design.
[0048] It should be noted that there may be some inaccuracies in the translation of the part "巧妙地实现了将取能电极同时作为辐射天线的功能" as the original Chinese expression seems a bit unclear. You may need to double-check and correct it according to the accurate meaning.3. This invention employs a nanowatt-level energy harvesting chip for energy harvesting. This chip features high efficiency and low power consumption, enabling it to collect sufficient energy to power the system even in low-power environments. Through the coordinated operation of the logic conversion module and the voltage regulation module, intelligent power management is achieved, dynamically adjusting the power output according to system requirements, thereby improving system energy efficiency and lifespan. Attached Figure Description
[0049] Figure 1 This is a connection diagram of the system modules of this utility model.
[0050] Figure 2 This is a circuit connection diagram of the energy harvesting and signal transmission module of this utility model.
[0051] Figure 3 This is a circuit connection diagram of the temperature conversion and forwarding module and the temperature acquisition module of this utility model.
[0052] Figure 4 This is the circuit connection diagram of the voltage regulator module of this utility model.
[0053] Figure 5 This is a circuit connection diagram of the logic conversion module of this utility model. Detailed Implementation
[0054] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0055] It should be understood that the step numbers used in the text are for ease of description only and are not intended to limit the order in which the steps are performed.
[0056] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.
[0057] The terms “comprising” and “including” indicate the presence of the described feature, whole, step, operation, element and / or component, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or collections thereof.
[0058] The term "and / or" refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0059] Embodiment 1:
[0060] In this embodiment, VIN, VOUT, CTRL, PG, VCCdisable>>, ADC, NTCctrl, and VSMPS all represent network names. Wires with the same network name indicate a connection relationship, and <<BOOT represents receiving an upgrade signal.
[0061] See Figure 1 , the present invention provides a wireless temperature measurement module system with an induction electrode sheet as an antenna, including a temperature conversion and forwarding module, a temperature acquisition module, an energy harvesting and signal transmission module, a logic conversion module, and a voltage stabilization module;
[0062] The output end of the energy harvesting and signal transmission module and the output end of the temperature conversion and forwarding module are connected to the input end of the logic conversion module. The output end of the logic conversion module and the output end of the energy harvesting and signal transmission module are connected to the input end of the voltage stabilization module. The output end of the voltage stabilization module is connected to the input end of the temperature conversion and forwarding module;
[0063] The output end of the temperature acquisition module is connected to the input end of the temperature conversion and forwarding module, and the output end of the temperature conversion and forwarding module is connected to the input end of the energy harvesting and signal transmission module;
[0064] The temperature acquisition module outputs an electrical signal to the temperature conversion and forwarding module according to the measured temperature. The temperature conversion and forwarding module is used to convert the electrical signal into a temperature measurement result and forward it to the energy harvesting and signal transmission module;
[0064]
[0065] The energy harvesting and signal transmission module is used for power supply and transmits the temperature measurement result to the receiving device through the electrodes of the energy harvesting and signal transmission module;
[0066] The logic conversion module is used to control whether the voltage stabilization module outputs a stable power supply.
[0067] After the energy harvesting and signal transmission module collects energy to a sufficient value, it is converted into a stable voltage through a voltage regulator and supplied to the temperature conversion and forwarding module for use.
[0068] See Figure 2 , as a preferred embodiment, the energy harvesting and signal transmission module includes a nanowatt energy harvesting chip U3, an input capacitance module, and an output energy harvesting capacitance module;
[0069] The model of the nanowatt energy harvesting chip U3 is LTC3688EDD-1#PBF;
[0070] The input capacitor module includes a third capacitor C72 and a fourth capacitor C75;
[0071] The output power harvesting capacitor module includes a fifth capacitor C38, a sixth capacitor C37, a seventh capacitor C36, an eighth capacitor C35, a ninth capacitor C34, a tenth capacitor C33, an eleventh capacitor C39, a twelfth capacitor C40, a thirteenth capacitor C41, and a fourteenth capacitor C42.
[0072] The input terminal PZ1 of the first piezoelectric element of the nanowatt-level energy harvesting chip U3 is connected to the first electrode PZD, the input terminal PZ2 of the second piezoelectric element of the nanowatt-level energy harvesting chip U3 is connected to the second electrode PZU, and the power good terminal PGOOD of the nanowatt-level energy harvesting chip U3 is connected to the input terminal of the logic conversion module.
[0073] The first output voltage selection terminal D0 and the second output voltage selection terminal D1 of the nanowatt-level energy harvesting chip U3 are grounded through the first capacitor. The second input voltage terminal VIN2 of the nanowatt-level energy harvesting chip U3 is grounded through the first capacitor. The output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3 is connected to the input terminal of the voltage regulator module and the input terminal of the logic conversion module, and is grounded through the fifth capacitor, the sixth capacitor, the seventh capacitor, the eighth capacitor, the ninth capacitor, the tenth capacitor, the eleventh capacitor, the twelfth capacitor, the thirteenth capacitor, and the fourteenth capacitor, respectively.
[0074] The switch output terminal SW of the nanowatt-level energy harvesting chip U3 is connected to the output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3 through the first inductor L22. The built-in power rail generator connection terminal CAP of the nanowatt-level energy harvesting chip U3 is connected to the first input voltage terminal VIN of the nanowatt-level energy harvesting chip U3 through the fifteenth capacitor C62. The first input voltage terminal VIN of the nanowatt-level energy harvesting chip U3 is grounded through the third capacitor and the fourth capacitor, respectively.
[0075] See Figure 4 In a preferred embodiment, the voltage regulator module includes a low-dropout linear regulator U11, model HT73L33;
[0076] The input terminal VIN of the low dropout linear regulator U11 is connected to the output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3, and grounded through the sixteenth capacitor C65.
[0077] The ground terminal VSS of the low dropout linear regulator is grounded, the enable terminal EN of the low dropout linear regulator is connected to the input terminal of the logic conversion module, and the output terminal VOUT of the low dropout linear regulator outputs power and is grounded.
[0078] See Figure 5 In a preferred embodiment, the logic conversion module includes a logic gate chip U15, model number SN74AUP1G32DBVR;
[0079] The first input terminal A of the logic gate chip U15 is connected to the power good terminal PGOOD of the nanowatt-level energy harvesting chip U3, the second input terminal B of the logic gate chip is connected to the temperature conversion and forwarding module through the first resistor R27, and the ground terminal GND of the logic gate chip is grounded.
[0080] The output terminal Y of the logic gate chip is grounded through the second resistor R22, and the output terminal Y of the logic gate chip is connected to the enable terminal EN of the low dropout linear regulator.
[0081] The power input terminal VCC of the logic gate chip is grounded through the seventeenth capacitor C68, and the power input terminal VCC of the logic gate chip is connected to the output voltage terminal VOUT of the nanowatt-level energy harvesting chip U3.
[0082] In a preferred embodiment, the temperature acquisition module includes a negative temperature coefficient thermistor R8, model B3950NTC;
[0083] One end of the negative temperature coefficient thermistor R8 is grounded, and the other end is connected to one end of the third resistor R6 and one end of the fourth resistor R7, respectively.
[0084] The other end of the third resistor R6 and the other end of the fourth resistor R7 are connected to the temperature conversion and forwarding module.
[0085] See Figure 3 In a preferred embodiment, the temperature conversion and forwarding module includes a wireless transceiver SOC chip U13, model STM32WLESCBUTR.
[0086] The first ADC channel terminal PB3 of the wireless transceiver SOC chip is connected to the other end of the fourth resistor R7.
[0087] The second ADC channel terminal PB4 and the general input / output terminal PB5 of the wireless transceiver SOC chip are connected to the other end of the third resistor R6.
[0088] The second input terminal B of the logic gate chip U15 is connected to the general-purpose input / output terminal PA1 of the wireless transceiver SOC chip through the first resistor. As long as the wireless transceiver SOC chip U13 is still working, the general-purpose input / output terminal PA1 of the wireless transceiver SOC chip U13 will always output a high level. Since the two input terminals (A, B) of the logic gate chip U15 are ORed, this ensures that the voltage regulator module will only cut off the power to the wireless transceiver SOC chip U13 when the wireless transceiver SOC chip U13 stops working.
[0089] The first internal digital section power supply terminal VDD1 of the wireless transceiver SOC chip U13 is grounded through the eighteenth capacitor C56 and connected to the power supply VCC.
[0090] The internal real-time clock power supply terminal VBAT of the wireless transceiver SOC chip is grounded through the nineteenth capacitor C59 and connected to the power supply.
[0091] The internal analog power supply terminal VDDA of the wireless transceiver SOC chip is grounded through the twentieth capacitor C51 and connected to the power supply.
[0092] The power supply terminal VDD2 of the second internal digital section of the wireless transceiver SOC chip is grounded through the twenty-first capacitor C55 and connected to the power supply.
[0093] The feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip is grounded through the 22nd capacitor C52 and connected to the switching terminal VLXSMPS of the internal switching power supply of the wireless transceiver SOC chip through the 2nd inductor L21.
[0094] The power supply terminal VDDSMPS of the internal switching power supply of the wireless transceiver SOC chip is grounded through the twenty-third capacitor C54 and connected to the power supply, respectively. The twenty-fourth capacitor C69 is connected in parallel across the twenty-third capacitor C54.
[0095] The grounding terminal VSSMPS of the internal switching power supply of the wireless transceiver SOC chip and the heat dissipation terminal EXP of the wireless transceiver SOC chip are grounded.
[0096] The power supply terminal VDDRF1V55 of the first internal radio frequency section of the wireless transceiver SOC chip is grounded through the twenty-fifth capacitor C57.
[0097] The power supply terminal VDDRF of the second internal radio frequency section of the wireless transceiver SOC chip is connected to one end of the twenty-sixth capacitor C53 and one end of the twenty-seventh capacitor C66, and is connected to the power supply. The other end of the twenty-sixth capacitor C53 and the other end of the twenty-seventh capacitor C66 are grounded.
[0098] The power supply terminal VDDPA of the internal radio frequency amplifier of the wireless transceiver SOC chip is grounded through the twenty-eighth capacitor C61, and connected to the power supply terminal VDDRF1V55 of the first internal radio frequency section of the wireless transceiver SOC chip and the feedback terminal VFBSMPS of the internal switching power supply of the wireless transceiver SOC chip.
[0099] The input terminal OSC_IN of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency input terminal 1 of the four-pin passive crystal oscillator X3. The output terminal OSC_OUT of the external high-speed crystal oscillator of the wireless transceiver SOC chip is connected to the frequency output terminal 3 of the four-pin passive crystal oscillator. The first grounding terminal 2 and the second grounding terminal 4 of the four-pin passive crystal oscillator are grounded.
[0100] The upgrade configuration terminal BOOOT0 of the wireless transceiver SOC chip is grounded through the fifth resistor R11. The upgrade configuration terminal of the wireless transceiver SOC chip is used to receive the upgrade signal <<BOOT. The reset terminal NRST of the wireless transceiver SOC chip is grounded through the twenty-ninth capacitor C58.
[0101] The output terminal VR_PA of the internal radio frequency amplifier power supply of the wireless transceiver SOC chip is grounded through the thirtieth capacitor C43 and the thirty-first capacitor C44 respectively, and is connected to one end of the fourth inductor L18 through the third inductor L19. The radio frequency signal output terminal RFO_LP of the line transceiver SOC chip is connected to one end of the fourth inductor L18. The other end of the fourth inductor L18 is connected to one end of the thirty-second capacitor C45 respectively, and is grounded through the thirty-third capacitor C29. The thirty-fourth capacitor C46 is connected in parallel at both ends of the fourth inductor L18. The other end of the thirty-second capacitor C45 is connected to one end of the thirty-sixth capacitor C47 through the fifth inductor L15 respectively, and is grounded through the thirty-fifth capacitor C21 and the sixth inductor L20 respectively. The other end of the thirty-sixth capacitor C47 is connected to the first electrode PZD respectively, and is connected to the second electrode PZU>> through the seventh inductor L23.
[0102] System principle:
[0103] Temperature acquisition module:
[0104] [[ID=1**********]]A negative temperature coefficient thermistor R8 is adopted, and the resistance value is changed through temperature change to generate a corresponding voltage signal. This signal is transmitted to the ADC input terminals (PB3, PB4, PB5) of the temperature conversion module through a voltage division circuit (resistors R6, R7).
[0105] Temperature conversion and forwarding module:
[0106] [[ID=**********]]The core is the wireless transceiver SOC chip U13. The built-in ADC converts the analog signal into a digital temperature value and transmits the data after modulation through a radio frequency circuit (the matching network is composed of inductors L15 - L23 and capacitors C21 - C47). The external crystal oscillator (X3) provides an accurate clock to ensure stable communication timing.
[0107] Energy harvesting and signal transmission module:
[0108] The nanowatt-level energy harvesting chip U3 harvests weak energy (such as electromagnetic field or vibration energy) from the environment through piezoelectric elements (PZ1, PZ2). Input capacitors (C72, C75) and an output capacitor network (C38-C42) are used for energy storage and filtering. A key innovation is that the inductive electrode sheets (PZD, PZU) simultaneously serve as energy harvesting electrodes and RF antennas, avoiding the shielding effect of metal electrodes on the antenna in traditional designs, thereby improving communication distance.
[0109] Logic conversion module:
[0110] Intelligent power management is implemented by logic gate chip U15. Its input receives the "Power Good" (PGOOD) signal from the energy harvesting chip and the status signal from the temperature conversion module (through resistor R27). When energy is sufficient and the system needs to operate, the logic gate outputs a high level, triggering the voltage regulator module to start.
[0111] Voltage regulator module:
[0112] The low-dropout linear regulator U11 outputs a stable voltage (e.g., 3.3V) under logic control and suppresses noise through a capacitor network (C65, C68, etc.), providing a clean power supply for the temperature conversion module and RF circuit.
[0113] Circuit principle:
[0114] 1. Integrated design of energy harvesting and antenna:
[0115] Piezoelectric energy harvesting: Piezoelectric elements convert mechanical vibration or electric field energy into electrical energy, which is then boosted and rectified by the U3 chip and stored in the capacitor network (C38-C42).
[0116] Antenna integration: Electrode sheets (PZD, PZU) are directly connected to the radio frequency matching network (inductor L23, capacitor C47, etc.), and electromagnetic wave radiation at specific frequencies (such as 433MHz or 2.4GHz) is achieved by utilizing the physical size and layout of the electrodes, without the need for additional antenna structures.
[0117] Anti-shielding mechanism: The electrodes, as open-structure radiators, avoid the shielding of the antenna by the traditional closed metal shell, allowing electromagnetic waves to propagate efficiently in free space.
[0118] 2. Intelligent power management:
[0119] Logic control flow:
[0120] The PGOOD signal of the energy harvesting chip indicates whether the voltage of the energy storage capacitor has reached the threshold.
[0121] The temperature conversion module sends its operating status signal via GPIO (PA1);
[0122] When both conditions are met, the logic gate chip (OR function) outputs a high level to enable the voltage regulator and start the system power supply.
[0123] Low power optimization: The regulator only operates when needed, reducing static power consumption and extending energy storage time.
[0124] 3. Radio frequency signal transmission:
[0125] Impedance matching network: The LC matching network, consisting of inductors L15-L23 and capacitors C21-C47, matches the impedance of the SOC chip's U13 RF output (RFO_LP) with that of the electrode antenna, maximizing transmission efficiency.
[0126] Harmonic suppression: Capacitors C29, C33, etc. are used to filter out harmonics and ensure that the signal complies with the communication frequency band specifications.
[0127] In this application embodiment, "at least one" refers to one or more, and "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent the existence of A alone, A and B simultaneously, or B alone. A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" and similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, at least one of a, b, and c can represent: a, b, c, a and b, a and c, b and c, or a and b and c, where a, b, and c can be single or multiple. The above descriptions are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made using the content of this utility model's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.
Claims
1. A wireless temperature measurement module system using an inductive electrode pad as an antenna, characterized by, The temperature conversion and forwarding module, the temperature collection module, the energy collection and signal transmission module, the logic conversion module and the voltage stabilizing module are included. The output end of the energy collection and signal transmission module and the output end of the temperature conversion and forwarding module are connected with the input end of the logic conversion module, the output end of the logic conversion module and the output end of the energy collection and signal transmission module are connected with the input end of the voltage stabilizing module, and the output end of the voltage stabilizing module is connected with the input end of the temperature conversion and forwarding module. The output end of the temperature collection module is connected with the input end of the temperature conversion and forwarding module, and the output end of the temperature conversion and forwarding module is connected with the input end of the energy collection and signal transmission module. The temperature collection module outputs an electric signal to the temperature conversion and forwarding module according to the measured temperature, and the temperature conversion and forwarding module is used for converting the electric signal into a temperature measurement result and forwarding the temperature measurement result to the energy collection and signal transmission module. The energy collection and signal transmission module is used for power supply, and the temperature measurement result is transmitted to a receiving device through the electrode of the energy collection and signal transmission module. The logic conversion module is used for controlling the voltage stabilizing module to output a stable power supply.
2. The wireless temperature measurement module system using an inductive electrode pad as an antenna according to claim 1, wherein, The energy collection and signal transmission module includes a nano-watt energy collection chip, an input capacitor module and an output energy collection capacitor module. The input capacitor module includes a third capacitor and a fourth capacitor. The output energy collection capacitor module includes a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a tenth capacitor, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor and a fourteenth capacitor. The input end of the first piezoelectric element of the nano-watt energy collection chip is connected with a first electrode, the input end of the second piezoelectric element of the nano-watt energy collection chip is connected with a second electrode, and the power good end of the nano-watt energy collection chip is connected with the input end of the logic conversion module. The first output voltage selection end and the second output voltage selection end of the nano-watt energy collection chip are grounded through the first capacitor, the second input voltage end of the nano-watt energy collection chip is grounded through the first capacitor, the output voltage end of the nano-watt energy collection chip is connected with the input end of the voltage stabilizing module and the input end of the logic conversion module, and is grounded through the fifth capacitor, the sixth capacitor, the seventh capacitor, the eighth capacitor, the ninth capacitor, the tenth capacitor, the eleventh capacitor, the twelfth capacitor, the thirteenth capacitor and the fourteenth capacitor respectively. The switch output end of the nano-watt energy collection chip is connected with the output voltage end of the nano-watt energy collection chip through the first inductor, the built-in power supply rail generator connection end of the nano-watt energy collection chip is connected with the first input voltage end of the nano-watt energy collection chip through the fifteenth capacitor, and the first input voltage end of the nano-watt energy collection chip is grounded through the third capacitor and the fourth capacitor respectively.
3. The wireless temperature measurement module system of claim 2, wherein the inductive electrode pad is configured to operate as an antenna. The voltage stabilizing module includes a low dropout linear voltage stabilizer. The input end of the low dropout linear voltage stabilizer is connected with the output voltage end of the nano-watt energy collection chip, and is grounded through the sixteenth capacitor. The ground end of the low dropout linear regulator is grounded, the enable end of the low dropout linear regulator is connected with the input end of the logic conversion module, the output end of the low dropout linear regulator outputs power supply, and the ground end.
4. The wireless temperature measurement module system of claim 3, wherein the inductive electrode pad is configured to operate as an antenna. The logic conversion module comprises a logic gate chip; The first input end of the logic gate chip is connected with the power good end of the nanowatt energy harvesting chip, the second input end of the logic gate chip is connected with the temperature conversion and forwarding module through the first resistor, and the ground end of the logic gate chip is grounded; The output end of the logic gate chip is grounded through the second resistor, and the output end of the logic gate chip is connected with the enable end of the low dropout linear regulator; The power supply input end of the logic gate chip is grounded through the seventeenth capacitor, and the power supply input end of the logic gate chip is connected with the output voltage end of the nanowatt energy harvesting chip.
5. The wireless temperature measurement module system of claim 4, wherein the inductive electrode pad is configured to operate as an antenna. The temperature acquisition module comprises a negative temperature coefficient thermistor; One end of the negative temperature coefficient thermistor is grounded, and the other end of the negative temperature coefficient thermistor is connected with one end of the third resistor and one end of the fourth resistor respectively; The other end of the third resistor and the other end of the fourth resistor are connected with the temperature conversion and forwarding module.
6. The wireless temperature measurement module system of claim 5, wherein the inductive electrode pad is configured to operate as an antenna. The temperature conversion and forwarding module comprises a wireless transceiver SOC chip; The first ADC channel end of the wireless transceiver SOC chip is connected with the other end of the fourth resistor; The second ADC channel end and the general input and output end of the wireless transceiver SOC chip are connected with the other end of the third resistor; The second input end of the logic gate chip is connected with the general input and output end of the wireless transceiver SOC chip through the first resistor; The first internal digital part power supply end of the wireless transceiver SOC chip is grounded through the eighteenth capacitor respectively, and is connected with the power supply respectively; The internal real-time clock power supply end of the wireless transceiver SOC chip is grounded through the nineteenth capacitor respectively, and is connected with the power supply respectively; The internal analog part power supply end of the wireless transceiver SOC chip is grounded through the twentieth capacitor respectively, and is connected with the power supply respectively; The second internal digital part power supply end of the wireless transceiver SOC chip is grounded through the twenty-first capacitor respectively, and is connected with the power supply respectively; The feedback end of the internal switching power supply of the wireless transceiver SOC chip is grounded through the twenty-second capacitor respectively, and is connected with the switching end of the internal switching power supply of the wireless transceiver SOC chip through the second inductor; The power supply end of the internal switching power supply of the wireless transceiver SOC chip is grounded through the twenty-third capacitor respectively, and is connected with the power supply, and the twenty-fourth capacitor is connected in parallel across the twenty-third capacitor; The ground end of the internal switching power supply of the wireless transceiver SOC chip and the heat dissipation end of the wireless transceiver SOC chip are grounded; The power supply end of the first internal radio frequency part of the wireless transceiver SOC chip is grounded through the twenty-fifth capacitor; The power supply end of the second internal radio frequency part of the wireless transceiver SOC chip is connected with one end of the twenty-sixth capacitor and one end of the twenty-seventh capacitor respectively, and is connected with the power supply, and the other end of the twenty-sixth capacitor and the other end of the twenty-seventh capacitor are grounded; The power supply end of the internal radio frequency amplifier of the wireless transceiving SOC chip is grounded through the twenty-eighth capacitor, and is connected with the power supply end of the first internal radio frequency part of the wireless transceiving SOC chip and the feedback end of the internal switching power supply of the wireless transceiving SOC chip; The input end of the external high-speed crystal oscillator of the wireless transceiving SOC chip is connected with the frequency input end of the four-pin passive crystal oscillator, the output end of the external high-speed crystal oscillator of the wireless transceiving SOC chip is connected with the frequency output end of the four-pin passive crystal oscillator, and the first ground end and the second ground end of the four-pin passive crystal oscillator are grounded; The upgrade configuration end of the wireless transceiving SOC chip is grounded through the fifth resistor, the upgrade configuration end of the wireless transceiving SOC chip is used for receiving an upgrade signal, and the reset end of the wireless transceiving SOC chip is grounded through the twenty-ninth capacitor; The output end of the internal radio frequency amplifier power supply of the wireless transceiving SOC chip is grounded through the thirtieth capacitor and the thirty-first capacitor, and is connected with one end of the third inductor and the fourth inductor through the third inductor, the radio frequency signal output end of the wireless transceiving SOC chip is connected with one end of the fourth inductor, the other end of the fourth inductor is connected with one end of the thirty-second capacitor, and is grounded through the thirty-third capacitor, the thirty-fourth capacitor is connected in parallel across the fourth inductor, the other end of the thirty-second capacitor is connected with one end of the thirty-sixth capacitor through the fifth inductor, and is grounded through the thirty-fifth capacitor and the sixth inductor, respectively, the other end of the thirty-sixth capacitor is connected with the first electrode and the second electrode through the seventh inductor, respectively.
Citation Information
Patent Citations
Temperature sensor
CN108760062A