Movement module and infrared imaging device

Abstract

The utility model provides a machine core module and an infrared imaging device, and relates to the technical field of infrared thermal imaging machine cores. The objective of the utility model is to improve the anti-electromagnetic interference performance on the basis of ensuring the miniaturization of a movement. The machine core module comprises a shutter, a detector, a first circuit board, a heat dissipation plate and a second circuit board which are sequentially arranged in the first direction, and the first direction is the optical axis direction of the machine core module. The detector is electrically connected with the first circuit board, and the edge of the shutter is connected with the edge of the first circuit board to surround the detector. The shutter, the first circuit board, the heat dissipation plate and the second circuit board are electrically connected and grounded.

Description

Technical Field

[0001] This utility model relates to the field of infrared thermal imaging core technology, specifically to a core module and an infrared imaging device. Background Technology

[0002] The continuous maturation of thermal imaging technology has driven the development of infrared sensors towards lightweight, small size, and high performance.

[0003] However, the miniaturization of infrared sensors inevitably leads to electromagnetic interference (EMI) problems. The smaller the overall size of the infrared sensor, the more susceptible it is to EMI. Current technologies often use metal casings to reduce EMI, but integrated metal casings significantly increase the size of the infrared sensor, contradicting the initial goal of lightweight and compact design. Utility Model Content

[0004] This utility model provides a mechanism module and an infrared imaging device, which aims to improve the anti-electromagnetic interference performance while ensuring the miniaturization of the mechanism.

[0005] To achieve the above objectives, the embodiments of this utility model adopt the following technical solutions:

[0006] In a first aspect, this application provides a camera module comprising a shutter, a detector, a first circuit board, a heat sink, and a second circuit board arranged sequentially along a first direction, wherein the first direction is the optical axis direction of the camera module. The detector is electrically connected to the first circuit board, and the edge of the shutter is connected to the edge of the first circuit board to surround the detector. The shutter, the first circuit board, the heat sink, and the second circuit board are electrically connected and grounded.

[0007] The shutter, first circuit board, heat sink, and second circuit board in the camera module provided in this application are connected to a common ground. Because the shutter, first circuit board, heat sink, and second circuit board are connected to a common ground, the components in the camera module are connected to the same ground potential. This helps reduce the potential difference between the shutter, first circuit board, heat sink, and second circuit board, which is a key factor in the propagation of electromagnetic interference. Therefore, connecting the shutter, first circuit board, heat sink, and second circuit board to a common ground effectively reduces electromagnetic interference. Furthermore, the common ground connection creates a shielding effect. When an external electromagnetic field attempts to interfere with the camera module, the common ground connection forms a discharge path, guiding the interference current to the ground, thereby mitigating the impact of electromagnetic interference on the internal circuitry of the camera module. Additionally, since the shutter, first circuit board, heat sink, and second circuit board are all made of metal, when they are interconnected, they form a metal shielding shell that reflects electromagnetic waves, reducing the possibility of electromagnetic waves penetrating the shell and entering the camera module. Because no new components are introduced into the entire camera module, the miniaturization requirements of the camera module can be met.

[0008] In one possible implementation, a first metal layer is disposed on the surface of the first circuit board facing the heat sink, and the first metal layer is grounded. A first conductive adhesive layer is disposed between the heat sink and the first metal layer, and the first conductive adhesive layer connects the heat sink and the first metal layer.

[0009] As one possible implementation, both the heat sink and the second circuit board are provided with screw holes, and the heat sink and the second circuit board are electrically connected by screws.

[0010] As one possible implementation, a second metal layer is provided on the surface of the heat sink away from the second circuit board. The second metal layer surrounds the screw holes of the heat sink and is in contact with and electrically connected to the screws.

[0011] As one possible implementation, the projection of the first conductive adhesive layer onto the heat sink along a first direction avoids the second metal layer, and the first metal layer and the second metal layer are in contact and electrically connected.

[0012] In one possible implementation, a third metal layer is provided on the surface of the heat sink facing the second circuit board, and the third metal layer surrounds the screw holes of the heat sink. A fourth metal layer is provided on the surface of the second circuit board facing the heat sink, and the fourth metal layer surrounds the screw holes of the second circuit board. The third metal layer and the fourth metal layer are in contact and electrically connected.

[0013] As one possible implementation, the mechanism module also includes a third circuit board and a heat insulation plate disposed on the side of the second circuit board away from the heat sink, with the heat insulation plate positioned between the third circuit board and the second circuit board. The third circuit board is electrically connected to the second circuit board and shares a common ground, the heat insulation plate is connected to the third circuit board, and the heat insulation plate is connected to the second circuit board.

[0014] As one possible implementation, screw holes are provided on both the third circuit board and the heat insulation board, and the heat sink, the second circuit board, the heat insulation board and the third circuit board are connected by screws.

[0015] In one possible implementation, the shutter includes a drive circuit and multiple solder pins disposed on the edge of the shutter. A first circuit board has multiple solder pads. The drive circuit is connected to the multiple solder pins, and the multiple solder pins are electrically connected to the corresponding solder pads. Among the multiple solder pins is a ground pin, and the ground terminal of the drive circuit is electrically connected to the ground pin.

[0016] As one possible implementation, the shutter has a first slot that extends through itself in a first direction, the surface of the first circuit board facing away from the heat sink is connected to the portion of the shutter surrounding the first slot, and the detector is housed in the first slot.

[0017] As one possible implementation, a sixth metal layer is provided on the side of the first circuit board facing the shutter, and the sixth metal layer is connected to the shutter through a second conductive adhesive layer.

[0018] As one possible implementation, the heat sink has a boss structure on the side near the first circuit board, and the first circuit board has a second slot through which the boss structure passes. There is a gap between the surface of the boss structure near the detector and the detector, and a heat-conducting layer is provided on the surface of the boss structure near the detector.

[0019] Secondly, this application also provides an infrared imaging device, including a core module and an image processor as described above, wherein the core module and the image processor are connected.

[0020] The beneficial effects of the second aspect can be referred to the beneficial effects of the first aspect, and will not be elaborated here. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a partial composition of a movement module provided in an embodiment of this application;

[0022] Figure 2 This is a schematic diagram of a heat sink structure provided in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram showing a partial composition of another movement module provided in an embodiment of this application;

[0024] Figure 4 This is a schematic diagram showing a partial composition of another movement module provided in an embodiment of this application;

[0025] Figure 5 This is a schematic diagram showing a partial composition of another movement module provided in an embodiment of this application;

[0026] Figure 6 This is a schematic diagram of a movement module provided in an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of an infrared imaging device provided in an embodiment of this application. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, when describing pipelines, the terms "connected" and "linked" in this utility model have the meaning of establishing conductivity. The specific meaning needs to be understood in conjunction with the context.

[0031] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0032] Infrared thermal imaging technology is a technique that uses an infrared detector and an optical imaging lens to receive the infrared radiation energy distribution pattern of a target and reflect it onto the photosensitive element of the infrared detector, thereby obtaining an infrared thermal image. This technology can convert invisible infrared radiation energy into a visible thermal image, intuitively displaying the temperature distribution of an object's surface. Due to its advantages such as being non-contact, real-time, fast, and intuitive, infrared thermal imaging technology is widely used in various fields.

[0033] Mechanism modules, such as infrared mechanism modules, are core components in devices manufactured using infrared thermal imaging technology. With the continuous development of technology, people's requirements for mechanism modules are also getting higher and higher, prompting mechanism modules to continuously develop towards lightweight, miniaturization and high performance.

[0034] This application provides a movement module, exemplarily, such as... Figure 1 As shown in the figure, the camera module 100 includes a shutter 1, a detector 2, a first circuit board 3, a heat sink 4, and a second circuit board 5, arranged sequentially along a first direction (indicated by the arrow in the figure). The first direction is the optical axis direction of the camera module 100. The detector 2 is electrically connected to the first circuit board 3, and the edge of the shutter 1 is connected to the edge of the first circuit board 3 to surround the detector 2. The shutter 1, the first circuit board 3, the heat sink 4, and the second circuit board 5 are electrically connected and grounded.

[0035] The detector 2 in the camera module 100 provided in this application is electrically connected to the first circuit board 3, and the detector 2 is surrounded by the shutter 1 and the first circuit board 3, thus providing good protection for the detector 2. The shutter 1, first circuit board 3, heat sink 4, and second circuit board 5 in the camera module 100 provided in this application are connected to a common ground. Because the shutter 1, first circuit board 3, heat sink 4, and second circuit board 5 are connected to a common ground, the components in the camera module 100 are connected to the same ground potential, which helps to reduce the potential difference between the shutter 1, first circuit board 3, heat sink 4, and second circuit board 5. Since potential difference is a key factor in the propagation of electromagnetic interference, the common ground connection of the shutter 1, first circuit board 3, heat sink 4, and second circuit board 5 can effectively reduce electromagnetic interference.

[0036] In addition, the common ground connection can form a shielding effect. When an external electromagnetic field attempts to interfere with the mechanism module, the common ground connection will form a discharge path to guide the interference current to the ground. By directing the electromagnetic interference to the ground, rather than allowing the electromagnetic interference to interfere with each other between the internal components of the mechanism module 100, the impact of electromagnetic interference on the internal circuit of the mechanism module 100 is reduced.

[0037] Furthermore, since the shutter 1, the first circuit board 3, the heat sink 4, and the second circuit board 5 are all made of metal—for example, the shutter 1 is made of aluminum, and the substrates of the first circuit board 3 and the second circuit board 5 are also made of aluminum—and the heat sink is typically made of a material with high thermal conductivity, such as copper, aluminum, or ceramic, these materials can quickly absorb heat and conduct it to the heat sink or other heat dissipation structures. Therefore, when the shutter 1, the first circuit board 3, the heat sink 4, and the second circuit board 5 are connected to each other, they essentially form a metal shielding shell that can reflect electromagnetic waves and reduce the possibility of electromagnetic waves penetrating the shell and entering the movement module 100. Since no new components are introduced into the entire movement module 100, the miniaturization requirement of the movement module 100 can be guaranteed.

[0038] Reference Figure 1 In some embodiments, a first metal layer is disposed on the surface of the first circuit board 3 facing the heat sink 4, and the first metal layer is grounded. A first conductive adhesive layer is disposed between the heat sink 4 and the first metal layer, connecting the heat sink 4 and the first metal layer. As one possible implementation, the material of the first metal layer includes copper, that is, the surface of the first circuit board 3 facing the heat sink 4 is copper-clad. The heat sink 4 is connected to the copper-clad side of the first circuit board 3 through the first conductive adhesive layer. As one possible implementation, the first conductive adhesive layer is conductive silicone grease.

[0039] Copper plating on the surface of the first circuit board 3 to the heat sink 4 helps to increase the heat dissipation area of ​​the first circuit board, prevents the components on the circuit board from overheating and causing the overall temperature of the core module 100 to be too high. In addition, it can also increase the mechanical strength of the first circuit board 3 to prevent the circuit board from breaking during processing, assembly or use.

[0040] Reference Figure 1 Both the heat sink 4 and the second circuit board 5 are provided with screw holes, and the heat sink 4 and the second circuit board 5 are electrically connected by screws. In some embodiments, exemplarily, refer to Figure 2 The heat sink 4 has a second metal layer on its surface away from the second circuit board 5. The second metal layer surrounds the screw holes of the heat sink 4 and is in contact with and electrically connected to the screws.

[0041] Figure 2The shaded area in the diagram represents the second metal layer area surrounding the screw holes on the heat sink 4. For example, the material of the second metal layer includes copper. Screws pass through the screw holes on the heat sink 4 and the second circuit board 5, connecting the heat sink 4 to the second circuit board 5. Applying copper plating to the area surrounding the screw holes increases the mechanical strength around them, preventing breakage or damage to the device when tightening the screws. The copper plating area serves as a heat conduction path, aiding in heat dissipation through the screws and the copper plating area, thus improving overall heat dissipation efficiency. Furthermore, copper plating ensures good electrical connections, reduces contact resistance, and forms electromagnetic shielding, reducing electromagnetic interference that may be caused by the screw holes.

[0042] Figure 2 The area indicated by the middle arrow is the application area of ​​the first conductive adhesive layer. It can be seen that the projection of the first conductive adhesive layer along the first direction on the heat sink 4 avoids the second metal layer, preventing adhesion between the first conductive adhesive layer and the screws during the installation and removal of the heat sink 4 and the second circuit board 5. The first and second metal layers are in contact and electrically connected, and because the first metal layer is grounded, a common ground connection is achieved between the heat sink 4 and the second circuit board 5.

[0043] Similarly, refer to Figure 1 To increase the mechanical strength around the screw holes, prevent breakage or damage to the device when tightening the screws, ensure good electrical connection, reduce contact resistance, and form electromagnetic shielding to reduce electromagnetic interference that may be caused by the screw holes, a third metal layer is provided on the surface of the heat sink 4 facing the second circuit board 5, surrounding the screw holes of the heat sink 4. A fourth metal layer is provided on the surface of the second circuit board 5 facing the heat sink 4, surrounding the screw holes of the second circuit board 5. The third and fourth metal layers are in contact and electrically connected. As one possible implementation, the materials of the third and fourth metal layers include copper.

[0044] In some embodiments, exemplarily, such as Figure 3 As shown, the mechanism module 100 also includes a heat insulation plate 6 and a third circuit board 7 disposed on the side of the second circuit board 5 away from the heat sink 4. The heat insulation plate 6 is disposed between the third circuit board 7 and the second circuit board 5. The third circuit board 7 is electrically connected to the second circuit board 5 and shares a common ground. The heat insulation plate 6 is connected to the third circuit board 7, and the heat insulation plate 6 is connected to the second circuit board 5. Since the second circuit board 5 is electrically connected to the shutter 1, the first circuit board 3, and the heat sink 4 and shares a common ground, and the second circuit board 5 and the third circuit board 7 are electrically connected to each other and share a common ground, the shutter 1, the detector 2, the first circuit board 3, the heat sink 4, the second circuit board 5, and the third circuit board 7 are all connected to a common ground.

[0045] As one possible implementation, both the heat insulation plate 6 and the third circuit board 7 are provided with screw holes, and the heat sink 4, the second circuit board 5, the heat insulation plate 6, and the third circuit board 7 are connected by screws. Similarly, to increase the mechanical strength around the screw holes, prevent breakage or damage to the components when tightening the screws, ensure good electrical connection, reduce contact resistance, and form electromagnetic shielding to reduce electromagnetic interference that may be caused by the screw holes, metal layers are provided on the opposing surfaces of the second circuit board 5 and the third circuit board 7, and the metal layers surround the screw holes. The two metal layers on the opposing surfaces are in contact and electrically connected. As one possible implementation, the material of the metal layers includes copper.

[0046] In some embodiments, exemplarily, such as Figure 4 As shown, shutter 1 includes a drive circuit and multiple solder pins 11 disposed on the edge of shutter 1. The first circuit board 3 has multiple solder pads 31. The drive circuit is connected to the multiple solder pins 11, and the multiple solder pins are electrically connected to the multiple solder pads 31. Each solder pin 11 includes a ground pin, and the ground terminal of the drive circuit is electrically connected to the ground pin. "Multiple solder pins 11 are electrically connected to multiple solder pads 31" means that the number of solder pins 11 is the same as the number of solder pads 31, with one solder pin 11 connected to one solder pad 31. The electrical connection between shutter 1 and the first circuit board 3 is achieved through the corresponding connection of the solder pins 11 and the solder pads 31. Since the ground pin in the solder pin 11 is connected to the ground terminal of the drive circuit, a common ground connection between shutter 1 and the first circuit board 3 can be achieved.

[0047] Reference Figure 1 and Figure 4 As one possible implementation, the shutter 1 has a first slot 12 extending through itself in a first direction. The surface of the first circuit board 3 facing away from the heat sink 4 is connected to the portion of the shutter 1 surrounding the first slot 12. The detector 2 is accommodated within the first slot 12. The detector 2 is accommodated within the first slot 12 of the shutter 1 and is surrounded by the shutter 1, thus achieving being surrounded by the shutter 1 and the first circuit board 3.

[0048] In some embodiments, a sixth metal layer is provided on the side of the first circuit board 3 facing the shutter 1. The sixth metal layer is connected to the shutter 1 through a second conductive adhesive layer. For example, the material of the sixth metal layer includes copper, and the second conductive adhesive layer is conductive adhesive. The first circuit board 3 and the shutter 1 are connected by adhesive. When the second conductive adhesive layer is conductive adhesive, the conductive adhesive area needs to be grounded with exposed copper to ensure the electrical connection between the shutter 1 and the first circuit board 3.

[0049] As one possible implementation method, refer to Figure 1 and Figure 2A boss structure 41 is provided on the side of the heat sink 4 near the first circuit board 3. The first circuit board 3 has a second slot 30, through which the boss structure 41 passes. There is a gap between the surface of the boss structure 41 near the detector 2 and the detector 2. A thermally conductive layer is provided on the surface of the boss structure 41 near the detector 2. For example, the thermally conductive layer is thermally conductive silicone grease, and the gap between the surface of the detector 2 and the detector 2 is approximately 50mm. Spin-coating thermally conductive silicone grease onto the surface of the boss structure 41 near the detector 2 ensures efficient heat transfer from the detector 2 to the heat sink 4. Effective heat dissipation by the heat sink 4 extends the service life of the core module 100 and improves its stability and reliability.

[0050] For example, refer to Figure 5 The camera module also includes a lens 8 and a lens mount 9. The lens 8 and lens mount 9 are located on the side of the shutter 1 furthest from the detector 2. The lens 8 and lens mount 9 are connected by threads, and the lens mount 9 is connected to the shutter 1 by screws. The camera module 100, formed by connecting the shutter 1, detector 2, first circuit board 3, heat sink 4, second circuit board 5, heat insulation board 6, third circuit board 7, lens 8, and lens mount 9, is as follows: Figure 6 As shown. According to Figure 6 It can be seen that the connection between the shutter 1, first circuit board 3, heat sink 4, second circuit board 5, heat insulation board 6, third circuit board 7, lens 8, and lens mount 9 in the mechanism module 100 provided in this application forms an integrated metal shell that encloses the detector 2. As one possible implementation, the second circuit board 5 is a power board responsible for supplying power to the mechanism module 100, and the third circuit board 7 is a main control board used for internal control of the mechanism module 100. Through the common ground connection design within the mechanism module 100, an effective electrostatic discharge path is formed. Compared to the traditional method of encapsulating a metal shell externally, this application achieves a similar function by establishing a common ground within the mechanism module 100's own structural components, thus improving electromagnetic interference resistance while maintaining the miniaturization of the mechanism module size.

[0051] This application also provides an infrared imaging device, exemplarily, such as... Figure 7 As shown, the infrared imaging device 200 includes a core module 100 and an image processor 50 as described above, with the core module 100 and the image processor 50 connected together. Because the core module 100 is miniaturized and has excellent electromagnetic interference resistance, the size of the infrared imaging device can also be further reduced, and the measured images are clearer and more accurate.

[0052] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein.

[0053] Finally, it should be noted that the above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A movement module, characterized in that, It includes a shutter, a detector, a first circuit board, a heat sink, and a second circuit board arranged sequentially along a first direction, wherein the first direction is the optical axis direction of the mechanism module; The detector is electrically connected to the first circuit board, and the edge of the shutter is connected to the edge of the first circuit board to surround the detector; The shutter, the first circuit board, the heat sink, and the second circuit board are electrically connected and grounded.

2. The movement module according to claim 1, characterized in that, The first circuit board has a first metal layer on its surface facing the heat sink, and the first metal layer is grounded. A first conductive adhesive layer is disposed between the heat sink and the first metal layer, and the first conductive adhesive layer connects the heat sink and the first metal layer.

3. The movement module according to claim 2, characterized in that, Both the heat sink and the second circuit board are provided with screw holes, and the heat sink and the second circuit board are electrically connected by screws.

4. The movement module according to claim 3, characterized in that, The heat sink has a second metal layer on the surface opposite to the second circuit board. The second metal layer surrounds the screw holes of the heat sink and is in contact with and electrically connected to the screws.

5. The movement module according to claim 4, characterized in that, The first conductive adhesive layer is disposed along the first direction on the heat sink to avoid the second metal layer, and the first metal layer and the second metal layer are in contact and electrically connected.

6. The movement module according to claim 3, characterized in that, The heat sink has a third metal layer on its surface facing the second circuit board, and the third metal layer surrounds the screw holes of the heat sink. The second circuit board has a fourth metal layer on its surface facing the heat sink, and the fourth metal layer surrounds the screw holes of the second circuit board; The third metal layer and the fourth metal layer are in contact and electrically connected.

7. The movement module according to claim 3, characterized in that, The mechanism module also includes a third circuit board and a heat insulation plate disposed on the side of the second circuit board away from the heat sink, and the heat insulation plate is disposed between the third circuit board and the second circuit board; The third circuit board is electrically connected to the second circuit board and shares a common ground. The heat insulation plate is connected to the third circuit board and the heat insulation plate is connected to the second circuit board.

8. The movement module according to claim 7, characterized in that, Both the third circuit board and the heat insulation board are provided with screw holes, and the heat sink, the second circuit board, the heat insulation board and the third circuit board are connected by the screws.

9. The movement module according to any one of claims 1 to 8, characterized in that, The shutter includes a drive circuit and a plurality of solder pins disposed on the edge of the shutter, and the first circuit board is provided with a plurality of solder pads; The driving circuit is connected to the plurality of welding pins, and the plurality of welding pins are electrically connected to the plurality of solder pads accordingly; The plurality of welding pins include a grounding pin, and the grounding terminal of the drive circuit is electrically connected to the grounding pin.

10. The movement module according to any one of claims 1 to 8, characterized in that, The shutter has a first slot that extends through itself along the first direction. The surface of the first circuit board facing away from the heat sink is connected to the portion of the shutter surrounding the first slot. The detector is accommodated within the first slot.

11. The movement module according to claim 10, characterized in that, A sixth metal layer is provided on the side of the first circuit board facing the shutter, and the sixth metal layer is connected to the shutter through a second conductive adhesive layer.

12. The movement module according to claim 2, characterized in that, The heat sink has a boss structure on the side near the first circuit board, and the first circuit board has a second slot, through which the boss structure passes. The protrusion structure has a gap between its surface near the detector and the detector, and a heat-conducting layer is provided on the surface of the protrusion structure near the detector.

13. An infrared imaging device, characterized in that, The infrared imaging device includes an image processor and a mechanism module as described in any one of claims 1 to 12, wherein the mechanism module is connected to the image processor.

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