Single-lens light-incoming multi-Cmos imaging device

Abstract

The utility model relates to the field of optical imaging and mechanical design, and discloses a single-lens light-incoming multi-Cmos imaging device, which comprises an optical focusing lens, an image intensifier is arranged at the bottom of the optical focusing lens, an installation assembly is arranged at the bottom of the image intensifier, the installation assembly is provided with a focusing lens and a CMOS base, and the focusing lens and the CMOS base are arranged on the optical focusing lens. The focusing lens is arranged at the bottom of the image intensifier, and the CMOS base is arranged at the bottom of the image intensifier. According to the utility model, through the sizes of imaging visual angles of a plurality of CMOS, the light inlet amount of the aperture, and the adoption of the CMOS of the same specification when a plurality of cameras are used for image acquisition, when image fusion is carried out, the image size and the data flow size can be unified, the fused image does not deviate, the difficulty of later software algorithm repair is reduced, the image quality is improved, and the image noise is reduced; meanwhile, the light incoming amount, the imaging focal length and the image size of the CMOS needing image fusion are unified, and image fusion can be more accurate.

Description

Technical Field

[0001] This utility model relates to the fields of optical imaging and mechanical design, specifically a single-lens light-intake multiple CMOS imaging device. Background Technology

[0002] Multi-lens machine vision imaging technology has been widely used in recent years, demonstrating its advantages in multiple fields, including autonomous driving, industrial automation, and medical imaging. With the development of machine vision and image processing algorithms, new requirements have been placed on image fusion, real-time image processing, standardization and modularization, and cost.

[0003] The key problems in multi-lens image fusion are mainly caused by geometric distortion, uneven exposure, and differences in viewing angle. Therefore, a single-lens CMOS imaging device is designed to handle multiple images. One lens receives the light and refracts and splits the light. The light is allocated in different proportions according to the needs of different lenses, so that the light sources for different CMOS imaging all come from the same lens. This can solve the fusion problems such as geometric distortion, exposure differences, differences in viewing angle, and image alignment in multi-lens image fusion from the light source head.

[0004] To address the aforementioned issues, a single-lens-intake multi-CMOS imaging device is proposed. Utility Model Content

[0005] The purpose of this invention is to provide a single-lens-intake multiple CMOS imaging device, which solves the key problems existing in the background technology for image fusion of multiple lenses, mainly caused by geometric distortion, uneven exposure, and differences in viewing angle. Therefore, a single-lens-intake multiple CMOS imaging device is designed, in which light enters through one lens, refracts and splits the light, and allocates different proportions of light according to the needs of different lenses, so that the light sources of different CMOS imaging all come from the same lens. This can solve the fusion problems such as geometric distortion, exposure difference, viewing angle difference, and image alignment when fusion of multiple lenses from the light source head.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a single-lens light-gathering CMOS imaging device, comprising an optical focusing lens, an image intensifier disposed at the bottom of the optical focusing lens, and a mounting assembly disposed at the bottom of the image intensifier.

[0007] By adopting the above technical solution, the full-spectrum lens has good transmittance in the ultraviolet to infrared bands, ensuring that different photosensitive CMOS imaging sensors are not affected.

[0008] As a further description of the above technical solution: the mounting assembly includes a focusing lens and a CMOS base, and the focusing lens is disposed at the bottom of the image intensifier.

[0009] By adopting the above technical solution, a composite image intensifier is formed by combining a low-light image intensifier and a special light particle intensifier. The photocathode of the composite image intensifier is composed of two interwoven materials, cesium telluride and indium gallium arsenide, which have excellent photosensitivity in both ultraviolet short waves and infrared long waves, thus solving the problem that existing image intensifiers can only enhance a very narrow band of spectrum.

[0010] As a further description of the above technical solution: the CMOS base is disposed at the bottom of the image intensifier.

[0011] By adopting the above technical solution, the beam splitter is composed of a beam splitter, an image intensifier, and a CMOS. The CMOS base is made of black nylon material, which can reduce the overall weight of the device while ensuring strength.

[0012] As a further description of the above technical solution: a CMOS front-end condenser lens is provided at the bottom of the focusing lens.

[0013] By adopting the above technical solution, the focusing lens achieves focusing.

[0014] As a further description of the above technical solution: multiple beam-splitting prisms are provided at the bottom of the CMOS front-end focusing lens.

[0015] By adopting the above technical solution, the beam splitter uses a full-spectrum transparent material and is composed of two triangular prisms and a coupling agent.

[0016] As a further description of the above technical solution: the outer wall of the multi-combination beam splitter is provided with a CMOS motherboard, and the outer wall of the CMOS motherboard is provided with a CMOS motherboard backplate.

[0017] By adopting the above technical solution, images from the beam splitter are received, and the optical signals are converted into electrical signals. The CPU processing system behind the CMOS then acquires the analog electrical signals and converts them into digital signals for data transmission and digital signal analysis for imaging and display.

[0018] As a further description of the above technical solution: a beam splitter is provided at the middle of the CMOS base.

[0019] By adopting the above technical solution, light is refracted by being drawn into a triangular prism, and the intensity and propagation path of the light are proportionally distributed by changing the ratio of the coupling agent, so that the light can be imaged on the CMOS.

[0020] As a further description of the above technical solution: Imaging CMOS is respectively provided on the inner walls of the four sides of the CMOS base.

[0021] By adopting the above technical solution, multiple CMOS imaging devices can unify the imaging field of view and the amount of light entering through the aperture. When multiple cameras acquire images, they use CMOS of the same specification. When performing image fusion, the image size and data stream size can be unified, and the fused image will not deviate. This reduces the difficulty of subsequent software algorithm repair, improves image quality, and reduces image noise.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] This utility model provides a single-lens, multi-CMOS imaging device. First, by using multiple CMOS imaging angles and apertures to capture light, and employing CMOS sensors of the same specifications when multiple cameras acquire images, the device can unify image size and data stream size during image fusion. This ensures that the fused image does not deviate, reduces the difficulty of post-processing software algorithms, improves image quality, and reduces image noise. At the same time, by unifying the light intake, imaging focal length, and image size of the CMOS sensors required for image fusion, the device can achieve more accurate image fusion.

[0024] This invention provides a single-lens CMOS imaging device that uses a beam splitter made of full-spectrum transparent material, consisting of two triangular prisms and a coupling agent. By changing the ratio of the coupling agent, the intensity and propagation path of the light are proportionally distributed, enabling the light to be imaged on the CMOS. Furthermore, the combination of the beam splitter and the light-guiding coupling fluid reduces light scattering and guides light refraction. The number of lenses is reduced from multiple to one, lowering the device's weight and allowing for a more compact design. The base is made of black nylon, which ensures strength while reducing the overall weight of the device. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0026] Figure 2 This is an exploded view of the focusing lens of this utility model;

[0027] Figure 3 This is a schematic diagram of the structure of the CMOS motherboard backplane of this utility model;

[0028] Figure 4 This is a schematic diagram of the CMOS base of this utility model;

[0029] Figure 5 This is a schematic diagram of the planar structure of the CMOS base of this utility model;

[0030] Figure 6 This is a schematic diagram of the structure of the beam splitter of this utility model.

[0031] In the diagram: 1. Optical focusing lens; 2. Image intensifier; 3. Focusing lens; 4. Multi-combination beam splitter; 5. CMOS motherboard; 6. CMOS front-end condenser lens; 7. CMOS motherboard backplate; 8. Beam splitter; 9. Imaging CMOS; 10. CMOS base. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] To further understand the contents of this utility model, a detailed description of this utility model will be provided with reference to the accompanying drawings.

[0034] Reference Figure 1 This invention discloses a single-lens, multi-CMOS imaging device, comprising an optical focusing lens 1. As the primary component of the light-entry device, the optical focusing lens 1's main function is to initially focus and adjust the incoming light. Through precise optical design, the optical focusing lens 1 can optimize the light propagation path according to different shooting scenarios and needs, ensuring that the light enters the subsequent imaging components at the appropriate angle and intensity. The optical focusing lens 1 is made of high-quality optical materials, possessing excellent light transmittance and optical stability, effectively reducing scattering and refraction losses during light propagation. An image intensifier 2 is located at the bottom of the optical focusing lens 1, playing a crucial role in the entire imaging device. It amplifies weak light signals, enabling the subsequent imaging components to receive sufficient light intensity, thereby improving image quality and clarity. The image intensifier 2 employs advanced photoelectric conversion and signal amplification technologies, converting light signals into electrical signals, amplifying these electrical signals, and then converting them back into light signals for output to the subsequent components.

[0035] Reference Figures 2-6The image intensifier 2 has a mounting assembly at its bottom, which includes a focusing lens 3 and a CMOS base 10. The focusing lens 3, located at the bottom of the image intensifier 2, further focuses the light after it has been amplified by the image intensifier 2, allowing the light to be more concentratedly projected onto the subsequent imaging components. The focusing lens 3 also uses high-precision optical materials and processing technology to ensure optimal focusing effect. The CMOS base 10 is also located at the bottom of the image intensifier 2. The main function of the CMOS front-end condenser lens 6 is to further converge and guide the light after it has been focused by the focusing lens 3, allowing the light to accurately enter the multi-combination beam splitter 4. The design and manufacturing of the CMOS front-end condenser lens 6 have undergone rigorous optical testing and optimization to ensure the accuracy of light convergence and propagation direction. The CMOS front-end condenser lens 6 is located at the bottom of the focusing lens 3, and the multi-combination beam splitter 4 is located at the bottom of the CMOS front-end condenser lens 6. It can split the incoming light according to a certain ratio and angle, allowing the light to be projected onto different imaging CMOS 9s. The multi-combination beam splitter 4 is made of full-spectrum transparent material and has undergone precise processing and assembly to ensure the accuracy and stability of light during the beam splitting process. A CMOS motherboard 5 is mounted on the outer wall of the multi-combination beam splitter 4. The CMOS motherboard 5 uses advanced integrated circuit technology and electronic components, featuring high performance and low power consumption, ensuring the stable operation of the entire imaging device. A CMOS motherboard backplate 7 is mounted on the outer wall of the CMOS motherboard 5. The beam splitter 8 is located in the middle of the CMOS base 10, and imaging CMOS 9s are mounted on the four inner walls of the CMOS base 10. As the core imaging component of the entire imaging device, the imaging CMOS 9 is responsible for converting the received light signals into electrical signals, and through subsequent circuit processing and signal conversion, ultimately forming an image signal output. The imaging CMOS 9 uses advanced semiconductor manufacturing processes and photoelectric conversion technology, featuring high sensitivity and high resolution, enabling the capture of high-quality images.

[0036] Working principle: Light entry and preliminary adjustment: External light first passes through optical focusing lens 1. The function of the optical focusing lens is to initially focus and adjust the light so that the light enters the subsequent components at a suitable angle and intensity to meet the imaging requirements.

[0037] Image enhancement processing: Light, after being adjusted by the optical focusing lens, enters the image intensifier 2. The function of the image intensifier may be to enhance the signal strength of the light, improve the clarity and contrast of the image, compensate for the loss of light during transmission and imaging, and lay the foundation for subsequent accurate imaging.

[0038] Focusing and Spectral Processing

[0039] The focusing lens 3 is located at the bottom of the image intensifier. Its function is to further focus the light passing through the image intensifier, making the light more concentrated and improving the accuracy of the image.

[0040] The focused light reaches the condenser lens 6 at the front end of the CMOS, which converges the light again, amplifies the light energy, and makes it better received by subsequent components.

[0041] The multi-beam splitter 4 is positioned at the bottom of the condenser lens at the front end of the CMOS sensor. Its main function is to split the converged light rays in different directions. These split rays are then transmitted to different imaging areas, enabling multi-area imaging with a single lens.

[0042] Imaging and Data Processing

[0043] The beam-splitter prism 8 is positioned in the middle of the CMOS base 10. It can perform secondary beam splitting or reflection of the light, ensuring that the light is accurately projected onto the imaging CMOS 9. The imaging CMOS is the core component for imaging, converting the received light signals into electrical signals to complete the initial image acquisition.

[0044] The CMOS motherboard 5 is connected to the outer wall of the multi-combination beam splitter 4, and the CMOS motherboard backplate 7 is also located on the outer wall of the CMOS motherboard. They work together to process, transmit and store the electrical signals acquired by the imaging CMOS, and finally form usable image data.

[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A single-lens, multi-CMOS imaging device, comprising an optical focusing lens (1), characterized in that: An image intensifier (2) is provided at the bottom of the optical focusing lens (1). An installation component is provided at the bottom of the image intensifier (2). The installation component includes a focusing lens (3) and a CMOS base (10). The focusing lens (3) is located at the bottom of the image intensifier (2). A CMOS front-end condenser lens (6) is provided at the bottom of the focusing lens (3). Multiple combination beam splitters (4) are provided at the bottom of the CMOS front-end condenser lens (6).

2. The single-lens, multi-CMOS imaging device according to claim 1, characterized in that: The CMOS base (10) is located at the bottom of the image intensifier (2).

3. The single-lens light-gathering multiple CMOS imaging device according to claim 1, characterized in that: The outer wall of the multi-combination beam splitter (4) is provided with a CMOS motherboard (5), and the outer wall of the CMOS motherboard (5) is provided with a CMOS motherboard backplate (7).

4. The single-lens light-gathering multiple CMOS imaging device according to claim 1, characterized in that: A beam splitter (8) is provided at the middle of the CMOS base (10).

5. The single-lens, multi-CMOS imaging device according to claim 1, characterized in that: The CMOS base (10) has imaging CMOS (9) installed on its four inner walls.

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