Water purification equipment

Abstract

The utility model relates to water purification equipment. The water purification equipment comprises a shell, a first baffle plate, a second baffle plate, a first tank body and a second tank body, the first baffle and the second baffle are arranged in the shell in a spaced mode, and the interior of the shell is divided into a first cavity, a second cavity and a third cavity through the first baffle and the second baffle. Wherein the first tank body is arranged in the first cavity, the second tank body is arranged in the third cavity, and the second cavity is a vacuum cavity. According to the water purification equipment, the heat insulation effect of the water purifier can be improved, and meanwhile, the energy loss of the water purifier is reduced.

Description

Technical Field

[0001] This utility model relates to the field of water purification, specifically to a water purification device. Background Technology

[0002] A water purifier, also called a water purification machine or water quality purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. However, current technologies for water purifiers that can simultaneously cool or heat have poor heat insulation between the heating and cooling chambers, affecting the cooling and heating effects of both. Utility Model Content

[0003] Therefore, this utility model provides a water purification device. The water purification device can improve the heat insulation effect of the water purifier while reducing its energy consumption.

[0004] This utility model provides the following technical solution:

[0005] A water purification device includes: a shell, a first baffle, a second baffle, a first tank, and a second tank;

[0006] The first baffle and the second baffle are spaced apart inside the housing, and the first baffle and the second baffle divide the housing into a first cavity, a second cavity and a third cavity;

[0007] The first tank is disposed within the first cavity, and the second tank is disposed within the third cavity, wherein the second cavity is a vacuum cavity.

[0008] Furthermore, it also includes: semiconductor refrigerators;

[0009] The semiconductor cooler is disposed in the second cavity. The semiconductor cooler has a cooling surface and a heating surface, wherein the heating surface abuts against the first tank and the cooling surface abuts against the second tank.

[0010] Furthermore, the inner walls of both the first cavity and the third cavity are provided with a heat insulation layer.

[0011] Furthermore, it also includes: thermal conductive components;

[0012] The first tank and / or the second tank are both provided with mounting holes. The heat-conducting component is connected to the heating surface and / or cooling surface of the semiconductor cooler. The heat-conducting component extends through the mounting holes into the first tank and / or the second tank. The heat-conducting component is used to conduct the energy of the heating surface to the first tank and conduct the energy of the cooling surface to the second tank.

[0013] Furthermore, the heat-conducting component includes: a heat-absorbing element and multiple heat-conducting sheets;

[0014] Multiple heat-conducting sheets are spaced apart on the heat-absorbing element along a first direction. The heat-absorbing element is attached to the heating surface and / or cooling surface. The heat-absorbing element is used to receive energy from the semiconductor cooler and release it through the heat-conducting sheets.

[0015] Furthermore, it also includes: limiting components;

[0016] The limiting member is disposed around the outer periphery of the mounting hole. The limiting member includes an extension and a limiting portion, wherein the limiting portion is disposed on the extension and there is an included angle between the extension and the limiting portion; when the heat-conducting assembly is installed in the mounting hole, the limiting portion is parallel to the heat-conducting sheet.

[0017] Furthermore, it also includes: filter elements and booster pumps;

[0018] The booster pump is connected to the filter element, and the filter element is connected to the first tank and / or the second tank. The filter element is used to provide purified water to the first tank and / or the second tank.

[0019] Furthermore, the water purifier also includes: a mounting base;

[0020] The housing also has an installation cavity, and the installation base is disposed in the installation cavity. The installation base has a groove, and the filter element has a guide block. When the filter element is installed on the installation base, the guide block is located in the groove.

[0021] Furthermore, a snap-fit ​​component is provided inside the mounting cavity, and the snap-fit ​​component is disposed on two opposite side walls of the housing, and the snap-fit ​​component is provided with a sliding groove;

[0022] The filter element is provided with a guide member, which cooperates with the slide groove to fix the filter element.

[0023] Furthermore, it also includes: vane pumps;

[0024] The vane pump is disposed in the second cavity and is connected to the first tank and the second tank. The vane pump is used to supply water to the water-using equipment.

[0025] The aforementioned water purification equipment includes a housing, within which a first baffle and a second baffle are installed at intervals. These baffles divide the housing into a first cavity, a second cavity, and a third cavity. The first cavity is located above the second cavity, and the second cavity is positioned above the third cavity. A first tank is housed within the first cavity, and a second tank is housed within the third cavity. The second cavity is designed as a vacuum chamber, which reduces heat conduction between the first and second cavities, thereby improving insulation and reducing energy consumption of the water purification equipment. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 One of the structural schematic diagrams of the water purification equipment provided in the embodiments of this utility model;

[0028] Figure 2 A schematic diagram of the structure of the shell, the first baffle, and the second baffle provided in the embodiment of this utility model;

[0029] Figure 3 This is the second structural schematic diagram of the water purification equipment provided in the embodiment of this utility model;

[0030] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0031] Figure 5 This is a schematic diagram of the structure of the heat-conducting component provided in an embodiment of the present utility model;

[0032] Figure 6 The third schematic diagram of the water purification equipment provided in this embodiment of the utility model;

[0033] Figure 7 Fourth schematic diagram of the water purification equipment provided in this embodiment of the utility model;

[0034] Figure 8 for Figure 7 Enlarged view of point B in the middle;

[0035] Figure 9 for Figure 8 A magnified view of point C in the middle.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100-Water purification equipment; 10-Shell; 11-First cavity; 12-Second cavity; 13-Third cavity; 14-Insulation layer; 15-Filter element; 151-Guide block; 152-Guide component; 16-Booster pump; 17-Mounting cavity; 171-Snap-fit ​​component; 172-Slide groove; 18-Mounting hole; 20-First baffle; 30-Second baffle; 40-First tank; 50-Second tank; 60-Semiconductor cooler; 61-Cooling surface; 62-Heating surface; 70-Heat-conducting component; 71-Heat-absorbing component; 72-Heat-conducting sheet; 80-Limiting component; 81-Extension; 82-Limiting part; 90-Mounting base; 91-Groove; 92-Vessel pump. Detailed Implementation

[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0039] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0040] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] A water purifier, also known as a water filter or water purifier, is a water treatment device that performs deep filtration and purification of water according to usage requirements. With the diversification of drinking water needs and the increasing popularity of cold water, adding cooling functions to water purifiers has become a trend. However, current technologies for water purifiers that can simultaneously cool or heat have poor heat insulation between their heating and cooling chambers, causing them to interfere with each other and resulting in significant energy loss within the purifier.

[0042] Therefore, this embodiment provides a water purification device 100. The water purification device 100 can improve the heat insulation effect of the water purifier, while reducing the energy consumption of the water purification device 100.

[0043] Please see Figure 1 and Figure 2 A water purification device 100 includes: a shell 10, a first baffle 20, a second baffle 30, a first tank 40, and a second tank 50;

[0044] The first baffle 20 and the second baffle 30 are spaced apart inside the housing 10, and the first baffle 20 and the second baffle 30 divide the housing 10 into a first cavity 11, a second cavity 12 and a third cavity 13.

[0045] The first tank 40 is disposed in the first cavity 11, the second tank 50 is disposed in the third cavity 13, and the second cavity 12 is a vacuum cavity.

[0046] The aforementioned water purification device 100 includes a housing 10, in which a first baffle 20 and a second baffle 30 are disposed. The first baffle 20 and the second baffle 30 are installed alternately in the housing 10, thereby dividing the housing 10 into a first cavity 11, a second cavity 12, and a third cavity 13. The first cavity 11 is located above the second cavity 12, and the second cavity 12 is located above the third cavity 13. A first tank 40 is disposed in the first cavity 11, and a second tank 50 is disposed in the third cavity 13. The second cavity 12 is set as a vacuum, which reduces heat conduction between the first cavity 11 and the second cavity 12, thereby improving the heat insulation effect and reducing the energy consumption of the water purification device 100.

[0047] Please see Figure 1 and Figure 2 In some embodiments, it also includes: a semiconductor cooler 60;

[0048] The semiconductor cooler 60 is disposed in the second cavity 12. The semiconductor cooler 60 has a cooling surface 61 and a heating surface 62, wherein the heating surface 62 abuts against the first tank 40, and the cooling surface 61 abuts against the second tank 50.

[0049] Understandably, a first tank 40 is provided in the first cavity 11, a semiconductor cooler 60 is provided in the second cavity 12, and a second tank 50 is provided in the third cavity 13. The semiconductor cooler 60 has a heating surface 62 and a cooling surface 61, wherein the cooling surface 61 faces the third cavity 13 and the heating surface 62 faces the third cavity. In this way, the first cavity 11 can heat up and the third cavity 13 can cool down, so that the water purification device 100 can simultaneously achieve cooling or heating. Placing the semiconductor cooler 60 in the second cavity can reduce the impact of the cold or heat generated by the semiconductor cooler 60, and can also enable the water purifier to produce cold water and hot water at the same time.

[0050] Please see Figure 2 In some embodiments, the inner walls of the first cavity 11 and the third cavity 13 are provided with a heat insulation layer 14.

[0051] It is understandable that a heat insulation layer 14 is provided on the inner wall of both the first cavity 11 and the third cavity 13. The heat insulation layer 14 can isolate the first cavity 11 or the third cavity 13 from the outside temperature. When there is a temperature difference between the inside of the shell 10 and the outside of the shell 10, the heat insulation layer 14 can prevent the energy inside the first cavity 11 or the third cavity 13 from leaking out, reduce the loss of cold energy in the shell 10, reduce energy waste, and also improve the heating (cooling) effect of the water purifier.

[0052] Please see Figures 3 to 5 In some embodiments, it also includes: a thermally conductive component 70;

[0053] The first tank 40 and / or the second tank 50 are both provided with mounting holes 18. The heat-conducting component 70 is connected to the heating surface 62 and / or the cooling surface 61 of the semiconductor cooler 60. The heat-conducting component 70 extends through the mounting holes 18 into the first tank 40 and / or the second tank 50. The heat-conducting component 70 is used to conduct the energy of the heating surface 62 into the first tank 40 and conduct the energy of the cooling surface 61 into the second tank 50.

[0054] It is understandable that mounting holes 18 are provided on the side walls of both the first tank 40 and the second tank 50, and heat-conducting components 70 are installed in the mounting holes 18. One end of the heat-conducting component 70 on the first tank 40 is in contact with the heating surface 62 of the semiconductor cooler 60, and the other end passes through the through hole on the hot water tank and extends into the first tank 40. One end of the heat-conducting component 70 on the second tank 50 is in contact with the cooling surface 61 of the semiconductor cooler 60, and the other end passes through the through hole on the second tank 50 and extends into the second tank 50. In this way, the heat-conducting component 70 can directly exchange heat with the water flow in the first tank 40 and the water flow in the second tank 50. This allows for more efficient transfer of the cold energy generated by the cooling surface 61 to the cold water tank or the heat generated by the heating surface 62 to the hot water tank, thereby improving the heat exchange efficiency of the water purifier and reducing its energy loss.

[0055] Please see Figures 3 to 5 In some embodiments, the heat-conducting component 70 includes: a heat-absorbing element 71 and a plurality of heat-conducting sheets 72;

[0056] Multiple heat-conducting sheets 72 are spaced apart on the heat-absorbing element 71 along a first direction. The heat-absorbing element 71 is attached to the heating surface 62 and / or the cooling surface 61. The heat-absorbing element 71 is used to receive energy from the semiconductor cooler 60 and release it through the heat-conducting sheets 72.

[0057] Understandably, the heat-conducting assembly 70 includes a heat-absorbing element 71 and heat-conducting plates 72. The heat-absorbing element 71 is connected to the heat exchanger and is used to collect the heat generated by the heat exchanger. Multiple heat-conducting plates 72 are spaced apart on the heat-absorbing element 71 and are perpendicular to the heat-absorbing element 71. The heat-conducting plates 72 extend into the first tank 40 and the second tank 50. In this way, the heat-conducting assembly 70 can transfer the cold energy on the heat-absorbing element 71 to the first tank 40 and the second tank 50. This allows the cold energy generated by the semiconductor cooler 60 to be transferred to the first tank 40 and the second tank 50 through the heat-absorbing element 71 and the heat-conducting plates 72. The multiple heat-conducting plates 72 can accelerate the efficiency of energy transfer, so that energy can enter the first tank 40 and the second tank 50 faster and more evenly, realizing heat exchange, and thus enabling the heat-conducting assembly 70 to conduct heat.

[0058] Please see Figures 3 to 5 In some embodiments, it also includes: a limiting member 80;

[0059] The limiting member 80 is disposed around the outer periphery of the mounting hole 18. The limiting member 80 includes an extension 81 and a limiting part 82, wherein the limiting part 82 is disposed on the extension 81 and there is an included angle between the extension 81 and the limiting part 82; when the heat-conducting assembly 70 is installed in the mounting hole 18, the limiting part 82 is parallel to the heat-conducting sheet 72.

[0060] Understandably, a limiting member 80 is provided on the outer periphery of the mounting hole 18. The limiting member 80 is used to cooperate with the heat-conducting assembly 70 to limit the relative position of the heat-conducting assembly 70 with respect to the first tank 40 and the second tank 50. The limiting member 80 includes an extension 81 and a limiting part 82. The extension 81 extends away from the mounting hole 18 (i.e., extends to the outside of the first tank 40 and the second tank 50). The limiting part 82 is disposed on the extension 81. The limiting part 82 can be disposed perpendicularly on the extension 81 or form an angle with the limiting part 82. This allows the limiting part 82 to limit the installation position of the heat-conducting assembly 70, making the installation of the heat-conducting assembly 70 more convenient.

[0061] Understandably, after the heat-conducting component 70 is installed on the limiting part 82, a seal can be provided between the limiting part 82 and the heat-conducting component 70 to prevent water leakage from the mounting hole 18. The heat-conducting component 70 can be directly fixed on the limiting part 82. Specifically, the limiting part 82 can be connected by providing the mounting hole 18 on the limiting part 82 and by connecting the heat-conducting component 70 to the mounting hole 18.

[0062] Please see Figure 6 In some embodiments, it also includes: filter element 15 and booster pump 16;

[0063] The booster pump 16 is connected to the filter element 15, and the filter element 15 is connected to the first tank 40 and / or the second tank 50. The filter element 15 is used to provide purified water to the first tank 40 and / or the second tank 50.

[0064] Understandably, the booster pump 16 is connected to the filter element 15, and the municipal water supply is connected to the booster pump 16. After being pressurized by the booster pump 16, the municipal water enters the filter element 15. The purified water filtered by the filter element 15 flows into the first tank 40 and / or the second tank 50. Then, the semiconductor cooler 60 generates cold energy to cool the purified water in the cold water tank, and the heat generated by the semiconductor cooler 60 during cooling heats the purified water in the hot water tank. In this way, cooling and heating can be achieved simultaneously. When the user needs to use hot water, it can be delivered to the water-using equipment through the outlet of the heat storage tank.

[0065] Understandably, the booster pump 16 is used to pressurize the unpurified water because the filter element 15 contains an RO filter element 15 (Reverse Osmosis membrane). The water pressure of the municipal water supply is insufficient to allow the water to pass through the RO filter element 15 during water purification. In order to ensure that the water can pass through the filter element 15 smoothly, the booster pump 16 is set up to ensure that the water can flow into the filter element 15 and at the same time ensure the purification efficiency of the filter element 15.

[0066] Please see Figures 7 to 9 In some embodiments, the water purifier further includes: a mounting base 90;

[0067] The housing 10 also has a mounting cavity 17, and the mounting base 90 is disposed in the mounting cavity 17. The mounting base 90 is provided with a groove 91, and the filter element 15 is provided with a guide block 151. When the filter element 15 is installed on the mounting base 90, the guide block 151 is located in the groove 91.

[0068] Understandably, the housing 10 is provided with an installation cavity 17, and an installation base 90 is provided in the installation cavity 17. The installation base 90 is used to install the filter element 15. The installation base 90 and the filter element 15 are detachably connected. The installation base 90 is provided with a water channel structure that is compatible with the filter element 15. When the filter element 15 is installed on the installation base 90, the filter element 15 can be used normally. To facilitate the installation of the filter element 15 onto the mounting base 90, a groove 91 is provided on the mounting base 90, extending through the top of the mounting base 90. A guide block 151 is provided on the side of the filter element 15 away from the handle. The guide block 151 is adapted to the size of the groove 91 and is used to cooperate with the groove 91. When the filter element 15 is installed on the base, the guide block 151 can be inserted into the groove 91 to position the filter element 15. At the same time, the cooperation between the filter element 15 and the guide block 151 can also restrict the rotation of the filter element 15 in its circumferential direction. This can improve the stability of the filter element 15 after installation, ensuring that the filter element 15 will not move during normal use, thereby improving the stability of the water purifier.

[0069] Please see Figures 7 to 9 In some embodiments, a snap-fit ​​member 171 is provided in the mounting cavity 17, the snap-fit ​​member 171 is provided on two opposite side walls of the housing 10, and a sliding groove 172 is provided on the snap-fit ​​member 171;

[0070] The filter element 15 is provided with a guide 152, which cooperates with the slide groove 172 to fix the filter element 15.

[0071] Understandably, a snap-fit ​​component 171 is provided inside the mounting cavity 17, and the snap-fit ​​component 171 is located on the side walls on both sides of the mounting cavity 17. The snap-fit ​​component 171 is provided with a sliding groove 172, and guide components 152 are provided on the two opposite side walls of the filter element 15. The guide components 152 on the filter element 15 are adapted to the sliding groove 172. Therefore, when the filter element 15 is installed into the mounting cavity 17, the guide component 152 can be snapped into the sliding groove 172 and cooperate with the mounting cavity 17. In this way, the snap-fit ​​component 171 can limit the horizontal displacement of the filter element 15 in the mounting cavity 17, and due to gravity, it will not move in the vertical direction of the filter element 15. This can improve the stability of the filter element 15 after installation, ensure that the filter element 15 will not move during normal use, and thus improve the stability of the water purifier.

[0072] Please see Figure 6 In some embodiments, it also includes: a vane pump 92;

[0073] The vane pump 92 is disposed in the second cavity 12 and is connected to the first tank 40 and the second tank 50. The vane pump 92 is used to supply water to water-using equipment.

[0074] Understandably, the vane pump 92 can be installed in any location, such as in the second chamber 12, and is connected to the water storage tank. This allows the vane pump 92 to pressurize the purified water in the first tank 40 and the second tank 50, and then deliver the pressurized water to the user end to supply water to the water purification equipment 100. Specifically, the purified water in the first tank 40 and the second tank 50 flows out through the outlet of the first tank 40 or the second tank 50 and to the vane pump 92. The vane pump 92 pressurizes the purified water and delivers it to the user end for use. The vane pump 92 ensures that the installation location of the first tank 40 and the second tank 50 is not affected by water pressure, and can smoothly deliver the hot water in the first tank 40 and the second tank 50 to the water-using equipment, thereby improving the user experience.

[0075] In this utility model, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The appearance of these phrases in various places in the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this utility model can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this utility model can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this utility model, provided there is no contradiction between them.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solution of this utility model should not depart from the spirit and scope of the technical solution of this utility model.

Claims

1. A water purification device, characterized in that, include: Shell, first baffle, second baffle, first tank, second tank; The first baffle and the second baffle are spaced apart inside the housing, dividing the housing into a first cavity, a second cavity, and a third cavity. The first tank is disposed within the first cavity, and the second tank is disposed within the third cavity, wherein the second cavity is a vacuum cavity.

2. The water purification apparatus according to claim 1, characterized by Also includes: Semiconductor coolers; The semiconductor cooler is disposed in the second cavity. The semiconductor cooler has a cooling surface and a heating surface, wherein the heating surface abuts against the first tank and the cooling surface abuts against the second tank.

3. The water purification apparatus according to claim 2, characterized by The inner walls of both the first cavity and the third cavity are provided with heat insulation layers.

4. The water purification apparatus according to claim 2, characterized by Also includes: Thermal conductive components; The first tank and / or the second tank are both provided with mounting holes. The heat-conducting component is connected to the heating surface and / or cooling surface of the semiconductor cooler. The heat-conducting component extends through the mounting holes into the first tank and / or the second tank. The heat-conducting component is used to conduct the energy of the heating surface to the first tank and conduct the energy of the cooling surface to the second tank.

5. The water purification apparatus according to claim 4, characterized by The heat-conducting component includes: a heat-absorbing element and multiple heat-conducting sheets; Multiple heat-conducting sheets are spaced apart on the heat-absorbing element along a first direction. The heat-absorbing element is attached to the heating surface and / or cooling surface. The heat-absorbing element is used to receive energy from the semiconductor cooler and release it through the heat-conducting sheets.

6. The water purification apparatus according to claim 5, characterized by Also includes: Limiting components; The limiting member is disposed around the outer periphery of the mounting hole. The limiting member includes an extension and a limiting portion, wherein the limiting portion is disposed on the extension and there is an included angle between the extension and the limiting portion; when the heat-conducting assembly is installed in the mounting hole, the limiting portion is parallel to the heat-conducting sheet.

7. The water purification apparatus according to claim 1, characterized by Also includes: Filter element, booster pump; The booster pump is connected to the filter element, and the filter element is connected to the first tank and / or the second tank. The filter element is used to provide purified water to the first tank and / or the second tank.

8. The water purification apparatus according to claim 7, characterized by The water purification equipment also includes: a mounting base; The housing also has an installation cavity, and the installation base is disposed in the installation cavity. The installation base has a groove, and the filter element has a guide block. When the filter element is installed on the installation base, the guide block is located in the groove.

9. The water purification apparatus of claim 8, wherein The mounting cavity is provided with a snap-fit ​​component, which is disposed on two opposite side walls of the housing, and the snap-fit ​​component is provided with a sliding groove. The filter element is provided with a guide member, which cooperates with the slide groove to fix the filter element.

10. The water purification apparatus according to claim 9, characterized by Also includes: vane pump; The vane pump is disposed in the second cavity and is connected to the first tank and the second tank. The vane pump is used to supply water to the water-using equipment.

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