Atomization device and electronic cigarette
By designing capillary pores that penetrate the substrate and conductive layer in the electronic cigarette atomizing device, the capillary force is used to make the e-liquid evenly cover the resistive layer and pads, solving the problems of easy coil clogging and pad dry burning in the atomizing device, thus improving the atomization quality and user experience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEMSENSING MICROSYST SUZHOU CHINA
- Filing Date
- 2025-04-27
- Publication Date
- 2026-04-28
AI Technical Summary
Existing electronic cigarette atomizing devices suffer from issues such as scorched cores and dry-burned pads, leading to a decline in ceramic core quality and a poor user experience.
The substrate design includes a capillary area and a conductive layer. The capillary extends through the substrate, resistive layer and pads. The capillary force allows the e-liquid to evenly cover the surface of the resistive layer and pads, increasing the contact area, carrying away heat and preventing excessive temperature.
It effectively avoids the problems of burnt core and dry burn of solder pads in atomizing devices, improves atomization quality and user experience, and avoids the problem of powder falling off ceramic cores.
Smart Images
Figure CN224165715U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic atomization technology, and more particularly to an atomizing device and an electronic cigarette. Background Technology
[0002] In existing technologies, ceramic cores are typically used as atomizing devices in electronic cigarettes. Thick-film printing technology is used to directly attach a metal layer to the surface of the ceramic core. Through-holes extending through the thickness of the ceramic core are created, and electricity is applied to the metal layer to generate heat. The medium (e.g., e-liquid) flows through these through-holes to the heated metal layer, achieving atomization and heating. However, due to the lack of through-holes in the metal layer, insufficient e-liquid output can easily lead to overheating of the ceramic core, causing it to burn and affecting its quality. Utility Model Content
[0003] This application provides an atomizing device and an electronic cigarette, which can solve the technical problem of easy coil clogging in existing atomizing devices.
[0004] In a first aspect, embodiments of this application provide an atomizing device, comprising:
[0005] A substrate having a first surface, the substrate including a capillary region, the capillary region including a connection region;
[0006] A conductive layer includes a resistive layer and pads, wherein the resistive layer is located on a first surface of the connection region, the pads are located on a first surface of the capillary region, and the pads are electrically connected to the resistive layer.
[0007] Multiple capillaries are located in the capillary region, and the capillaries penetrate the substrate, the resistive layer and the pads in a direction perpendicular to the first surface.
[0008] In some implementations, the substrate is a glass substrate.
[0009] In some embodiments, the resistive layer is a metal resistive layer.
[0010] In some implementations, the pad is located on a first surface of the connection area, and the resistive layer surrounds the pad.
[0011] In some embodiments, the pads are located on a first surface outside the connection area, and the pads are located at the edge of the resistive layer.
[0012] In some embodiments, at least a portion of the resistive layer is located on the inner wall surface of the capillary.
[0013] In some embodiments, the atomizing device further includes: at least one first groove located on a first surface of the connection area, the first groove being recessed relative to the first surface; the resistive layer is also located on the inner wall surface of the first groove, and a portion of the resistive layer surface located within the first groove has at least one second groove.
[0014] In some embodiments, the surface roughness of the first surface ranges from 0.5 μm to 10 μm.
[0015] In some embodiments, the plurality of capillaries are arranged in an array along the first direction and the second direction, the first direction being perpendicular to the second direction and both the first direction and the second direction being parallel to the first surface; the first groove includes a first sub-groove and a second sub-groove, the first sub-groove and the second sub-groove being located between the capillaries, the first sub-groove being parallel to the first direction and the second sub-groove being parallel to the second direction.
[0016] In some embodiments, the substrate has a second surface disposed opposite to the first surface, and the substrate further includes a receiving groove recessed relative to the second surface.
[0017] In some embodiments, the receiving groove includes an opening away from the resistive layer and a bottom surface close to the resistive layer; the opening has a first projection on the first surface, the bottom surface has a second projection on the first surface, the second projection is within the range of the first projection, and the area of the first projection is greater than the area of the second projection.
[0018] In some embodiments, the resistive layer has a third projection on the first surface, the second projection is within the range of the third projection, and the area of the second projection is smaller than the area of the third projection.
[0019] Secondly, embodiments of this application provide an electronic cigarette, including the atomizing device as described in any of the preceding embodiments.
[0020] This application achieves the following technical effects: Based on the atomizing device provided in the embodiments of this application, capillary pores simultaneously penetrate the substrate, the resistor layer, and the pads. Due to capillary force, e-liquid can contact the upper surface of the resistor layer (the surface away from the substrate) through the capillary pores at the resistor layer, and can contact the upper surface of the pads (the surface away from the substrate) through the capillary pores at the pads. E-liquid more easily covers the upper surface of the resistor layer and the upper surface of the pads, increasing the contact area between the e-liquid and the resistor layer and pads. This makes the e-liquid easier to atomize, carrying away a large amount of heat, ensuring the substrate does not overheat, avoiding coil burning problems, and improving the quality of the atomizing device. Furthermore, by providing a first groove on the first surface of the substrate connection area, the surface of the resistor layer formed thereon has a second groove corresponding to the first groove. The presence of the second groove increases the roughness of the resistor layer. Thus, under the action of capillary force, the e-liquid is more easily diffused to the surface of the resistor layer. The e-liquid is easier to atomize and can absorb the heat of the resistor layer, preventing the resistor layer from dry burning. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.
[0023] Figure 1 An atomizing device provided for embodiments of this application is in Figure 2 Schematic diagram of the cross-sectional structure at point AA;
[0024] Figure 2 A top view of an atomizing device provided for an embodiment of this application;
[0025] Figure 3 A cross-sectional structural schematic diagram of an atomizing device provided for an embodiment of this application;
[0026] Figure 4 A partial top view of an atomizing device provided for an embodiment of this application;
[0027] Figure 5 A partial cross-sectional structural diagram of the substrate and resistive layer provided for an embodiment of this application;
[0028] Figure 6 A partial cross-sectional structural diagram of the substrate and resistive layer provided for an embodiment of this application;
[0029] Figure 7 A partial cross-sectional structural diagram of the substrate and resistive layer provided for an embodiment of this application;
[0030] Figure 8 A partial cross-sectional structural diagram of the substrate and resistive layer provided for an embodiment of this application;
[0031] Figure 9 A partial cross-sectional structural diagram of the substrate and resistive layer provided for an embodiment of this application;
[0032] Figure 10 A partial cross-sectional structural diagram of the substrate and resistive layer provided for an embodiment of this application;
[0033] Figure 11 A top view of an atomizing device provided for an embodiment of this application;
[0034] Figure 12 A partial top view of an atomizing device provided for an embodiment of this application;
[0035] Figure 13 A partial top view of an atomizing device provided for an embodiment of this application;
[0036] Figure 14 This is a partial top view of an atomizing device provided in an embodiment of this application.
[0037] Explanation of reference numerals in the attached figures:
[0038] 1-Substrate; 11-First surface; 12-Capillary region; 13-Connection region; 14-First groove; 141-First sub-groove; 142-Second sub-groove; 143-Third sub-groove; 15-Second surface; 16-Receiving groove; 161-Opening; 162-Bottom surface; 2-Conductive layer; 21-Resistant layer; 211-Second groove; 22-Pad; 3-Capillary; Z-Direction perpendicular to the first surface; X-First direction; Y-Second direction. Detailed Implementation
[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.
[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.
[0041] In the description of this application, it should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0042] In existing technologies, ceramic cores are typically used as atomizing devices in electronic cigarettes. Thick-film printing technology is used to directly attach a metal layer to the surface of the ceramic core. Through-holes extending through the thickness of the ceramic core are created, and electricity is applied to the metal layer to generate heat. The medium (e.g., e-liquid) flows through these through-holes to the heated metal layer, achieving atomization and heating. However, because the metal layer lacks through-holes, e-liquid cannot pass through the resistive layer, resulting in insufficient e-liquid output, unsatisfactory atomization, and the e-liquid not absorbing enough heat. This can easily cause the ceramic core to overheat, leading to burnt-out coils and affecting the quality of the ceramic core.
[0043] Furthermore, solder pads can be arranged on the surface of the ceramic core. However, the solder pads in the existing technology are complete structures, and the soot cannot reach the inside of the solder pads, making the solder pads prone to dry burning.
[0044] Furthermore, during the atomization heating process of the ceramic core, its material may produce microparticles, commonly known as powder shedding, which affects the user experience.
[0045] In view of the technical problems of ceramic cores being prone to clogging and solder pads being prone to dry burning in the prior art, this application proposes an atomizing device and an electronic cigarette to overcome the above problems.
[0046] The following description, in conjunction with the accompanying drawings, introduces an atomizing device and an electronic cigarette provided in this application.
[0047] See Figure 1 As shown, Figure 1For the atomizing device in Figure 2 The cross-sectional view at point AA shows an embodiment of an atomizing device comprising: a substrate 1, a conductive layer 2, and a plurality of capillary pores 3. The substrate 1 has a first surface 11 and includes a capillary region 12 (not shown), which includes a connection region 13 (not shown). The conductive layer 2 includes a resistive layer 21 and pads 22. The resistive layer 21 is located on the first surface 11 of the connection region 13, and the pads 22 are located on the first surface 11 of the capillary region 12, electrically connected to the resistive layer 21. A plurality of capillary pores 3 are located in the capillary region 12 and penetrate the substrate 1, the resistive layer 21, and the pads 22 along a direction Z perpendicular to the first surface 11. Typically, there are two pads 22, which are electrically connected to an external circuit. The external circuit supplies power to the resistive layer 21 through the pad 22. Both the resistive layer 21 and the pad 22 heat up. The medium (e.g., e-liquid) passes through the capillary 3 from the side away from the first surface 11 and comes into contact with the resistive layer 21 or the pad 22. As the resistive layer 21 or the pad 22 heats up, the e-liquid begins to evaporate and form smoke when it reaches a certain temperature, thus achieving atomization.
[0048] For details, please refer to Figure 2 As shown, AA represents the central axis of substrate 1 along the first direction X. Substrate 1 includes a capillary region 12, and the capillary region 12 includes a connection region 13. The edge of the resistive layer 21 (not shown) coincides with the edge of the connection region 13. The pad 22 is located on the first surface 11 of the connection region 13, and the resistive layer 21 surrounds the pad 22. The resistive layer 21 and the pad 22 are integrally formed.
[0049] In some embodiments, see Figure 11 As shown, the edge of the resistive layer 21 (not shown) coincides with the edge of the connection area 13, and the pad 22 is located on the first surface 11 outside the connection area 13, and the pad 22 is located at the edge of the resistive layer 21. It should be noted that this application does not limit whether the pad 22 is located on the first surface 11 of the connection area 13 or on the first surface 11 of the non-connection area 13 portion of the capillary region 12.
[0050] Based on the above embodiments, the capillary pores 3 simultaneously penetrate the substrate 1, the resistor layer 21, and the pads 22, allowing e-liquid to contact the upper surface of the resistor layer 21 (the surface away from the substrate 1) through the capillary pores 3 at the resistor layer 21, and to contact the upper surface of the pads 22 (the surface away from the substrate 1) through the capillary pores 3 at the pads 22. The e-liquid continuously diffuses through capillary force, covering the resistor layer 21 and the pads 22. During heating and atomization, the temperature of the resistor layer 21 and the pads 22 rises. Because the e-liquid atomizes and carries away heat, the temperature of the resistor layer 21 and the pads 22 is lower than the temperature of the area without e-liquid coverage, solving the problem of burnt coils caused by dry burning of the substrate 1 and improving the quality of the atomization device. The capillary pores 3 penetrating the pads 22 allow the e-liquid to enter the interior of the pads 22, enabling the e-liquid to more effectively absorb the heat generated by the pads 22, thus preventing the pads 22 from dry burning and protecting them. Furthermore, since the connecting area 13 is located within the capillary area 12 and the resistive layer 21 is located in the connecting area 13, it can be ensured that the edge of the resistive layer 21 is also penetrated by the capillary 3, making it easier for the e-liquid to reach the upper surface of the resistive layer 21 through the capillary 3 and achieve atomization.
[0051] In some embodiments, the substrate 1 is a glass substrate. Using a glass substrate instead of a ceramic core can avoid the problem of powder shedding.
[0052] In some embodiments, the resistive layer 21 is a metal resistive layer. Both the metal resistive layer and the pads 22 have capillaries 3, allowing the e-liquid to simultaneously wet both the metal resistive layer and the pads 22. This ensures good temperature consistency between the two, avoiding stress mismatch caused by large temperature differences, and thus preventing the problem of easy peeling of the metal resistive layer.
[0053] In some embodiments, see Figure 9 As shown, the height of the resistor layer 21 and the pad 22 can be the same. The resistor layer 21 and the pad 22 can be electroplated on the first surface 11 by an electroplating process.
[0054] In some embodiments, see Figure 10 As shown, the heights of the resistor layer 21 and the pad 22 may be different.
[0055] In some embodiments, see Figure 1 As shown, the substrate 1 has a second surface 15 disposed opposite to the first surface 11, and the substrate 1 also includes a receiving groove 16 recessed relative to the second surface 15.
[0056] In some embodiments, see Figure 1 As shown, the receiving groove 16 includes an opening 161 on the side away from the resistor layer 21 and a bottom surface 162 on the side close to the resistor layer 21; the opening 161 has a first projection on the first surface 11, and the bottom surface 162 has a second projection on the first surface 11. The second projection is within the range of the first projection, and the area of the first projection is greater than the area of the second projection.
[0057] Based on the above embodiments, before heating, the fumes are first stored in the receiving tank 16, reducing the distance between the e-liquid and the resistor layer 21. After heating begins, the e-liquid can quickly diffuse into the resistor layer 21, resulting in a short atomization response time. Furthermore, since the receiving tank 16 has a trapezoidal structure with a large opening 161 and a small bottom surface 162, it is convenient to add e-liquid to the substrate 1 after the e-liquid is used up, thanks to the trapezoidal structure.
[0058] In some embodiments, the resistive layer 21 has a third projection on the first surface 11, the second projection is within the range of the third projection, and the area of the second projection is smaller than the area of the third projection.
[0059] Based on the above embodiments, the e-liquid flowing out from the bottom surface 162 of the accommodating groove 16 can all come into contact with the resistive layer 21, thereby achieving a better atomization effect.
[0060] In some embodiments, the substrate 1 further includes an edge region surrounding the capillary region 12, the edge region having no capillary pores 3, which can enhance the support strength of the substrate 1.
[0061] In some embodiments, the diameter of the capillary pore 3 ranges from 20 μm to 200 μm.
[0062] In some embodiments, the resistance value of the resistive layer 21 ranges from 0.4Ω to 1.5Ω.
[0063] In some embodiments, the height of the pad 22 ranges from 10 nm to 1 μm, where the height refers to the length of the pad 22 along the direction Z perpendicular to the first surface 11. The length of the pad 22 along the first direction X may or may not be the same as the length of the resistor layer 21 along the first direction X.
[0064] In some embodiments, the slope of the sidewall of the receiving groove 16 ranges from 45 degrees to 90 degrees.
[0065] See Figures 3 to 5 As shown, another atomizing device is proposed in this application embodiment, which is similar to... Figures 1 to 2 The difference in the embodiment shown is that: the first surface 11 of the connection area 13 of the substrate 1 has at least one first groove 14, and the surface of the part of the resistor layer 21 located in the first groove 14 has at least one second groove 211. The roughness of the resistor layer 21 is increased based on the second groove 211, so that under the action of capillary force, the e-liquid can more easily diffuse to the surface of the resistor layer 21, thus avoiding the dry burning of the resistor layer 21.
[0066] Specifically, the atomizing device includes: a substrate 1, a conductive layer 2, and a plurality of capillary pores 3. The substrate 1 has a first surface 11 and includes a capillary region 12 (not shown), which includes a connection region 13 (not shown). The conductive layer 2 includes a resistive layer 21 and pads 22. The resistive layer 21 is located on the first surface 11 of the connection region 13, and the pads 22 are located on the first surface 11 of the capillary region 12, and are electrically connected to the resistive layer 21. The plurality of capillary pores 3 are located in the capillary region 12 and penetrate the substrate 1, the resistive layer 21, and the pads 22 in a direction Z perpendicular to the first surface 11.
[0067] In some embodiments, see Figure 4 As shown, the atomizing device also includes a first groove 14 located on the first surface 11. The first groove 14 is located at least on the first surface 11 of the connection area 13 of the substrate 1. In addition, it may also be located on the first surface 11 of the capillary area 12 outside the connection area 13 and / or on the first surface 11 outside the capillary area 12.
[0068] In some embodiments, see Figure 5 As shown, there is a first groove 14 between two adjacent capillary pores 3, and the first groove 14 is recessed relative to the first surface 11; the resistive layer 21 is also located on the inner wall surface of the first groove 14, and the part of the resistive layer 21 located in the first groove 14 has a second groove 211.
[0069] In some embodiments, see Figure 4 As shown, multiple capillary pores 3 are arranged in an array along the first direction X and the second direction Y. The first direction X is perpendicular to the second direction Y, and both the first direction X and the second direction Y are parallel to the first surface 11. The first groove 14 includes a first sub-groove 141 and a second sub-groove 142. The first sub-groove 141 and the second sub-groove 142 are located between the capillary pores 3. The first sub-groove 141 is parallel to the first direction X, and the second sub-groove 142 is parallel to the second direction Y.
[0070] In some embodiments, the first sub-groove 141 can penetrate the substrate 1 along the first direction X, and the second sub-groove 142 can penetrate the substrate 1 along the second direction Y. Through the first sub-groove 141 and the second sub-groove 142, e-liquid can more easily diffuse along the first surface 11. The second groove 211 formed by the first sub-groove 141 and the second sub-groove 142 can also store e-liquid fumes, reducing the risk of burnt coils caused by dry burning. Furthermore, since the first sub-groove 141 and the second sub-groove 142 cover a large area, e-liquid fumes are less likely to flow out when the atomizing device is inverted.
[0071] In some embodiments, see Figure 12 As shown, the first sub-groove 141 can connect adjacent capillary pores 3 along the first direction X, and the second sub-groove 142 can connect adjacent capillary pores 3 along the second direction Y.
[0072] In some embodiments, see Figure 13 As shown, a portion of the first sub-groove 141 is located between capillary pores 3, and a portion of the first sub-groove 141 connects to adjacent capillary pores 3 along the first direction X. A portion of the second sub-groove 142 is located between capillary pores 3, and a portion of the second sub-groove 142 connects to adjacent capillary pores 3 along the second direction Y.
[0073] In some embodiments, see Figure 14 As shown, the first groove 14 also includes a third sub-groove 143. The third sub-groove 143 has an angle of 45 degrees with the first direction X and an angle of 45 degrees with the second direction Y. The third sub-groove 143 connects to the adjacent capillary pore 3.
[0074] In some embodiments, see Figure 6 As shown, an irregular first groove 14 can also be formed on the first surface 11 by sandblasting or etching. The resistive layer 21 is also located on the inner wall surface of the irregular first groove 14, and the surface of the resistive layer 21 located in the irregular first groove 14 has an irregular second groove 211.
[0075] In some embodiments, the surface roughness of the first surface 11 ranges from 0.5 μm to 10 μm, and the surface roughness refers to Ra (Roughness Average).
[0076] In some embodiments, see Figure 8 As shown, there are multiple first grooves 14 between two adjacent capillary pores 3. In this embodiment, three are used as an example for illustration. In other embodiments, more first grooves 14 can be provided. This application does not limit the number of first grooves 14 between two adjacent capillary pores 3. The first grooves 14 are recessed relative to the first surface 11. The resistive layer 21 is also located on the inner wall surface of the first grooves 14, and the part of the resistive layer 21 surface located in the first grooves 14 has three second grooves 211. The number of first grooves 14 is equal to the number of second grooves 211. By providing multiple second grooves 211, the roughness of the upper surface of the resistive layer 21 can be further increased.
[0077] Based on the above embodiments, by setting the first groove 14 and using the first groove 14 to form the second groove 211 on the resistor layer 21, the roughness of the resistor layer 21 can be increased. In this way, under the action of capillary force, the e-liquid can more easily diffuse to the surface of the resistor layer 21, the e-liquid can be easily atomized and absorb the heat of the resistor layer 21, avoiding the resistor layer 21 from dry burning and avoiding a large temperature difference between the areas covered by e-liquid and the areas not covered by e-liquid; and the total adhesion between the e-liquid and the surface of the resistor layer 21 is increased, making it less likely for the e-liquid to leak to the outside of the atomizing device.
[0078] In some embodiments, see Figure 7As shown, at least a portion of the resistive layer 21 is located on the inner wall surface of the capillary pore 3. By extending the resistive layer 21 to the inner wall surface of the capillary pore 3, the surface area of the resistive layer 21 can be increased, making it easier for the e-liquid in the capillary pore 3 to contact the resistive layer 21, thereby achieving a better heating effect.
[0079] This application also proposes an electronic cigarette, including the atomizing device described in any of the above embodiments.
[0080] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.
[0081] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.
[0082] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.
Claims
1. An atomizing device, characterized in that, include: A substrate (1) having a first surface (11) and including a capillary region (12) and a connecting region (13); The conductive layer (2) includes a resistive layer (21) and a pad (22). The resistive layer (21) is located on the first surface (11) of the connection area (13), and the pad (22) is located on the first surface (11) of the capillary area (12). The pad (22) is electrically connected to the resistive layer (21). Multiple capillaries (3) are located in the capillary region (12), and the capillaries (3) penetrate the substrate (1), the resistive layer (21) and the pad (22) in a direction (Z) perpendicular to the first surface (11).
2. The atomizing device according to claim 1, characterized in that, The substrate (1) is a glass substrate.
3. The atomizing device according to claim 1, characterized in that, The resistive layer (21) is a metal resistive layer.
4. The atomizing device according to claim 1, characterized in that, The pad (22) is located on the first surface (11) of the connection area (13), and the resistive layer (21) surrounds the pad (22).
5. The atomizing device according to claim 1, characterized in that, The pad (22) is located on the first surface (11) outside the connection area (13), and the pad (22) is located at the edge of the resistor layer (21).
6. The atomizing device according to claim 1, characterized in that, At least a portion of the resistive layer (21) is located on the inner wall surface of the capillary (3).
7. The atomizing device according to claim 1, characterized in that, Also includes: At least one first groove (14) is located on the first surface (11) of the connection area, the first groove (14) being recessed relative to the first surface (11); the resistive layer (21) is also located on the inner wall surface of the first groove (14), and the portion of the surface of the resistive layer (21) located within the first groove (14) has at least one second groove (211).
8. The atomizing device according to claim 7, characterized in that, The surface roughness of the first surface (11) ranges from 0.5 μm to 10 μm.
9. The atomizing device according to claim 7, characterized in that, The plurality of capillaries (3) are arranged in an array along a first direction (X) and a second direction (Y), the first direction (X) being perpendicular to the second direction (Y), and both the first direction (X) and the second direction (Y) being parallel to the first surface (11). The first groove (14) includes a first sub-groove (141) and a second sub-groove (142), the first sub-groove (141) and the second sub-groove (142) are located between the capillary pores (3), the first sub-groove (141) is parallel to the first direction (X), and the second sub-groove (142) is parallel to the second direction (Y).
10. The atomizing device according to claim 1, characterized in that, The substrate (1) has a second surface (15) disposed opposite to the first surface (11), and the substrate (1) further includes a receiving groove (16) recessed relative to the second surface (15).
11. The atomizing device according to claim 10, characterized in that, The receiving groove (16) includes an opening (161) on the side away from the resistive layer (21) and a bottom surface (162) on the side close to the resistive layer (21); The opening (161) has a first projection on the first surface (11), and the bottom surface (162) has a second projection on the first surface (11). The second projection is within the range of the first projection, and the area of the first projection is greater than the area of the second projection.
12. The atomizing device according to claim 11, characterized in that, The resistive layer (21) has a third projection on the first surface (11), the second projection is within the range of the third projection, and the area of the second projection is smaller than the area of the third projection.
13. An electronic cigarette, characterized in that, Includes the atomizing device as described in any one of claims 1 to 12.