LED display module and LED screen

Abstract

The utility model relates to the technical field of screen structures, in particular to an LED display module and an LED screen. The utility model provides an LED display module, which comprises a printed circuit board, a plurality of LED chips and a plurality of LED chips, the plurality of LED light-emitting chips are respectively arranged at the plurality of chip mounting positions; the light-transmitting part is covered on the LED light-emitting chip; the printed circuit board is provided with a light-transmitting part and a middle part, the full-black photoresist coating layer covers the printed circuit board, the full-black photoresist coating layer is provided with a laser hole above the light-transmitting part, the laser hole is exposed out of the light-transmitting part, the full-black photoresist coating layer is sealed above the middle part, and the middle part is a part between the adjacent LED light-emitting chips. It needs to be clear that the ink color consistency of the LED display module is improved through uniform coating of the all-black photoresist coating layer and accurate arrangement of the laser holes, and the LED display module has a good LED light emitting effect. In addition, the LED screen formed by splicing the display modules has good ink color consistency and has a good LED light-emitting effect.

Description

Technical Field

[0001] This application relates to the field of screen structure technology, and in particular to an LED display module and an LED screen. Background Technology

[0002] LED screens, or light-emitting diode screens, are display devices that use semiconductor light-emitting diodes to display text, images, and other information. Their modular design allows for flexible assembly into various shapes and sizes to suit different needs. Whether it's a large outdoor billboard or a small indoor display screen, it can all be achieved through splicing.

[0003] However, since LED screens are composed of multiple display modules, differences in PCB substrate color, LED lamp packaging color, and the light absorption and reflection characteristics of packaging materials can occur during the manufacturing process, resulting in color variations between display modules. When multiple display modules are combined into a large screen, uneven color blocks resembling mosaic tiles appear, affecting the visual effect of the LED screen. Therefore, inconsistency in color between display modules remains a pressing problem to be solved in the LED screen manufacturing process. Utility Model Content

[0004] This application aims to at least solve one of the technical problems existing in the prior art. To this end, this application proposes an LED display module and an LED screen that can enhance the color uniformity of the LED display module and have better LED luminous effect.

[0005] The LED display module according to the first aspect of this application includes:

[0006] A printed circuit board, wherein the printed circuit board has multiple chip mounting positions;

[0007] Multiple LED light-emitting chips are respectively installed in the multiple chip mounting positions;

[0008] The light-transmitting part is covered by the LED light-emitting chip;

[0009] A black photoresist coating layer covers the printed circuit board. The black photoresist coating layer has a laser hole above the light-transmitting part, the laser hole exposes the light-transmitting part, and the black photoresist coating layer is sealed above the middle part, which is the part between adjacent LED light-emitting chips.

[0010] The LED display module according to the embodiments of this application has at least the following beneficial effects:

[0011] The LED display module of this application embodiment includes: a printed circuit board with multiple chip mounting positions; multiple LED light-emitting chips respectively mounted in the multiple chip mounting positions; a light-transmitting portion covering the LED light-emitting chips; and a full-black photoresist coating layer covering the printed circuit board, the full-black photoresist coating layer having laser holes above the light-transmitting portion, the laser holes exposing the light-transmitting portion, and the full-black photoresist coating layer sealing above a middle portion, wherein the middle portion is the portion between adjacent LED light-emitting chips. It should be noted that the uniform coating of the full-black photoresist coating layer and the precise setting of the laser holes in this application embodiment improve the ink color consistency of the LED display module and provide better LED light-emitting effect.

[0012] According to some embodiments of this application, the LED display module includes a plurality of LED beads respectively mounted on the plurality of chip mounting positions, and the LED beads include the LED light-emitting chip mounted on the chip mounting position, the light-transmitting part on the LED light-emitting chip, and the bead bracket.

[0013] According to some embodiments of this application, the all-black photoresist coating layer seals the portion between the edge of the laser hole and the junction position on the outer wall of the lamp bead bracket, wherein the junction position is the position where the outer wall meets the middle portion.

[0014] According to some embodiments of this application, the first thickness of the all-black photoresist coating layer applied to the portion between the edge and the junction of the laser aperture is less than the second thickness of the all-black photoresist coating layer applied to the middle portion.

[0015] According to some embodiments of this application, there is a transition layer between adjacent LED beads, the transition layer covers the surface of the printed circuit board and the bracket connection portion, the bracket connection portion is located in the connection area between the LED bead bracket and the chip mounting position, and the all-black photoresist coating layer is coated on the transition layer and the portion between the laser hole edge and the junction position.

[0016] According to some embodiments of this application, a transparent protective layer is provided above the printed circuit board, the transparent protective layer covers the LED beads and the transition layer, the all-black photoresist coating layer covers the transparent protective layer, and the laser hole exposes the light-transmitting part through the transparent protective layer.

[0017] According to some embodiments of this application, a transparent protective layer is provided above the printed circuit board, the transparent protective layer covers the LED beads and the middle part, the all-black photoresist coating layer covers the transparent protective layer, and the laser hole exposes the light-transmitting part through the transparent protective layer.

[0018] According to some embodiments of this application, the laser hole has a first boundary point and a second boundary point. The first boundary point is the intersection of a first line and the upper edge of the transparent protective layer. The second boundary point is the intersection of a second line and the upper edge of the transparent protective layer. The first line is an extension of the line between the center of the LED light-emitting chip and the first upper edge point of the inner sidewall of the lamp bead bracket. The second line is an extension of the line between the center of the LED light-emitting chip and the second upper edge point of the inner sidewall of the lamp bead bracket.

[0019] According to some embodiments of this application, the light-transmitting portion integrally covers the LED light-emitting chip and the middle portion, and the all-black photoresist coating layer seals the area of ​​the light-transmitting portion located above the middle portion.

[0020] According to a second aspect embodiment of the present application, the LED screen is composed of LED display modules spliced ​​together as described in any one of the first aspect embodiments of the present application.

[0021] The LED screen according to the embodiments of this application has at least the following beneficial effects:

[0022] Since the LED screen in this application embodiment is spliced ​​from the LED display modules described in any one of the first aspects of this application, the LED display module in this application embodiment includes: a printed circuit board with multiple chip mounting positions; multiple LED light-emitting chips respectively mounted in the multiple chip mounting positions; a light-transmitting portion covering the LED light-emitting chips; and a black photoresist coating layer covering the printed circuit board, the black photoresist coating layer having laser holes above the light-transmitting portion, the laser holes exposing the light-transmitting portion, and the black photoresist coating layer sealing above the middle portion, wherein the middle portion is the portion between adjacent LED light-emitting chips. It should be noted that the uniform coating of the black photoresist coating layer and the precise setting of the laser holes in this application embodiment improve the ink color consistency of the LED display module and have a better LED light-emitting effect. On this basis, the LED screen spliced ​​from the LED display modules also has good ink color consistency and a good LED light-emitting effect. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of the structure of an LED display module in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of another structure of the LED display module in the embodiments of this application;

[0026] Figure 3 This is a schematic diagram of the structure of an LED bead in one embodiment of this application;

[0027] Figure 4 This is a schematic diagram of a structure of an LED display module including LED beads in an embodiment of this application;

[0028] Figure 5 This is a schematic diagram of another structure of an LED display module including LED beads in an embodiment of this application;

[0029] Figure 6 This is a schematic diagram of a structure of an LED display module including LED beads and a transition layer in an embodiment of this application;

[0030] Figure 7 This is a schematic diagram of a structure of an LED display module including LED beads and a transparent protective layer in an embodiment of this application;

[0031] Figure 8 This is a schematic diagram of a structure of an LED display module including LED beads, a transition layer and a transparent protective layer in an embodiment of this application;

[0032] Figure 9 This is a schematic diagram illustrating the geometric relationship of the laser aperture in an LED display module according to an embodiment of this application;

[0033] Figure 10 This is a schematic diagram illustrating the arrangement of laser holes in an LED display module according to an embodiment of this application;

[0034] Figure 11 This is a schematic diagram of the structure of an LED screen in an embodiment of this application;

[0035] Figure label:

[0036] LED screen 1000, LED display module 100, printed circuit board 110, LED lamp bead 120, LED light-emitting chip 121, lamp bead bracket 122, bracket connecting part 123, light-transmitting part 130, all-black photoresist coating layer 140, laser hole 141, laser hole edge 142, junction position 143, first boundary point 1431, second boundary point 1432, first line 1441, second line 1442, first upper edge point 1421, second upper edge point 1422, middle part 150, transition layer 160, transparent protective layer 170. Detailed Implementation

[0037] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0038] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0039] In the description of this application, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0042] LED screens, or light-emitting diode screens, are display devices that use semiconductor light-emitting diodes to display various information such as text, images, animations, and videos. They offer numerous advantages, including high brightness, strong contrast, rich colors, fast response time, wide viewing angles, and long lifespan, and are widely used in many fields.

[0043] The modular design of LED screens allows them to be flexibly assembled into various shapes and sizes to suit the needs of different locations. Whether it's a large outdoor billboard or a small indoor display screen, it can all be achieved through splicing. Therefore, the splicing characteristics of LED screens make them a flexible, efficient, and reliable display solution suitable for a wide range of application scenarios and needs.

[0044] However, since LED screens are composed of multiple LED display modules, differences in PCB substrate color, LED lamp packaging color, and the light absorption and reflection characteristics of packaging materials can occur during the manufacturing process, leading to color variations between LED display modules. When multiple LED display modules are combined into a large screen, uneven color blocks resembling mosaic tiles appear, commonly known as the "tofu block phenomenon," severely affecting the visual effect of the LED screen. Therefore, inconsistency in color between LED display modules remains a pressing problem to be solved in the LED screen manufacturing process.

[0045] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes an LED display module that can enhance the color uniformity of the LED display module and has better LED luminous effect.

[0046] The LED display module and LED screen of the present application embodiments are described below with reference to the accompanying drawings.

[0047] Reference Figure 1 The LED display module according to the embodiments of this application may include:

[0048] Printed circuit board 110, with multiple chip mounting positions on the printed circuit board 110;

[0049] It should be noted that the printed circuit board 110, as a basic component, provides a platform for the installation and connection of other components. The multiple chip mounting positions on it can precisely position and fix the LED light-emitting chips 121, ensuring the consistency of each LED light-emitting chip 121 in position and angle, thus laying the foundation for uniform light output.

[0050] Multiple LED light-emitting chips 121 are respectively installed in multiple chip mounting positions;

[0051] It should be noted that the LED light-emitting chip 121 is the core light-emitting component of the display module. Multiple LED light-emitting chips 121 are respectively mounted on chip mounting positions on the printed circuit board 110. This layout not only improves the installation efficiency of the LED light-emitting chips 121 but also makes the light distribution more uniform. Each LED light-emitting chip 121 can emit light independently. By controlling different chip combinations, rich colors and patterns can be displayed, meeting diverse display needs.

[0052] The light-transmitting part 130 is covered on the LED light-emitting chip 121;

[0053] It should be noted that the design of the light-transmitting portion 130 in this embodiment plays a crucial role in protection and optical optimization. It covers the LED light-emitting chip 121, forming a uniform protective layer that effectively prevents damage to the LED light-emitting chip 121 from the external environment, such as dust and moisture. Simultaneously, the material and thickness of the light-transmitting portion 130 are carefully designed to ensure efficient light transmission, reducing light loss and thereby improving the overall brightness and luminous efficiency of the LED display module.

[0054] In some specific embodiments of this application, the light-transmitting portion 130 may specifically be epoxy resin. Epoxy resin, as a high-performance material suitable for electronic packaging, possesses many excellent properties, enabling it to play an important role in LED display modules.

[0055] First, epoxy resin possesses excellent optical properties. Its high transparency effectively transmits the light emitted by the LED chip 121, reducing light loss during propagation and thus improving the module's brightness. Furthermore, the moderate refractive index of epoxy resin matches well with that of the LED chip 121, further reducing light reflection loss at the interface and allowing more light to propagate smoothly, thereby enhancing the module's luminous efficiency.

[0056] Secondly, epoxy resin possesses excellent chemical stability and mechanical properties. It can withstand certain temperature changes and chemical corrosion, ensuring that the encapsulation layer will not discolor, age, or crack under different environmental conditions, thereby extending the lifespan of the LED chip 121. This stability is particularly important for applications such as outdoor screens that need to withstand harsh environments, ensuring that the screen maintains stable performance and good display effects during long-term use.

[0057] In addition, epoxy resin has good processing properties. Before curing, it has a certain degree of fluidity, allowing it to uniformly cover the surface of the LED chip 121 or the lamp bead bracket 122, forming a smooth and bubble-free encapsulation layer. This uniform encapsulation not only helps improve light propagation efficiency but also effectively protects the LED chip 121 from external factors such as moisture and dust, enhancing the reliability and stability of the module.

[0058] It is evident that using epoxy resin as the light-transmitting part 130 offers significant advantages in terms of optical performance, chemical stability, mechanical properties, and processing performance. It effectively protects the LED light-emitting chip 121, optimizes the light propagation path, and improves the brightness and luminous efficacy of the LED display module. This allows the LED display module to operate stably in various environments, providing strong support for the high-performance application of LED screens.

[0059] According to some embodiments provided in this application, in addition to its protective function, the light-transmitting portion 130 can also optimize the light emitted by the LED light-emitting chip 121. It should be understood that the optical characteristics of the light-transmitting portion 130, such as refractive index and transmittance, affect the propagation path and light emission efficiency of the light. Embodiments of this application can reduce reflection and absorption losses during light propagation by selecting and designing a suitable light-transmitting portion 130, allowing more light to propagate effectively, thereby improving the brightness and luminous efficiency of the LED screen. Furthermore, the light-transmitting portion 130 can also use special optical structure designs, such as microlens arrays and light diffusion layers, to shape and homogenize the light, improving the light distribution characteristics and making the light from the LED screen more uniform and softer, thus enhancing the overall display effect and visual experience.

[0060] Specifically, in LED display modules, the optical properties of the light-transmitting portion 130 play a crucial role in light propagation and display effects. Below are some specific examples of how the light-transmitting portion 130 optimizes light propagation:

[0061] In some embodiments, the light-transmitting portion 130, through its high light transmittance and suitable refractive index, can reduce reflection and absorption losses of light during propagation. For example, using an encapsulation material with a refractive index matching that of the LED light-emitting chip 121 can reduce reflections formed inside the light-transmitting portion 130, allowing more light to propagate effectively. This not only improves the brightness of the LED screen but also enhances its luminous efficacy, enabling the screen to achieve a higher brightness level with the same power consumption.

[0062] In some embodiments, the light-transmitting portion 130 can be designed as a microlens array structure, using tiny convex or concave lenses to focus or scatter light. This design can improve the light distribution characteristics, making the light more evenly distributed across the entire screen. For example, in large outdoor LED screens, the microlens array can evenly distribute light in all directions, ensuring consistent brightness and color performance when viewed from different angles.

[0063] According to some embodiments provided in this application, an optical coating can be added to the surface of the light-transmitting portion 130 to further optimize light propagation. For example, an anti-reflective coating can reduce surface reflection and increase light transmittance; while an anti-reflective film can improve the transmittance of light at specific wavelengths and enhance the color saturation of the screen. The application of these optical coatings enables the LED screen to maintain good display performance under different ambient light conditions.

[0064] Furthermore, the light-transmitting section 130 can also employ a multi-layer structure design, with each layer possessing different optical properties to achieve multiple optimizations of light. For example, the bottom layer can be a high-refractive-index material to reduce reflection; the middle layer can be a light-diffusing layer to homogenize light; and the top layer can be an anti-reflective coating to improve light transmittance. This multi-layer structure enhances the optical performance of the LED screen, enabling it to achieve higher levels in brightness, uniformity, and color performance.

[0065] It should be understood that the light-transmitting part 130 not only plays an important role in protecting the LED light-emitting chip 121, but also significantly improves the light propagation effect and overall display quality of the LED screen through various optical design and optimization methods.

[0066] A black photoresist coating layer 140 is applied over the printed circuit board 110. The black photoresist coating layer 140 has a laser hole 141 above the light-transmitting portion 130, the laser hole 141 is exposed above the light-transmitting portion 130, and the black photoresist coating layer 140 is sealed above the middle portion 150, wherein the middle portion 150 is the portion between adjacent LED light-emitting chips 121.

[0067] It should be noted that the all-black photoresist coating layer 140 is a key improvement in this embodiment. It covers the printed circuit board 110, forming a uniform black coating. Above the light-transmitting portion 130, this coating layer has laser holes 141 that precisely expose the light-transmitting portion 130, allowing light to accurately pass through the LED light-emitting chip 121. It should be understood that the laser holes 141 in this embodiment can be formed at specific locations by etching the all-black photoresist coating layer 140 with a laser. This design not only improves the uniformity and consistency of light but also avoids light scattering and reflection in non-light-emitting areas, thereby reducing light pollution and energy waste. Furthermore, the sealing design of the all-black photoresist coating layer 140 above the middle portion 150 further enhances the black color consistency of the display module, making the entire LED screen more visually unified and harmonious.

[0068] In some specific embodiments of this application, the all-black photoresist coating layer 140 can be made of an epoxy material containing black ink, forming a coating that has both excellent light-blocking properties and can firmly adhere to the surfaces of the light-transmitting portion 130 and the printed circuit board 110. In some preferred embodiments, the proportion of black ink in the epoxy material is 20%, and the coating thickness is optimally controlled between 5 μm and 8 μm. This design exhibits significant advantages and characteristics in several aspects.

[0069] First, epoxy material, as a high-performance polymer, possesses excellent adhesion, chemical stability, and mechanical properties. It can firmly adhere to the surfaces of the light-transmitting part 130, the LED bead bracket 122, and the printed circuit board 110, forming a uniform and stable coating. This excellent adhesion ensures that the photoresist layer will not easily peel off or crack during long-term use, thereby improving the reliability and lifespan of the LED display module. Furthermore, epoxy material also has excellent insulation and weather resistance, effectively protecting the internal electronic components of the LED display module from external environmental factors such as moisture, dust, and temperature changes.

[0070] Secondly, the optimal proportion of black ink in the epoxy material is set at 20%, a proportion carefully optimized in this application embodiment. A 20% black ink content provides sufficient light-blocking effect, effectively masking potential color differences within the module, such as the color of the printed circuit board 110 and the LED bead bracket 122, resulting in a uniform black color throughout the module when not illuminated. This uniformity is crucial for improving the visual effect of the LED screen, especially when the screen is off, preventing noticeable color blocks or differences and providing a more uniform and natural visual experience. Furthermore, the 20% black ink proportion ensures good light transmission of the all-black photoresist coating layer 140, allowing the light emitted by the LED light-emitting chip 121 to propagate efficiently through the light-transmitting holes, without excessive light absorption and scattering due to excessive ink content, thus affecting the brightness and luminous efficiency of the LED display module.

[0071] Furthermore, controlling the coating thickness within the range of 5μm to 8μm is based on multiple considerations and optimizations. A thickness of 5μm to 8μm ensures that the all-black photoresist coating layer 140 forms a uniform and stable coating during the coating process, avoiding problems such as uneven coating, prolonged drying time, and even coating cracking caused by excessively thick coatings. It also prevents poor light-blocking effects and poor color consistency caused by coatings that are too thin. This thickness range allows for minimizing the impact on the light-emitting efficiency of the LED chip 121 while maintaining good light-blocking performance, achieving an optimal balance between ink color consistency and light propagation efficiency. Moreover, a coating thickness of 5μm to 8μm helps reduce material usage, thereby reducing production costs and improving production efficiency to some extent, demonstrating economic viability and feasibility in practical applications.

[0072] As can be seen, the preferred embodiment of the all-black photoresist coating layer 140 in this application achieves superior performance in terms of light-blocking properties, light transmittance, adhesion, reliability, and cost control by using epoxy material with a black ink ratio of 20% and precisely controlling the coating thickness to 5μm to 8μm. However, the all-black photoresist coating layer 140 that can be selected in the embodiments of this application is diverse and not limited to the embodiments mentioned above.

[0073] It should be clarified that the LED display module of this application embodiment effectively solves the problem of color difference between display modules caused by factors such as PCB substrate color, LED lamp packaging color, and light absorption and reflection characteristics of packaging materials during the manufacturing process by covering the printed circuit board 110 with a full black photoresist coating layer 140 and setting a laser hole 141 above the light-transmitting part 130, thereby improving the consistency of ink color.

[0074] The uniform application of the all-black photoresist coating layer 140 ensures consistent light absorption and reflection characteristics around each LED chip 121. Because this layer seals over the center portion 150, it prevents light scattering and reflection from non-emitting areas, thus reducing visual differences between different LED display modules. The precise placement of the laser aperture 141 ensures that light can accurately pass through the LED chip 121, further improving light uniformity and consistency.

[0075] Furthermore, this design ensures consistent ink color while also providing good LED luminous effect. The all-black photoresist coating layer 140 does not negatively affect the luminous efficiency of the LED chip 121; on the contrary, by optimizing the light propagation path, it makes the light more concentrated and uniformly emitted from the light-transmitting part 130, thereby improving the display quality of the entire LED screen.

[0076] The uniform coating of the all-black photoresist coating layer 140 and the precise setting of the laser holes 141 in this embodiment improve the ink color consistency of the LED display module and have a better LED luminous effect.

[0077] It is worth noting that the light-transmitting portion 130 is covered on the surface of the LED light-emitting chip 121, which can correspond to a variety of covering methods.

[0078] According to some embodiments provided in this application, the light-transmitting portion 130 can be coated on the surface of each LED light-emitting chip 121, with one LED light-emitting chip 121 corresponding to one light-transmitting portion 130. This method saves materials relatively well, but the manufacturing difficulty is slightly higher. Figure 1 The structure shown is shown.

[0079] In other embodiments, a large light-transmitting portion 130 can be directly laid on the surface of all LED light-emitting chips 121 on the printed circuit board 110. This method consumes more material, but is simpler to manufacture. Figure 2 The structure shown is shown.

[0080] Reference Figure 2 According to some embodiments of this application, the light-transmitting portion 130 integrally covers the LED light-emitting chip 121 and the middle portion 150, and the all-black photoresist coating layer 140 seals the area of ​​the light-transmitting portion 130 located above the middle portion 150.

[0081] It should be noted that the light-transmitting portion 130 integrally covers the LED light-emitting chip 121 and the middle portion 150, ensuring that light passing through the LED light-emitting chip 121 passes through a uniform medium, thereby reducing scattering and reflection during light propagation. This design helps improve the uniformity and consistency of light, making the entire LED screen visually flatter and more uniform. The all-black photoresist coating layer 140 seals the area above the middle portion 150 in the light-transmitting portion 130, giving the LED display module good ink color consistency. The uniform coating of the all-black photoresist coating layer 140 ensures that the light absorption and reflection characteristics around each LED light-emitting chip 121 are consistent, avoiding color difference problems caused by scattering and reflection of light in non-light-emitting areas. This sealing design also prevents external light from interfering with the LED light-emitting chip 121, improving the display effect of the LED display module under different lighting conditions. In this way, the embodiments of this application ensure ink color consistency while also having good LED light-emitting effect.

[0082] It should be understood that the light-transmitting portion 130 can be covered on the surface of the LED light-emitting chip 121 in various ways, and is not limited to the examples mentioned above.

[0083] It is worth noting that, such as Figure 1 and Figure 2 As shown in the diagram, the LED chip 121 can be directly fixed to the chip mounting position on the printed circuit board 110. In other embodiments, it can also be as follows... Figure 3 As shown, the LED bead 120 may include an LED light-emitting chip 121, a light-transmitting part 130 covering the corresponding LED light-emitting chip 121, and a bead bracket 122. The LED bead 120 is fixed to the chip mounting position by the bead bracket 122 so that the LED light-emitting chip 121 can be connected to the printed circuit board 110.

[0084] Reference Figure 3 According to some embodiments of this application, the LED display module may include: a plurality of LED beads 120 respectively mounted on a plurality of chip mounting positions, wherein each LED bead 120 includes an LED light-emitting chip 121 mounted on a chip mounting position, a light-transmitting portion 130 on the LED light-emitting chip 121, and a bead bracket 122.

[0085] It should be noted that the LED display module includes multiple LED beads 120 respectively installed in multiple chip mounting positions. Each LED bead 120 includes an LED light-emitting chip 121 installed in the chip mounting position, a light-transmitting part 130 on the LED light-emitting chip 121, and a bead bracket 122.

[0086] It should be noted that the LED bead 120, as the core light-emitting unit of the LED display module, directly affects the display effect of the entire screen through its structure and performance. Each LED bead 120 contains an LED light-emitting chip 121, which are precisely mounted on the chip mounting positions of the printed circuit board 110. This precise positioning ensures the consistency of each light-emitting chip in position and angle, thus laying the foundation for uniform light output.

[0087] It should be noted that the light-transmitting portion 130 covers the LED light-emitting chip 121, playing a crucial role in protection and optical optimization. It not only effectively prevents damage to the chip from external environmental factors such as dust and moisture, but also optimizes the light propagation path, reduces light loss, and improves the uniformity and consistency of light. The material and thickness of the light-transmitting portion 130 are carefully designed to ensure optimal optical performance.

[0088] The LED bead bracket 122 is the supporting structure for the LED bead 120. It not only provides physical support for the LED light-emitting chip 121 and the light-transmitting part 130, but also serves as an electrical connection. The design of the LED bead bracket 122 needs to consider heat dissipation performance to ensure that the LED light-emitting chip 121 can maintain a stable temperature when operating at high brightness, thereby extending its lifespan and improving the display effect.

[0089] It should be understood that the LED display module design mentioned in the embodiments of this application has good application potential in practical applications. Whether used for large outdoor billboards or small indoor display screens, it can provide high-quality display effects. Outdoor billboards need to maintain stable operation in various harsh environments, and the sealed design and efficient heat dissipation performance of this LED display module perfectly meet this requirement. In indoor display screens, its high-precision light control and uniform ink color consistency ensure clear information transmission and aesthetically pleasing visual effects.

[0090] It should be understood that there are various ways to connect the LED light-emitting chip 121 to the printed circuit board 110, and these are not limited to the examples mentioned above.

[0091] In some embodiments, the all-black photoresist coating layer 140 can be directly coated on the surface of the LED bead holder 122, or it can be coated on the printed circuit board 110, or it can cover the printed circuit board 110 or the LED bead holder 122 without direct contact, so that the LED display module has the same black color appearance. For example, each LED light-emitting chip 121 is covered in the light-transmitting part 130 of the LED bead 120. The all-black photoresist coating layer 140 is coated on the surface of the printed circuit board 110 and the LED bead holder 122, and the light-transmitting holes are distributed on the light-emitting path corresponding to each LED light-emitting chip 121, such as... Figure 4 The structure shown.

[0092] Reference Figure 4 According to some embodiments of this application, the all-black photoresist coating layer 140 seals the portion between the laser hole edge 142 and the junction position 143 on the outer wall of the lamp bead bracket 122, where the junction position 143 is the position where the outer wall meets the middle portion 150.

[0093] It should be noted that the all-black photoresist coating layer 140 seals the portion between the laser hole edge 142 and the junction 143 on the outer wall of the LED chip bracket 122. The junction 143 is the location where the outer wall meets the middle part 150. This sealing design helps improve the color consistency of the LED display module. The uniform coating of the all-black photoresist coating layer 140 ensures that the light absorption and reflection characteristics around each LED chip 121 are consistent, avoiding color difference problems caused by light scattering and reflection in non-light-emitting areas. This has an important effect on enhancing the visual appeal of LED screens in various applications, whether it is a large outdoor billboard or a small indoor display screen.

[0094] On the other hand, the sealed design of the all-black photoresist coating layer 140 effectively prevents external environmental factors from interfering with the LED light-emitting chip 121. By sealing the portion between the laser hole edge 142 and the junction position 143 on the outer wall of the lamp bead bracket 122, external substances such as dust and moisture can be prevented from entering, thereby improving the stability and lifespan of the LED display module. This sealed design also reduces the scattering and reflection of light in non-light-emitting areas, making the light more concentrated and uniformly emitted from the light-transmitting part 130, thereby improving the display quality of the entire LED screen.

[0095] Furthermore, this sealing design of the all-black photoresist coating layer 140 enhances the structural reliability of the LED display module. In practical applications, LED display modules need to withstand various environmental conditions, such as temperature changes and humidity effects. By sealing the portion between the laser hole edge 142 and the junction position 143 on the outer wall of the lamp bead bracket 122, component loosening or damage caused by environmental factors can be effectively prevented, thereby ensuring the stability and high performance of the LED display module during long-term use.

[0096] It should be understood that the sealing design of the all-black photoresist coating layer 140 in the embodiments of this application not only improves the color consistency and luminous effect of the LED display module, but also enhances its stability and reliability under different environmental conditions, providing new technical support for the development of LED display technology.

[0097] Reference Figure 5According to some embodiments of this application, the first thickness of the all-black photoresist coating layer 140 applied on the portion between the laser hole edge 142 and the junction position 143 is less than the second thickness of the all-black photoresist coating layer 140 applied on the middle portion 150.

[0098] It should be noted that the first thickness of the all-black photoresist coating layer 140 applied to the portion between the laser hole edge 142 and the junction position 143 is less than the second thickness of the all-black photoresist coating layer 140 applied to the middle portion 150. This difference in thickness helps improve the color consistency of the LED display module. The thicker coating of the all-black photoresist coating layer 140 in the middle portion 150 allows for more effective absorption and reflection of light, reducing light scattering in non-light-emitting areas and thus avoiding color difference issues. The thinner coating of the all-black photoresist coating layer 140 applied to the portion between the laser hole edge 142 and the junction position 143 ensures that light emitted from the light-transmitting portion 130 is more uniform and concentrated, further enhancing the overall visual effect of the LED screen.

[0099] On the other hand, this thickness design also optimizes light control and propagation. The thicker all-black photoresist coating layer 140 in the middle 150 better blocks interference from external light, improving the contrast and clarity of the display module under different lighting conditions. Meanwhile, the thinner coating layer between the laser aperture edge 142 and the junction 143 helps light escape more smoothly from the light-transmitting portion 130, reducing light loss at the edges and thus improving light utilization efficiency.

[0100] Furthermore, this thickness design also takes into account the structural stability and heat dissipation performance of the LED display module. The thicker all-black photoresist coating layer 140 in the middle 150 provides better physical support and protection, preventing damage to the LED light-emitting chip 121 from external environmental factors. At the same time, the relatively thin coating layer between the laser hole edge 142 and the junction 143 does not excessively hinder heat dissipation, ensuring that the LED light-emitting chip 121 can maintain a stable temperature during operation, thereby extending its service life.

[0101] Reference Figure 6 According to some embodiments of this application, there is a transition layer between adjacent LED beads 120. The transition layer covers the surface of the printed circuit board 110 and the bracket connection portion 123. The bracket connection portion 123 is located in the connection area between the LED bead bracket 122 and the chip mounting position. The all-black photoresist coating layer 140 is coated on the transition layer and the portion between the laser hole edge 142 and the junction position 143.

[0102] It should be noted that a transition layer 160 is provided between adjacent LED beads 120. The transition layer 160 covers the surface of the printed circuit board 110 and the bracket connection portion 123. The bracket connection portion 123 is located in the connection area between the LED bead bracket 122 and the chip mounting position. A full-black photoresist coating layer 140 is applied to the transition layer 160 and the portion between the laser hole edge 142 and the junction position 143. The transition layer 160 effectively improves the connection stability and electrical performance between the LED beads 120. Covering the surface of the printed circuit board 110 and the bracket connection portion 123, it provides a uniform mounting base for the LED beads 120, reducing electrical connection problems caused by surface unevenness or poor contact. Simultaneously, the transition layer 160 also provides insulation and protection, preventing damage to the circuit board and bracket connection portion 123 from external environmental factors.

[0103] Secondly, this transition layer 160 covers the printed circuit board 110 and the LED holders 122 of each LED 120, as well as between adjacent LEDs 120, providing a smooth connection and uniform transition. The all-black photoresist coating layer 140 is precisely coated on the surface of the light-transmitting portion 130, the surface of the LED holders 122, and the surface of the transition layer 160, forming a continuous and uniform light-shielding layer. This design not only enhances the color consistency of the module but also ensures efficient light propagation through the precise setting of the light-transmitting holes. Specifically, the introduction of the transition layer 160 creates a smooth connection surface between adjacent LEDs 120, covering the surfaces of the printed circuit board 110 and the LED holders 122. This not only helps reduce visual discontinuities caused by height differences or color variations between different components but also provides a more uniform substrate, allowing the all-black photoresist coating layer 140 to be coated more evenly. The all-black photoresist coating layer 140 completely covers the light-transmitting part 130, the lamp bead bracket 122, and the transition layer 160, effectively masking any potential color differences and ensuring that the entire module presents a uniform black color when not lit. This comprehensive coating method ensures that the function of the all-black photoresist coating layer 140 is maximized, and the color difference of the LED display module is minimized from any angle.

[0104] According to some embodiments of this application, the transition layer 160 includes an ink affinity material corresponding to the all-black photoresist coating layer 140, the ink affinity material filling between adjacent LED beads 120.

[0105] It should be noted that, in the design of the LED display module, in order to further improve the color consistency and overall display effect of the LED display module, according to some embodiments of this application, a transition layer 160 is provided between adjacent LED beads 120, and the transition layer 160 contains an ink affinity material corresponding to the all-black photoresist coating layer 140. This ink affinity material fills the spaces between adjacent LED beads 120. This design not only enhances the adhesion between the all-black photoresist coating layer 140 and the transition layer 160, but also further optimizes the color transition and light propagation effect of the module through the characteristics of the ink affinity material.

[0106] It is important to clarify that in the embodiment where the ink-affinity material serves as the transition layer 160, an intermediate layer with good affinity is formed between adjacent LED beads 120, allowing the all-black photoresist coating layer 140 to be coated more evenly and firmly onto its surface. This not only helps reduce visual discontinuities caused by height differences or color variations between different components, but also provides a more uniform substrate, enabling the all-black photoresist coating layer 140 to more evenly cover the entire surface of the LED display module. The complete coverage of the all-black photoresist coating layer 140 on the light-transmitting portion 130, the bead support 122, and the transition layer 160 effectively masks any potential color differences, resulting in a consistent black color throughout the module when not illuminated. This coating method ensures that the function of the all-black photoresist coating layer 140 is maximized, and the color difference of the LED display module is reduced to a low level from any angle.

[0107] In some more specific embodiments, the use of ink-affinity materials also helps improve the reliability and stability of the LED display module. It enhances the adhesion between the all-black photoresist coating layer 140 and the underlying material, reducing coating peeling or cracking caused by environmental changes (such as temperature and humidity). Additionally, the ink-affinity material itself may possess protective properties, such as moisture and dust resistance, further extending the module's lifespan. This design, while improving display performance, also ensures stable operation of the LED screen in various environments, providing a superior and reliable visual experience.

[0108] It should be understood that the design of the transition layer 160 and the all-black photoresist coating layer 140 in the embodiments of this application not only improves the ink color consistency and optical performance of the LED display module, but also enhances its structural stability and heat dissipation performance.

[0109] It is worth noting that the all-black photoresist coating layer 140 can be coated not only on the surface of the printed circuit board 110 and the LED bead bracket 122, but also on the transparent protective layer 170 disposed above the printed circuit board 110, such as... Figure 7 , 8 The structure shown.

[0110] Reference Figure 7 According to some embodiments of this application, a transparent protective layer 170 is provided above the printed circuit board 110. The transparent protective layer 170 covers the LED lamp bead 120 and the middle part 150. The all-black photoresist coating layer 140 covers the transparent protective layer 170. The laser hole 141 is exposed through the transparent protective layer 170 to reveal the light-transmitting part 130.

[0111] It should be noted that a transparent protective layer 170 is provided above the printed circuit board 110. The transparent protective layer 170 covers the LED beads 120 and the middle part 150. A black photoresist coating layer 140 covers the transparent protective layer 170, and the laser hole 141 is exposed through the transparent protective layer 170 to reveal the light-transmitting part 130. The transparent protective layer 170 effectively improves the stability and protection performance of the LED display module. It covers the LED beads 120 and the middle part 150, forming a uniform protective barrier to prevent damage to the LED beads 120 and the middle part 150 from external environmental factors such as dust and moisture, thereby extending the service life of the LED display module. At the same time, the transparent protective layer 170 also provides a certain degree of mechanical support, reducing the loosening or damage of components caused by physical impact or vibration.

[0112] On the other hand, the all-black photoresist coating layer 140 covers the transparent protective layer 170, further optimizing the optical performance of the LED display module. The uniform coating of the all-black photoresist coating layer 140 ensures consistent light absorption and reflection characteristics around each LED bead 120, reducing light scattering and reflection in non-light-emitting areas, thereby improving color consistency and display effect. Especially in designs where the laser aperture 141 exposes the light-transmitting portion 130 through the transparent protective layer 170, the all-black photoresist coating layer 140 effectively prevents light leakage at the edges, ensuring that light is concentrated and emitted from the light-transmitting portion 130, further enhancing light uniformity and brightness.

[0113] Furthermore, this design also takes into account the heat dissipation performance and long-term stability of the LED display module. The combination of the transparent protective layer 170 and the all-black photoresist coating layer 140 not only enhances the overall structure of the module but also effectively disperses and conducts the heat generated by the LED chips 120 during operation, preventing performance degradation and shortened lifespan due to overheating. This is crucial for the stability and reliability of the LED display module under long-term, high-intensity operating conditions.

[0114] According to some specific embodiments of this application, the transparent protective layer 170 can be made of a highly transparent material, such as optical-grade polycarbonate or acrylic resin, which have good optical properties and mechanical strength. It is firmly installed above the printed circuit board 110 and the light-transmitting part 130, forming a robust barrier that effectively prevents external physical impacts, scratches, and the intrusion of contaminants. This transparent protective layer 170 ensures that key components inside the module, such as the LED light-emitting chip 121, the light-transmitting part 130, and the printed circuit board 110, can still operate stably in various harsh environments, thereby extending the lifespan of the entire screen.

[0115] According to some embodiments of this application, the transparent protective layer 170 employs an ink affinity material corresponding to the all-black photoresist coating layer 140.

[0116] It should be noted that a major advantage of ink affinity materials is their ability to enhance the adhesion between the ink photoresist layer and the transparent protective layer 170. During the use of LED display modules, they are exposed to environmental factors such as temperature changes, humidity fluctuations, and mechanical vibrations. These factors can cause peeling or cracking between the ink photoresist layer and the protective board, thus affecting the display effect and lifespan of the LED display module. The use of ink affinity materials effectively solves this problem. It forms a substrate on the surface of the transparent protective layer 170 with high affinity to the all-black photoresist coating layer 140, allowing the ink photoresist layer to adhere more firmly to the protective board. This enhanced adhesion ensures that the ink photoresist layer will not easily peel off during long-term use, thereby maintaining the ink color consistency and light propagation efficiency of the LED display module.

[0117] Furthermore, ink-affinity materials also contribute to improved optical performance of the module. They ensure that the all-black photoresist coating layer 140 forms a uniform and smooth coating on the transparent protective layer 170, avoiding light scattering and absorption problems caused by uneven coating. This not only improves the brightness and luminous efficacy of the LED display module but also makes the light distribution more uniform, enhancing the overall display quality of the screen. In some high-end display applications, such as indoor high-definition screens and outdoor large advertising screens, this improvement in optical performance is crucial for achieving high-quality image and video displays.

[0118] As can be seen, the transparent protective layer 170 of this application embodiment adopts an ink affinity material corresponding to the all-black photoresist coating layer 140, which enhances the adhesion of the ink photoresist layer and improves the reliability and stability of the LED display module.

[0119] It should be understood that the design of the transparent protective layer 170 and the all-black photoresist coating layer 140 in the embodiments of this application not only improves the color consistency and optical performance of the LED display module, but also enhances its protective performance, heat dissipation performance and long-term stability.

[0120] Reference Figure 8 According to some embodiments of this application, a transparent protective layer 170 is provided above the printed circuit board 110. The transparent protective layer 170 covers the LED lamp bead 120 and the transition layer 160. The all-black photoresist coating layer 140 covers the transparent protective layer 170. The laser hole 141 exposes the light-transmitting part 130 through the transparent protective layer 170.

[0121] It should be noted that in some cases, there is a transition layer 160 between adjacent LED beads 120, and the transition layer 160 covers the surface of the printed circuit board 110 and the bracket connection portion 123. In this embodiment, a transparent protective layer 170 is provided above the printed circuit board 110, the transparent protective layer 170 covers the LED beads 120 and the transition layer 160, the all-black photoresist coating layer 140 covers the transparent protective layer 170, and the laser hole 141 exposes the light-transmitting portion 130 through the transparent protective layer 170.

[0122] It should be understood that the design of the transparent protective layer 170 and the all-black photoresist coating layer 140 in the embodiments of this application not only improves the color consistency and optical performance of the LED display module, but also enhances its protective performance, heat dissipation performance and long-term stability.

[0123] Reference Figure 9 , Figure 10 According to some embodiments of this application, the laser hole 141 has a first boundary point 1431 and a second boundary point 1432. The first boundary point 1431 is the intersection of the first line 1441 and the upper edge of the transparent protective layer 170. The second boundary point 1432 is the intersection of the second line 1442 and the upper edge of the transparent protective layer 170. The first line 1441 is an extension of the line between the center of the LED light-emitting chip 121 and the first upper edge point 1421 of the inner sidewall of the lamp bead bracket 122. The second line 1442 is an extension of the line between the center of the LED light-emitting chip 121 and the second upper edge point 1422 of the inner sidewall of the lamp bead bracket 122.

[0124] It should be noted that in this embodiment, the laser hole 141 has a first boundary point 1431 and a second boundary point 1432. The first boundary point 1431 is the intersection of the first line 1441 and the upper edge of the transparent protective layer 170, and the second boundary point 1432 is the intersection of the second line 1442 and the upper edge of the transparent protective layer 170. The first line 1441 is an extension of the line between the center of the LED light-emitting chip 121 and the first upper edge point 1421 of the inner sidewall of the lamp bead bracket 122, and the second line 1442 is an extension of the line between the center of the LED light-emitting chip 121 and the second upper edge point 1422 of the inner sidewall of the lamp bead bracket 122. The key to this design is precisely controlling the size of the laser hole 141 to ensure the optimal balance between color consistency and display effect in the LED display module. If the size of the laser hole 141 is too large, it will result in insufficient coverage of the all-black photoresist coating layer 140 in the non-light-emitting areas, causing light to scatter and reflect in these areas, disrupting color consistency and causing color differences. Conversely, if the size of the laser aperture 141 is too small, it will limit the amount of light passing through, resulting in poor display effects, such as insufficient brightness and uneven lighting.

[0125] Based on this, by defining the boundary point of the laser hole 141 as the intersection of the extension line connecting the center of the LED light-emitting chip 121 and the upper edge of the inner sidewall of the lamp bead bracket 122 with the upper edge of the transparent protective layer 170, this design ensures that the size of the laser hole 141 is precisely matched with the geometric relationship between the LED light-emitting chip 121 and the lamp bead bracket 122. This precision allows light to be emitted from the light-transmitting part 130 more concentratedly and efficiently, while avoiding scattering and reflection of light in non-light-emitting areas, thus ensuring both consistent ink color and good display effect.

[0126] It should be understood that the precise determination of the size of the laser hole 141 in the embodiments of this application improves the ink color consistency and optical performance of the LED display module.

[0127] According to some more specific embodiments provided in this application, in order to ensure that each light-transmitting hole in the embodiments of this application is precisely distributed on the light-emitting path of the corresponding LED light-emitting chip 121, and to ensure that light can smoothly propagate through the light-transmitting holes, the size and shape of these light-transmitting holes can be preset to match the light-emitting characteristics of the LED light-emitting chip 121, thereby minimizing light loss while ensuring efficient light propagation. This precise setting of light-transmitting holes not only improves the brightness performance of the module, but also ensures the uniformity and consistency of light, enabling the entire LED screen to present high-quality images and videos when lit.

[0128] According to some embodiments provided in this application, the light emission path of the LED light-emitting chip 121 can be determined by its packaging structure and optical design. After the light is emitted from the LED light-emitting chip 121, it will be refracted and reflected by the light-transmitting part 130 and finally emitted from a specific direction.

[0129] In this embodiment, the position, size, and shape parameters of each light-transmitting hole can be matched and set according to the optical path influencing factors corresponding to the LED light-emitting chip 121. These optical path influencing factors may include, but are not limited to, the structure and position of the LED light-emitting chip 121, and the optical characteristics of the light-transmitting portion 130. Specifically, the position and orientation of the LED light-emitting chip 121 determine the initial propagation direction of the light, while the refractive index and transmittance of the light-transmitting portion 130 affect the propagation path of the light.

[0130] In this embodiment, optical simulation software can be used to simulate the propagation path and distribution of light emitted by the LED light-emitting chip 121 based on the structure and position of the LED light-emitting chip 121, the optical characteristics of the light-transmitting part 130, and other light path influencing factors. This allows for the determination of matching position parameters, size parameters, and shape parameters for the light-transmitting hole corresponding to each LED light-emitting chip 121.

[0131] Reference Figure 11 According to the embodiments of this application, the LED screen 1000 is formed by splicing together the LED display modules 100 of the embodiments of this application.

[0132] It should be noted that the LED display module 100 in this embodiment of the application has a high degree of consistency and precision in its structural design. Each display module is carefully designed and manufactured to ensure seamless connection between the modules when spliced ​​into a large screen, forming a unified display effect. Specifically, the optical performance of the LED display module 100 has been optimized. The uniform coating of the all-black photoresist coating layer 140 and the precise setting of the laser holes 141 ensure that each LED display module 100 has good color consistency and light uniformity when emitting light. When multiple modules are spliced ​​into a large screen, the entire screen can present uniform color and brightness, avoiding mosaic effects or color block inconsistencies caused by differences between modules. In this way, the LED screen 1000 spliced ​​from the LED display modules 100 has good color consistency and good LED luminous effect.

[0133] This document uses specific examples to illustrate the principles and implementation methods of this application. The examples are merely for the purpose of helping to understand the core ideas of this application. The above are only preferred embodiments of this application. It should be noted that due to the limitations of written expression, and the existence of an infinite number of specific structures, those skilled in the art can make various improvements, modifications, or variations without departing from the principles of this application, and can also combine the above technical features in an appropriate manner. These improvements, modifications, variations, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.

Claims

1. An LED display module, characterized in that, include: A printed circuit board, wherein the printed circuit board has multiple chip mounting positions; Multiple LED light-emitting chips are respectively installed in the multiple chip mounting positions; The light-transmitting part is covered by the LED light-emitting chip; A black photoresist coating layer covers the printed circuit board. The black photoresist coating layer has a laser hole above the light-transmitting part, the laser hole exposes the light-transmitting part, and the black photoresist coating layer is sealed above the middle part, which is the part between adjacent LED light-emitting chips.

2. The LED display module according to claim 1, characterized in that, include: The LED display module includes multiple LED beads respectively installed in the multiple chip mounting positions. Each LED bead includes an LED light-emitting chip installed in the chip mounting position, a light-transmitting part on the LED light-emitting chip, and a bead bracket.

3. The LED display module according to claim 2, characterized in that, The all-black photoresist coating layer seals the portion between the edge of the laser hole and the junction position on the outer wall of the lamp bead bracket, where the junction position is the location where the outer wall meets the middle part.

4. The LED display module according to claim 3, characterized in that, The first thickness of the all-black photoresist coating layer applied to the portion between the edge and the junction of the laser aperture is less than the second thickness of the all-black photoresist coating layer applied to the middle portion.

5. The LED display module according to claim 3, characterized in that, There is a transition layer between adjacent LED beads. The transition layer covers the surface of the printed circuit board and the bracket connection portion. The bracket connection portion is located in the connection area between the LED bead bracket and the chip mounting position. The all-black photoresist coating layer is applied to the transition layer and the portion between the laser hole edge and the junction position.

6. The LED display module according to claim 5, characterized in that, A transparent protective layer is provided above the printed circuit board, which covers the LED beads and the transition layer. A black photoresist coating layer covers the transparent protective layer, and the laser hole exposes the light-transmitting part through the transparent protective layer.

7. The LED display module according to claim 2, characterized in that, A transparent protective layer is provided above the printed circuit board, which covers the LED beads and the middle part. A black photoresist coating layer covers the transparent protective layer, and the laser hole exposes the light-transmitting part through the transparent protective layer.

8. The LED display module according to claim 6 or 7, characterized in that, The laser aperture has a first boundary point and a second boundary point. The first boundary point is the intersection of a first line and the upper edge of the transparent protective layer. The second boundary point is the intersection of a second line and the upper edge of the transparent protective layer. The first line is an extension of the line between the center of the LED chip and the first upper edge of the inner wall of the lamp bead bracket. The second line is an extension of the line between the center of the LED chip and the second upper edge of the inner wall of the lamp bead bracket.

9. The LED display module according to claim 1, characterized in that, The light-transmitting part integrally covers the LED light-emitting chip and the middle part, and the all-black photoresist coating layer seals the area of ​​the light-transmitting part above the middle part.

10. An LED screen, characterized in that, The LED screen is composed of LED display modules as described in any one of claims 1 to 9.

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