Vacuum sputtering device for efficiently and uniformly depositing copper film

Abstract

The utility model discloses a vacuum sputtering device for efficiently and uniformly depositing a copper film, which relates to the technical field of film plating machines and comprises a master console, an electronic control device arranged in the master console, a film plating box arranged in the middle of the top surface of the master console, a box door hinged to the front end surface of the film plating box, a film plating mechanism arranged in the film plating box, and a connecting structure arranged between the film plating box and the box door. The coating mechanism comprises an adjusting assembly, an anode assembly, a cathode assembly and a magnetic control assembly; according to the utility model, through the matching of the adjusting assembly and the cathode assembly, the distance between the electrodes can be freely adjusted, so that the coating uniformity is ensured, the coating uniformity is improved, and the uniform coating capability is realized; through cooperation of the cathode assembly and the magnetic control assembly, the sputtering direction of the plasma can be restrained to the maximum degree, so that the coating efficiency is improved, and the efficient coating capacity is achieved; and finally, the problem of low coating quality caused by improper electrode distance or serious plasma dissipation during coating of the existing equipment is solved.

Description

A vacuum sputtering device for efficient and uniform copper film deposition Technical Field

[0001] This utility model relates to the field of coating machine technology, and in particular to a vacuum sputtering device for efficient and uniform deposition of copper film. Background Technology

[0002] Copper mold sputtering (usually referring to sputtering coating technology based on copper molds) is a process that uses physical vapor deposition (PVD) to form a thin film on the surface of a substrate, and is widely used, especially in precision electronics, optical devices, and decorative coatings. The main equipment used in this process is a sputtering coating machine, which is a device that uses physical vapor deposition (PVD) technology to sputter and deposit target materials onto the surface of a substrate in a vacuum environment to form a thin film. This technology is widely used in electronics, optics, semiconductors, solar energy, biomedicine, and decorative coatings, and has advantages such as uniform film formation, strong adhesion, and precise control of film thickness. Among existing sputtering coating machines, medium-voltage plasma coating machines are the most widely used, but existing equipment usually lacks an electrode spacing adjustment structure, which makes it impossible to adjust to new parameters in time when some parameters change, resulting in poor coating quality. The plasma generated by existing equipment is seriously dissipated, which reduces the utilization rate of the target material and reduces the coating efficiency. Therefore, this utility model improves the existing equipment to address the above problems. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a vacuum sputtering device for efficient and uniform copper film deposition.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a vacuum sputtering device for efficient and uniform deposition of copper film, comprising a main control console, an electronic control device inside the main control console, a coating box in the middle of the top surface of the main control console, a door hinged to the front end of the coating box, a coating mechanism inside the coating box, a connecting structure between the coating box and the door, and the coating mechanism comprising an adjustment component, an anode component, a cathode component, and a magnetocontrol component.

[0005] Preferably, the connection structure includes a box door with an observation window. A handle is provided on one side of the observation window. The box door and the coating box are connected by a louvered hinge. A locking bar is hinged to the other side of the coating box. A limit ball is fixed to the other end of the locking bar. A C-shaped bayonet is fixed to the limit ball on the same side of the box door.

[0006] Preferably, the adjustment assembly includes a coating chamber, with an air extraction port connected to the center of the bottom surface of the coating chamber. The air extraction port is connected to a vacuum pump inside the main control panel. Air intake nozzles are installed and fixed on both sides of the air extraction port. The lower ends of the air intake nozzles are connected to an air supply device via hoses. An electric actuator is vertically installed and fixed on the top surface of the coating chamber. A connecting plate is fixed to the telescopic end of the electric actuator. Adjustment rods are vertically fixed to both sides of the bottom surface of the connecting plate. The lower ends of the adjustment rods penetrate the coating chamber and are fixed to the cathode assembly.

[0007] Preferably, the anode assembly includes a connecting column, the upper end of which is fixed to the top surface inside the coating tank, and the lower end of which is fixed to an anode disk. Pressure plates are evenly abutted around the bottom surface of the anode disk, and the pressure plates are fixed to the lower end of the anode disk by fastening bolts. A groove is formed in the middle of the bottom surface of the anode disk, and an anode plate is provided in the groove. A substrate is abutted against the bottom surface of the anode plate, and the substrate is fixed on the anode disk by the pressure plates.

[0008] Preferably, the cathode assembly includes a cathode disk, with adjusting rods fixed to both sides of the top surface of the cathode disk, and a groove is formed in the middle of the top surface of the cathode disk, with a cathode plate disposed in the groove, and the top surface of the cathode plate abutting against the target plate.

[0009] Preferably, the magnetic control assembly includes an N-pole magnet, which is installed and fixed on the outer periphery of the bottom surface of the cathode disk. An S-pole magnet is installed and fixed in the middle of the bottom surface of the cathode disk. A sealing plate is fixed to the bottom surfaces of the N-pole magnet and the S-pole magnet. A water pipe is symmetrically connected to the middle of the bottom surface of the sealing plate, and the other end of the water pipe is connected to a water supply device.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: By cooperating with the adjustment component and the cathode component, this utility model facilitates the free adjustment of the distance between the electrodes, thereby ensuring the uniformity of the coating and improving the coating uniformity, thus achieving the ability to uniformly coat the film; furthermore, by cooperating with the cathode component and the magnetron component, it is easy to constrain the sputtering direction of the plasma to the greatest extent, thereby improving the coating efficiency and achieving the ability to efficiently coat the film; finally, it solves the problem of low coating quality caused by unsuitable electrode distance or severe plasma dissipation during coating in existing equipment. Attached Figure Description

[0011] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0012] Figure 1 is a three-dimensional schematic diagram of the overall appearance of the device proposed in this utility model;

[0013] Figure 2 is a three-dimensional schematic diagram of the coating mechanism proposed in this utility model.

[0014] Figure 3 is a three-dimensional schematic diagram of the adjustment component structure proposed in this utility model;

[0015] Figure 4 is a three-dimensional schematic diagram of the anode assembly structure proposed in this utility model;

[0016] Figure 5 is a partial cross-sectional view of the cathode assembly structure proposed in this utility model;

[0017] Figure 6 is a partial cross-sectional view of the magnetic control component structure proposed in this utility model.

[0018] The following are the components listed in the diagram: 1. Main control panel; 2. Coating chamber; 3. Chamber door; 4. Observation window; 5. Handle; 6. Louver; 7. Locking bar; 8. Air extraction port; 9. Air intake nozzle; 10. Electric actuator; 11. Connecting plate; 12. Adjusting rod; 13. Connecting column; 14. Anode plate; 15. Pressure plate; 16. Fastening bolt; 17. Anode plate; 18. Substrate; 19. Cathode plate; 20. Cathode plate; 21. Target plate; 22. N pole magnet; 23. S pole magnet; 24. Sealing plate; 25. Water pipe. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Example: Referring to Figures 1-6, a vacuum sputtering device for efficient and uniform copper film deposition according to this utility model includes a main control console 1, which contains electronic control equipment. A coating chamber 2 is located in the center of the top surface of the main control console 1. A door 3 is hinged to the front end of the coating chamber 2. A coating mechanism is located inside the coating chamber 2. A connecting structure is provided between the coating chamber 2 and the door 3. The coating mechanism includes an adjustment component, an anode component, a cathode component, and a magnetron control component. The modular device facilitates device maintenance and upgrades, improving practicality. The connecting structure includes the door 3, which has an observation window 4. A handle 5 is located on one side of the observation window 4. The door 3 and the coating chamber 2 are hinged together by louvers 6. A locking rod 7 is hinged to the other side of the coating chamber 2. A limit ball is fixed to the other end of the locking rod 7. A C-shaped buckle is fixed to the same side of the door 3 in conjunction with the limit ball. The cooperation between the locking rod 7 and the C-shaped buckle facilitates quick opening or sealing of the container, improving ease of use.

[0021] In this invention, to solve the problem of low coating quality caused by unsuitable electrode distance or severe plasma dissipation during coating in existing equipment, the following technical solution is adopted: In use, the adjustment assembly includes a coating box 2. An air extraction port 8 is connected to the center of the bottom surface of the coating box 2. The air extraction port 8 is connected to a vacuum pump inside the main control panel 1. Air inlet nozzles 9 are fixedly installed on both sides of the air extraction port 8. The lower end of the air inlet nozzles 9 is connected to an air supply device via a flexible hose. An electric actuator 10 is vertically fixedly installed on the top surface of the coating box 2. A connecting plate 1 is fixedly connected to the telescopic end of the electric actuator 10. 1. Adjusting rods 12 are vertically fixed to both sides of the bottom surface of the connecting plate 11. The lower end of the adjusting rods 12 passes through the coating box 2 and is fixed to the cathode assembly. Air is drawn out through the air extraction port 8 to form a vacuum environment, and at the same time, the ionization medium is sprayed in through the air inlet nozzle 9 to facilitate plasma generation and improve practicality. The anode assembly includes a connecting column 13. The upper end of the connecting column 13 is fixed to the top surface inside the coating box 2, and the lower end of the connecting column 13 is fixed to an anode disk 14. Pressure plates 15 are evenly abutted around the bottom surface of the anode disk 14. The pressure plates 15 are fixed to the anode disk 14 by fastening bolts 16. At the end, an anode disk 14 has a groove in the center of its bottom surface, in which an anode plate 17 is placed. The bottom surface of the anode plate 17 abuts against a substrate 18. The substrate 18 is fixed to the anode disk 14 by a pressure plate 15. The cooperation of the pressure plate 15 and the fastening bolt 16 facilitates quick clamping of the substrate 18, improving practicality. The cathode assembly includes a cathode disk 19, with adjusting rods 12 fixed to both sides of the top surface of the cathode disk 19. A groove is formed in the center of the top surface of the cathode disk 19, in which a cathode plate 20 is placed. The top surface of the cathode plate 20 abuts against a target plate 21. The magnetron assembly includes an N-pole magnet 2. 2. The N-pole magnet 22 is installed and fixed on the outer periphery of the bottom surface of the cathode disk 19. The S-pole magnet 23 is installed and fixed in the middle of the bottom surface of the cathode disk 19. The bottom surfaces of the N-pole magnet 22 and the S-pole magnet 23 are fixedly connected to a sealing plate 24. A water pipe 25 is symmetrically connected in the middle of the bottom surface of the sealing plate 24. The other end of the water pipe 25 is connected to a water supply device. Through the cooperation of the cathode assembly and the magnetron assembly, the sputtering direction of the plasma is constrained to the greatest extent, thereby improving the coating efficiency. At the same time, the water pipe 25 supplies water to the magnetron assembly for internal circulation, cools the magnetron assembly, and maintains the magnetic force, thus improving its practicality.

[0022] Working Principle: In the use of this utility model, firstly, power is supplied to all electrical equipment, then the main control console 1 is started. The main control console 1 controls the extension and retraction of the electric push rod 10 to adjust the distance between the anode plate 17 and the cathode plate 20. Then, the substrate 18 is clamped by the pressure plate 15, and the target plate 21 is placed on the cathode plate 20. Then, the box door 3 is closed, and the locking rod 7 is rotated to lock it in the C-shaped bayonet to maintain the airtight environment inside the coating box 2. Then, air is drawn out through the air extraction port 8 to form a vacuum environment. Then, the preset inert gas is injected through the air intake nozzle 9. After all preparations are completed, the preset inert gas is introduced into the anode plate 17 and the cathode plate 20 through the main control console 1. The current is set to cause back-current breakdown between the anode plate 17 and the cathode plate 20, thereby bombarding the target plate 21 and forming plasma. The plasma itself is charged and can be constrained by the S-pole magnet 23 to achieve efficient film deposition. The plasma is deposited on the bottom surface of the substrate 18 and forms a thin film. During the consumption of the target plate 21, the parameters change. The main control console 1 autonomously controls the electrode spacing through the electric push rod 10 to adapt to the parameter changes and ensure uniform film deposition. During this period, the cathode plate 20 is continuously at high temperature, which will affect the ionization effect and the magnetic force of the magnet. At this time, cooling water is circulated through the water pipe 25 to lower the temperature of the cathode plate 20 and the magnet until the final film deposition is completed.

[0023] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A vacuum sputtering apparatus for efficient and uniform deposition of copper films, comprising a main control console (1), characterized in that: The main control console (1) is equipped with electronic control equipment. A coating box (2) is provided in the middle of the top surface of the main control console (1). A door (3) is hinged to the front end of the coating box (2). A coating mechanism is provided inside the coating box (2). A connection structure is provided between the coating box (2) and the door (3). The coating mechanism includes an adjustment component, an anode component, a cathode component, and a magnetic control component.

2. The vacuum sputtering apparatus for efficient and uniform copper film deposition according to claim 1, characterized in that: The connection structure includes a door (3), an observation window (4) on the door (3), a handle (5) on one side of the observation window (4), the door (3) and the coating box (2) are hinged together by louvers (6), a locking bar (7) is hinged to the other side of the coating box (2), a limit ball is fixed to the other end of the locking bar (7), and a C-shaped bayonet is fixed to the same side of the door (3) in cooperation with the limit ball.

3. The vacuum sputtering apparatus for efficient and uniform copper film deposition according to claim 2, characterized in that: The adjustment assembly includes a coating box (2), with an air extraction port (8) connected to the middle of the bottom surface of the coating box (2). The air extraction port (8) is connected to the vacuum pump inside the main control panel (1). Air intake nozzles (9) are installed and fixed on both sides of the air extraction port (8). The lower end of the air intake nozzles (9) is connected to the air supply equipment through a hose. An electric push rod (10) is vertically installed and fixed on the top surface of the coating box (2). A connecting plate (11) is fixed to the telescopic end of the electric push rod (10). An adjustment rod (12) is vertically fixed to both sides of the bottom surface of the connecting plate (11). The lower end of the adjustment rod (12) passes through the coating box (2) and is fixed to the cathode assembly.

4. The vacuum sputtering apparatus for efficient and uniform copper film deposition according to claim 3, characterized in that: The anode assembly includes a connecting column (13), the upper end of which is fixed to the top surface inside the coating box (2), and the lower end of which is fixed to an anode disk (14). Pressure plates (15) are evenly abutted around the bottom surface of the anode disk (14). The pressure plates (15) are fixed to the lower end of the anode disk (14) by fastening bolts (16). A groove is provided in the middle of the bottom surface of the anode disk (14), and an anode plate (17) is provided in the groove. A substrate (18) is abutted on the bottom surface of the anode plate (17). The substrate (18) is installed and fixed on the anode disk (14) by the pressure plates (15).

5. The vacuum sputtering apparatus for efficient and uniform copper film deposition according to claim 4, characterized in that: The cathode assembly includes a cathode disk (19), with adjusting rods (12) fixed to both sides of the top surface of the cathode disk (19). A groove is provided in the middle of the top surface of the cathode disk (19), and a cathode plate (20) is provided in the groove. The top surface of the cathode plate (20) abuts against the target plate (21).

6. The vacuum sputtering apparatus for efficient and uniform copper film deposition according to claim 5, characterized in that: The magnetic control assembly includes an N-pole magnet (22), which is fixed on the outer periphery of the bottom surface of the cathode disk (19). An S-pole magnet (23) is fixed on the middle of the bottom surface of the cathode disk (19). A sealing plate (24) is fixed to the bottom surfaces of the N-pole magnet (22) and the S-pole magnet (23). A water pipe (25) is symmetrically connected to the middle of the bottom surface of the sealing plate (24). The other end of the water pipe (25) is connected to a water supply device.

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