Preheating device for high-temperature probe card test

Abstract

The utility model discloses a preheating device for high-temperature probe card testing, which relates to the technical field of probe card testing and comprises a probe card testing preheating box, a temperature master controller is fixedly mounted on the outer wall of one side of the probe card testing preheating box, and a connecting arm is fixedly connected to the inner wall of one side, close to the temperature master controller, of the probe card testing preheating box. And the top end of one side of the connecting arm is fixedly connected with a heating disc. A probe card body is directly installed in an installation buckle groove in the bottom end of a first installation disc, heating resistance wires at multiple positions on a heating disc are directly controlled through a temperature master controller to achieve heating operation, and the position height of a top end adjusting threaded rod in a communication column can be directly controlled through rotation of a rotation adjusting disc; therefore, the position height of the first mounting disc at the top end in the probe card test preheating box can be controlled, the distance operation between the first mounting disc and the heating disc is further controlled, and the uniform heating effect can be achieved through the heating resistance wires at multiple positions.

Description

Technical Field

[0001] This utility model relates to the field of probe card testing technology, and in particular to a preheating device for high-temperature probe card testing. Background Technology

[0002] Probe cards are responsible for the electrical connection between the test system and the integrated circuit chip. During functional testing of the wafer, the probes on the probe card contact the wafer's pads, outputting test signals to the wafer or receiving signals from the wafer. Probe cards are crucial for both early-stage test development and later-stage mass production testing yield assurance, making them a critical process in wafer manufacturing that significantly impacts manufacturing costs. Considering cost, quality control, and process optimization, high-temperature testing needs to be introduced during the probe testing stage. High-temperature testing requires preheating the probe card using a probe machine for approximately 30 minutes to reach ideal conditions before calibrating the probe card's pin positions and height. Therefore, we designed a preheating device for high-temperature probe card testing. Utility Model Content

[0003] The purpose of this invention is to provide a preheating device for high-temperature probe card testing.

[0004] To solve the above technical problems, this utility model provides the following technical solution: a preheating device for high-temperature probe card testing, comprising a probe card testing preheating box, a temperature controller fixedly installed on one outer wall of the probe card testing preheating box, a connecting arm fixedly connected to the inner wall of the probe card testing preheating box near the temperature controller, a heating plate fixedly connected to the top of one side of the connecting arm, a heating resistance wire fixedly installed on one side surface of the heating plate, a first lifting frame fixedly installed on the top surface of one side of the probe card testing preheating box, a top adjusting threaded rod movably installed inside one side of the first lifting frame, a rotating adjusting disc fixedly connected to the top of one side of the top adjusting threaded rod, a first mounting disc rotatably connected to the bottom of one side of the top adjusting threaded rod, and a mounting buckle groove formed on one side surface of the first mounting disc, the probe card body being detachably installed inside the mounting buckle groove.

[0005] Preferably, a connecting column is fixedly installed on the top side of the probe card test preheating box, an electrical connection line is fixedly connected between the heating plate and the temperature controller, a supporting bottom column is fixedly connected to the bottom side of the probe card test preheating box, and a supporting foot plate is fixedly installed on the bottom side of the supporting bottom column.

[0006] Preferably, there are several heating resistance wires, which are evenly distributed on the top and bottom surfaces of the heating plate. The first mounting plate is located directly above the heating plate. The top adjusting threaded rod and the first lifting frame are connected by a threaded connection. The top adjusting threaded rod passes through the interior of the connecting column and through the top of the probe card test preheating box. The top adjusting threaded rod and the connecting column are connected by a threaded connection. The mounting buckle slot and the probe card body are connected by a movable snap-fit. The probe card body is located directly above the heating plate.

[0007] Preferably, a second lifting frame is fixedly installed on one bottom side of the probe card test preheating box, and a bottom adjusting threaded rod is internally threaded on one side of the second lifting frame. A second mounting plate is rotatably connected to the top surface of one side of the bottom adjusting threaded rod.

[0008] Preferably, the second mounting plate is located inside the probe card test preheating box, directly below the heating plate, the bottom adjusting threaded rod passes through the bottom surface of the probe card test preheating box, the connection between the bottom adjusting threaded rod and the probe card test preheating box is a threaded connection, and the probe card body is movably engaged on the top surface of the second mounting plate.

[0009] Preferably, a connecting shaft is rotatably connected to the edge of the top surface of one side of the probe card test preheating chamber, a sealed chamber door is fixedly connected to one side of the connecting shaft, a door handle is fixedly installed on one side of the front of the sealed chamber door, an observation window is fixedly installed on one side surface of the sealed chamber door, a data display is fixedly installed on the top front of the temperature controller, and a control setting panel is provided at the bottom front of the temperature controller.

[0010] Compared with related technologies, the preheating device for high-temperature probe card testing provided by this utility model has the following advantages:

[0011] 1. This utility model provides a preheating device for high-temperature probe card testing. The probe card body is directly installed into the mounting clip groove at the bottom of the first mounting plate. A temperature controller directly controls multiple heating resistance wires on the heating plate to achieve heating. Rotating the adjustment disc directly controls the position and height of the top adjusting threaded rod inside the connecting column, thereby controlling the position and height of the first mounting plate at the top of the probe card testing preheating chamber, and thus controlling the distance between the first mounting plate and the heating plate. The multiple heating resistance wires ensure uniform heating, and adjusting the distance ensures preheating efficiency, avoiding excessive distance that could directly affect the diversity of tests, as preheating distance directly impacts preheating efficiency.

[0012] 2. This utility model provides a preheating device for high-temperature probe card testing. By setting the second mounting plate to have the same structure as the first mounting plate, the probe card body can be directly installed inside the second mounting plate for simultaneous preheating from both sides, further improving the efficiency of the device. At the same time, the bottom adjusting threaded rod can independently control the position and height of the second mounting plate and adjust the distance between the second mounting plate and the heating plate as needed. An observation window is set on the sealed door to observe the preheating situation inside the device. The use of the heating plate can be directly controlled through the control setting panel on the temperature controller, improving the ease of use. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2 This is a schematic diagram of the overall front side view of the device of this utility model;

[0015] Figure 3 This is a schematic diagram of the overall top view of the device of this utility model;

[0016] Figure 4 This is a side view structural diagram of the probe card test preheating box of this utility model.

[0017] The diagram shows the following components: 1. Probe card test preheating chamber; 2. Temperature controller; 3. Connecting arm; 4. Heating plate; 5. Heating resistance wire; 6. First lifting frame; 7. Top adjusting threaded rod; 8. Rotating adjustment plate; 9. First mounting plate; 10. Mounting clip slot; 11. Probe card body; 12. Connecting column; 13. Power connection line; 14. Support base column; 15. Support foot plate; 16. Second lifting frame; 17. Bottom adjusting threaded rod; 18. Second mounting plate; 19. Connecting movable shaft; 20. Sealed chamber door; 21. Chamber door handle; 22. Observation window; 23. Data display; 24. Control setting panel. Detailed Implementation

[0018] Example 1:

[0019] Please see Figure 1-4This utility model provides a technical solution: a preheating device for high-temperature probe card testing, including a probe card testing preheating box 1. A temperature controller 2 is fixedly installed on one outer wall of the probe card testing preheating box 1. A connecting arm 3 is fixedly connected to the inner wall of the probe card testing preheating box 1 near the temperature controller 2. A heating plate 4 is fixedly connected to the top of one side of the connecting arm 3. A heating resistance wire 5 is fixedly installed on one side of the surface of the heating plate 4. A first lifting frame 6 is fixedly installed on the top surface of one side of the probe card testing preheating box 1. A top adjusting threaded rod 7 is movably installed inside one side of the first lifting frame 6. A rotating adjusting plate 8 is fixedly connected to the top of one side of the top adjusting threaded rod 7. A first mounting plate 9 is rotatably connected to the bottom of one side of the top adjusting threaded rod 7. A mounting buckle groove 10 is opened on one side of the surface of the first mounting plate 9. A probe card body 11 is detachably installed inside the mounting buckle groove 10. A connecting column 12 is fixedly installed on the top side of the test preheating box 1. A power connection line 13 is fixedly connected between the heating plate 4 and the temperature controller 2. A support base column 14 is fixedly connected to the bottom side of the probe card test preheating box 1. A support foot plate 15 is fixedly installed on the bottom side of the support base column 14. There are several heating resistance wires 5, which are evenly distributed on the top and bottom surfaces of the heating plate 4. The first mounting plate 9 is located directly above the heating plate 4. The top adjusting threaded rod 7 and the first lifting frame 6 are connected by a threaded connection. The top adjusting threaded rod 7 passes through the interior of the connecting column 12 and the top of the probe card test preheating box 1. The top adjusting threaded rod 7 and the connecting column 12 are connected by a threaded connection. The mounting buckle groove 10 and the probe card body 11 are connected by a movable snap-fit. The probe card body 11 is located directly above the heating plate 4.

[0020] In the implementation scheme, the probe card body 11 is directly installed into the mounting clip slot 10 at the bottom of the first mounting plate 9. The heating operation is achieved by directly controlling the heating resistance wires 5 at multiple positions on the heating plate 4 through the temperature controller 2. The position height of the top adjusting threaded rod 7 inside the connecting column 12 can be directly controlled by rotating the adjusting plate 8, thereby controlling the position height of the top of the first mounting plate 9 inside the probe card test preheating box 1, and thus controlling the distance between the first mounting plate 9 and the heating plate 4. The heating resistance wires 5 at multiple positions can achieve a uniform heating effect. Adjusting the distance can ensure the preheating efficiency and avoid the distance being too far, which directly affects the diversity of tests, because the preheating distance directly affects the preheating efficiency.

[0021] Example 2:

[0022] Please see Figure 1-4This utility model provides a technical solution: a preheating device for high-temperature probe card testing, comprising a second lifting frame 16 fixedly installed at the bottom of one side of a probe card testing preheating chamber 1; a bottom adjusting threaded rod 17 threadedly connected to the inside of one side of the second lifting frame 16; a second mounting plate 18 rotatably connected to the top surface of one side of the bottom adjusting threaded rod 17; the second mounting plate 18 being located inside the probe card testing preheating chamber 1, directly below the heating plate 4; and the bottom adjusting threaded rod 17 penetrating the bottom surface of the probe card testing preheating chamber 1. The connection between the probe card test preheating box 1 and the probe card is a threaded connection. The probe card body 11 is movably attached to the top surface of the second mounting plate 18. The edge of the top surface of one side of the probe card test preheating box 1 is rotatably connected to the connecting movable shaft 19. A sealed box door 20 is fixedly connected to one side of the connecting movable shaft 19. A box door handle 21 is fixedly installed on one side of the front of the sealed box door 20. An observation window 22 is fixedly installed on one side of the sealed box door 20. A data display 23 is fixedly installed on the top front of the temperature main controller 2. A control setting panel 24 is provided at the bottom front of the temperature main controller 2.

[0023] In the implementation scheme, by setting the second mounting plate 18 and the first mounting plate 9 to have the same structure, the probe card body 11 can be directly installed inside the second mounting plate 18 to achieve the effect of simultaneous preheating on both sides, further improving the efficiency of the device. At the same time, the bottom adjusting threaded rod 17 can independently control the position and height of the second mounting plate 18 and adjust the distance between the second mounting plate 18 and the heating plate 4, and make appropriate adjustments according to actual needs. By setting an observation window 22 on the sealed box door 20, the preheating situation inside the device can be observed. The use of the heating plate 4 can be directly controlled through the control setting panel 24 on the temperature main controller 2, improving the ease of use.

[0024] Working principle:

[0025] The probe card body 11 is directly installed into the mounting clip slot 10 at the bottom of the first mounting plate 9. The heating operation is achieved by directly controlling the heating resistance wires 5 at multiple positions on the heating plate 4 through the temperature controller 2. The position height of the top adjusting threaded rod 7 inside the connecting column 12 can be directly controlled by rotating the adjusting plate 8, thereby controlling the position height of the top of the first mounting plate 9 inside the probe card test preheating box 1, and thus controlling the distance between the first mounting plate 9 and the heating plate 4. The heating resistance wires 5 at multiple positions can achieve a uniform heating effect. Adjusting the distance can ensure the preheating efficiency and avoid the distance being too far, which directly affects the diversity of the test, because the preheating distance can directly affect the preheating efficiency.

[0026] By setting the second mounting plate 18 to have the same structure as the first mounting plate 9, the probe card body 11 can be directly installed inside the second mounting plate 18 to achieve the effect of simultaneous preheating on both sides, further improving the efficiency of the device. At the same time, the bottom adjusting threaded rod 17 can independently control the position and height of the second mounting plate 18 and adjust the distance between the second mounting plate 18 and the heating plate 4 as needed. By setting an observation window 22 on the sealed box door 20, the preheating situation inside the device can be observed. The use of the heating plate 4 can be directly controlled through the control setting panel 24 on the temperature main controller 2, improving the ease of use.

Claims

1. A preheating device for high-temperature probe card testing, comprising a probe card testing preheating chamber (1), wherein a temperature controller (2) is fixedly installed on one outer wall of the probe card testing preheating chamber (1), characterized in that: The probe card test preheating box (1) has a connecting arm (3) fixedly connected to the inner wall of one side near the temperature controller (2). A heating plate (4) is fixedly connected to the top of one side of the connecting arm (3). A heating resistance wire (5) is fixedly installed on one side of the heating plate (4). A first lifting frame (6) is fixedly installed on the top surface of one side of the probe card test preheating box (1). A top adjusting threaded rod (7) is movably installed inside one side of the first lifting frame (6). A rotating adjusting plate (8) is fixedly connected to the top of one side of the top adjusting threaded rod (7). A first mounting plate (9) is rotatably connected to the bottom of one side of the top adjusting threaded rod (7). A mounting buckle groove (10) is opened on one side surface of the first mounting plate (9). The probe card body (11) is detachably installed inside the mounting buckle groove (10).

2. The preheating device for high-temperature probe card testing according to claim 1, characterized in that, A connecting column (12) is fixedly installed on the top of one side of the probe card test preheating box (1). A power connection line (13) is fixedly connected between the heating plate (4) and the temperature controller (2). A support base column (14) is fixedly connected to the bottom of one side of the probe card test preheating box (1). A support foot plate (15) is fixedly installed on the bottom of one side of the support base column (14).

3. The preheating device for high-temperature probe card testing according to claim 2, characterized in that, The number of heating resistance wires (5) is several, and the several heating resistance wires (5) are evenly distributed on the top and bottom surfaces of the heating plate (4). The first mounting plate (9) is located directly above the heating plate (4). The connection between the top adjusting threaded rod (7) and the first lifting frame (6) is a threaded connection. The top adjusting threaded rod (7) passes through the interior of the connecting column (12). The top adjusting threaded rod (7) passes through the top of the probe card test preheating box (1). The connection between the top adjusting threaded rod (7) and the connecting column (12) is a threaded connection. The connection between the mounting buckle groove (10) and the probe card body (11) is a movable snap-fit. The probe card body (11) is located directly above the heating plate (4).

4. The preheating device for high-temperature probe card testing according to claim 1, characterized in that, A second lifting frame (16) is fixedly installed on one side of the bottom of the probe card test preheating box (1). A bottom adjusting thread rod (17) is threadedly connected to one side of the second lifting frame (16). A second mounting plate (18) is rotatably connected to the top surface of one side of the bottom adjusting thread rod (17).

5. The preheating device for high-temperature probe card testing according to claim 4, characterized in that, The second mounting plate (18) is located inside the probe card test preheating box (1). The second mounting plate (18) is located directly below the heating plate (4). The bottom adjusting threaded rod (17) passes through the bottom surface of the probe card test preheating box (1). The connection between the bottom adjusting threaded rod (17) and the probe card test preheating box (1) is a threaded connection. The probe card body (11) is movably engaged on the top surface of the second mounting plate (18).

6. The preheating device for high-temperature probe card testing according to claim 1, characterized in that, The probe card test preheating box (1) has a connecting movable shaft (19) rotatably connected to the edge of the top surface of one side. A sealed box door (20) is fixedly connected to one side of the connecting movable shaft (19). A box door handle (21) is fixedly installed on one side of the front of the sealed box door (20). An observation window (22) is fixedly installed on one side of the sealed box door (20). A data display (23) is fixedly installed on the top front of the temperature controller (2). A control setting panel (24) is provided at the bottom front of the temperature controller (2).

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