Wafer calibration device

Abstract

The utility model discloses a wafer calibration device. The wafer calibration device comprises a supporting main body, the bearing platform is arranged on the supporting main body and is used for supporting the wafer; the detection part is arranged on the supporting main body and is provided with a vertical detection space, and the detection space at least covers part of the edge of the wafer; the first driving device is arranged on the supporting body and used for driving the bearing table to move in the first direction; the second driving device is arranged on the first driving device and used for driving the bearing table to move in the second direction, and the second direction and the first direction are mutually orthogonal; the rotating device comprises a rotating shaft, one end of the rotating shaft penetrates through the bearing table, the other end of the rotating shaft is connected with the second driving device, and the rotating device is used for driving the bearing table to rotate around the axis in the horizontal direction; and the first driving device, the second driving device and the rotating device are matched to drive the wafer to move so as to calibrate the wafer. According to the utility model, at least the problems of tedious wafer calibration process and low wafer calibration efficiency in the prior art can be solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, and in particular to a wafer calibration device. Background Technology

[0002] In semiconductor manufacturing, V-shaped notches or flat-edge designs are used on the outer edge of the wafer to identify the position and orientation of the chips. Because the orientation and position of the wafer vary within the wafer carrier, the wafer's orientation and alignment with its center must be confirmed after it is removed from the carrier before subsequent wafer fabrication processes can proceed.

[0003] In existing technologies, wafers need to be moved from the wafer cassette to a fixed, precise location. Due to positioning deviations within the cassette, these deviations persist during transport to the working position, causing the wafer to deviate from the center of the reaction chamber. This can lead to significant differences between the process reaction and the expected results, and may even result in serious problems such as wafer breakage or damage. Existing calibration equipment involves cumbersome calibration processes and low calibration efficiency.

[0004] Therefore, it is necessary to provide a new wafer calibration device to solve the above-mentioned problems existing in the prior art. Utility Model Content

[0005] The purpose of this invention is to provide a wafer calibration device for calibrating wafers, which can at least solve the problems of cumbersome wafer calibration process and low wafer calibration efficiency in the prior art.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] A wafer calibration device includes a support body;

[0008] A support platform, located on the support body, is used to support the wafer;

[0009] The detection element is disposed on the support body and has a vertical detection space, the detection space at least covering a portion of the edge of the wafer;

[0010] A first driving device is provided on the supporting body for driving the support platform to move along a first direction;

[0011] A second driving device is disposed on the first driving device and is used to drive the support platform to move along a second direction, the second direction being orthogonal to the first direction;

[0012] A rotating device includes a rotating shaft, one end of which passes through the support platform and the other end is connected to the second driving device. The rotating device is used to drive the support platform to rotate horizontally around its own axis.

[0013] The first driving device, the second driving device, and the rotating device cooperate to drive the wafer to move in order to calibrate the wafer.

[0014] By adopting the above technical solution, during the wafer calibration process, the wafer is placed on the carrier stage and in the detection space. The detection device performs calibration detection on the wafer. During the detection process, the carrier stage is driven to move along the first direction by the first driving device and along the second direction by the second driving device, thereby driving the wafer to move in the horizontal direction. The wafer is rotated by the rotating device to adjust the angle of the wafer. The first driving device, the second driving device and the detection device work together to move the wafer position, thereby simplifying the wafer calibration process.

[0015] Optionally, the bottom of the support platform is provided with a connecting hole; the rotating shaft includes:

[0016] The hollow frustum portion passes through the connecting hole so that the rotating shaft can be connected to the support platform;

[0017] The turntable is located at the bottom of the hollow frustum and abuts against the support platform;

[0018] The hollow shaft has one end located at the bottom of the turntable and the other end used to connect to the second drive device.

[0019] Optionally, the support platform has a first adsorption channel inside and an adsorption cavity communicating with the first adsorption channel at the top.

[0020] A second adsorption channel is provided on the rotating shaft. The second adsorption channel passes through the hollow frustum portion, the turntable portion, and the hollow shaft portion and then communicates with the first adsorption channel.

[0021] A pneumatic rotary joint is dynamically sealed and connected to the other end of the second adsorption channel. The pneumatic rotary joint is used to connect to a vacuum generator, which is used to evacuate the adsorption chamber to fix the wafer.

[0022] Optionally, the first driving device includes:

[0023] The fastener is fixedly installed on the supporting body;

[0024] The first drive rod is rotatably mounted on the fixed member;

[0025] A driving component has a driving hole for the first driving rod to pass through, so that when the first driving rod rotates, it drives the driving component to move along the first direction.

[0026] The second driving device is disposed on the driving member so that when the driving member moves, it drives the second driving device, the rotating device and the support platform to move synchronously along the first direction.

[0027] Optionally, the fixing member is provided with a first guide rail, and the driving member is slidably disposed on the first guide rail;

[0028] The first drive rod is threadedly connected to the drive member so that the drive member moves when the first drive rod rotates.

[0029] Optionally, the second driving device includes:

[0030] The second drive rod is rotatably disposed on the drive member, and the second drive rod is perpendicular to the first drive rod.

[0031] A movable component has a movable hole for the second drive rod to pass through, and the movable component is used to fix the rotating device so that when the second drive rod rotates, it drives the movable component and the rotating device to move along the second direction; so as to drive the support platform to move synchronously along the second direction.

[0032] Optionally, the fixing member is provided with a second guide rail, and the moving member is slidably disposed on the second guide rail;

[0033] The second drive rod is threadedly connected to the moving part so that the moving part is driven to move when the second drive rod rotates.

[0034] Optionally, the detection element includes a transmitter and a receiver, which are vertically spaced apart from each other on the support body to form the detection space.

[0035] Optionally, the support body is hollow, and a calibration channel is provided on the top wall;

[0036] The detection element is located on the top wall of the supporting body;

[0037] The first driving device, the second driving device, and the rotating device are all located inside the support body;

[0038] One end of the support platform is located inside the support body and connected by the rotating device; the other end extends through the calibration channel to the outside of the support body to support the wafer.

[0039] Optionally, the adsorption cavity is provided with a support component, the end face of which is flush with the support stage to support the wafer. Attached Figure Description

[0040] Figure 1This is a schematic diagram of the main structure of a wafer calibration device according to an embodiment of the present invention;

[0041] Figure 2 This is a schematic diagram of the internal structure of a wafer calibration device according to an embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of the structure of a second driving device of the wafer calibration apparatus according to an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of the structure of a rotating device in a wafer calibration apparatus according to an embodiment of the present invention;

[0044] Figure 5 This is a cross-sectional view of the connection between a rotating device and a support stage in a wafer calibration apparatus according to an embodiment of the present invention.

[0045] Figure 6 This is a schematic diagram of the structure of a rotating shaft in a wafer calibration device according to an embodiment of the present invention.

[0046] Figure label:

[0047] 100. Support body; 110. Calibration channel; 200. Support platform; 210. Connecting hole; 211. Annular groove; 212. Sealing groove; 220. First adsorption channel; 230. Suction cup part; 231. Adsorption chamber; 240. Air inlet; 300. Detection element; 310. Emitter; 320. Receiver; 330. Cover; 400. First driving device; 410. Fixing element; 411. First guide rail; 412. First driver; 413. First support; 420. First driving rod; 430. Driving element; 431. Driving hole; 432. 433. Second guide rail; 434. Second support; 435. Extension seat; 500. Second drive device; 510. Second drive rod; 520. Moving part; 521. Moving hole; 600. Rotating device; 610. Rotating shaft; 611. Hollow frustum part; 612. Turntable part; 613. Hollow shaft part; 622. Second adsorption channel; 620. Drive component; 700. Pneumatic rotary joint; 800. Support assembly; 810. Support block; 910. Lead screw nut; 920. Output pulley; 930. Transmission pulley; 940. Slider. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0049] The following is in conjunction with the appendix Figure 1-6 The specific embodiments of this utility model will be further described in detail below.

[0050] An embodiment of this utility model provides a wafer calibration device, which is installed on the front-end module of a semiconductor device and is used to calibrate the positional relationship of the wafer relative to the front-end module. The reference... Figure 1 and Figure 2 The wafer calibration device includes a support body 100;

[0051] A support platform 200 is located on the support body 100 to support the wafer;

[0052] The detection element 300 is disposed on the support body 100 and has a vertical detection space, the detection space at least covering a portion of the edge of the wafer;

[0053] The first driving device 400 is located on the support body 100 and is used to drive the support platform 200 to move along the first direction.

[0054] The second driving device 500 is disposed on the first driving device 400 and is used to drive the support platform 200 to move along a second direction, the second direction being orthogonal to the first direction.

[0055] The rotating device 600 includes a rotating shaft 610, one end of which passes through the support platform 200 and the other end is connected to the second driving device 500. The rotating device 600 is used to drive the support platform 200 to rotate horizontally around its own axis.

[0056] The first driving device 400, the second driving device 500, and the rotating device 600 work together to drive the wafer movement in order to calibrate the wafer.

[0057] The support body 100 is used to support the components for calibrating the wafer. The carrier stage 200 is used to support the wafer. After the wafer is fixed on the carrier stage 200, part of the wafer extends into the detection space formed by the detection element 300. The carrier stage 200 is driven to move by the first driving device 400, the second driving device 500 and the rotating device 600, thereby driving the wafer to move, adjusting the position of the wafer, and realizing the calibration of the wafer.

[0058] In some embodiments, the first driving device 400, the second driving device 500, and the rotating device 600 are disposed on the end face of the support body 100; the detection element 300 is disposed on the end face of the support body 100 to facilitate wafer calibration.

[0059] In some embodiments, the first driving device 400, the second driving device 500, and the rotating device 600 are disposed inside the support body 100; the detection element 300 is disposed on the end face of the support body 100 to facilitate wafer calibration.

[0060] In this embodiment, refer to Figure 2 For example, the first driving device 400, the second driving device 500 and the rotating device 600 are located inside the support body 100; specifically, the support body 100 is hollow and has a calibration channel 110 on its top wall.

[0061] The testing component 300 is located on the top wall of the supporting body 100;

[0062] The first driving device 400, the second driving device 500, and the rotating device 600 are all located inside the supporting body 100;

[0063] One end of the support stage 200 is located inside the support body 100 and is connected by a rotating device 600; the other end extends through the calibration channel 110 to the outside of the support body 100 to support the wafer.

[0064] In some embodiments, the calibration channel 110 can be circular, rectangular or other shapes, primarily to avoid interfering with the movement of the support stage 200.

[0065] In some embodiments, the first driving device 400 is disposed on the support body 100 and placed inside the support body 100. The first driving device 400 is fixed inside the support body 100 and to the bottom of the support body 100. At the same time, the first driving device 400 is connected to the support platform 200 to drive the support platform 200 to move in a first direction. In some specific embodiments, the first driving device 400 is indirectly connected to the support platform 200, and the specific connection method will be described later.

[0066] In some embodiments, the second driving device 500 is disposed on the first driving device 400 and connected to the support platform 200, so that when the first driving device 400 is activated, it can drive the second driving device 500 and the support platform 200 to move together along a first direction; when the second driving device 500 is activated, it can drive the support platform 200 to move along a second direction. In some specific embodiments, the second driving device 500 and the support platform 200 are indirectly connected, and the specific connection method will be described later.

[0067] In some specific embodiments, the first direction and the second direction are perpendicular to each other. For example, the first direction faces the X-axis and the second direction faces the Y-axis; or the first direction faces the Y-axis and the second direction faces the X-axis. In this embodiment, the first direction facing the X-axis and the second direction facing the Y-axis are used as examples. In some more specific embodiments, the perpendicular direction faces the Z-axis.

[0068] In some embodiments, the rotating device 600 is disposed on the second driving device 500 and connected to the support platform 200, so that when the first driving device 400 is activated, it drives the second driving device 500, the rotating device 600, and the support platform 200 to move synchronously in a first direction; when the second driving device 500 is activated, it drives the rotating device 600 and the support platform 200 to move synchronously in a second direction; when the rotating device 600 is activated, it drives the support platform 200 to rotate; thereby adjusting the position of the wafer on the support platform 200 to calibrate the wafer. In some specific embodiments, the rotating device 600 is directly connected to the support platform 200, and the specific connection method is described later.

[0069] In some embodiments, the first drive device 400 and the second drive device 500 may both be electric cylinders, and the rotating device 600 may be a motor, so as to enable the support platform 200 to move and rotate along the X and Y axes in the horizontal direction.

[0070] In some embodiments, to make the calibration process more accurate, reference is made. Figure 2 and Figure 3 The first drive unit 400 includes:

[0071] Fastener 410 is fixedly installed on the supporting body 100;

[0072] The first drive rod 420 is rotatably mounted on the fixed member 410;

[0073] The driving member 430 has a driving hole 431, which is used to pass through the first driving rod 420, so that when the first driving rod 420 rotates, it drives the driving member 430 to move along the first direction.

[0074] The second drive device 500 is provided on the drive member 430 so that when the drive member 430 moves, it drives the second drive device 500, the rotating device 600 and the support platform 200 to move synchronously in the first direction.

[0075] Specifically, the fastener 410 is plate-shaped and fixed to the bottom wall inside the support body 100. The fastening method can be adhesive, bolt, or snap-fit, etc., which is not limited here. The main purpose is that the fastener 410 can be fixed to the support body 100 and there will be no relative displacement between the fastener 410 and the support body 100.

[0076] The axis of the first drive rod 420 is parallel to the first direction and is rotatably mounted on the fixing member 410. In some embodiments, to facilitate the installation of the first drive rod 420, two first supports 413 are provided at intervals along the first direction on the fixing member 410. The first supports 413 are provided with first rotating holes for the first drive rod 420 to pass through. After the first drive rod 420 passes through the first rotating holes, it can rotate around its own axis in the first rotating holes, and there is a gap between the first drive rod 420 and the fixing member 410.

[0077] The fixing member 410 is also provided with a driving member 430. The driving member 430 can be block-shaped, plate-shaped, or other shapes, without limitation, as long as the driving member 430 can move on the fixing member 410. The driving member 430 has a driving hole 431 that passes through the driving member 430 along a first direction. The first driving rod 420 passes through the driving hole 431, so that when the first driving rod 420 rotates, it can drive the driving member 430 to move along the first direction. At the same time, the second driving device 500 is provided on the driving member 430, so that when the first driving rod 420 rotates, it can drive the second driving device 500, the rotating device 600, and the support platform 200 to move simultaneously along the first direction.

[0078] In order to facilitate the first drive rod 420 to drive the drive member 430 to move in the first direction when it rotates, the fixed member 410 is provided with a first guide rail 411, and the drive member 430 is slidably disposed on the first guide rail 411.

[0079] The first drive rod 420 is threadedly connected to the drive member 430 so that the drive member 430 moves when the first drive rod 420 rotates.

[0080] In some embodiments, the first drive rod 420 is directly threaded to the inner wall of the drive hole 431, and the drive member 430 is restricted by the fixing member 410 and cannot rotate, so that when the first drive rod 420 rotates, it can drive the drive member 430 to move in the first direction.

[0081] In some embodiments, a lead screw nut 910 is fixedly installed in the drive hole 431, a first drive rod 420 passes through the lead screw nut 910, and the outer wall of the first drive rod 420 is threadedly connected to the lead screw nut 910. The drive member 430 is restricted by the fixed member 410 and cannot rotate, so that when the first drive rod 420 rotates, it can drive the drive member 430 to move in the first direction.

[0082] In some specific embodiments, the first drive rod 420 is a lead screw.

[0083] In some embodiments, the driving member 430 is restricted by the fixing member 410 in a manner that allows the sidewall of the driving member 430 to directly contact the end face of the fixing member 410, thereby preventing the driving member 430 from rotating; alternatively, a first guide rail 411 is provided on the fixing member 410, and the driving member 430 is slidably disposed on the first guide rail 411, thereby preventing the driving member 430 from rotating. In this embodiment, the method of providing a first guide rail 411 on the fixing member 410 is adopted.

[0084] Specifically, the first guide rail 411 is fixedly mounted on the end face of the fixing member 410 and extends along the first direction. Its fixing method can be snap-fit, adhesive or bolt fixing, etc., which is not limited here, as long as there is no relative movement between the first guide rail 411 and the fixing member 410.

[0085] In some embodiments, to facilitate the movement of the fixing member 410, a slider 940 is provided on the first guide rail 411. The slider 940 can slide along the first guide rail 411 in a first direction. Simultaneously, the slider 940 is fixedly disposed at the bottom of the fixing member 410 to facilitate the sliding of the fixing member 410 along the first guide rail 411 in the first direction. In some embodiments, to reduce the friction between the slider 940 and the first guide rail 411 and prevent the fixing member 410 from jamming during movement, grease can be applied between the guide rail and the slider 940. Alternatively, rolling friction can be used between the slider 940 and the first guide rail 411. This is prior art and will not be elaborated upon here.

[0086] To facilitate the rotation of the first drive rod 420, a first driver 412 is also provided on the fixing member 410. In some embodiments, the first driver 412 is a motor.

[0087] In some embodiments, the first driver 412 is fixedly mounted on the fixed plate and connected to the first drive rod 420, that is, the motor shaft is keyed to the end of the first drive rod 420 so as to drive the first drive rod 420 to rotate.

[0088] In some embodiments, the first driver 412 is fixedly mounted on a fixed plate and indirectly connected to the first drive rod 420. Specifically, the end of the first drive rod 420 extends through the first rotating hole to the outside of the first support 413, and a transmission pulley 930 is fixed at this end. The fixing method can be snap-fit ​​or bolt fixing, etc., which is not limited here, as long as the transmission pulley 930 and the first drive rod 420 can rotate synchronously. An output pulley 920 is keyed to the shaft of the first driver 412. The output pulley 920 is connected to the transmission drive pulley in a pulley drive manner, so that the first driver 412 can drive the first drive rod 420 to rotate when it is started.

[0089] The second drive unit 500 includes:

[0090] The second drive rod 510 is rotatably mounted on the drive member 430, and the second drive rod 510 is perpendicular to the first drive rod 420.

[0091] The movable component 520 has a movable hole 521 for the second drive rod 510 to pass through. The movable component 520 is used to fix the rotating device 600 so that when the second drive rod 510 rotates, it drives the movable component 520 and the rotating device 600 to move in the second direction, so as to drive the support platform 200 to move synchronously in the second direction.

[0092] In order to facilitate the movement of the rotating device 600 and the support platform 200 in the second direction, refer to Figure 2 and Figure 3 A second drive rod 510 is provided on the driving member 430, and the axis of the second drive rod 510 is parallel to the second direction, so that the second drive rod 510 is perpendicular to the first drive rod 420. In some embodiments, in order to facilitate the installation of the second drive rod 510, two second supports 433 are provided on the moving member 520 at intervals along the second direction. The second supports 433 are provided with second rotating holes for the second drive rod 510 to pass through. After the second drive rod 510 passes through the second rotating holes, it can rotate around its own axis in the second rotating holes, and there is a gap between the second drive rod 510 and the driving member 430.

[0093] The movable component 520 has a movable hole 521 through which it passes in the second direction. Simultaneously, a second drive rod 510 passes through the movable hole 521, enabling the movable component 520 to move in the second direction when it rotates. A rotating device 600 is also located on the movable component 520, allowing the second drive rod 510 to simultaneously drive both the rotating device 600 and the support platform 200 to move in the second direction when the second drive rod 510 rotates.

[0094] In order to facilitate the movement of the moving part 520 in the second direction when the second drive rod 510 rotates, the fixed part 410 is provided with a second guide rail 432, and the moving part 520 is slidably disposed on the second guide rail 432.

[0095] The second drive rod 510 is threadedly connected to the movable part 520 so that the movable part 520 is driven to move when the second drive rod 510 rotates.

[0096] In some embodiments, the second drive rod 510 is directly threaded to the inner wall of the moving hole 521, and the moving member 520 is restricted by the driving member 430 and cannot rotate, so that when the second drive rod 510 rotates, it can drive the moving member 520 to move in the second direction.

[0097] In some embodiments, a lead screw nut 910 is fixedly disposed in the movable hole 521, a second drive rod 510 passes through the lead screw nut 910, and the outer wall of the second drive rod 510 is threadedly connected to the lead screw nut 910. The movable member 520 is restricted by the fixed member 410 and cannot rotate, so that when the second drive rod 510 rotates, it can drive the movable member 520 to move in the second direction.

[0098] In some specific embodiments, the second drive rod 510 is a lead screw.

[0099] In some embodiments, the movable member 520 is restricted by the driving member 430 in a manner that the sidewall of the movable member 520 contacts the end face of the driving member 430, preventing the movable member 520 from rotating; alternatively, a second guide rail 432 is provided on the driving member 430, and the movable member 520 is slidably disposed on the second guide rail 432, thus preventing the movable member 520 from rotating. In this embodiment, the method of providing a second guide rail 432 on the driving member 430 is selected.

[0100] Specifically, the second guide rail 432 is fixedly disposed on the end face of the driving member 430 along the second direction. The fixing method can be adhesive, snap-fit ​​or bolt fixing, etc., without limitation, as long as there is no relative movement between the second guide rail 432 and the driving member 430.

[0101] Furthermore, a slider 940 is provided on the second guide rail 432. The slider 940 can slide along the second direction on the second guide rail 432. At the same time, the slider 940 is fixedly disposed at the bottom of the moving member 520 so as to drive the moving member 520 to slide along the second direction on the second guide rail 432. In some embodiments, in order to reduce the friction between the slider 940 and the second guide rail 432 and prevent the fixing member 410 from getting stuck during movement, grease can be applied between the second guide rail 432 and the slider 940, or rolling friction can be made between the slider 940 and the second guide rail 432. This is prior art and will not be described in detail here.

[0102] To facilitate the rotation of the second drive rod 510, a second driver 434 is provided on the moving part 520. In some embodiments, the second driver 434 is a motor.

[0103] In some embodiments, the second driver 434 is fixedly mounted on the drive member 430 and connected to the second drive rod 510, that is, the motor shaft is keyed to the end of the second drive rod 510 so as to drive the second drive rod 510 to rotate.

[0104] In some embodiments, the second driver 434 is disposed on the drive member 430 and indirectly connected to the second drive rod 510. Specifically, the end of the second drive rod 510 extends to the outside of the second support 433 after passing through the second rotating hole, and a transmission pulley 930 is fixed at the end. The fixing method can be snap-fit ​​or bolt fixing, etc., which is not limited here, as long as the transmission pulley 930 and the second drive rod 510 can rotate synchronously. An output pulley 920 is keyed to the shaft of the second driver 434. The output pulley 920 is connected to the transmission drive pulley in a pulley drive manner so that the second driver 434 can drive the second drive rod 510 to rotate when it is started.

[0105] In some specific embodiments, an extension seat 435 is fixedly provided on the side wall of the driving member 430 to increase the length of the driving member 430 in the second direction. In some embodiments, the second driving member 620 may be fixedly provided to the driving member 430 or fixedly provided to the extension seat 435.

[0106] In some more specific embodiments, the second driver 434 is fixedly mounted on the extension base 435, and the shaft of the second driver 434 passes through the extension base 435 and is fixed to the output pulley 920; the second driver 434 is mounted on the extension base 435 so that the second driver 434 does not interfere with the movement of the moving member 520. When the second driver 434 is activated, the second drive rod 510 rotates, driving the moving member 520 to move in the second direction, thereby driving the rotating device 600 and the support platform 200 to move in the second direction.

[0107] The bottom of the support platform 200 is provided with a connecting hole 210 for the rotating shaft 610 to pass through, so that the rotating shaft 610 can be connected to the support platform 200; the connection method between the rotating shaft 610 and the support platform 200 will be described in detail later.

[0108] The rotating device 600 also includes a drive unit 620, which is connected to the rotating shaft 610 and is used to drive the rotating shaft 610 and the support stage 200 to rotate, so as to rotate the wafer.

[0109] Specifically, refer to Figure 3 and Figure 4The driving component 620 is disposed on the top wall of the movable component 520 and connected to the rotating shaft 610, so that the rotating shaft 610 is connected to the second driving device 500. In some embodiments, the driving component 620 is a motor. The driving component 620 and the rotating shaft 610 can be directly connected, such as by a key; or they can be indirectly connected, such as by a gear transmission. There are no restrictions here, as long as the driving component 620 can drive the rotating shaft 610 to rotate.

[0110] In some embodiments, to facilitate fixing the wafer on the support stage 200, refer to Figure 4 and Figure 5 The support platform 200 has a first adsorption channel 220 inside and an adsorption cavity 231 communicating with the first adsorption channel 220 at the top.

[0111] A second adsorption channel 622 is provided on the rotating shaft 610, and one end of the second adsorption channel 622 is connected to the first adsorption channel 220.

[0112] The pneumatic rotary joint 700 is dynamically sealed and connected to the other end of the second adsorption channel 622. The pneumatic rotary joint 700 is used to connect to a vacuum generator, which is used to evacuate the adsorption chamber 231 to fix the wafer.

[0113] Specifically, refer to Figure 4 and Figure 5 The support stage 200 includes a suction cup portion 230 and an air inlet portion 240. The top of the suction cup portion 230 is used to fix the wafer, and the bottom of the suction cup portion 230 is fixed to the air inlet portion 240. The fixing method between the suction cup portion 230 and the air inlet portion 240 can be bonding, bolt fixing or integral molding, etc., without limitation, as long as there is no relative movement between the two. The top of the suction cup portion 230 has an adsorption cavity 231. When the wafer is placed in the suction cup portion 230, the adsorption cavity 231 is evacuated to fix the wafer to the top of the suction cup portion 230 by vacuum adsorption, that is, to the top of the support stage 200.

[0114] In some embodiments, refer to Figure 5 In order to facilitate the evacuation of the adsorption chamber 231, a first adsorption channel 220 is opened inside the air inlet 240, wherein the first adsorption channel 220 is connected to the adsorption chamber 231. In the working state, the adsorption chamber 231 is evacuated by evacuating the first adsorption channel 220.

[0115] More specifically, the bottom of the air inlet 240 has a connecting hole 210, which communicates with the first adsorption channel 220 and the two are coaxially arranged; the rotating shaft 610 passes through the connecting hole 210; at the same time, a second adsorption channel 622 is formed inside the rotating shaft 610, which passes through the rotating shaft 610 along its axial direction. The top of the second adsorption channel 622 communicates with the first adsorption channel 220, and the bottom of the second adsorption channel 622 is provided with a pneumatic rotary joint 700 through a dynamic seal. The dynamic seal method is existing technology and will not be described in detail here. The pneumatic rotary joint 700 is used to connect to an external vacuum generator. When the vacuum generator is started, it evacuates the adsorption chamber 231 through the second adsorption channel 622 and the first adsorption channel 220, thereby fixing the wafer position.

[0116] In some embodiments, an annular groove 211 is provided on the inner wall of the connecting hole 210, and a sealing ring is provided in the annular groove 211. The sealing ring contacts the outer wall of the rotating shaft 610, thereby ensuring the sealing between the rotating shaft 610 and the air intake 240.

[0117] In some embodiments, the sealing ring is made of rubber or silicone.

[0118] In some embodiments, the support platform 200 has a connection hole 210 at its bottom; the rotating shaft 610 includes:

[0119] The hollow frustum portion 611 passes through the connecting hole 210 so that the rotating shaft 610 is connected to the support platform 200;

[0120] The turntable 612 is located at the bottom of the hollow frustum 611 and abuts against the support platform 200.

[0121] The hollow shaft portion 613 has one end located at the bottom of the turntable portion 612 and the other end used to connect to the second drive device 500.

[0122] Specifically, refer to Figure 5 and Figure 6The rotating shaft 610 includes a hollow frustum portion 611, a turntable portion 612, and a hollow shaft portion 613, which are fixedly arranged sequentially from top to bottom. The fixing method can be bonding, integral molding, etc., and is not limited here, as long as there is no relative rotation between the three components and good sealing at their connection points. The hollow frustum portion 611 is used to pass through the connecting hole 210 to connect the rotating shaft 610 and the support platform 200. The diameter of the turntable portion 612 is larger than the diameter of the support platform 200, and when the rotating shaft 610 is connected to the support platform 200, the bottom of the support platform 200 contacts the turntable portion 612, allowing the turntable portion 612 to provide support. The hollow shaft portion 613 is used to connect to the pneumatic rotary joint 700. The second adsorption channel 622 passes through the hollow frustum portion 611, the turntable portion 612, and the hollow shaft portion 613 to facilitate the adsorption process.

[0123] In some embodiments, refer to Figure 4 The adsorption cavity 231 is provided with a support assembly 800, the end face of which is flush with the support stage 200 to support the wafer. In some specific embodiments, the support assembly 800 includes multiple support blocks 810, which are arranged in a fan shape from the center of the adsorption cavity 231 toward the edge on the bottom wall of the adsorption cavity 231. Multiple support assemblies 800 are provided, and they are evenly distributed circumferentially around the bottom of the adsorption cavity 231 to support the wafer and improve the problem of potential damage to the wafer during vacuum adsorption.

[0124] To facilitate wafer inspection, the inspection unit 300 includes a transmitter 310 and a receiver 320, which are vertically spaced on the support body 100 to form an inspection space.

[0125] Specifically, a cover 330 is provided on the top wall of the support body 100. The cover 330 is arranged in a "C" shape and has a first part and a second part in the vertical direction. The transmitter 310 and the receiver 320 are respectively disposed in the first part and the second part, so that the transmitter 310 and the receiver 320 can be distributed on the upper and lower end faces of the wafer.

[0126] The principle of an embodiment of a wafer calibration device in this application is as follows: the wafer is fixed on the support stage 200 and placed in the detection space. The transmitter 310 and receiver 320 detect the wafer. During this process, the position of the wafer in the first direction is adjusted by the first driving device 400, the position of the wafer in the second direction is adjusted by the second driving device 500, and the angle of the wafer is adjusted by the rotating device 600 to complete the wafer calibration.

[0127] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A wafer calibration device, characterized in that, Including the supporting structure (100); A support platform (200) is disposed on the support body (100) to support the wafer; A detection element (300) is disposed on the support body (100) and has a vertical detection space, the detection space at least covering a portion of the edge of the wafer; A first driving device (400) is disposed on the support body (100) and is used to drive the support platform (200) to move along a first direction; A second driving device (500) is disposed on the first driving device (400) for driving the support platform (200) to move along a second direction, the second direction being orthogonal to the first direction; The rotating device (600) includes a rotating shaft (610), one end of which passes through the support platform (200) and the other end is connected to the second driving device (500). The rotating device (600) is used to drive the support platform (200) to rotate around its own axis in the horizontal direction. The first driving device (400), the second driving device (500), and the rotating device (600) cooperate to drive the wafer to move in order to calibrate the wafer.

2. The wafer calibration apparatus according to claim 1, characterized in that, The support platform (200) has a connecting hole (210) at its bottom; the rotating shaft (610) includes: A hollow frustum portion (611) is provided through the connecting hole (210) so that the rotating shaft (610) is connected to the support platform (200); The turntable (612) is located at the bottom of the hollow frustum (611) and abuts against the support platform (200); The hollow shaft part (613) is located at one end at the bottom of the turntable part (612) and at the other end for connection with the second drive device (500).

3. The wafer calibration apparatus according to claim 2, characterized in that, The support platform (200) has a first adsorption channel (220) inside and an adsorption cavity (231) communicating with the first adsorption channel (220) at the top; The rotating shaft (610) is provided with a second adsorption channel (622), which passes through the hollow frustum portion (611), the turntable portion (612) and the hollow shaft portion (613) and communicates with the first adsorption channel (220); A pneumatic rotary joint (700) is dynamically sealed to the bottom of the hollow shaft (613). The pneumatic rotary joint (700) is used to connect a vacuum generator, which is used to evacuate the adsorption chamber (231) to fix the wafer.

4. The wafer calibration apparatus according to claim 1, characterized in that, The first drive device (400) includes: A fastener (410) is fixedly disposed on the supporting body (100); The first drive rod (420) is rotatably mounted on the fixed member (410); The driving member (430) has a driving hole (431), which is used to pass through the first driving rod (420) so that when the first driving rod (420) rotates, it drives the driving member (430) to move along the first direction; The second driving device (500) is disposed on the driving member (430) so that when the driving member (430) moves, it drives the second driving device (500), the rotating device (600) and the support platform (200) to move synchronously along the first direction.

5. The wafer calibration apparatus according to claim 4, characterized in that, The fixing member (410) is provided with a first guide rail (411), and the driving member (430) is slidably disposed on the first guide rail (411); The first drive rod (420) is threadedly connected to the drive member (430) so that the drive member (430) moves when the first drive rod (420) rotates.

6. The wafer calibration apparatus according to claim 4, characterized in that, The second drive unit (500) includes: The second drive rod (510) is rotatably disposed on the drive member (430), and the second drive rod (510) is perpendicular to the first drive rod (420); The movable component (520) has a movable hole (521) for the second drive rod (510) to pass through. The movable component (520) is used to fix the rotating device (600) so that when the second drive rod (510) rotates, it drives the movable component (520) and the rotating device (600) to move along the second direction; so as to drive the support platform (200) to move synchronously along the second direction.

7. The wafer calibration apparatus according to claim 6, characterized in that, The driving member (430) is provided with a second guide rail (432), and the moving member (520) is slidably disposed on the second guide rail (432); The second drive rod (510) is threadedly connected to the moving part (520) so that the moving part (520) is driven to move when the second drive rod (510) rotates.

8. The wafer calibration apparatus according to claim 1, characterized in that, The detection element (300) includes a transmitter (310) and a receiver (320), which are vertically spaced apart on the support body (100) to form the detection space.

9. The wafer calibration apparatus according to claim 1, characterized in that, The support body (100) is hollow, and a calibration channel (110) is provided on the top wall; The detection element (300) is disposed on the top wall of the support body (100); The first driving device (400), the second driving device (500), and the rotating device (600) are all located inside the support body (100); One end of the support platform (200) is located inside the support body (100) and connected by the rotating device (600); the other end extends through the calibration channel (110) to the outside of the support body (100) to support the wafer.

10. The wafer calibration apparatus according to claim 3, characterized in that, The adsorption cavity (231) is provided with a support component (800), the end face of which is flush with the support stage (200) to support the wafer.

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