Crystal heat sink device and laser comprising same

Abstract

The utility model provides a crystal heat sink device and a laser comprising the same, which comprise a base with a through hole for fixing a crystal, a heating element fixed near the through hole and used for heating the base, and a temperature sensing element fixed near the through hole and used for measuring the temperature of the base, the heating element is in direct contact with the base, the heating element is powered on and starts heating when the temperature of the base measured by the temperature sensing element is lower than a set temperature, and the non-inductive resistor is powered off and stops heating when the temperature of the base measured by the temperature sensing element is higher than the set temperature, so that the crystal is controlled to work in a stable temperature range, and stable and reliable work of the crystal is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of laser crystal technology, and in particular to a crystal heat sink device and a laser including the same. Background Technology

[0002] Traditionally, laser crystals are mounted using heat sinks with toleranced grooves and the crystal surface is wrapped with a thermally conductive material such as indium foil. However, laser crystals have specific temperature requirements for operation. Utility Model Content

[0003] Therefore, it is necessary to address the shortcomings of the existing technology by providing a temperature-controllable crystal heat sink device and a laser including the same.

[0004] This utility model provides a crystal heat sink device, which includes a base having a through hole for fixing the crystal, a heating element fixed near the through hole for heating the base, and a temperature sensing element fixed near the through hole for measuring the temperature of the base.

[0005] Furthermore, the base has a receiving hole near the through hole, and the temperature sensing element is located in the receiving hole.

[0006] Furthermore, the base has a groove near the through hole, and the heating element is fixed in the groove.

[0007] Furthermore, the crystal heat sink device also includes a pressure block located near the through hole and an elastic pressing member for pressing against the pressure block to fix the crystal in the through hole.

[0008] Furthermore, the through hole is square, and two adjacent edges of the through hole are provided with stepped grooves communicating with the through hole, and the other two adjacent edges form two heat-conducting surfaces. The crystal heat sink device includes two pressure blocks respectively fixed in the two stepped grooves.

[0009] Furthermore, the base has two threaded holes extending into the corresponding stepped grooves, and the elastic pressing members of the crystal heat sink device are two ball screws that pass through the two threaded holes and abut against the corresponding pressing blocks.

[0010] Furthermore, both pressure blocks have heat-conducting surfaces.

[0011] Furthermore, the through hole is located at the center of the base, and the receiving hole, the groove, and the two threaded holes are distributed on the outer periphery of the base.

[0012] This utility model also provides a laser, which includes an adjustment frame, a crystal heat sink device fixed to the adjustment frame, a crystal fixed to the crystal heat sink device, a heat insulation pad located between the adjustment frame and the crystal heat sink device, and a control circuit, wherein the crystal heat sink device is the crystal heat sink device as described above.

[0013] Furthermore, the crystal is a nonlinear frequency doubling crystal.

[0014] The crystal heat sink device and laser included therein provided by this utility model utilize the temperature sensing element to measure that when the temperature of the base is lower than the set temperature, the heating element is energized and heating begins. When the temperature sensing element measures that the temperature of the base is higher than the set temperature, the non-inductive resistor is de-energized and heating stops, thereby controlling the crystal to operate within a stable temperature error range and ensuring the reliability of the laser. Attached Figure Description

[0015] Figure 1 This is an exploded view of the crystal heat sink device of this utility model.

[0016] Figure 2 This is another exploded view of the crystal heat sink device of this utility model.

[0017] Figure 3 This is a schematic diagram of the crystal heat sink device of this utility model.

[0018] Figure 4 This is a schematic diagram of the laser of this utility model. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0020] In the description of this utility model, the terms "horizontal," "vertical," "upper," "lower," "left," "right," "inner," "outer," "between," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Unless otherwise expressly specified and limited, the terms "connection," "linked," "fixed," "installed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a magnetic connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0021] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, "more" means one or more, unless otherwise explicitly specified.

[0022] Finally, it should be noted that, unless otherwise specified, the embodiments of this utility model and the various features thereof can be combined with each other, all of which are within the protection scope of this utility model.

[0023] Please refer to Figures 1 to 3 This is a schematic diagram of the crystal heat sink device 100 of this utility model. The crystal heat sink device 100 includes a base 10, a pressure block 20, an elastic pressing member 30, a heating element 40, and a temperature sensing element 50. The base 10 has a through hole 11 at its center for placing a crystal 102, and a stepped groove 12 communicating with the through hole 11 at its edge. A fixing hole 13 is formed at the bottom of the stepped groove 12. A heat-conducting surface 14 is formed at the edge of the through hole 11 to contact the crystal 102. A through hole 15 extending to the stepped groove 12 is formed on the side of the base 10. A receiving hole 16 and a groove 17 are formed on the side of the base 10.

[0024] The pressure block 20 has a heat-conducting surface 21 that contacts the crystal 102 and an oblong hole 22 corresponding to the fixing hole 13 of the base 10. The pressure block 20 is placed in the stepped groove 12 and fixed in the fixing hole 13 by a fastener 60 passing through the oblong hole 21, thus making the pressure block 20 contact the stepped groove 12. The elastic pressing member 30 passes through the through hole 15, with its end extending out of the through hole 15 and abutting against the pressure block 20. Since the extending direction of the oblong hole 21 of the pressure block 20 is the same as the abutting direction of the elastic pressing member 30, the pressure block 20 can be pushed to move in the stepped groove 12, allowing the heat-conducting surface 21 of the pressure block 20 to enter the through hole 11 of the base 10 and contact the crystal 102. The heating element 40 is fixed in the groove 17. The groove 17 not only accommodates the heating element 40, bringing it closer to the crystal 102, but also reduces the weight of the base 10. The temperature sensing element 50 is placed in the receiving hole 16 of the base 10, closer to the crystal 102, ensuring no air disturbance causes temperature monitoring errors. Therefore, the crystal heat sink device 100 has a simple structure, allowing the crystal 102 to be easily and conveniently installed in the through hole 11. The heat-conducting surfaces 14 and 21 of the crystal 102 in contact with the base 10 and the pressure block 20, as well as the contact surface of the pressure block 20 within the stepped groove 12, are all large, giving the crystal heat sink device 100 high thermal conductivity. Furthermore, the heat-conducting surface 14 of the base 10 is in rigid contact with the crystal 102, while the heat-conducting surface 21 of the pressure block 20 is in flexible / elastic contact with the crystal 102. When the temperature of the crystal 102 rises and deforms, the elastic pressing member 30 elastically contracts, and the crystal 102 can push the pressure block 20 to move in the stepped groove 12 in the opposite direction, without causing damage due to the inability of the crystal 102 to release its own stress. When the temperature of the crystal 102 drops, the elastic pressing member 30 elastically recovers, and pushes the pressure block 20 to move in the stepped groove 12 and make close contact with the crystal 102. This not only reliably fixes the crystal 102, but also makes the crystal heat sink device 100 safer.

[0025] In this embodiment, the base 10 is square, with a through hole 15 on each of its two adjacent sides and a groove 17 on each of its other two adjacent sides. The two through holes 15 and the two grooves 17 are located on the four sides of the base 10. Each through hole 15 is a threaded hole. The through hole 11 of the base 10 is also square to accommodate the square crystal 102. Stepped grooves 12 communicating with the through hole 11 are formed on two adjacent edges of the through hole 11, and two heat-conducting surfaces 14 are formed on the other two adjacent edges. The pressure blocks 20 are two square pressure blocks 20 respectively fixed in the two stepped grooves 12, so that when the two pressure blocks 20 are fixed in the two stepped grooves 12 by fasteners such as screws, they are in mutual surface contact. The elastic pressing members 30 are two ball screws. Generally, ball screws consist of a housing, a spring, and steel balls. In this way, two ball screws are respectively screwed into the threaded holes on two adjacent sides of the base 10, with their steel balls extending out of the threaded holes and abutting against the edges of the corresponding pressure blocks 20. This causes the pressure blocks 20 to move towards the center of the through hole 11, allowing the heat-conducting surfaces 21 of the two pressure blocks 20, the two heat-conducting surfaces 14 of the base 10, and the surface of the crystal 102 to come into close contact. The two pressure blocks 20 also make surface contact with the two stepped grooves 12, increasing the heat-conducting area by increasing the contact area. Thus, driven by the corresponding ball screws, the two pressure blocks 20 can force the crystal 102 into close contact with the two heat-conducting surfaces 14 of the base 10 from two mutually perpendicular directions, thereby easily and conveniently fixing the crystal 102. Furthermore, the ball screws have a certain degree of elasticity, which can eliminate the stress caused by temperature changes in the crystal 102 and prevent damage to the crystal 102. Meanwhile, the heat-conducting surfaces 21 of the two pressure blocks 20 and the two heat-conducting surfaces 14 of the base 10 are in close contact with the crystal 102, and the two pressure blocks 20 are in surface contact with the two stepped grooves 12 respectively. This combination of flexible / elastic and rigid contact improves the safety and reliability of the crystal heat sink device 100. The heating element 40 consists of two heating resistors, specifically non-inductive resistors and thick-film resistors, which are placed in the two grooves 17 and fixed with screws to directly contact the base 100. The temperature sensing element 50 is a temperature control probe placed in the receiving hole 16 of the base 100, specifically a teardrop-shaped NTC thermistor probe. This not only increases the contact area between the crystal 102 and the crystal heat sink device 100 due to the increased heat-conducting surface, but also allows for rapid heat conduction to the crystal 102 when the heating resistors are energized, achieving uniform heating. In other words, the crystal heat sink device 100 is not only simple in structure but also safe and reliable.

[0026] Please refer to Figure 4This is a schematic diagram of the laser 200 of this utility model. The laser 200 includes a base plate 201, an adjustment frame 202 fixed to the base plate 201, a crystal heat sink device 100 fixed to the adjustment frame 202, a crystal 102 fixed to the crystal heat sink device 100, a heat insulation pad 204 located between the adjustment frame 202 and the crystal heat sink device 100, and a control circuit 206. The adjustment frame 202 can adjust the angle of the crystal heat sink device 100 to achieve angular phase matching of the crystal 102, while the heat insulation pad 204 avoids heat diffusion of the crystal 102, making the temperature of the crystal 102 more stable. In this embodiment, the crystal 102 can be a nonlinear frequency conversion crystal.

[0027] Initially, the temperature of the crystal 102 is measured by the temperature sensing element 50 (such as a temperature probe) controlled by the control circuit 206 (actually obtained indirectly by measuring the temperature of the base 10, the same below) and fed back. If the temperature of the crystal 102 is lower than the set temperature, the heating element 40 (such as a non-inductive resistor) is energized by the control circuit 206 to start heating. When the temperature sensing element 50 (such as a temperature probe) measures that the temperature of the crystal 102 is higher than the set temperature, the control circuit 206 controls the heating element 40 (such as a non-inductive resistor) to be de-energized, stopping heating. Since the set temperature of the crystal 102 is higher than room temperature, when the temperature of the crystal 102 drops due to natural heat dissipation or other reasons and is detected by the temperature sensing element 50 (such as a temperature probe), the heating element 40 (such as a non-inductive resistor) can be energized again to heat it, and so on. As shown above, the crystal heat sink device 100 has four surfaces (the heat-conducting surfaces 21 of the two pressure blocks 20 and the two heat-conducting surfaces 14 of the base 10) in close contact with the crystal 102, and the two pressure blocks 20 are in surface contact with the two stepped grooves 12 respectively. This results in a large heat-conducting area, allowing for rapid heat transfer to the crystal 102 and ensuring uniform heating. Thus, the crystal heat sink device 100 exhibits high uniform thermal conductivity. In a practical example where the crystal 102 is a frequency doubling crystal, its temperature variation can be controlled within a small error range (e.g., ±0.2℃), ensuring the stability of the frequency doubling efficiency.

[0028] Although the crystal 102 in this embodiment is a nonlinear frequency conversion crystal, the crystal heat sink device 100 is not only applicable to nonlinear frequency conversion lasers, but also to other types of lasers with similar crystal temperature control requirements. That is, the crystal heat sink device 100 adopts a simpler and more effective solution, can be used as a standalone product, and can be directly integrated into other lasers, making it highly versatile.

[0029] The laser 200 of this invention utilizes heating elements 40 such as heating resistors, temperature sensing elements 50 such as temperature control probes, and control circuits 206 to form a temperature control system for the crystal 102, thereby achieving a small temperature control error for the crystal 102. Furthermore, the use of elastic compression components 30 such as ball screws not only ensures reliable fixation of the crystal 102, but also, due to its flexible / elastic contact, eliminates stress caused by temperature changes in the crystal 102. This prevents damage to the crystal 102 caused by compression due to rigid contact when the crystal 102 deforms with temperature changes, achieving high safety and reliability of the crystal heat sink device 100 with a simple structure.

[0030] The above-described embodiments only illustrate limited implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications, improvements, or deteriorations without departing from the concept of this utility model, such as changing the square through-hole 11 to a circular through-hole 11, or the square pressure block 20 to a non-square pressure block. These modifications only reduce the contact area and may affect the heat conduction effect; these are all within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the claims.

Claims

1. A crystal heat sink device, characterized in that, The crystal heat sink device includes a base having a through hole for fixing the crystal, a heating element fixed near the through hole for heating the base, and a temperature sensing element fixed near the through hole for measuring the temperature of the base.

2. The crystal heat sink device as described in claim 1, characterized in that: The base has a receiving hole near the through hole, and the temperature sensing element is located in the receiving hole.

3. The crystal heat sink device as described in claim 2, characterized in that: The base has a groove near the through hole, and the heating element is fixed in the groove.

4. The crystal heat sink device as described in claim 3, characterized in that: The crystal heat sink device further includes a pressure block located near the through hole and an elastic pressing member for pressing against the pressure block to fix the crystal in the through hole.

5. The crystal heat sink device as described in claim 4, characterized in that: The through hole is square, and two adjacent edges of the through hole are provided with stepped grooves that communicate with the through hole. The other two adjacent edges form two heat-conducting surfaces. The crystal heat sink device includes two pressure blocks that are respectively fixed in the two stepped grooves.

6. The crystal heat sink device as described in claim 5, characterized in that: The base has two threaded holes that extend to the corresponding stepped grooves, and the elastic pressing members of the crystal heat sink device are two ball screws that pass through the two threaded holes and abut against the corresponding pressing blocks.

7. The crystal heat sink device as described in claim 5, characterized in that: Both of the pressure blocks have heat-conducting surfaces.

8. The crystal heat sink device as described in claim 6, characterized in that: The through hole is located at the center of the base, and the receiving hole, the groove and the two threaded holes are distributed on the outer periphery of the base.

9. A laser, characterized in that, The laser includes an adjustment frame, a crystal heat sink device fixed to the adjustment frame, a crystal fixed to the crystal heat sink device, a heat insulation pad located between the adjustment frame and the crystal heat sink device, and a control circuit, wherein the crystal heat sink device is the crystal heat sink device as described in any one of claims 1-8.

10. A laser as described in claim 9, characterized in that: The crystal is a nonlinear frequency doubling crystal.

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