Anti-interference laminated module combined structure

Abstract

The utility model provides an anti-interference laminated module combination structure comprising at least two radio frequency processing modules, each radio frequency processing module comprises an anti-interference housing and a PCBA board, and the PCBA board is arranged in the housing; a connecting part is arranged on the shell; the PCBA board is provided with a connecting terminal, the shell is provided with an anti-interference connecting interface corresponding to the connecting terminal, and the connecting terminal extends into the connecting interface; when any at least two radio frequency processing modules are connected in a stacked mode, the shells of the two adjacent radio frequency processing modules are connected through a connecting part, the connecting terminals and the connecting interfaces between the two adjacent radio frequency processing modules are in butt joint respectively, and the two butt-joint connecting interfaces seal the two butt-joint connecting terminals in the two butt-joint connecting interfaces in an anti-interference mode. According to the utility model, the radio frequency processing modules can be randomly stacked and combined, and the modules can be electrically connected only through butt joint of the connecting terminals on the PCBA board, so that additional fixing pieces and data communication lines are not needed, and the defects of module mounting structures in the market at present can be effectively overcome.

Description

Technical Field

[0001] This utility model relates to the field of radio frequency processing module technology, and in particular to an anti-interference stacked module combination structure. Background Technology

[0002] Currently available drone detection equipment, especially those using radio spectrum detection technology, involves various combinations of radio frequency processing modules. The structural installation and data communication between these modules involve complex mounting brackets and data transmission cables. Furthermore, to address EMC (electromagnetic compatibility) issues, vulnerable parts require various shielding structures, and connecting cables need shielding layers, ferrite beads, and other anti-electromagnetic interference measures. This makes installation complex, demanding high standards for assembly processes and material manufacturing. It also hinders the expansion and development of the equipment. When the internal module combinations change, corresponding module mounting components must be remade.

[0003] Therefore, how to solve the problem of electromagnetic interference resistance of modules, while enabling modules to be randomly stacked and combined without the need for additional fasteners and data communication lines, has become a pressing technical problem in this field. Utility Model Content

[0004] To address the aforementioned problems, this utility model provides an anti-interference stacked module assembly structure, comprising at least two radio frequency (RF) processing modules. Each RF processing module includes an anti-interference housing and a PCBA board, with the PCBA board disposed within the housing. The housing has a connecting portion; the PCBA board has connecting terminals; and the housing has an anti-interference connecting interface corresponding to the connecting terminals, with the connecting terminals extending into the connecting interfaces. When any two RF processing modules are stacked, the housings of adjacent RF processing modules are connected via the connecting portion, and the connecting terminals and connecting interfaces between adjacent RF processing modules are respectively mated, with the mated connecting interfaces sealing the mated connecting terminals within them for anti-interference purposes.

[0005] Optionally, the connecting part is provided with a connecting hole, and the connecting parts of the stacked radio frequency processing modules are fastened together by fasteners passing through the connecting hole.

[0006] Optionally, the connection interface is a hollow boss structure, and the mating end of the connection terminal extends from inside the connection interface to outside the connection interface, or is located inside the connection interface;

[0007] In the two connecting terminals that are mated, the mating end of one of the connecting terminals extends into the other connecting interface and mates with the other connecting terminal.

[0008] Optionally, at least one of the stacked surfaces of the housing is provided with a heat dissipation groove, the connection interface is located in the heat dissipation groove, and the mating end face of the connection interface protrudes from the bottom surface of the heat dissipation groove and is flush with the stacked surface of the housing.

[0009] Optionally, the anti-interference stacked module combination structure includes at least three radio frequency processing modules. The PCBA board of the radio frequency processing module located in the middle layer is provided with at least two connection terminals. These two connection terminals are respectively located on the upper and lower surfaces of the PCBA board. The upper and lower surfaces of the housing of the radio frequency processing module are provided with two connection interfaces corresponding to the upper and lower connection terminals.

[0010] Optionally, the upper surface of the PCBA board of the lowest-level radio frequency processing module is provided with at least one connection terminal, and the upper surface of the housing of the radio frequency processing module is provided with a connection interface corresponding to the connection terminal.

[0011] Optionally, the lower surface of the PCBA board of the uppermost RF processing module is provided with at least one connection terminal, and the lower surface of the housing of the RF processing module is provided with a connection interface corresponding to the connection terminal.

[0012] Optionally, the PCBA board is completely or partially installed within the housing, with the susceptible portion of the PCBA board located within the housing.

[0013] Optionally, the connection interface is integrally formed with the housing and is made of an anti-interference material.

[0014] Optionally, the two connecting terminals are connected by a plug-in method.

[0015] Compared with the prior art, the present invention has the following technical advantages:

[0016] This utility model provides an anti-interference stacked module combination structure, including at least two radio frequency processing modules. The radio frequency processing modules can be randomly stacked and combined. The modules only need to be electrically connected through the connection terminals on the PCBA board. Therefore, no additional fasteners and data communication lines are required, which can effectively solve the drawbacks of the current module installation structure on the market.

[0017] Furthermore, this invention combines multiple radio frequency processing modules into a complete integrated component, while the data communication ports (connection terminals) between modules are also completely shielded inside the housing through the docking interface, which can completely avoid interference from external signals.

[0018] Furthermore, in this invention, the susceptible parts of the PCBA board are located inside the outer casing, which is made of an anti-interference material. The purpose is to protect the susceptible parts from interference, thereby effectively solving the problem of electromagnetic interference in the module.

[0019] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is an assembly diagram of the anti-interference stacked module combination structure provided in Embodiment 1 of this utility model;

[0022] Figure 2 This is a disassembly diagram of the anti-interference stacked module combination structure provided in Embodiment 1 of this utility model;

[0023] Figure 3 This is a front axonometric view of the first radio frequency processing module provided in Embodiment 1 of this utility model;

[0024] Figure 4 This is a rear axonometric view of the first radio frequency processing module provided in Embodiment 1 of this utility model;

[0025] Figure 5 This is a front axonometric view of the second radio frequency processing module provided in Embodiment 1 of this utility model;

[0026] Figure 6 This is a rear axonometric view of the second radio frequency processing module provided in Embodiment 1 of this utility model;

[0027] Figure 7 This is a front axonometric view of the third radio frequency processing module provided in Embodiment 1 of this utility model;

[0028] Figure 8 This is a rear axonometric view of the third radio frequency processing module provided in Embodiment 1 of this utility model;

[0029] Figure 9 This is a cross-sectional view of the anti-interference stacked module combination structure provided in Embodiment 1 of this utility model;

[0030] Figure 10 This is an assembly diagram of the anti-interference stacked module combination structure provided in Embodiment 2 of this utility model;

[0031] Figure 11 This is a disassembly diagram of the anti-interference stacked module combination structure provided in Embodiment 2 of this utility model;

[0032] Figure 12 This is a cross-sectional view of the anti-interference stacked module combination structure provided in Embodiment 2 of this utility model.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1--First radio frequency processing module;

[0035] 101 -- First connecting hole;

[0036] 102 -- First upper shell;

[0037] 103 -- First lower shell;

[0038] 104 -- First RF socket;

[0039] 105 -- First heat dissipation groove;

[0040] 106 -- First connection interface;

[0041] 107 -- First PCBA board;

[0042] 10701 -- First lower connection terminal;

[0043] 2--Second radio frequency processing module;

[0044] 201 -- Second upper connecting hole;

[0045] 202 -- Second lower connecting hole;

[0046] 203 -- Second upper shell;

[0047] 204 -- Second lower shell;

[0048] 205 -- Second RF connector;

[0049] 206 -- Second upper connection interface;

[0050] 207 -- Second PCBA board;

[0051] 20701 -- Second upper connection terminal;

[0052] 208 -- Second upper heat dissipation recess;

[0053] 209 -- Second lower connection interface;

[0054] 3--Third radio frequency processing module;

[0055] 301--Third upper connecting hole one;

[0056] 302 -- Third upper shell;

[0057] 303 -- Third lower shell;

[0058] 304 -- Third heat dissipation groove;

[0059] 305 -- Third upper connection interface;

[0060] 306 -- Peripheral Interface;

[0061] 307 -- Third PCBA board;

[0062] 30701 -- Third upper connection terminal;

[0063] 308 -- Third upper connecting hole two;

[0064] 4--First fastener;

[0065] 5--Second fastener. Detailed Implementation

[0066] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0067] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus. The terms "above" and "over," and any variations thereof, are intended to describe positional relationships and do not imply direct contact between the described objects.

[0068] This utility model provides an anti-interference stacked module combination structure, including at least two radio frequency (RF) processing modules. Each RF processing module includes an anti-interference housing and a PCBA board, with the PCBA board disposed inside the housing. The housing has a connecting portion; the PCBA board has connecting terminals; and the housing has an anti-interference connection interface corresponding to the connecting terminals, with the connecting terminals extending into the connection interface. When any at least two RF processing modules are stacked, the housings of two adjacent RF processing modules are connected through the connecting portion, and the connecting terminals and connection interfaces between two adjacent RF processing modules are respectively mated, with the mated connection interfaces sealing the mated connecting terminals inside them for anti-interference purposes.

[0069] In this invention, the PCBA board can be completely installed inside the housing or partially installed inside the housing. However, the parts susceptible to interference need to be located inside the housing. The housing is made of anti-interference material to protect the parts susceptible to interference from interference, thereby effectively solving the problem of electromagnetic interference in the module.

[0070] Moreover, the RF processing modules can be randomly stacked and combined. The modules only need to be electrically connected through the connection terminals on the PCBA board. Therefore, no additional fasteners and data communication lines are required, which can effectively solve the drawbacks of the current module installation structure on the market.

[0071] Furthermore, this invention combines multiple radio frequency processing modules into a complete integrated component, while the data communication ports (connection terminals) between modules are also completely shielded inside the housing through the docking interface, which can completely avoid interference from external signals.

[0072] In this invention, when any two or more radio frequency processing modules are stacked and connected, the housings of adjacent radio frequency processing modules are connected by a connecting part. This invention does not limit the connection method of the connecting part; it can be a detachable connection or an integrated connection, with a detachable connection being preferred, such as a snap-fit ​​or fastener connection.

[0073] As one embodiment, the connecting part is provided with a connecting hole, and the connecting parts of the stacked radio frequency processing modules are fastened together by fasteners passing through the connecting hole.

[0074] In this embodiment, the connecting hole can be a threaded hole or a hole structure of other shapes and structures. The fastener is a fixed connection structure that is adapted to the connecting hole.

[0075] In one specific implementation, the connection hole is a threaded hole, and the stacked radio frequency processing modules are connected by threaded fasteners passing through the corresponding threaded holes.

[0076] The connection interface can be an opening directly on the laminated surface of the outer shell, or it can protrude from the laminated surface of the outer shell. This utility model does not impose any specific limitations on this.

[0077] To facilitate the connection interface docking between stacked RF processing modules, as one embodiment, the connection interface is a hollow boss structure. The connection terminal extends into the connection interface, and the mating end of the connection terminal extends out of the connection interface or is located inside the connection interface. In the two mating connection terminals, the mating end of one connection terminal extends into the other connection interface and docks with the other connection terminal. The purpose is to provide an anti-interference seal between the two mating connection interfaces and the two mating connection terminals within them.

[0078] To facilitate interference-resistant sealing of the two connecting terminals within the two docking interfaces, as one embodiment, at least one layered surface of the housing (after stacking, the opposing surfaces of the housings of two adjacent RF processing modules are in contact, i.e., the lower surface of the housing of the upper RF processing module is in contact with the upper surface of the housing of the lower RF processing module; therefore, the contacting surface is the layered surface) is provided with a heat dissipation groove. The connecting interface is located within the heat dissipation groove, and the mating end face of the connecting interface protrudes from the bottom surface of the heat dissipation groove. The mating end face of the connecting interface can be flush with the layered surface of the housing, or it can protrude from or be lower than the layered surface of the housing. This invention does not impose any limitations on this and can be set according to actual usage requirements.

[0079] This embodiment does not restrict the position of the heat dissipation groove. In order to make the stacked radio frequency processing modules more stable, the heat dissipation groove is set in the middle of the stacked surface of the housing.

[0080] If two RF processing modules are stacked, the lower RF processing module's PCBA board has at least one upper connection terminal located on its upper surface. The upper surface of the lower RF processing module's housing has an upper connection interface corresponding to the upper connection terminal, with the upper connection terminal extending into the upper connection interface. The upper RF processing module's PCBA board has at least one lower connection terminal located on its lower surface. The lower surface of the RF processing module's housing has a lower connection interface corresponding to the lower connection terminal, with the lower connection terminal extending into the lower connection interface. The upper connection terminal and lower connection terminal are mated together, and the upper connection interface and lower connection interface are mated together.

[0081] If at least three radio frequency processing modules are stacked, an intermediate radio frequency processing module is set between the upper and lower layers of the radio frequency processing modules. The PCBA board of the intermediate layer radio frequency processing module is provided with at least two connection terminals. These two connection terminals are respectively located on the upper and lower surfaces of the PCBA board. The upper and lower surfaces of the housing of the radio frequency processing module are provided with two connection interfaces corresponding to the upper and lower connection terminals.

[0082] In order to enable the stacking of different RF processing modules, the positions of the connection parts, connection terminals and connection interfaces of each RF processing module must correspond, that is, they must be of the same standard, in order to achieve arbitrary stacking.

[0083] This invention does not limit the number of connection terminals on the PCBA board; it can be set according to actual usage requirements. To simplify the electrical connections between the various RF processing modules, a lower connection terminal is provided on the PCBA board of the topmost RF processing module, two connection terminals (top and bottom) are provided on the PCBA board of the middle RF processing modules, and an upper connection terminal is provided on the PCBA board of the bottommost RF processing module.

[0084] Since both the connection interface and the housing are interference-resistant, the connection interface and the housing can be made as a single unit and made of interference-resistant material.

[0085] This invention does not limit the specific type of anti-interference material, such as aluminum alloy or other metal alloy materials, which can effectively shield interference signals.

[0086] This utility model does not limit the specific structure of the outer shell. As one embodiment, the outer shell includes an upper shell and a lower shell, which are fixedly connected to form an accommodating space for accommodating a PCBA board.

[0087] In order to effectively achieve electrical connection between the two stacked radio frequency processing modules, as an example, the two connection terminals are connected by plugging, which can improve the connection stability of the two connection terminals.

[0088] This invention does not limit the shape of the connection interface; it can be set according to the specific shape of the connection terminal.

[0089] In one embodiment, if the connecting terminal has a flat structure, then the connecting interface is a flat ring-shaped interface that matches the connecting terminal.

[0090] This invention does not limit the number of radio frequency processing modules that can be stacked. Two specific embodiments are listed below for detailed description.

[0091] Example 1

[0092] Please refer to Figures 1 to 9 This embodiment provides an anti-interference stacked module combination structure, including a first radio frequency processing module 1, a second radio frequency processing module 2 and a third radio frequency processing module 3, which are stacked sequentially from top to bottom.

[0093] The first radio frequency processing module 1 includes a first housing and a first PCBA board 107. The first housing includes a first upper housing 102 and a first lower housing 103. The first upper housing 102 and the first lower housing 103 are connected to form a closed accommodating space, and the first PCBA board 107 is disposed in the accommodating space.

[0094] The lower surface of the first PCBA board 107 is provided with a first lower connection terminal 10701.

[0095] The lower surface of the first housing is provided with a first heat dissipation groove 105 in the middle. Both sides of the lower surface of the first housing protrude from the first heat dissipation groove 105, that is, the two sides of the lower surface of the first housing form a first contact surface that is in contact with the second radio frequency processing module 2.

[0096] A first lower connection interface 106 is provided on the first heat dissipation groove 105, and the first lower connection interface 106 communicates with the accommodating space of the first outer shell. The first lower connection interface 106 is a hollow boss structure protruding from the first heat dissipation groove 105, that is, the first lower connection interface 106 is located inside the first heat dissipation groove 105, and the mating end face of the first lower connection interface 106 protrudes from the bottom surface of the groove of the first heat dissipation groove 105 and is flush with the first mating surfaces on the left and right sides of the first outer shell.

[0097] The first lower connection terminal 10701 extends from the first housing into the first lower connection port 106, and the mating end of the first lower connection terminal 10701 is located inside the first lower connection port 106.

[0098] The first housing also has a first radio frequency socket 104 on its side.

[0099] The lower edge of the first outer casing is provided with several first connecting parts, and the first connecting parts are provided with first connecting holes 101.

[0100] The second radio frequency processing module 2 includes a second housing and a second PCBA board 207. The second housing includes a second upper housing 203 and a second lower housing 204. The second upper housing 203 and the second lower housing 204 are connected to form a closed accommodating space, and the second PCBA board 207 is disposed in the accommodating space.

[0101] The upper and lower surfaces of the second PCBA board 207 are respectively provided with a second upper connection terminal 20701 and a second lower connection terminal 20702. The upper and lower surfaces of the housing of the radio frequency processing module are provided with a second upper connection interface 206 and a second lower connection interface 209 corresponding to the second upper connection terminal 20701 and the second lower connection terminal 20702.

[0102] The upper surface of the second housing is provided with a second upper heat dissipation groove 208 in the middle. Both sides of the upper surface of the second housing protrude from the second upper heat dissipation groove 208, that is, the two sides of the upper surface of the second housing form a second upper bonding surface that is bonded to the two first bonding surfaces of the first housing of the first radio frequency processing module 1.

[0103] The second upper heat dissipation groove 208 is provided with a second upper connection interface 206, which communicates with the accommodating space of the second outer shell. The second upper connection interface 206 is a hollow boss structure protruding from the second upper heat dissipation groove 208, that is, the second upper connection interface 206 is located inside the second upper heat dissipation groove 208, and the mating end face of the second upper connection interface 206 protrudes from the bottom surface of the groove of the second upper heat dissipation groove 208 and is flush with the second upper mating surfaces on the left and right sides of the second outer shell.

[0104] The second upper connection terminal 20701 extends from inside the second housing into the second upper connection interface 206, and the mating end of the second upper connection terminal 20701 extends from inside the second upper connection interface 206 into the outside of the second upper connection interface 206.

[0105] The lower surface of the second housing is provided with a second lower connection interface 209, which communicates with the accommodating space of the second housing. A second lower connection terminal 20702 extends into the second lower connection interface 209, and the mating end of the second lower connection terminal 20702 is located within the second lower connection interface 209.

[0106] The second housing also has a second radio frequency socket 205 on its side.

[0107] The upper surface edge of the second outer shell is a second upper connecting part corresponding to the first connecting part, and the second upper connecting part is provided with a second upper connecting hole 201.

[0108] The lower edge of the second outer casing is provided with a second lower connecting part, and the second lower connecting part is provided with a second lower connecting hole 202.

[0109] The third radio frequency processing module 3 includes a third housing and a third PCBA board 307. The third housing includes a third upper housing 302 and a third lower housing 303. The third upper housing 302 and the third lower housing 303 are connected to form a closed accommodating space, and the third PCBA board 307 is disposed in the accommodating space.

[0110] The upper surface of the third PCBA board 307 is provided with a third upper connection terminal 30701.

[0111] The upper surface of the third housing is provided with a third heat dissipation groove 304 in the middle. Both sides of the upper surface of the third housing protrude from the third heat dissipation groove 304, that is, the two sides of the upper surface of the third housing form a third contact surface that is in contact with the lower surface of the second housing of the second radio frequency processing module 2.

[0112] The third heat dissipation groove 304 is provided with a third upper connection interface 305, which communicates with the accommodating space of the third housing. The third upper connection interface 305 is a hollow boss structure protruding from the third heat dissipation groove 304, that is, the third upper connection interface 305 is located inside the third heat dissipation groove 304, and the mating end face of the third upper connection interface 305 protrudes from the bottom surface of the groove of the third heat dissipation groove 304 and is flush with the third mating surfaces on the left and right sides of the third housing.

[0113] The third upper connection terminal 30701 extends from inside the third housing into the third upper connection interface 305, and the mating end of the third upper connection terminal 30701 extends from inside the third upper connection interface 305 into the outside of the third upper connection interface 305.

[0114] The side of the third housing is also provided with several peripheral interfaces 306, which are used for functions such as connecting an external power supply to power the module, powering the cooling fan, or connecting external sensors.

[0115] The upper surface of the third outer shell has two sides of the third upper connecting part, and the third upper connecting part is provided with a third upper connecting hole 301 corresponding to the second connecting hole.

[0116] When the first RF processing module 1, the second RF processing module 2, and the third RF processing module 3 are stacked sequentially from top to bottom, the first RF processing module 1 and the second RF processing module 2 are securely connected by several first fasteners 4 inserted into the corresponding first connection holes 101 and second upper connection holes 201. The first lower connection terminal 10701 mates with the second upper connection terminal 20701, and the first lower connection interface 106 mates with the second upper connection interface 206 to seal the internal mating first lower connection terminal 10701 and the second upper connection terminal 20701 against interference. The second RF processing module 2 and the third RF processing module 3 are securely connected by several second fasteners 5 inserted into the corresponding second lower connection holes 202 and third upper connection holes 301. The second lower connection terminal 20702 mates with the third upper connection terminal 30701, and the second lower connection interface 209 mates with the third upper connection interface 305 to seal the internal mating second lower connection terminal 20702 and the third upper connection terminal 30701 against interference.

[0117] Example 2

[0118] Please refer to Figures 10 to 12 This embodiment provides an anti-interference stacked module combination structure, including the first radio frequency processing module 1 and the third radio frequency processing module 3 described in embodiment 1, wherein the first radio frequency processing module 1 and the third radio frequency processing module 3 are stacked sequentially from top to bottom.

[0119] The third upper connecting part is also provided with a third upper connecting hole 308 corresponding to the first connecting hole 101.

[0120] When the first RF processing module 1 and the third RF processing module 3 are stacked sequentially from top to bottom, several first fasteners 4 are inserted into the corresponding first connection holes 101 and third upper connection holes 308 respectively to fasten the two RF processing modules. The first lower connection terminal 10701 is connected to the third upper connection terminal 30701, and the first lower connection interface 106 is connected to the third upper connection interface 305 to seal the first lower connection terminal 10701 and the third upper connection terminal 30701 internally to prevent interference.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. An anti-interference stacked module combination structure, characterized in that, The system includes at least two radio frequency (RF) processing modules. Each RF processing module includes an anti-interference housing and a PCBA board, with the PCBA board disposed within the housing. The housing has a connecting portion. The PCBA board has connecting terminals, and the housing has an anti-interference connecting interface corresponding to the connecting terminals. The connecting terminals extend into the connecting interfaces. When any two RF processing modules are stacked, the housings of two adjacent RF processing modules are connected through the connecting portion. The connecting terminals and connecting interfaces between two adjacent RF processing modules are respectively mated, and the two mated connecting interfaces provide anti-interference sealing for the two mated connecting terminals inside.

2. The anti-interference stacked module combination structure according to claim 1, characterized in that, The connecting part is provided with a connecting hole, and the connecting parts of the stacked radio frequency processing modules are fastened together by fasteners passing through the connecting hole.

3. The anti-interference stacked module combination structure according to claim 1, characterized in that, The connection interface is a hollow boss structure, and the mating end of the connection terminal extends from inside the connection interface to outside the connection interface, or is located inside the connection interface; In the two connecting terminals that are mated, the mating end of one of the connecting terminals extends into the other connecting interface and mates with the other connecting terminal.

4. The anti-interference stacked module combination structure according to claim 3, characterized in that, At least one of the stacked surfaces of the housing is provided with a heat dissipation groove, the connection interface is located in the heat dissipation groove, and the mating end face of the connection interface protrudes from the bottom surface of the heat dissipation groove and is flush with the stacked surface of the housing.

5. The anti-interference stacked module combination structure according to any one of claims 1 to 4, characterized in that, The device includes at least three radio frequency processing modules. The PCBA board of the radio frequency processing module located in the middle layer is provided with at least two connection terminals. These two connection terminals are respectively located on the upper and lower surfaces of the PCBA board. The upper and lower surfaces of the housing of the radio frequency processing module are provided with two connection interfaces corresponding to the upper and lower connection terminals.

6. The anti-interference stacked module combination structure according to any one of claims 1 to 4, characterized in that, The upper surface of the PCBA board of the lowest-level radio frequency processing module is provided with at least one connection terminal, and the upper surface of the housing of the radio frequency processing module is provided with a connection interface corresponding to the connection terminal.

7. The anti-interference stacked module combination structure according to any one of claims 1 to 4, characterized in that, The lower surface of the PCBA board of the uppermost radio frequency processing module is provided with at least one connection terminal, and the lower surface of the housing of the radio frequency processing module is provided with a connection interface corresponding to the connection terminal.

8. The anti-interference stacked module combination structure according to claim 1, characterized in that, The PCBA board is fully or partially installed inside the housing, and the vulnerable parts of the PCBA board are located inside the housing.

9. The anti-interference stacked module combination structure according to claim 1, characterized in that, The connection interface is integrally formed with the housing and is made of anti-interference material.

10. The anti-interference stacked module combination structure according to claim 1, characterized in that, The two connecting terminals are connected by a plug-in method.

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