Wafer slice cross section automatic detection device driven by double motors

Abstract

The utility model is applicable to the technical field of semiconductor manufacturing, and provides a double-motor-driven wafer slice cross section automatic detection device which comprises a device shell, a rectangular groove is formed in the top surface of the device shell, and a longitudinal guide rail is arranged on one side of the device shell and located above the rectangular groove. A longitudinal guide rail is arranged in the rectangular groove, a transverse guide rail is arranged below the longitudinal guide rail, a longitudinal direct current motor is arranged at one end of the longitudinal guide rail, a transverse direct current motor is arranged at one end of the transverse guide rail, an industrial camera and an adjustable LED lamp are arranged on the bottom face of the transverse guide rail, and a wafer slicing tray is arranged on the bottom face of the rectangular groove. The utility model provides a wafer slice cross section automatic detection device driven by double motors, which realizes rapid and comprehensive quality detection through low-cost and high-precision automatic scanning and visual analysis, solves the problems of low efficiency of traditional manual detection and high cost of high-precision equipment, and improves the detection efficiency. Meanwhile, the defect that an existing machine vision system is insufficient in motion control precision is overcome.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to an automatic detection device for the cross-section of wafer slices driven by dual motors. Background Technology

[0002] Wafer slicing cross-section inspection is a very important quality control operation in the semiconductor manufacturing process. It is typically used to evaluate the structure, thickness, material distribution, and presence of defects of the circuits on the wafer.

[0003] In the semiconductor manufacturing field, the cross-sectional quality of wafers after slicing directly affects the yield and reliability of chips. Traditional inspection methods mainly rely on manual visual inspection or high-precision optical equipment (such as laser confocal microscopes and scanning electron microscopes), which have the following problems:

[0004] 1. Low efficiency of manual inspection: Manual visual inspection relies on experience, is easily affected by subjective factors, and cannot quantify the size of defects;

[0005] 2. High-cost equipment limits widespread adoption: Precision optical equipment is expensive (usually exceeding one million RMB), complex to maintain, and difficult to adapt to production line needs;

[0006] 3. Insufficient automation: Existing semi-automatic equipment mostly uses single-direction scanning or complex multi-axis motion systems, resulting in slow detection speed and high cost.

[0007] To address the above problems, this invention proposes an automatic detection device for the cross-section of wafer slices driven by dual motors. Utility Model Content

[0008] The purpose of this invention is to provide an automatic detection device for the cross-section of wafer slices driven by dual motors, so as to solve the problems in the background art mentioned above.

[0009] To achieve the above objectives, this utility model provides the following technical solution: an automatic wafer slicing cross-section inspection device driven by dual motors, comprising a device housing, a rectangular groove on the top surface of the device housing, a longitudinal guide rail above one side of the device housing located above the rectangular groove, a transverse guide rail below the longitudinal guide rail, a longitudinal DC motor at one end of the longitudinal guide rail, a transverse DC motor at one end of the transverse guide rail, an industrial camera and an adjustable LED light on the bottom surface of the transverse guide rail, and a wafer slicing tray on the bottom surface of the rectangular groove.

[0010] Preferably, a first fixing plate is provided below the longitudinal guide rail, and a first U-shaped clamping plate is provided above the first fixing plate. The first U-shaped clamping plate is clamped on the longitudinal guide rail, and a first fixing block is provided on the top surface of the first U-shaped clamping plate. A first threaded rod is provided at the output end of the longitudinal DC motor, and the first threaded rod passes through the first fixing block. The first fixing plate is fixedly connected to one end of the transverse guide rail.

[0011] Preferably, a carrier plate is provided below the transverse guide rail, and a second U-shaped clamping plate is provided on the top surface of the carrier plate. The second U-shaped clamping plate is clamped on the transverse guide rail, and a second fixing block is provided on the top surface of the second U-shaped clamping plate. A second threaded rod is provided at the output end of the transverse DC motor, and the second threaded rod passes through the second fixing block.

[0012] Preferably, the top surfaces of the first U-shaped card plate and the second U-shaped card plate are provided with limiting components.

[0013] Preferably, the limiting component includes two limiting rods, which are symmetrically arranged on the top surface of the corresponding transverse or longitudinal guide rail. The bottom surfaces of the two limiting rods are symmetrically provided with locking blocks, which are arranged on the top surface of the corresponding first U-shaped locking plate and second U-shaped locking plate.

[0014] Preferably, the top of the transverse guide rail, the longitudinal guide rail, and the rectangular groove are all provided with protective covers, and a bracket is provided between the top protective cover of the longitudinal guide rail and the device housing.

[0015] This utility model has at least the following beneficial effects:

[0016] This invention provides an automatic inspection device for the cross-section of wafer slices driven by dual motors. Through low-cost, high-precision automated scanning and visual analysis, it achieves rapid and comprehensive quality inspection, solving the problems of low efficiency and high cost of traditional manual inspection and high-precision equipment. At the same time, it overcomes the shortcomings of insufficient motion control precision in existing machine vision systems. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the longitudinal guide rail and the transverse guide rail structure of this utility model;

[0019] Figure 3 This is a top view of the longitudinal guide rail and the transverse guide rail of this utility model;

[0020] Figure 4 This is an external schematic diagram of the present invention;

[0021] Figure 5 This is a schematic diagram of the modules of this utility model.

[0022] In the attached figures: 1. Device housing; 2. Longitudinal DC motor; 3. Transverse DC motor; 4. Support; 5. Wafer slicing tray; 6. Longitudinal guide rail; 7. Transverse guide rail; 8. Industrial camera; 9. Adjustable LED light; 10. First threaded rod; 11. First fixing block; 12. First U-shaped clamping plate; 13. First fixing plate; 14. Limiting rod; 15. Second threaded rod; 16. Clamping block; 17. Carrier plate; 18. Second U-shaped clamping plate; 19. Second fixing block; 20. Rectangular groove. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0024] Example

[0025] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 This utility model provides a technical solution: an automatic detection device for the cross-section of a wafer slicing driven by dual motors, including a device housing 1. A rectangular groove 20 is formed on the top surface of the device housing 1. A longitudinal guide rail 6 is provided on one side of the device housing 1 above the rectangular groove 20. A transverse guide rail 7 is provided below the longitudinal guide rail 6. A longitudinal DC motor 2 is provided at one end of the longitudinal guide rail 6. Specifically, a transverse DC motor 3 is provided at one end of the transverse guide rail 7. Specifically, the mounting base of the transverse DC motor 3 is fixedly connected to the transverse guide rail 7. An industrial camera 8 and an adjustable LED light 9 are provided on the bottom surface of the transverse guide rail 7. A wafer slicing tray 5 is provided on the bottom surface of the rectangular groove 20. Specifically, the wafer slicing tray 5 is fixedly connected to the bottom surface of the rectangular groove 20.

[0026] Furthermore, a first fixing plate 13 is provided below the longitudinal guide rail 6, and a first U-shaped clamping plate 12 is provided above the first fixing plate 13. Specifically, the first U-shaped clamping plate 12 is fixedly connected to the first fixing plate 13 and is clamped on the longitudinal guide rail 6. Specifically, the first U-shaped clamping plate 12 is slidably connected to the longitudinal guide rail 6. A first fixing block 11 is provided on the top surface of the first U-shaped clamping plate 12. Specifically, the first fixing block 11 is fixedly connected to the first U-shaped clamping plate 12. A first threaded rod 10 is provided at the output end of the longitudinal DC motor 2. Specifically, the first threaded rod 10 is fixedly connected to the output end of the longitudinal DC motor 2 and passes through the first fixing block 11. The first fixing plate 13 is fixedly connected to one end of the transverse guide rail 7. Specifically, the first threaded rod 10 is threadedly connected to the first fixing block 11 and rotatably connected to the end of the transverse guide rail 7.

[0027] Furthermore, a carrier plate 17 is provided below the transverse guide rail 7, and a second U-shaped clamping plate 18 is provided on the top surface of the carrier plate 17. Specifically, the second U-shaped clamping plate 18 is fixedly connected to the carrier plate 17 and is clamped on the transverse guide rail 7. Specifically, the second U-shaped clamping plate 18 is slidably connected to the transverse guide rail 7. A second fixing block 19 is provided on the top surface of the second U-shaped clamping plate 18. Specifically, the second fixing block 19 is fixedly connected to the second U-shaped clamping plate 18. A second threaded rod 15 is provided at the output end of the transverse DC motor 3. The second threaded rod 15 passes through the second fixing block 19. Specifically, the second threaded rod 15 is rotatably connected to the transverse guide rail 7 and is threadedly connected to the second fixing plate 19.

[0028] Furthermore, the top surfaces of the first U-shaped card plate 12 and the second U-shaped card plate 18 are provided with limiting components. The limiting components include two limiting rods 14, which are symmetrically arranged on the top surfaces of the corresponding transverse guide rail 7 or longitudinal guide rail 6. Specifically, the two limiting rods 14 are fixedly connected to the top surfaces of the corresponding transverse guide rail 7 or longitudinal guide rail 6. The bottom surfaces of the two limiting rods 14 are symmetrically provided with locking blocks 16. Specifically, the locking blocks 16 are slidably connected to the limiting rods 14. The locking blocks 16 are arranged on the top surfaces of the corresponding first U-shaped card plate 12 and the second U-shaped card plate 18. Specifically, the locking blocks 16 are fixedly connected to the top surfaces of the corresponding first U-shaped card plate 12 and the second U-shaped card plate 18.

[0029] Furthermore, the tops of the transverse guide rail 7, the longitudinal guide rail 6, and the rectangular groove 20 are all provided with protective covers. A bracket 4 is provided between the top protective cover of the longitudinal guide rail 6 and the device housing 1. Specifically, the bracket 4 is fixedly connected to the top protective cover of the longitudinal guide rail 6 and the device housing 1.

[0030] The working principle of this utility model:

[0031] Step 1. Wafer loading and positioning: Place the wafer slices on the vacuum tray and start the adsorption fixation; the camera performs initial position calibration and identifies the wafer edge reference point.

[0032] Step 2. Automatic scanning and image acquisition: Dual motors drive the guide rail to move along a preset path (such as a serpentine path); the camera triggers shooting at a fixed frequency (such as 5 frames per second) and records the position coordinates synchronously; the images are transmitted to the processing unit in real time for stitching and caching.

[0033] Step 3. Visual Analysis and Defect Assessment:

[0034] Geometric dimension measurement: Cutting width, Hough transform to detect straight edges, calculate pixel distance and convert to actual value; Edge chipping, morphological dilation + contour difference method, quantify defect area;

[0035] Surface defect detection: crack recognition, local contrast enhancement + skeleton extraction algorithm; contamination particles, dark field image threshold segmentation (alarm when grayscale difference > 30);

[0036] Process anomaly monitoring: missing metal layer, comparison of regional grayscale mean (allowable deviation ±5%); development residue, Fourier transform analysis of texture anomalies;

[0037] Step 4. Results Output and Feedback: Generate an inspection report (including defect location map and size distribution histogram); upload the data to the MES system via RS485 or Ethernet interface.

[0038] This application provides a low-cost, high-precision, fully automated wafer slicing cross-section inspection device, which solves the problems of low efficiency and high cost of traditional manual inspection and high-precision equipment. At the same time, it overcomes the shortcomings of insufficient motion control precision in existing machine vision systems and achieves the following functions:

[0039] ①. Macroscopic geometric dimension measurement (cut width, edge chipping dimensions);

[0040] ②. Surface defect detection (cracks, contaminant particles, missing metal layer);

[0041] ③. Real-time monitoring of process anomalies (developer residue, cutting depth deviation).

[0042] This application achieves full-coverage scanning and high-precision inspection of wafer slicing through the collaborative design of a precision guide rail system driven by dual DC motors and machine vision, specifically including:

[0043] a. Dual DC motor drive system: controls the transverse guide rail (X-axis) and the longitudinal guide rail (Y-axis) respectively, and achieves a positioning accuracy of ±5μm through closed-loop feedback control;

[0044] b. Adaptive Lighting System: Adopts an adjustable ring LED light source, which automatically adjusts the light intensity and angle according to the surface material to enhance the contrast of defects;

[0045] c. Image stitching and real-time analysis: Seamless image stitching is achieved by synchronizing motion control with camera trigger signals, and defect classification is performed using deep learning algorithms.

[0046] Specifications of each component in this application:

[0047] Lateral guide (X-axis) and longitudinal guide (Y-axis): Precision linear guides are used (repeat positioning accuracy ≤5μm); the guide surface is chrome-plated to reduce friction loss; the lateral guide travel is adapted to 6-12 inch wafers (150-300mm).

[0048] DC drive motors: Two brushless DC motors (rated torque 0.2 N·m, speed adjustable from 0 to 500 rpm); connected to the guide rail via synchronous belt or ball screw, with a reduction ratio of 1:10; built-in encoder feedback, supporting closed-loop control.

[0049] Wafer slicing tray: Vacuum adsorption tray: Surface covered with anti-static silicone pad, adsorption force ≥50N.

[0050] Industrial camera: 20-megapixel CMOS sensor (5120×3840 resolution); equipped with a 5X telecentric lens, with a single pixel resolution of 2μm (in a 10mm×10mm field of view).

[0051] Adjustable LED light: (brightness adjustable from 0 to 3000 Lux, color temperature from 3000 to 6500 K); supports switching between coaxial light and dark lighting modes.

[0052] Compared with the prior art, this application has the following technical advantages:

[0053] ① Dual-motor cooperative control algorithm: Based on position-velocity dual closed-loop PID control, the X / Y axis synchronization error is less than 0.01%; the scanning speed is dynamically adjusted and the speed is automatically reduced in complex areas (such as the intersection of cutting tracks).

[0054] ② Adaptive light source adjustment technology: Automatically selects the illumination mode based on the surface reflectivity (calculated through pre-scanned grayscale values): High reflectivity areas (such as metal layers): Enable coaxial light to suppress specular reflection; Low reflectivity areas (such as silicon substrates): Enable annular dark field to enhance edge contrast.

[0055] ③ Real-time image stitching optimization: A fast stitching algorithm based on SIFT feature matching, with a single frame stitching time of <50ms; differential compensation of overlapping areas is used to eliminate image misalignment caused by mechanical vibration.

[0056] ④ Flexible adjustment: The camera angle can be flexibly adjusted through the guide rail structure to adapt to different observation needs.

[0057] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this utility model, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0058] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic detection device for the cross-section of a wafer slice driven by dual motors, characterized in that, The device includes a housing (1), the top surface of which has a rectangular groove (20). A longitudinal guide rail (6) is provided on one side of the housing (1) above the rectangular groove (20), and a transverse guide rail (7) is provided below the longitudinal guide rail (6). A longitudinal DC motor (2) is provided at one end of the longitudinal guide rail (6), and a transverse DC motor (3) is provided at one end of the transverse guide rail (7). An industrial camera (8) and an adjustable LED light (9) are provided on the bottom surface of the transverse guide rail (7), and a wafer slicing tray (5) is provided on the bottom surface of the rectangular groove (20).

2. The automatic detection device for wafer slicing cross-section driven by dual motors according to claim 1, characterized in that: A first fixing plate (13) is provided below the longitudinal guide rail (6), and a first U-shaped clamping plate (12) is provided above the first fixing plate (13). The first U-shaped clamping plate (12) is clamped on the longitudinal guide rail (6). A first fixing block (11) is provided on the top surface of the first U-shaped clamping plate (12). A first threaded rod (10) is provided at the output end of the longitudinal DC motor (2). The first threaded rod (10) passes through the first fixing block (11). The first fixing plate (13) is fixedly connected to one end of the transverse guide rail (7).

3. The automatic detection device for wafer slicing cross-section driven by dual motors according to claim 2, characterized in that: A carrier plate (17) is provided below the transverse guide rail (7). A second U-shaped clamping plate (18) is provided on the top surface of the carrier plate (17). The second U-shaped clamping plate (18) is clamped on the transverse guide rail (7). A second fixing block (19) is provided on the top surface of the second U-shaped clamping plate (18). A second threaded rod (15) is provided at the output end of the transverse DC motor (3). The second threaded rod (15) passes through the second fixing block (19).

4. The automatic detection device for wafer slicing cross-section driven by dual motors according to claim 3, characterized in that: The top surfaces of the first U-shaped card plate (12) and the second U-shaped card plate (18) are provided with limiting components.

5. The automatic detection device for wafer slicing cross-section driven by dual motors according to claim 4, characterized in that: The limiting assembly includes two limiting rods (14), which are symmetrically arranged on the top surface of the corresponding transverse guide rail (7) or longitudinal guide rail (6). The bottom surfaces of the two limiting rods (14) are symmetrically provided with locking blocks (16), which are arranged on the top surface of the corresponding first U-shaped locking plate (12) and second U-shaped locking plate (18).

6. The automatic wafer slicing cross-section detection device driven by dual motors according to claim 5, characterized in that: The top of the transverse guide rail (7), the longitudinal guide rail (6) and the rectangular groove (20) are all provided with protective covers, and a bracket (4) is provided between the top protective cover of the longitudinal guide rail (6) and the outer shell (1) of the device.

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