Light-emitting chip assembly, LED display module and LED display device

Abstract

The utility model provides a light-emitting chip assembly, an LED display module and an LED display device, and the light-emitting chip assembly comprises a mounting substrate, a light-emitting layer, a light-emitting layer and a light-emitting layer, the red light emitting chip is arranged on the front side of the mounting substrate, and the red light emitting chip is provided with a red light front surface; the blue light emitting chip is arranged on the front side of the red light emitting chip; the green light emitting chip is arranged on the front side of the red light emitting chip; wherein the blue light emitting chip and the green light emitting chip can shield part of the red light front surface. According to the technical scheme, the problem of display color deviation at different angles in the prior art can be effectively solved.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and more specifically, to a light-emitting chip assembly, an LED display module, and an LED display device. Background Technology

[0002] With the maturity of LED display technology and the expansion of its applications, users have placed higher demands on the quality of LED products, especially the color display quality of LED display devices. Currently, in related fields, large-screen direct-view LED display devices often exhibit inconsistent color display at different viewing angles (relative to the viewing angle > 60 degrees). This is primarily because the emission angle of red LED chips is approximately 120 degrees, while that of green and blue LED chips is approximately 140 degrees. At different viewing angles, the emission of red, green, and blue LED chips differs significantly, resulting in color deviation.

[0003] To solve the above problems, the following two methods are commonly used in this field: using a blue light-emitting chip to excite red phosphor instead of a red light-emitting chip. The structure formed by this method is usually a CSP structure, which has a large size, a wide half-width, low color saturation, and poor display effect; in addition, a blue light-emitting chip can be used to excite quantum dots, but this process is currently immature, the structure is greatly affected by high temperature and high humidity, the reliability is poor, and the color stability is poor after long-term use. Utility Model Content

[0004] The main objective of this invention is to provide a light-emitting chip assembly, an LED display module, and an LED display device to solve the problem of color deviation at different angles in related technologies.

[0005] To achieve the above objectives, according to one aspect of the present invention, a light-emitting chip assembly is provided, comprising: a mounting substrate; a red light-emitting chip disposed on the front side of the mounting substrate, the red light-emitting chip having a red light front surface; a blue light-emitting chip disposed on the front side of the red light-emitting chip; and a green light-emitting chip disposed on the front side of the red light-emitting chip; wherein the blue light-emitting chip and the green light-emitting chip are capable of partially blocking the red light front surface.

[0006] Furthermore, there is a distance between the projections of the blue light-emitting chip and the green light-emitting chip onto the red light front surface and the edge of the red light front surface.

[0007] Furthermore, the blue light-emitting chip and the green light-emitting chip are spaced apart in a direction parallel to the red light front surface.

[0008] Furthermore, the distance between the projection of the blue light-emitting chip onto the red light front surface and the edge of the red light front surface is greater than or equal to 50 μm and less than or equal to 100 μm.

[0009] Furthermore, the ratio of the sum of the projected areas of the blue and green light-emitting chips on the red light front surface to the surface area of ​​the red light front surface is greater than or equal to 1:3 and less than or equal to 2:3; and / or, the thickness of the red light-emitting chip is greater than or equal to 100 μm and less than or equal to 200 μm, and the thickness of both the blue and green light-emitting chips is greater than or equal to 75 μm and less than or equal to 150 μm.

[0010] Furthermore, the blue light-emitting chip has a chip body and electrodes. The chip body has a connection surface that is set opposite to the blue light front surface, the connection surface is connected to the red light front surface, and the electrodes are located on the blue light front surface.

[0011] Furthermore, the light-emitting chip assembly also includes a first conductive portion, a second conductive portion, a third conductive portion, and a fourth conductive portion located on the mounting substrate. The third conductive portion and the fourth conductive portion are both located outside the red light-emitting chip. The first conductive portion is conductively connected to the first electrode of the red light-emitting chip, the first electrode of the blue light-emitting chip, and the first electrode of the green light-emitting chip. The second conductive portion is conductively connected to the second electrode of the red light-emitting chip. The third conductive portion is conductively connected to the second electrode of the blue light-emitting chip. The fourth conductive portion is conductively connected to the second electrode of the green light-emitting chip.

[0012] Furthermore, the light-emitting chip assembly also includes bonding wires and a protective colloid portion. The bonding wires are connected between the electrode and the first conductive portion, and the protective colloid portion is connected to the mounting substrate. The bonding wires, the red light-emitting chip, the blue light-emitting chip, and the green light-emitting chip are all located within the protective colloid portion.

[0013] According to another aspect of the present invention, an LED display module is provided, comprising a plurality of light-emitting chip components, wherein the light-emitting chip components are those described above.

[0014] According to another aspect of the present invention, an LED display device is provided, including an LED display module, wherein the LED display module is the LED display module described above.

[0015] By applying the technical solution of this utility model, the mounting substrate provides a mounting base for each component of the light-emitting chip assembly. The red, blue, and green light-emitting chips can emit red, blue, and green light respectively, thereby creating a display effect similar to a "point light source" and achieving the display function. The red light-emitting chip is located on the front side of the mounting substrate and has a red light front surface. The blue and green light-emitting chips are also located in front of the red light-emitting chip. The blue and green light-emitting chips can partially block the red light front surface, allowing the red light-emitting chip to emit light from its front surface. The red light intensity is reduced, meaning the central light intensity of the red light-emitting chip is weakened. This reduces the central light intensity, increasing the emission angle of the red light-emitting chip. When the central light intensity is too high, most of the light is concentrated in the central area, resulting in a smaller emission angle. Reducing the central light intensity makes the light distribution more uniform, increasing the propagation of light to the sides and surrounding areas, thus increasing the emission angle. This makes the emission angle of the red light-emitting chip comparable to that of the blue and green light-emitting chips, ensuring consistent display colors when viewed from a normal angle or at a wide angle. Furthermore, by directly using blue and green light-emitting chips to partially block the front surface of the red light source, the light-emitting chip assembly does not need additional blocking structures, saving costs and simplifying the manufacturing process. Therefore, the technical solution of this application effectively solves the problem of color deviation at different angles in related technologies. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0017] Figure 1 A front view schematic diagram of an embodiment of the light-emitting chip assembly according to the present invention is shown;

[0018] Figure 2 It shows Figure 1 A three-dimensional structural diagram of the light-emitting chip component.

[0019] The above figures include the following reference numerals:

[0020] 10. Install the substrate;

[0021] 20. Red light-emitting chip; 21. Red light front surface;

[0022] 30. Blue light-emitting chip; 31. Chip body; 311. Blue light front surface; 32. Electrode;

[0023] 40. Green light-emitting chip;

[0024] 51. First conductive part; 52. Second conductive part; 53. Third conductive part; 54. Fourth conductive part. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0026] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0027] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0028] like Figure 1 as well as Figure 2As shown, this application provides a light-emitting chip assembly. An embodiment of the light-emitting chip assembly includes: a mounting substrate 10, a red light-emitting chip 20, a blue light-emitting chip 30, and a green light-emitting chip 40; the red light-emitting chip 20 is disposed on the front side of the mounting substrate 10, and the red light-emitting chip 20 has a red light front surface 21; the blue light-emitting chip 30 is disposed on the front side of the red light-emitting chip 20; and the green light-emitting chip 40 is disposed on the front side of the red light-emitting chip 20; wherein the blue light-emitting chip 30 and the green light-emitting chip 40 can partially block the red light front surface 21.

[0029] Applying the technical solution of this embodiment, the mounting substrate 10 provides a mounting base for each component of the light-emitting chip assembly. The red light-emitting chip 20, blue light-emitting chip 30, and green light-emitting chip 40 can emit red light, blue light, and green light respectively, thereby enabling the light-emitting chip assembly to form a display effect similar to a "point light source," thus realizing the display function. The red light-emitting chip 20 is disposed on the front side of the mounting substrate 10, and the red light-emitting chip 20 has a red light front surface 21. The blue light-emitting chip 30 and the green light-emitting chip 40 are both disposed on the front side of the red light-emitting chip 20. The blue light-emitting chip 30 and the green light-emitting chip 40 can block part of the red light front surface 21, thereby causing the red light-emitting chip 20 to emit red light from the front surface 21. The red light emitted from the front surface 21 is reduced, meaning the central light intensity of the red light-emitting chip 20 is weakened. This reduction in central light intensity increases the emission angle of the red light-emitting chip 20. When the central light intensity of the red light-emitting chip 20 is too high, most of the light is concentrated in the central area, resulting in a smaller emission angle. By reducing the central light intensity, the light distribution becomes more uniform, increasing the propagation of light to the sides and surrounding areas, thus increasing the emission angle. This makes the emission angle of the red light-emitting chip 20 comparable to that of the blue light-emitting chip 30 and the green light-emitting chip 40, ensuring consistent display colors when viewed from a normal angle or at a wide angle. Furthermore, by directly using the blue light-emitting chip 30 and the green light-emitting chip 40 to partially block the red light front surface 21, the light-emitting chip assembly does not need additional blocking structures to block the red light front surface 21, saving costs and simplifying the manufacturing process. Therefore, the technical solution of this embodiment effectively solves the problem of color deviation at different angles in related technologies.

[0030] like Figure 1 as well as Figure 2As shown, the projections of the blue light-emitting chip 30 and the green light-emitting chip 40 onto the red light front surface 21 are both spaced apart from the edge of the red light front surface 21. Specifically, the projections of the blue light-emitting chip 30 and the green light-emitting chip 40 onto the red light front surface 21 are spaced apart from the edge of the red light front surface 21, making the red light emission more uniform. In this embodiment, the red light-emitting chip 20, the blue light-emitting chip 30, and the green light-emitting chip 40 are all cuboid structures, the red light front surface 21 is a rectangular surface, and the projections of the blue light-emitting chip 30 and the green light-emitting chip 40 onto the red light front surface 21 are also rectangular surfaces. In other embodiments, the blue light-emitting chip and the green light-emitting chip can be spaced apart from the red light-emitting chip in the front-back direction.

[0031] like Figure 1 as well as Figure 2 As shown, the blue light-emitting chip 30 and the green light-emitting chip 40 are spaced apart in a direction parallel to the red light front surface 21. This arrangement allows red light to be emitted from between the blue light-emitting chip 30 and the green light-emitting chip 40, resulting in more uniform red light emission and improved display effect.

[0032] like Figure 1 as well as Figure 2 As shown, the distance between the projection of the blue light-emitting chip 30 onto the red light front surface 21 and the edge of the red light front surface 21 is greater than or equal to 50 μm and less than or equal to 100 μm. Specifically, satisfying the above-mentioned distance allows the blue light-emitting chip 30 to be more easily bonded to the red light front surface 21 via a dispensing process. The green light-emitting chip 40 also has a similar characteristic. The distance between the projection of the blue light-emitting chip 30 onto the red light front surface 21 and the edge of the red light front surface 21 can be 50 μm, 68 μm, 73 μm, 88 μm, 91 μm, or 100 μm.

[0033] like Figure 1 as well as Figure 2 As shown, the ratio of the sum of the projected areas of the blue light-emitting chip 30 and the green light-emitting chip 40 on the red light front surface to the surface area of ​​the red light front surface 21 is greater than or equal to 1:3 and less than or equal to 2:3. Specifically, satisfying the above requirements, on the one hand, can sufficiently reduce the surface area of ​​the red light front surface 21, thereby weakening the central light intensity of the red light-emitting chip 20 and increasing the emission angle of the red light-emitting chip 20; on the other hand, it does not excessively block the red light front surface 21, thereby affecting the display of red. The ratio of the sum of the projected areas of the blue light-emitting chip 30 and the green light-emitting chip 40 on the front emitting surface to the surface area of ​​the red light front surface 21 can be 1:3, 1.3:3, 1.6:3, or 2:3.

[0034] like Figure 1 as well as Figure 2As shown, the thickness of the red light-emitting chip 20 is greater than or equal to 100 μm and less than or equal to 200 μm, while the thicknesses of the blue light-emitting chip 30 and the green light-emitting chip 40 are both greater than or equal to 75 μm and less than or equal to 150 μm. Specifically, the relatively thicker red light-emitting chip 20 can increase its lateral emission, and the thickness of the red light-emitting chip 20 can be 100 μm, 123 μm, 168 μm, 189 μm, or 200 μm; the thicknesses of the blue light-emitting chip 30 and the green light-emitting chip 40 can both be 75 μm, 88 μm, 92 μm, 134 μm, or 150 μm.

[0035] like Figure 1 as well as Figure 2 As shown, the blue light-emitting chip 30 has a chip body 31 and electrodes 32. The chip body 31 has a connection surface disposed opposite to the blue light front surface 311, and the connection surface is connected to the red light front surface 21. The electrodes 32 are located on the blue light front surface 311. That is to say, the red light-emitting chip 20 is a flip-chip, while the blue light-emitting chip 30 and the green light-emitting chip 40 are upright chips, which simplifies the processing of the light-emitting chip assembly and enables the blue light-emitting chip 30 and the green light-emitting chip 40 to partially block the red light front surface 21. The electrodes 32 include a first electrode and a second electrode, one of which is a cathode and the other is an anode.

[0036] like Figure 1 as well as Figure 2 As shown, the light-emitting chip assembly also includes a first conductive portion 51, a second conductive portion 52, a third conductive portion 53, and a fourth conductive portion 54 located on the mounting substrate 10. The third conductive portion 53 and the fourth conductive portion 54 are both located outside the red light-emitting chip 20. The first conductive portion 51 is electrically connected to the first electrode of the red light-emitting chip 20, the first electrode of the blue light-emitting chip 30, and the first electrode of the green light-emitting chip 40. The second conductive portion 52 is electrically connected to the second electrode of the red light-emitting chip 20. The third conductive portion 53 is electrically connected to the second electrode of the blue light-emitting chip 30, and the fourth conductive portion 54 is electrically connected to the second electrode of the green light-emitting chip 40. This arrangement allows the red light-emitting chip 20, the blue light-emitting chip 30, and the green light-emitting chip 40 to share a cathode or anode, reducing the number of conductive portions. The placement of the first conductive portion 51, the second conductive portion 52, the third conductive portion 53, and the fourth conductive portion 54 improves the consistency of the light-emitting chip assembly.

[0037] like Figure 1 as well as Figure 2As shown, the light-emitting chip assembly also includes bonding wires and a protective colloid portion. The bonding wires connect the electrode 32 and the first conductive portion 51, and the protective colloid portion is connected to the mounting substrate 10. The bonding wires, the red light-emitting chip 20, the blue light-emitting chip 30, and the green light-emitting chip 40 are all located within the protective colloid portion. Specifically, the use of bonding wires enables the electrical connection between the blue light-emitting chip 30 and the green light-emitting chip 40 and the conductive portion; the protective colloid portion protects the bonding wires, the red light-emitting chip 20, the blue light-emitting chip 30, and the green light-emitting chip 40. The protective colloid portion can be made of epoxy resin or the like.

[0038] This application also provides an LED display module, which includes multiple light-emitting chip components, wherein the light-emitting chip group is the aforementioned light-emitting chip group. The aforementioned light-emitting chip group can effectively solve the problem of color deviation at different angles in related technologies, and the LED display module with the aforementioned light-emitting chip group also has the above-mentioned advantages.

[0039] Specifically, multiple light-emitting chip components are arranged in an array, and the mounting substrate of each light-emitting chip component is part of an integrated PCB board.

[0040] This application also provides an LED display device, which includes an LED display module, wherein the LED display module is the aforementioned LED display module. The aforementioned LED display module can effectively solve the problem of color deviation at different angles in related technologies, and the LED display device having the aforementioned LED display module also has the aforementioned advantages.

[0041] In the description of this utility model, it should be understood that "multiple" means two or more. Directional terms such as "front, back, up, down, left, right," "horizontal, vertical, perpendicular, horizontal," and "top, bottom" indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are used solely for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner or outer contours relative to the outline of each component itself.

[0042] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0043] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0044] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A light-emitting chip assembly, characterized in that, include: Mounting substrate (10); A red light-emitting chip (20) is disposed on the front side of the mounting substrate (10), and the red light-emitting chip (20) has a red light front surface (21); A blue light-emitting chip (30) is disposed on the front side of the red light-emitting chip (20); A green light-emitting chip (40) is disposed on the front side of the red light-emitting chip (20); The blue light-emitting chip (30) and the green light-emitting chip (40) can block part of the red light front surface (21).

2. The light-emitting chip assembly according to claim 1, characterized in that, The projections of the blue light-emitting chip (30) and the green light-emitting chip (40) onto the red light front surface (21) are both at a distance from the edge of the red light front surface (21).

3. The light-emitting chip assembly according to claim 2, characterized in that, The blue light-emitting chip (30) and the green light-emitting chip (40) are spaced apart in a direction parallel to the red light front surface (21).

4. The light-emitting chip assembly according to claim 2, characterized in that, The distance between the projection of the blue light-emitting chip (30) onto the red light front surface (21) and the edge of the red light front surface (21) is greater than or equal to 50 μm and less than or equal to 100 μm.

5. The light-emitting chip assembly according to claim 2, characterized in that, The ratio of the sum of the projected areas of the blue light-emitting chip (30) and the green light-emitting chip (40) on the red light front surface (21) to the surface area of ​​the red light front surface (21) is greater than or equal to 1:3 and less than or equal to 2:3; and / or, The thickness of the red light-emitting chip (20) is greater than or equal to 100 μm and less than or equal to 200 μm, and the thickness of the blue light-emitting chip (30) and the green light-emitting chip (40) are both greater than or equal to 75 μm and less than or equal to 150 μm.

6. The light-emitting chip assembly according to any one of claims 1 to 5, characterized in that, The blue light-emitting chip (30) has a chip body (31) and an electrode (32). The chip body (31) has a connection surface and a blue light front surface (311) that are set opposite to each other. The connection surface is connected to the red light front surface (21). The electrode (32) is located on the blue light front surface (311).

7. The light-emitting chip assembly according to claim 6, characterized in that, The light-emitting chip assembly further includes a first conductive portion (51), a second conductive portion (52), a third conductive portion (53), and a fourth conductive portion (54) located on the mounting substrate (10). The third conductive portion (53) and the fourth conductive portion (54) are both located outside the red light-emitting chip (20). The first conductive portion (51) is conductively connected to the first electrode of the red light-emitting chip (20), the first electrode of the blue light-emitting chip (30), and the first electrode of the green light-emitting chip (40). The second conductive portion (52) is conductively connected to the second electrode of the red light-emitting chip (20). The third conductive portion (53) is conductively connected to the second electrode of the blue light-emitting chip (30). The fourth conductive portion (54) is conductively connected to the second electrode of the green light-emitting chip (40).

8. The light-emitting chip assembly according to claim 7, characterized in that, The light-emitting chip assembly also includes bonding wires and a protective colloid portion. The bonding wires are connected between the electrode (32) and the first conductive portion (51). The protective colloid portion is connected to the mounting substrate (10). The bonding wires, the red light-emitting chip (20), the blue light-emitting chip (30), and the green light-emitting chip (40) are all located within the protective colloid portion.

9. An LED display module, comprising multiple light-emitting chip components, characterized in that, The light-emitting chip assembly is the light-emitting chip assembly according to any one of claims 1 to 8.

10. An LED display device, comprising an LED display module, characterized in that, The LED display module is the LED display module as described in claim 9.

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