Shock-resistant flexible package buffer structure of microelectronic product

Abstract

The utility model relates to the technical field of electronic product packaging, in particular to a microelectronic product anti-vibration flexible package buffering structure which comprises a packaging box with a one-way opening in the top end, a storage groove used for storing microelectronic equipment is formed in the top end of the packaging box, and a flocking layer is laid in the storage groove. Through the arrangement of the packaging box, the storage groove, the flocking layer, the inserting groove, the partition plate piece, the buffering air bag, the cover plate mechanism and other components, the flocking layer and the storage groove are attached, the inserting groove and the partition plate piece are connected in an inserted mode, and the partition plate piece and the buffering air bag are fixedly connected; the buffering air bag can absorb and disperse impact force acting on packaging through elastic deformation of the buffering air bag, meanwhile, the cover plate mechanism covers the top end of the packaging box in a rotating mode, microelectronic equipment is sealed and protected, and the service life of the microelectronic equipment is prolonged. Therefore, the device can perform effective anti-seismic protection on the screened microelectronic equipment through cooperation of the components.

Description

Technical Field

[0001] This application relates to the field of electronic product packaging technology, and in particular to a shock-resistant soft packaging cushioning structure for microelectronic products. Background Technology

[0002] With the rapid development of electronic technology, microelectronic products have been widely used in people's lives and work. However, microelectronic products are usually precise in structure, small in size and expensive. During transportation and storage, they are easily damaged by external forces such as vibration and impact. Traditional packaging methods, such as simple cardboard boxes or adding a small amount of cushioning material, cannot provide sufficient shock protection for microelectronic products. Although some existing cushioning packaging structures can play a certain role in shock resistance, most of them have problems such as complex structure, high cost and unsatisfactory cushioning effect. Therefore, designing a soft packaging cushioning structure for microelectronic products that is simple in structure, low in cost and has good shock resistance is of great practical significance.

[0003] A search revealed Chinese Patent Publication No. CN217049826U, which discloses an electronic product packaging box, including an upper cover, a lower cover, and a support. The support includes a first support and a second support. The back of the electronic product is connected to the first support, and the camera of the electronic product can protrude from the camera receiving hole on the first support. The first support and the second support are rotatably connected, allowing the first support to rotate parallel to the second support to wrap the electronic product between the first and second supports; or allowing the first support to rotate at an angle relative to the second support to support the electronic product. Thus, the packaging box itself can provide support for the electronic product during viewing or use, enabling the packaging box to not only protect and wrap the electronic product but also serve as a support after the packaging box is opened, thereby achieving reuse of the packaging box and improving its practicality.

[0004] Regarding the aforementioned technologies, the inventors have discovered the following drawbacks: traditional packaging methods, such as simple cardboard boxes or adding a small amount of cushioning material, cannot provide sufficient shock protection for microelectronic products. Although some existing cushioning packaging structures can provide some shock resistance, most of them suffer from problems such as complex structure, high cost, and unsatisfactory cushioning effect. Utility Model Content

[0005] In order to solve the problems mentioned in the background art, this application provides a shock-resistant soft packaging cushioning structure for microelectronic products.

[0006] This application provides a shock-resistant soft packaging cushioning structure for microelectronic products, which adopts the following technical solution: A shock-resistant soft packaging cushioning structure for microelectronic products includes a packaging box with a one-way opening at the top, and the top of the packaging box is provided with a storage slot for storing microelectronic devices.

[0007] The storage tank is lined with a flocked layer, and slots are arranged in a straight line on both the flocked layer and the inside of the storage tank. A partition is inserted into the slot, and a buffer airbag filled with gas is fixedly connected to the front and rear sides of the partition. A cover mechanism is rotatably connected to the top of the packaging box.

[0008] Optionally, a longitudinally arranged rubber strip is provided on the bottom surface of the packaging box. The cross-section of the rubber strip is circular, and there are two rubber strips in total.

[0009] Optionally, the two rubber strips are fixedly connected in a horizontal array to the left and right sides of the bottom surface of the packaging box, and grooves are provided on both the front and back sides of the right end of the packaging box.

[0010] Optionally, an accessory box is inserted into the groove on the right end face of the packaging box, and a cardboard sealing plate is fixedly connected to the right side face of the accessory box.

[0011] Optionally, the encapsulation plate is embedded in the groove on the right side of the packaging box, and the inside of the accessory box is also provided with an accessory slot for placing charging cable accessories.

[0012] Optionally, the cover plate mechanism is a double-layer cardboard pressing structure, and the inside of the cover plate mechanism is also fixedly connected with a corrugated structure shock-resistant layer in a linear array.

[0013] Optionally, a sealing strip is fixedly connected to the right side of the cover plate mechanism, and the sealing strip wraps around the sealing plate to the right.

[0014] Optionally, the packaging strip is provided in two places, and adhesive tape is fixedly connected to the side of the packaging strip away from the cover plate mechanism. The adhesive tape is used to bond to the bottom surface of the packaging box.

[0015] In summary, this application includes the following beneficial technical effects:

[0016] This invention incorporates components such as a packaging box, storage tank, flocked layer, slot, partition, cushioning airbag, and cover mechanism. Through the close fit between the flocked layer and storage tank, the insertion of the slot and partition, and the fixed connection between the partition and cushioning airbag, the cushioning airbag absorbs and disperses the impact force acting on the packaging through its elastic deformation. Simultaneously, the cover mechanism rotates to cover the top of the packaging box, providing sealed protection for the microelectronic equipment. Thus, this device achieves effective shockproof protection for the selected microelectronic equipment through the coordinated operation of these components.

[0017] This utility model incorporates components such as a packaging box, rubber strip, accessory box, sealing plate, accessory slot, sealing tape, and adhesive tape. Through the fixed relationship between the rubber strip and the bottom of the packaging box, the insertion relationship between the accessory box and the groove on the right side of the packaging box, the connection relationship between the sealing plate and the groove and accessory box, the winding relationship between the sealing tape and the cover mechanism and the sealing plate, and the bonding relationship between the adhesive tape and the bottom surface of the packaging box, the rubber strip can buffer the impact force transmitted from the bottom through its elasticity. The accessory box can be stably placed by the sealing plate and can store accessories. The sealing tape and adhesive tape can disperse the impact force of the entire packaging structure through their mutual cooperation. Thus, this device, through the cooperation of these components, provides shockproof protection for selected microelectronic devices while simultaneously storing accessories, improving overall practicality. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure after disassembly in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the overall structure after assembly in the embodiments of this application;

[0020] Figure 3 This is a schematic diagram of the combination of packaging box and storage tank in an embodiment of this application;

[0021] Figure 4 This is a structural schematic diagram of the combination of the cover plate mechanism and the seismic layer in the embodiments of this application.

[0022] Figure 5 This is a schematic diagram of the combined structure from a bottom to a side view in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the split left view in an embodiment of this application.

[0024] Reference numerals: 1. Packaging box; 101. Rubber strip; 1011. Accessory box; 1012. Encapsulation plate; 1013. Accessory slot; 2. Storage slot; 201. Flocked layer; 2011. Slot; 2012. Partition; 2013. Buffer airbag; 3. Cover mechanism; 301. Shock-resistant layer; 3011. Encapsulation tape; 3012. Adhesive tape. Detailed Implementation

[0025] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0026] This application discloses a shock-resistant soft packaging cushioning structure for microelectronic products. For example... Figure 1-6As shown, a shock-resistant soft packaging cushioning structure for microelectronic products includes a packaging box 1 with a one-way opening at the top. A longitudinally arranged rubber strip 101 with a circular cross-section is provided on the bottom surface of the packaging box 1. Two rubber strips 101 are arranged in a horizontal array and fixedly connected to the left and right sides of the bottom surface of the packaging box 1. Grooves are provided on both the front and rear sides of the right end of the packaging box 1. Two circular cross-section rubber strips 101 are arranged horizontally on both sides of the bottom surface of the packaging box 1. When the packaging is subjected to vibration, the rubber strips 101 utilize their elasticity to cushion the impact force from the bottom. Furthermore, they increase the friction between the packaging and the placement surface during placement, reducing slippage of the packaging box 1, improving stability, and further enhancing the shock resistance protection for the microelectronic equipment. A storage slot 2 for storing the microelectronic equipment is provided at the top of the packaging box 1.

[0027] The interior of the storage tank 2 is lined with a flocked layer 201. Both the flocked layer 201 and the interior of the storage tank 2 have slots 2011 arranged in a straight line. A partition 2012 is inserted into the slot 2011. A buffer airbag 2013 filled with gas is fixedly connected to the front and rear sides of the partition 2012. The top of the packaging box 1 is rotatably connected to a cover mechanism 3. The cover mechanism 3 is a double-layer cardboard pressing structure. The interior of the cover mechanism 3 is also fixedly connected in a straight line with a corrugated shock-absorbing layer 301. A sealing tape 3011 is fixedly connected to the right side of the cover mechanism 3. The sealing tape 3011 wraps around the sealing plate 1012 to the right. The cover mechanism 3 is a double-layer cardboard pressing structure with a shock-absorbing layer 301. The right side of the cover mechanism 3 has a sealing tape 3011. The double-layer cardboard and shock-resistant layer 301 can enhance the strength of the cover plate mechanism 3. The corrugated structure of the shock-resistant layer 301 can effectively disperse the impact force. The encapsulation tape 3011 wraps the encapsulation plate 1012, which can not only fix the cover plate mechanism 3, but also absorb some energy through its own tensile deformation when subjected to lateral impact, thus providing shock resistance.

[0028] The packaging box 1 has a storage slot 2, which contains a flocked layer 201, a slot 2011, a partition 2012, and a cushioning airbag 2013. It is also connected to a cover mechanism 3. These components work together. The flocked layer 201 can protect the surface of the microelectronic device. The slot 2011 and the partition 2012 can fix the position of the device. When the cushioning airbag 2013 is impacted, it absorbs the impact force through its own gas compression deformation. The cover mechanism 3 can block foreign objects from the outside, thus playing a shockproof and protective role for the microelectronic device.

[0029] Please see Figure 6An accessory box 1011 is inserted into a groove on the right side of the packaging box 1. A cardboard sealing plate 1012 is fixedly connected to the right side of the accessory box 1011. The sealing plate 1012 is embedded in the groove on the right side of the packaging box 1. The accessory box 1011 also has an accessory slot 1013 for placing charging cables and other accessories inside. The accessory box 1011 is inserted into the groove on the right side of the packaging box 1. The accessory box 1011 has a sealing plate 1012 and an accessory slot 1013 inside. This design not only facilitates the storage of accessories such as charging cables, but also makes the accessory box 1011 stable by using the way the sealing plate 1012 is embedded in the groove, preventing the accessories from shaking and colliding during transportation. At the same time, it enhances the structural strength of the right side of the packaging box 1 to a certain extent and helps to resist shock.

[0030] Please see Figure 5 The sealing tape 3011 has two locations, and each of the two sealing tapes 3011 has an adhesive tape 3012 fixedly connected to the side away from the cover mechanism 3. The adhesive tape 3012 is used to bond to the bottom surface of the packaging box 1. The two sealing tapes 3011, with adhesive tape 3012 on the side away from the cover mechanism 3, are used to bond to the bottom surface of the packaging box 1. This ensures that the cover mechanism 3 is tightly fixed to the packaging box 1, preventing the cover mechanism 3 from accidentally opening during transportation. Moreover, when the packaging is subjected to impacts from various directions, the sealing tape 3011 and adhesive tape 3012 work together to disperse the impact force throughout the packaging structure, improving the overall shock resistance.

[0031] The implementation principle of the shockproof soft packaging cushioning structure for microelectronic products in this application embodiment is as follows: When it is necessary to package microelectronic products, the microelectronic products are first placed in the storage slot 2 at the top of the packaging box 1. The flocked layer 201 inside the storage slot 2 can prevent the surface of the microelectronic products from directly contacting the storage slot 2 and prevent scratch damage. The slots 2011 arranged in a straight line array inside the flocked layer 201 and the storage slot 2 are used to insert partitions 2012. The user can adjust the number and position of the partitions 2012 according to the size and shape of the microelectronic products, so as to better fix the microelectronic products and restrict their movement in the storage slot 2.

[0032] The buffer airbags 2013, which are fixedly connected to the front and rear sides of the partition 2012, can play a buffering role if the packaging is subjected to external vibration or impact during transportation or storage. When the impact force is applied to the packaging, the buffer airbags 2013 will undergo elastic deformation, and absorb and disperse the impact force through the compression and expansion of the gas, thereby reducing the impact on microelectronic devices.

[0033] After the microelectronic device is properly placed, rotate the cover mechanism 3 to cover the top of the packaging box 1 to seal and protect the microelectronic device. The cover mechanism 3 is a double-layer cardboard pressing structure with a corrugated structure shock-resistant layer 301 fixedly connected in a straight array inside, which can enhance the overall strength of the cover mechanism 3. When external impact force acts on the cover mechanism 3, the corrugated structure shock-resistant layer 301 can effectively disperse the impact force and further protect the microelectronic device.

[0034] Two rubber strips 101 are longitudinally arranged on the bottom surface of the packaging box 1. The cross-section is circular and they are horizontally arrayed and fixed on the left and right sides of the bottom surface. During handling or transportation, when the packaging is subjected to vibration or impact from the bottom, the rubber strips 101 can buffer the impact force from the bottom due to their good elasticity. At the same time, the rubber strips 101 can also increase the friction between the packaging and the placement surface, making the packaging box 1 more stable when placed, reducing slippage, and avoiding damage to microelectronic devices caused by accidental slippage.

[0035] The accessory box 1011, which is inserted into the groove on the right side of the packaging box 1, is used to store accessories such as charging cables. The encapsulation plate 1012, which is fixedly connected to the right side of the accessory box 1011, is embedded in the groove on the right side of the packaging box 1, so that the accessory box 1011 can be placed stably. The accessory slot 1013 opened inside the accessory box 1011 makes it convenient to classify and store accessories, and avoids the accessories from shaking and colliding during transportation. Moreover, the accessory box 1011 and the encapsulation plate 1012 enhance the structural strength of the right side of the packaging box 1 to a certain extent, and help the overall packaging to play a shockproof role.

[0036] Two encapsulation tapes 3011 are fixedly connected to the right side of the cover mechanism 3, wrapping around the encapsulation plate 1012 to the right. Adhesive tapes 3012 are fixedly connected to the side of the encapsulation tapes 3011 away from the cover mechanism 3. The adhesive tapes 3012 are bonded to the bottom surface of the packaging box 1. This design ensures that the cover mechanism 3 is tightly fixed to the packaging box 1, preventing the cover mechanism 3 from being accidentally opened during transportation. When the packaging is impacted from all directions, the encapsulation tapes 3011 and adhesive tapes 3012 work together to disperse the impact force throughout the packaging structure, further improving the overall shock resistance and providing all-round protection for microelectronic devices.

[0037] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A shock-resistant soft packaging cushioning structure for microelectronic products, comprising a packaging box (1) with a one-way opening at the top, characterized in that: The top of the packaging box (1) is provided with a storage slot (2) for storing microelectronic devices. The storage tank (2) is lined with a flocked layer (201). Both the flocked layer (201) and the storage tank (2) are arranged in a straight line with slots (2011). A partition (2012) is inserted into the slot (2011). A buffer airbag (2013) filled with gas is fixedly connected to the front and rear sides of the partition (2012). The top of the packaging box (1) is rotatably connected to a cover mechanism (3).

2. The shock-resistant soft packaging cushioning structure for microelectronic products according to claim 1, characterized in that: The bottom surface of the packaging box (1) is provided with a longitudinally arranged rubber strip (101). The cross-section of the rubber strip (101) is circular, and there are two rubber strips (101).

3. The shock-resistant soft packaging cushioning structure for microelectronic products according to claim 2, characterized in that: The two rubber strips (101) are fixedly connected in a horizontal array to the left and right sides of the bottom surface of the packaging box (1). The right side of the packaging box (1) has grooves on both the front and back sides.

4. The shock-resistant soft packaging cushioning structure for microelectronic products according to claim 3, characterized in that: An accessory box (1011) is inserted into the groove on the right end face of the packaging box (1), and a cardboard packaging board (1012) is fixedly connected to the right side face of the accessory box (1011).

5. The shock-resistant soft packaging cushioning structure for microelectronic products according to claim 4, characterized in that: The encapsulation plate (1012) is embedded in the groove on the right side of the packaging box (1), and the accessory box (1011) also has an accessory slot (1013) for placing charging cable accessories.

6. The shock-resistant soft packaging cushioning structure for microelectronic products according to claim 1, characterized in that: The cover plate mechanism (3) is a double-layer cardboard pressing structure, and the inside of the cover plate mechanism (3) is also fixedly connected in a linear array with a corrugated anti-vibration layer (301).

7. The shock-resistant soft packaging cushioning structure for microelectronic products according to claim 1, characterized in that: A sealing strip (3011) is fixedly connected to the right side of the cover plate mechanism (3), and the sealing strip (3011) wraps around the sealing plate (1012) to the right.

8. The shock-resistant soft packaging cushioning structure for microelectronic products according to claim 7, characterized in that: The packaging strip (3011) is provided in two places. On the side of the two packaging strips (3011) that is away from the cover plate mechanism (3), an adhesive strip (3012) is fixedly connected. The adhesive strip (3012) is used to bond to the bottom surface of the packaging box (1).

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