High-speed cable switching fixing structure and optical module

Abstract

The utility model relates to a high-speed cable switching and fixing structure, which is characterized in that a base is pressed on an insulating part and is welded with a grounding bonding pad on a PCB (Printed Circuit Board), an upper cover seals and covers a plurality of compartments on the base, and two cable cards are arranged in each compartment side by side; the middle area of the wire clamp is wrapped by the insulating part, the front and rear ends of the two wire clamps are respectively arranged outside the insulating part, and the sectional area size of the middle area of the wire clamp is smaller than that of the front and rear ends of the wire clamp; the front ends of the two wire clamps are respectively welded with the two signal bonding pads, and the two signal wires of each high-speed cable are respectively and horizontally welded with the rear ends of the two wire clamps in one compartment on the base after the protective layer is stripped. The base, the ground wire exposed in the high-speed cable and the copper / aluminum foil exposed in the high-speed cable are welded in a laser welding mode. The beneficial effects are that the sectional area of the wire clamp exposed in the air is larger than the sectional area of the wire clamp wrapped by the insulating part, so that the impedance can be kept at a balance value, and the impedance increase caused by excessive dispensing does not need to be considered.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to a high-speed cable adapter fixing structure and an optical module. Background Technology

[0002] In traditional optical modules, the signal and ground lines of high-speed cables are called dual-core coaxial cables with ground wires. These cables have two signal lines and two ground wires (with the ground wires located outside the two signal lines), all directly soldered to the PCB board. The disadvantage of this method is that after soldering, UV adhesive must be applied and cured with an ultraviolet lamp to prevent the signal lines from detaching and affecting performance. If too much adhesive is applied during the adhesive application process, it will affect the impedance, thus impacting the optical module's performance. This problem has a smaller impact on low-speed optical modules such as 10G, 25G, 40G, 100G, and 200G, but a significant impact on high-speed optical modules such as 800G and 1600G. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a high-speed cable adapter fixing structure and optical module to overcome the shortcomings of the prior art.

[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0005] A high-speed cable adapter fixing structure includes: a PCB board, on which at least one insulating component is arranged along its length. Each insulating component is pressed by a base that covers it and is welded to a grounding pad on the PCB board. Each base has multiple rows of independent compartments in the area where the insulating component is pressed. A cover is fixed on each base to seal all the compartments thereon. Two signal pads are provided in the area enclosed by each compartment on the PCB board. Two line clips are arranged side by side in each compartment. The middle area of ​​the line clips is wrapped by the insulating component. The front and rear ends of the two line clips are outside the insulating component, and the cross-sectional area of ​​the middle area of ​​the line clips is smaller than that of the front and rear ends. The front ends of the two line clips are welded to the two signal pads respectively. After the protective layer of each high-speed cable is stripped, the two signal lines are horizontally welded to the rear ends of the two line clips in one of the compartments on the base. The base, the exposed ground wire in the high-speed cable, and the exposed copper / aluminum foil in the high-speed cable are welded together by laser welding.

[0006] The beneficial effects of this utility model are:

[0007] 1) This fixing structure does not require glue application, so there is no need to consider the impedance increase caused by excessive glue application, thus ensuring that it does not affect the performance of the high-speed optical module.

[0008] 2) A specially designed base, with each high-speed cable in its own independent compartment, combined with a cover, effectively prevents interference between signal lines in the high-speed cable;

[0009] 3) After the protective layer of the high-speed cable is stripped, the two signal lines are horizontally soldered to two line clips in one of the compartments on the base. By introducing the line clips, the signal lines do not need to be bent, which prevents stress from causing the signal pads to be scrapped. At the same time, the signal lines can be cut relatively short to reduce impedance, which is better for the signal and ensures performance.

[0010] 4) Only the middle area of ​​the line card is wrapped by the insulating material, while the front and rear ends of the line card are outside the insulating material, meaning that the front and rear ends of the line card are exposed to the air. Then, the cross-sectional area of ​​the middle area of ​​the line card is smaller than the cross-sectional area of ​​its front and rear ends. By making the cross-sectional area of ​​the line card exposed to the air larger than the cross-sectional area wrapped by the insulating material, the impedance can be kept at a balanced value, thereby optimizing the impedance and facilitating signal transmission. Furthermore, since the cross-sectional area of ​​the middle area of ​​the line card is smaller than the cross-sectional area of ​​its front and rear ends, the insulating material can be used to lock the line card in place, preventing the line card from being pulled off after it is soldered to the signal pads on the PCB.

[0011] Based on the above technical solution, the present invention can be further improved as follows.

[0012] Furthermore, the outer surfaces of the areas at the rear ends of the two line cards located in the same compartment, which are used to solder the signal lines, are bent and extended a distance away from the PCB board.

[0013] The further beneficial effects of adopting the above are: it allows the signal line to make effective contact with the line card, avoiding signal distortion, and resistance welding can be used for soldering.

[0014] Furthermore, the line card has a Z-shaped structure, and the length of the horizontally distributed pin segments at the front end of the line card is greater than the length of the signal pads.

[0015] The further beneficial effects of adopting the above are: designing the line card with a Z-shaped structure, and making the length of the horizontally distributed pin segment at the front end of the line card larger than the length of the signal pad, so that the pin segment can act as an elastic buffer area to prevent excessive stress after being soldered to the signal pad on the PCB board.

[0016] Furthermore, a limiting hole is provided between the base and the top cover at each corresponding compartment. The end of the high-speed cable enters the limiting hole and, after the protective layer of the two signal lines is stripped, is horizontally soldered to the rear end of the two line clips in the compartment corresponding to the limiting hole.

[0017] The further beneficial effect of adopting the above is that the high-speed cable is limited by the limiting hole, which effectively reduces the risk of the high-speed cable becoming loose.

[0018] Furthermore, the base has a limiting surface in each limiting hole to limit the end face of the high-speed cable protective sleeve. The exposed ground wire end face of the high-speed cable abuts against the limiting surface. The copper / aluminum foil of the high-speed cable in the protective sleeve within the limiting hole is exposed. The top cover has a soldering hole between two adjacent high-speed cables, corresponding to the exposed ground wire and copper / aluminum foil of each high-speed cable. The base material is copper-plated tin, and the top cover material is copper-plated tin. Solder paste is added to the soldering hole, and the solder paste is used to weld the top cover, base, exposed ground wire and exposed copper / aluminum foil of the high-speed cable into one piece by laser welding.

[0019] The further beneficial effects of adopting the above are as follows: solder paste can be added through the solder filling hole, and the solder paste can be melted into a liquid state by laser welding. Then it flows through the top cover, base, exposed ground wire in the high-speed cable, and exposed copper / aluminum foil in the high-speed cable, and then solidifies, thereby making the top cover, base, exposed ground wire in the high-speed cable, and exposed copper / aluminum foil in the high-speed cable welded together as one, resulting in higher assembly efficiency and better reliability.

[0020] Furthermore, the base has a groove at each corresponding solder hole that connects two adjacent limiting holes, and the ground wire and copper / aluminum foil exposed in the high-speed cable inside the limiting hole are located near the groove.

[0021] The further beneficial effects of the above are as follows: when solder paste is added to the soldering hole and melts into a liquid state, the liquid solder paste can flow into the limiting hole through the groove, and first flow through the exposed ground wire on one side of the high-speed cable to the exposed copper / aluminum foil of the high-speed cable, and then flow to the exposed ground wire on the other side of the high-speed cable, and then solidify, thereby making the top cover, base, exposed ground wire in the high-speed cable and exposed copper / aluminum foil 630 in the high-speed cable welded together as one, making the welding process more convenient.

[0022] Furthermore, on the surface of the base away from the PCB board, there is a first limiting groove at each corresponding compartment, one end of which is connected to the compartment and the other end of which passes through the side of the base. On the surface of the top cover adjacent to the PCB board, there is a second limiting groove at each corresponding first limiting groove. The first limiting groove on the base and the second limiting groove on the top cover together form a limiting hole.

[0023] The further beneficial effect of adopting the above method is that the limiting hole can be formed by assembly, which reduces the processing difficulty.

[0024] Furthermore, the base has multiple solder blocks along the width of the PCB board, and the top cover has a solder hole for accommodating each solder block.

[0025] The further beneficial effects of the above are: solder paste can be added through the soldering hole, and the solder paste can be melted into a liquid state first and then solidified by laser welding, so that the top cover and the base are fused together as one piece.

[0026] Furthermore, the insulating component is made of plastic, and the wire clip and the insulating component are integrally molded using injection molding.

[0027] The further beneficial effects of adopting the above are: reducing the processing difficulty, while ensuring the firmness of the assembly between the wire clip and the insulation component.

[0028] Based on the above technical solution, this utility model also provides an optical module, including the above-mentioned high-speed cable adapter and fixing structure.

[0029] The further beneficial effect of adopting the above is that it ensures that the performance of the high-speed optical module is not affected. Attached Figure Description

[0030] Figure 1 This is a structural diagram of the high-speed cable adapter fixing structure of this utility model;

[0031] Figure 2 This is a structural diagram of the high-speed cable adapter fixing structure of this utility model after removing the top cover;

[0032] Figure 3 This is a structural diagram of the high-speed cable adapter fixing structure of this utility model after removing the top cover and base;

[0033] Figure 4 for Figure 3 Partial structural diagram;

[0034] Figure 5 for Figure 4 Partial structural diagram;

[0035] Figure 6 An exploded first-person view of the base, cable clips, top cover, and high-speed cable;

[0036] Figure 7 A second-person exploded view of the base, cable clips, top cover, and high-speed cable;

[0037] Figure 8 This is an exploded view of the base, cable clips, and top cover.

[0038] The attached diagram lists the components represented by each number as follows:

[0039] 1. PCB board, 110. Grounding pad, 120. Signal pad, 2. Insulator, 3. Base, 310. Compartment, 320. Groove, 330. First limiting groove, 331. Limiting surface, 340. Solder block, 4. Wire clip, 5. Top cover, 510. Soldering hole, 520. Second limiting groove, 530. Soldering hole, 540. Ramp, 6. High-speed cable, 610. Signal line, 620. Ground line, 630. Copper / aluminum foil. Detailed Implementation

[0040] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0041] Example 1

[0042] like Figures 1 to 8 As shown, a high-speed cable adapter fixing structure includes:

[0043] A PCB board 1 has at least one insulating component 2 arranged along its length. The number of insulating components 2 can be one, two, three, four, etc. Each insulating component 2 is pressed against a base 3 that covers it and is welded to a grounding pad 110 on the PCB board 1. That is, the surface of the base 3 adjacent to the PCB board 1 has an assembly groove to accommodate the insulating component 2. Therefore, the base 3 can press the insulating component 2 while simultaneously welding it to the grounding pad 110 on the PCB board 1. During assembly, the insulating component 2 is first placed on the PCB board 1, and then the base 3 is used to press the insulating component 2 down. By introducing the insulating component 2, subsequent assembly is performed on the insulating component 2. After the line card 4 is soldered to the signal pad 120 on the PCB board 1, it can prevent the line card 4 from being pulled off. The base 3 is soldered to the grounding pad 110 on the PCB board 1 to achieve grounding. The base 3 is made of metal. The insulating parts 2 and the base 3 on the PCB board 1 are arranged in rows along the length of the PCB board 1. Since the high-speed cable group composed of multiple high-speed cables 6 is arranged in rows along the width of the PCB board 1, the number of high-speed cables 6 in each high-speed cable group can be four or six, or other numbers. Therefore, the length direction of the insulating parts 2 and the base 3 is preferably distributed along the width direction of the PCB board 1.

[0044] Each base 3 has multiple rows of independent compartments 310 in the area of ​​the pressure insulation 2. Each compartment 310 can be understood as a hole that penetrates the upper and lower surfaces of the base 3. The multiple compartments 310 on each base 3 are preferably arranged in rows along the width direction of the PCB board 1. The number of compartments 310 on the base 3 is determined by the number of high-speed cables 6 in the high-speed cable group 6. For example, if each high-speed cable group has four or six high-speed cables 6, then the base 3 adapted to the high-speed cable group will have four or six compartments 310.

[0045] Each base 3 is fixed with a top cover 5 that seals all the compartments 310 thereon. Because the top cover 5 seals the compartments 310, the fit between the base 3 and the top cover 5 forms a shielding cavity at each compartment 310. Two signal pads 120 are provided on the PCB board 1 within the area enclosed by each compartment 310. Two wire clips 4 are arranged side-by-side in each compartment 310, and the middle area of ​​each wire clip 4 is wrapped by an insulating component 2, thus securing the wire clip 4. The front and rear ends of the two wire clips 4 are located outside the insulating component 2, and the cross-sectional area of ​​the middle area of ​​each wire clip 4 is smaller than that of its front end and smaller than that of its rear end. With a small cross-sectional area, the front ends of the two line clips 4 are respectively soldered to the two signal pads 120. The line clips 4 are made of metal. After the protective layer (insulating medium) is stripped, the two signal lines 610 of each high-speed cable 6 are horizontally soldered to the rear ends of the two line clips 4 in one of the compartments 310 on the base 3. The high-speed cable 6 is located between the upper cover 5 and the base 3. The base 3, the exposed ground wire 620 in the high-speed cable 6, and the exposed copper / aluminum foil 630 in the high-speed cable 6 are soldered together by laser welding. Since the base 3 is grounded, when the ground wire 620 is soldered to the base 3, the ground wire 620 in the high-speed cable 6 is also grounded.

[0046] Example 2

[0047] like Figure 4 , Figure 5 As shown, this embodiment is a further improvement on embodiment 1, as detailed below:

[0048] The outer side of the area at the rear end of the two line cards 4 located in the same compartment 310, which is used to solder the signal line 610, is bent and extended a distance away from the PCB board 1, thereby forming an extension section that allows the signal line 610 to make effective contact with the line card 4 and avoids signal distortion. Resistance soldering can be used for soldering.

[0049] Furthermore: Line card 4 is preferably a Z-shaped structure, and the length of the horizontally distributed pin segment at the front end of line card 4 is greater than the length of the signal pad 120. In this embodiment, line card 4 is designed as a Z-shaped structure, and the length of the horizontally distributed pin segment at the front end of line card 4 is greater than the length of the signal pad 120, so that the pin segment can act as an elastic buffer area to prevent excessive stress after it is soldered to the signal pad 120 on PCB board 1. It can be understood that the longer the pin segment, the more flexible line card 4 is, and the soldering can be slightly deformed. The shorter the pin segment, the less flexible it is. If there are tolerance reasons, the gap between line card 4 and signal pad 120 will be too large, which may lead to the risk of forming a cold solder joint. Under normal circumstances, the length of the horizontally distributed pin segment at the front end of line card 4 is preferably about twice the length of the signal pad 120.

[0050] Example 3

[0051] like Figure 1 , Figure 6 , Figure 7 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below:

[0052] A limiting hole is provided between the base 3 and the top cover 5 at each corresponding compartment 310. The end of the high-speed cable 6 enters the limiting hole and after the protective layer of the two signal lines 610 is stripped, it is horizontally welded to the rear end of the two wire clips 4 in the compartment 310 corresponding to the limiting hole. The limiting hole limits the high-speed cable 6, effectively reducing the risk of the high-speed cable 6 loosening (usually referring to rotation). The cross-sectional area of ​​the limiting hole is determined according to the cross-sectional area of ​​the high-speed cable 6 with the protective sleeve, and the two are usually consistent.

[0053] Example 4

[0054] like Figure 2 , Figure 7 , Figure 8 As shown, this embodiment is a further improvement on embodiment 3, as detailed below:

[0055] The base 3 has a limiting surface 331 in each limiting hole to limit the end face of the protective sleeve of the high-speed cable 6. The exposed ground wire 620 end face of the high-speed cable 6 abuts against the limiting surface 331. The copper / aluminum foil 630 of the protective sleeve of the high-speed cable 6 in the limiting hole is exposed. The top cover 5 has a soldering hole 510 between two adjacent high-speed cables 6, corresponding to the exposed ground wire 620 and copper / aluminum foil 630 of each high-speed cable 6. The top cover 5 is preferably made of tin-plated copper, and the base 3 is preferably made of tin-plated copper. In practical applications, it is not ruled out that the base 3 and the top cover 5 may be made of other metal materials. This is just an example. Solder paste can be added through the solder hole 510. The solder paste can be melted into a liquid state by laser welding. Then it flows through the top cover 5, the base 3, the exposed ground wire 620 in the high-speed cable 6, and the exposed copper / aluminum foil 630 in the high-speed cable 6, and then solidifies, thereby fusing the top cover 5, the base 3, the exposed ground wire 620 in the high-speed cable 6, and the exposed copper / aluminum foil 630 in the high-speed cable 6 into one piece.

[0056] Furthermore, the base 3 has a groove 320 at each corresponding soldering hole 510 that connects two adjacent limiting holes. The groove 320 is adjacent to the exposed ground wire 620 and copper / aluminum foil 630 in the high-speed cable 6 within the limiting hole. When solder paste is added to the soldering hole 510 and melts into a liquid state, the liquid solder paste can flow into the limiting hole through the groove 320. It first flows through the exposed ground wire 620 on one side of the high-speed cable 6 to the exposed copper / aluminum foil 630 of the high-speed cable 6, and then flows to the exposed ground wire 620 on the other side of the high-speed cable 6, and then solidifies. This allows the top cover 5, the base 3, the exposed ground wire 620 in the high-speed cable 6, and the exposed copper / aluminum foil 630 in the high-speed cable 6 to be fused together as one unit.

[0057] Example 5

[0058] like Figure 6 , Figure 7 , Figure 8 As shown, this embodiment is a further improvement on embodiment 3 or 4, as detailed below:

[0059] On the surface of the PCB board 1 on the back of the base 3, a first limiting groove 330 is provided at each corresponding compartment 310, with one end communicating with the compartment 310 and the other end penetrating through the side of the base 3. On the surface of the top cover 5 adjacent to the PCB board 1, a second limiting groove 520 is provided at each corresponding first limiting groove 330. The first limiting groove 330 on the base 3 and the second limiting groove 520 on the top cover 5 together form a limiting hole, that is, the limiting hole can be formed by assembly, reducing the processing difficulty.

[0060] Example 6

[0061] like Figure 7 , Figure 8 As shown, this embodiment is a further improvement on any one of embodiments 1 to 5, as detailed below:

[0062] The base 3 has multiple solder blocks 340 along the width of the PCB board 1. The top cover 5 has a solder hole 530 for each solder block 340. Solder paste can be added through the solder hole 530. The solder paste can be melted into liquid by laser welding and then solidified so that the top cover 5 and the base 3 are fused together.

[0063] Example 7

[0064] like Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 8 As shown, this embodiment is a further improvement on any one of embodiments 1 to 6, as detailed below:

[0065] The insulating component 2 is made of plastic, while the wire clip 4 and the insulating component 2 are integrally molded by injection molding, which reduces the processing difficulty and ensures the firmness of the assembly between the wire clip 4 and the insulating component 2.

[0066] The top cover 5 has a ramp 540 on the side away from the high-speed cable 6. When a PCB board 1 has multiple adjacent bases 3 along its length on the same side, the ramp 540 on the top cover 5 facilitates the passage of the high-speed cable 6 over another base 3 in front of it, reducing the bending angle of the high-speed cable 6.

[0067] Example 8

[0068] An optical module includes a high-speed cable adapter fixing structure as described in any one of embodiments 1 to 7.

[0069] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A high-speed cable adapter fixing structure, characterized in that, include: A PCB board (1) has at least one insulating element (2) arranged along its length. Each insulating element (2) is pressed by a base (3) covering it and welded to a grounding pad (110) on the PCB board (1). Each base (3) has multiple rows of independent compartments (310) in the area where the insulating element (2) is pressed. Each base (3) has a cover (5) fixed on it to seal all the compartments (310). The PCB board (1) has two signal pads (120) in the area enclosed by each compartment (310). Two wire clips (4) are arranged side by side in each compartment (310). The middle area is wrapped by an insulating component (2). The front and rear ends of the two wire clips (4) are outside the insulating component (2), and the cross-sectional area of ​​the middle area of ​​the wire clip (4) is smaller than the cross-sectional area of ​​its front and rear ends. The front ends of the two wire clips (4) are respectively welded to two signal pads (120). After the protective layer is peeled off, the two signal lines (610) of each high-speed cable (6) are respectively horizontally welded to the rear ends of the two wire clips (4) in one of the compartments (310) on the base (3). The base (3), the exposed ground wire (620) in the high-speed cable (6) and the exposed copper / aluminum foil (630) in the high-speed cable (6) are welded together by laser welding.

2. The high-speed cable adapter fixing structure according to claim 1, characterized in that, The outer side of the area at the rear end of the two line cards (4) in the same compartment (310) used to solder to the signal line (610) is bent and extended a distance away from the PCB board (1).

3. The high-speed cable adapter fixing structure according to claim 1, characterized in that, The line card (4) has a Z-shaped structure, and the length of the horizontally distributed pin segment at the front end of the line card (4) is greater than the length of the signal pad (120).

4. The high-speed cable adapter fixing structure according to claim 1, characterized in that, The base (3) and the top cover (5) are provided with a limiting hole at each corresponding compartment (310). The end of the high-speed cable (6) enters the limiting hole and after the protective layer of the two signal lines (610) is peeled off, it is horizontally welded to the rear end of the two line clips (4) in the compartment (310) corresponding to the limiting hole.

5. The high-speed cable adapter fixing structure according to claim 4, characterized in that, The base (3) has a limiting surface (331) in each limiting hole to limit the end face of the protective sleeve of the high-speed cable (6). The exposed end face of the ground wire (620) in the high-speed cable (6) abuts against the limiting surface (331). The copper / aluminum foil (630) in the protective sleeve of the high-speed cable (6) in the limiting hole is exposed. The top cover (5) has a tin-filling hole (510) between two adjacent high-speed cables (6) at the exposed ground wire (620) and copper / aluminum foil (630) of each high-speed cable (6). The base (3) is made of copper-plated tin. The top cover (5) is made of copper-plated tin. Solder paste is added to the tin-filling hole (510) and the exposed ground wire (620) and copper / aluminum foil (630) in the high-speed cable (6) are fused together by laser welding.

6. The high-speed cable adapter fixing structure according to claim 5, characterized in that, The base (3) has a groove (320) at each corresponding solder hole (510) to connect two adjacent limiting holes. The groove (320) is adjacent to the ground wire (620) and copper / aluminum foil (630) exposed in the high-speed cable (6) in the limiting hole.

7. A high-speed cable adapter fixing structure according to any one of claims 3 to 6, characterized in that, On the surface of the base (3) away from the PCB board (1), a first limiting groove (330) is provided at each corresponding compartment (310), with one end connected to the compartment (310) and the other end penetrating through the side of the base (3). On the surface of the top cover (5) adjacent to the PCB board (1), a second limiting groove (520) is provided at each corresponding first limiting groove (330). The first limiting groove (330) on the base (3) and the second limiting groove (520) on the top cover (5) together form a limiting hole.

8. The high-speed cable adapter fixing structure according to claim 1, characterized in that, The base (3) has multiple welding blocks (340) along the width direction of the PCB board (1), and the top cover (5) has a welding hole (530) for accommodating each welding block (340) at each corresponding welding block (340).

9. The high-speed cable adapter fixing structure according to claim 1, characterized in that, The insulating component (2) is made of plastic, and the wire clip (4) and the insulating component (2) are integrally molded by injection molding.

10. An optical module, characterized in that, Includes the high-speed cable adapter fixing structure as described in any one of claims 1 to 9.

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