Grinding device convenient for dismounting mounting disc

Abstract

The grinding device comprises a supporting table, a positioning seat is fixedly connected to the top of the supporting table, a first threaded rod is connected to the side face of the positioning seat in a threaded and sleeved mode, a clamping plate is movably connected to one end of the first threaded rod in a sleeved mode, and a clamping mechanism is arranged in the positioning seat. According to the grinding device convenient to disassemble the mounting disc, by arranging a positioning seat, when the positioning disc is disassembled and fixed, a positioning block is sleeved with the positioning seat, and at the moment, a first threaded rod is rotated, so that the first threaded rod can drive a clamping plate to be clamped and fixed to the side face of the positioning block; by arranging the positioning block on the positioning disc, the positioning block can drive the positioning disc to be fixed in the positioning seat, namely fixed at the top of the supporting table, so that the mounting position needs to be corrected when the positioning disc is disassembled and fixed, the convenience of disassembling and assembling the positioning disc is improved, and the convenience of grinding multi-specification wafers is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of grinding devices that facilitate the removal of the mounting plate, specifically a grinding device that facilitates the removal of the mounting plate. Background Technology

[0002] In the fabrication of semiconductor devices, various materials are repeatedly formed into a film with a layered structure on the semiconductor wafer. To form this layered structure, the technology for planarizing the surface of the semiconductor wafer becomes crucial. Chemical mechanical polishing (CMP) is widely used as a method for semiconductor wafer surface planarization. During CMP, both the polishing pad and the wafer carrier rotate. The debris generated during polishing is splashed onto the spindle due to centrifugal force. After prolonged use, a thick layer of dirt accumulates on the spindle, requiring periodic shutdown for manual cleaning.

[0003] In existing technologies, such as the "Wafer Grinding Apparatus" with Chinese patent announcement number CN220637431U, a rotating shaft, a cleaning assembly, and a water injection pipe are included. The cleaning assembly is arranged around the sidewall of the rotating shaft and includes at least one annular pipe and at least one nozzle module. The nozzle module includes several nozzles for spraying water onto the sidewall of the rotating shaft to clean it while it is operating. The water injection pipe is connected to at least one annular pipe and is used to inject water into the annular pipe. The wafer grinding apparatus provided in this solution can clean the rotating shaft while grinding the wafer.

[0004] The aforementioned patent has some shortcomings: during wafer grinding, since the wafer needs to be clamped and fixed with the help of an adapter mounting plate, most existing wafer mounting plates are fixed with bolts, which requires the mounting plate to be disassembled and replaced when clamping and fixing wafers of different specifications, thus making the grinding of wafers of different specifications more cumbersome. Utility Model Content

[0005] The purpose of this invention is to provide a grinding device that facilitates the removal of the mounting plate, thereby solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a grinding device for easy disassembly of the mounting plate, comprising a support platform, a positioning seat fixedly connected to the top of the support platform, a first threaded rod threadedly sleeved on the side of the positioning seat, a clamping plate movably sleeved at one end of the first threaded rod, a clamping mechanism provided inside the positioning seat, the clamping mechanism comprising a positioning block, a positioning disk fixedly connected to the top of the positioning block, a second threaded rod threadedly sleeved on the side of the positioning disk, and a clamping sleeve movably sleeved at one end of the second threaded rod.

[0007] A positioning sleeve is fixedly connected to the top of the support platform, a cylinder is fixedly installed on the top of the positioning sleeve, a lifting block is fixedly connected to the bottom of the cylinder, and an adjustment mechanism is provided on the outside of the lifting block.

[0008] By adopting the above technical solution, the clamping, fixing, and disassembly of the positioning plate were achieved.

[0009] As a further embodiment of this utility model: the front shape of the clamping sleeve is C-shaped, and there are two clamping sleeves, which are symmetrically distributed about the positioning block as the axis of symmetry.

[0010] By adopting the above technical solution, the wafer clamping and fixing effect was achieved.

[0011] As a further embodiment of this utility model: the cylinder is located directly above the positioning sleeve, and one end of the cylinder is movably sleeved inside the positioning sleeve.

[0012] By adopting the above technical solution, the height adjustment effect of the grinding component was achieved.

[0013] As a further embodiment of this utility model: the adjusting mechanism includes a first limiting sleeve, which is fixedly connected to the outside of the lifting block. A first slider is movably sleeved inside the first limiting sleeve. A first motor is fixedly installed on the front of the first limiting sleeve. A first threaded post is fixedly connected to the output shaft of the first motor. A second limiting sleeve is fixedly connected to the bottom of the first slider. A second slider is movably sleeved inside the second limiting sleeve. A second motor is fixedly installed on the side of the second limiting sleeve. A second threaded post is fixedly connected to the output shaft of the second motor.

[0014] By adopting the above technical solution, the omnidirectional position adjustment effect of the grinding component in the horizontal direction is achieved.

[0015] As a further embodiment of this utility model: a grinding mechanism is provided at the bottom of the second slider, the grinding mechanism includes a third motor, the third motor is fixedly installed at the bottom of the second slider, and a grinding disc is fixedly sleeved on the output shaft of the third motor.

[0016] By adopting the above technical solution, the wafer grinding effect was achieved.

[0017] Compared with the prior art, the beneficial effects of this utility model are: the grinding device that facilitates the disassembly of the mounting plate, by setting a positioning seat, when the positioning plate is disassembled and fixed, the positioning block is sleeved inside the positioning seat. At this time, rotating the No. 1 threaded rod causes the No. 1 threaded rod to drive the clamping plate to clamp and fix it on the side of the positioning block, thereby allowing the positioning block to drive the positioning plate to be fixed inside the positioning seat, that is, fixed on the top of the support platform. This makes it necessary to correct the installation position when the positioning plate is disassembled and fixed, thereby improving the convenience of disassembling and assembling the positioning plate, that is, improving the convenience of grinding multi-specification wafers.

[0018] In addition, the grinding device, which facilitates the removal of the mounting plate, is also equipped with an adjustment mechanism. When the position of the grinding mechanism needs to be adjusted, the No. 1 motor and the No. 2 motor can drive the No. 1 slider and the No. 2 slider to move horizontally through the No. 1 threaded column and the No. 2 threaded column, that is, drive the grinding mechanism to move horizontally, thereby achieving the effect of all-round adjustment of the position of the grinding mechanism, thus bringing convenience to the positioning and adjustment of the grinding position of the wafer, and thus bringing convenience to the grinding of the wafer. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This is a front view of the structure of this utility model;

[0021] Figure 3 This is a bottom view of the positioning disk in the structure of this utility model.

[0022] In the diagram: 1. Support platform; 2. Positioning sleeve; 3. Cylinder; 4. Positioning seat; 5. Threaded rod No. 1; 6. Clamping plate; 7. Clamping mechanism; 71. Positioning block; 72. Positioning disc; 73. Threaded rod No. 2; 74. Clamping sleeve; 8. Lifting block; 9. Adjustment mechanism; 91. Limiting sleeve No. 1; 92. Slider No. 1; 93. Motor No. 1; 94. Threaded column No. 1; 95. Limiting sleeve No. 2; 96. Slider No. 2; 97. Motor No. 2; 98. Threaded column No. 2; 10. Grinding mechanism; 101. Motor No. 3; 102. Grinding disc. Detailed Implementation

[0023] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0024] The components of the present invention embodiments described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0025] Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] Please see Figure 1-3 An embodiment of this utility model provides a grinding device for easy disassembly of the mounting plate, including a support platform 1. A positioning seat 4 is fixedly connected to the top of the support platform 1. A first threaded rod 5 is threadedly sleeved on the side of the positioning seat 4. A clamping plate 6 is movably sleeved at one end of the first threaded rod 5. A clamping mechanism 7 is provided inside the positioning seat 4. The clamping mechanism 7 includes a positioning block 71. A positioning plate 72 is fixedly connected to the top of the positioning block 71. A second threaded rod 73 is threadedly sleeved on the side of the positioning plate 72. A clamping sleeve 74 is movably sleeved at one end of the second threaded rod 73.

[0029] A positioning sleeve 2 is fixedly connected to the top of the support platform 1. A cylinder 3 is fixedly installed on the top of the positioning sleeve 2. A lifting block 8 is fixedly connected to the bottom of the cylinder 3. An adjustment mechanism 9 is provided on the outside of the lifting block 8.

[0030] Specifically, by setting the positioning seat 4, when disassembling and fixing the positioning disk 72, the positioning block 71 is sleeved inside the positioning seat 4. At this time, the first threaded rod 5 is rotated so that the first threaded rod 5 can drive the clamping plate 6 to clamp and fix it on the side of the positioning block 71. Thus, the positioning block 71 can drive the positioning disk 72 to be fixed inside the positioning seat 4, that is, fixed on the top of the support platform 1. This makes it necessary to correct the installation position when disassembling and fixing the positioning disk 72, thereby improving the convenience of disassembling and assembling the positioning disk 72, that is, improving the convenience of grinding multi-specification wafers.

[0031] Furthermore, the front shape of the clamping sleeve 74 is C-shaped, and there are two clamping sleeves 74, which are symmetrically distributed about the positioning block 71 as the axis of symmetry.

[0032] Specifically, when wafer clamping and fixing are required, the wafer is fitted inside the positioning disk 72. At this time, the second threaded rod 73 is rotated so that the second threaded rod 73 can drive the clamping sleeve 74 to tightly press against the side of the wafer, thereby clamping and fixing the wafer inside the positioning disk 72.

[0033] Furthermore, the cylinder 3 is located directly above the positioning sleeve 2, and one end of the cylinder 3 is movably sleeved inside the positioning sleeve 2;

[0034] Specifically, during wafer grinding, cylinder 3 is activated, which causes the lifting block 8 to move up and down, thereby moving the grinding component up and down. This allows the grinding component to fit closely with the wafer, achieving the height adjustment effect of the wafer grinding component.

[0035] Furthermore, the adjustment mechanism 9 includes a first limiting sleeve 91, which is fixedly connected to the outside of the lifting block 8. A first slider 92 is movably sleeved inside the first limiting sleeve 91. A first motor 93 is fixedly installed on the front of the first limiting sleeve 91. A first threaded post 94 is fixedly connected to the output shaft of the first motor 93. A second limiting sleeve 95 is fixedly connected to the bottom of the first slider 92. A second slider 96 is movably sleeved inside the second limiting sleeve 95. A second motor 97 is fixedly installed on the side of the second limiting sleeve 95. A second threaded post 98 is fixedly connected to the output shaft of the second motor 97.

[0036] Specifically, when the position of the grinding mechanism 10 needs to be adjusted, the first motor 93 and the second motor 97 can drive the first slider 92 and the second slider 96 to move horizontally through the first threaded post 94 and the second threaded post 98, that is, drive the grinding mechanism 10 to move horizontally, thereby achieving the effect of all-round adjustment of the position of the grinding mechanism 10, thus bringing convenience to the positioning and adjustment of the wafer grinding position, and thus bringing convenience to the wafer grinding.

[0037] Furthermore, a grinding mechanism 10 is provided at the bottom of the second slider 96. The grinding mechanism 10 includes a third motor 101, which is fixedly installed at the bottom of the second slider 96. A grinding disc 102 is fixedly sleeved on the output shaft of the third motor 101.

[0038] Specifically, when wafer grinding is required, motor 101 is started, which drives the grinding disc 102 to rotate rapidly, thereby allowing the rapidly rotating grinding disc 102 to grind and polish the wafer.

[0039] Working principle: By setting the positioning seat 4, when the positioning disk 72 is disassembled and fixed, the positioning block 71 is sleeved inside the positioning seat 4. At this time, the first threaded rod 5 is rotated, so that the first threaded rod 5 drives the clamping plate 6 to clamp and fix it on the side of the positioning block 71. Thus, the positioning block 71 drives the positioning disk 72 to be fixed inside the positioning seat 4, that is, fixed on the top of the support platform 1. This makes it necessary to correct the installation position when disassembling and fixing the positioning disk 72, thereby improving the convenience of disassembling and assembling the positioning disk 72, that is, improving the convenience of multi-specification wafer grinding. When wafer clamping and fixing is required, the wafer is sleeved inside the positioning disk 72. At this time, the second threaded rod 73 is rotated, so that the second threaded rod 73 drives the clamping sleeve 74 to tightly press against the side of the wafer, thereby clamping and fixing the wafer inside the positioning disk 72. When wafer grinding is performed, the cylinder 3 is activated, so that the cylinder 3 drives the... The moving lifting block 8 moves up and down, which in turn moves the grinding component up and down, allowing the grinding assembly to fit closely with the wafer, thus achieving the height adjustment effect of the wafer grinding assembly. When the position of the grinding mechanism 10 needs to be adjusted, the first motor 93 and the second motor 97 drive the first slider 92 and the second slider 96 to move horizontally through the first threaded post 94 and the second threaded post 98, which in turn drives the grinding mechanism 10 to move horizontally, thus achieving the all-round adjustment effect of the position of the grinding mechanism 10, thereby facilitating the positioning and adjustment of the wafer grinding position, and thus facilitating the wafer grinding. When wafer grinding is required, the third motor 101 is started, which drives the grinding disk 102 to rotate rapidly, thereby allowing the rapidly rotating grinding disk 102 to grind and polish the wafer. The contents not described in detail in this description belong to the prior art known to those skilled in the art.

[0040] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A grinding device that facilitates the removal of the mounting plate, characterized in that: The device includes a support platform, a positioning seat fixedly connected to the top of the support platform, a first threaded rod threadedly fitted onto the side of the positioning seat, a clamping plate movably fitted onto one end of the first threaded rod, a clamping mechanism provided inside the positioning seat, the clamping mechanism including a positioning block, a positioning disc fixedly connected to the top of the positioning block, a second threaded rod threadedly fitted onto the side of the positioning disc, and a clamping sleeve movably fitted onto one end of the second threaded rod. A positioning sleeve is fixedly connected to the top of the support platform, a cylinder is fixedly installed on the top of the positioning sleeve, a lifting block is fixedly connected to the bottom of the cylinder, and an adjustment mechanism is provided on the outside of the lifting block.

2. The grinding device for easy disassembly of the mounting plate according to claim 1, characterized in that: The front of the clamping sleeve is C-shaped, and there are two clamping sleeves, which are symmetrically distributed about the positioning block as the axis of symmetry.

3. The grinding device for easy disassembly of the mounting plate according to claim 1, characterized in that: The cylinder is located directly above the positioning sleeve, and one end of the cylinder is movably fitted inside the positioning sleeve.

4. The grinding device for easy disassembly of the mounting plate according to claim 1, characterized in that: The adjustment mechanism includes a first limiting sleeve, which is fixedly connected to the outside of the lifting block. A first slider is movably fitted inside the first limiting sleeve. A first motor is fixedly installed on the front of the first limiting sleeve. A first threaded post is fixedly connected to the output shaft of the first motor. A second limiting sleeve is fixedly connected to the bottom of the first slider. A second slider is movably fitted inside the second limiting sleeve. A second motor is fixedly installed on the side of the second limiting sleeve. A second threaded post is fixedly connected to the output shaft of the second motor.

5. The grinding device for easy disassembly of the mounting plate according to claim 4, characterized in that: A grinding mechanism is provided at the bottom of the second slider. The grinding mechanism includes a third motor, which is fixedly installed at the bottom of the second slider. A grinding disc is fixedly sleeved on the output shaft of the third motor.

Images