Copper ion removing device and film-removing back-etching equipment

Abstract

The utility model discloses a copper ion removing device and a film-removing back-etching device, and relates to the technical field of semiconductors. The copper ion removal device comprises a liquid supply bin, a precipitation bin, a stirring mechanism, a filter pressing mechanism and a conveying pipeline. The liquid supply bin, the precipitation bin, the stirring mechanism and the filter pressing mechanism are sequentially connected through a conveying pipeline, the filter pressing mechanism is connected with the liquid supply bin through the conveying pipeline, the liquid supply bin is used for storing liquid medicine, the precipitation bin is used for precipitating the liquid medicine, and the stirring mechanism is used for mixing and stirring the precipitated liquid medicine and a copper removal agent to form a copper condensate; and the filter pressing mechanism is used for carrying out filter pressing on the stirred liquid medicine to filter out copper condensate in the liquid medicine. Compared with the prior art, the copper ion removal device provided by the utility model has the advantages that the liquid supply bin, the precipitation bin, the stirring mechanism and the filter pressing mechanism which are connected end to end through the conveying pipeline are adopted, so that the content of copper ions in liquid medicine can be effectively reduced, the service life of the liquid medicine is prolonged, the cost of the liquid medicine is reduced, and economic benefits are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a copper ion removal device and a film removal and re-etching equipment. Background Technology

[0002] Currently, with the continuous increase in silicon wafer production capacity, the requirements for semiconductor equipment are also becoming increasingly stringent. In the wafer stripping and etch-back process, a circulating solution is needed for etch-back; the higher the silicon wafer production capacity, the higher the copper ion content in the solution. Since copper ions reduce the additive content in the solution, significantly decreasing the process effectiveness, additives need to be continuously added to extend the solution's lifespan. If the copper ion content in the solution is too high, the additive content will rapidly decrease, rendering further additions ineffective, and a fresh solution must be added. Current wafer stripping and etch-back machines can only maintain the process effectiveness by adding or replacing the solution, resulting in a short solution lifespan and high solution costs.

[0003] In view of this, designing and manufacturing a copper ion removal device and a film removal and re-etching equipment that can extend the service life of the solution and reduce the cost of the solution is particularly important in semiconductor production. Utility Model Content

[0004] The purpose of this invention is to provide a copper ion removal device that can effectively reduce the copper ion content in the liquid medicine, extend the service life of the liquid medicine, reduce the cost of the liquid medicine, and improve economic benefits.

[0005] Another objective of this invention is to provide a film removal and re-etching device that can effectively reduce the copper ion content in the solution, extend the service life of the solution, reduce the cost of the solution, and improve economic efficiency.

[0006] This utility model is achieved by the following technical solution.

[0007] A copper ion removal device includes a liquid supply tank, a sedimentation tank, a stirring mechanism, a filter press mechanism, and a conveying pipeline. The liquid supply tank, sedimentation tank, stirring mechanism, and filter press mechanism are connected in sequence through the conveying pipeline. The filter press mechanism is connected to the liquid supply tank through the conveying pipeline. The liquid supply tank is used to store the chemical solution. The sedimentation tank is used to precipitate the chemical solution. The stirring mechanism is used to mix and stir the precipitated chemical solution with a copper removal agent to form a copper solid. The filter press mechanism is used to filter the stirred chemical solution to remove the copper solid.

[0008] Optionally, the delivery pipeline includes a first delivery pipeline, a second delivery pipeline, a third delivery pipeline, and a fourth delivery pipeline. The liquid supply tank is connected to the sedimentation tank through the first delivery pipeline, the sedimentation tank is connected to the stirring mechanism through the second delivery pipeline, the stirring mechanism is connected to the filter press mechanism through the third delivery pipeline, and the filter press mechanism is connected to the liquid supply tank through the fourth delivery pipeline.

[0009] Optionally, the first delivery pipeline includes a liquid pump and a connecting pipe, one end of which is connected to the liquid supply tank and the other end of which is connected to the sedimentation tank, and the liquid pump is installed on the connecting pipe.

[0010] Optionally, the stirring mechanism includes a mixing chamber, a first driving component, and stirring blades. The mixing chamber is connected between the sedimentation chamber and the filter press mechanism via a conveying pipeline. The first driving component is installed in the mixing chamber and is connected to the stirring blades in a driving connection. The stirring blades extend into the mixing chamber.

[0011] Optionally, the mixing chamber is provided with an inlet, an outlet, and an addition port. The inlet and the addition port are both set higher than the outlet. The inlet is used to input the precipitated solution, the addition port is used to add the copper removal agent, and the outlet is used to output the stirred solution.

[0012] Optionally, the stirring blade includes a rotating shaft and a stirring rod, the stirring rod being connected to the rotating shaft and extending radially along the rotating shaft, the rotating shaft being perpendicular to the bottom wall of the mixing chamber.

[0013] Optionally, there are multiple stirring rods, which are divided into multiple groups. The multiple groups of stirring rods are arranged parallel to each other along the axial direction of the rotating shaft, and the multiple stirring rods in each group are arranged in a ring array on the circumference of the rotating shaft.

[0014] Optionally, the filter press mechanism includes a second driving member, a pressing plate, a thrust plate, and multiple filter plates. The pressing plate, the thrust plate, and the filter plates are stacked, and the multiple filter plates are disposed between the pressing plate and the thrust plate. The second driving member is connected to the pressing plate for transmission. The second driving member is used to drive the pressing plate to move towards the thrust plate so as to filter the medicine liquid through the filter plates.

[0015] Optionally, the filter press mechanism also includes a limiting post, which passes through the pressing plate, the thrust plate and multiple filter plates, and slides with the pressing plate, the thrust plate and the filter plates. The limiting post is perpendicular to the pressing plate.

[0016] A film removal and re-etching device includes the aforementioned copper ion removal apparatus. The copper ion removal apparatus includes a liquid supply tank, a sedimentation tank, a stirring mechanism, a filter press mechanism, and a conveying pipeline. The liquid supply tank, sedimentation tank, stirring mechanism, and filter press mechanism are connected sequentially through the conveying pipeline. The filter press mechanism is connected to the liquid supply tank through the conveying pipeline. The liquid supply tank is used to store the chemical solution. The sedimentation tank is used to precipitate the chemical solution. The stirring mechanism is used to mix and stir the precipitated chemical solution with a copper removal agent to form a copper solid. The filter press mechanism is used to filter the stirred chemical solution to remove the copper solid.

[0017] The copper ion removal device and the film removal and re-etching equipment provided by this utility model have the following advantages:

[0018] Beneficial effects:

[0019] The copper ion removal device provided by this utility model comprises a liquid supply tank, a sedimentation tank, a stirring mechanism, and a filter press mechanism connected sequentially via a conveying pipeline. The filter press mechanism is connected to the liquid supply tank via the conveying pipeline. The liquid supply tank stores the chemical solution, the sedimentation tank precipitates the chemical solution, the stirring mechanism mixes the precipitated chemical solution with the copper removal agent to form a copper solidified product, and the filter press mechanism filters the stirred chemical solution to remove the copper solidified product. Compared with the prior art, the copper ion removal device provided by this utility model, due to the use of a liquid supply tank, sedimentation tank, stirring mechanism, and filter press mechanism connected end-to-end via a conveying pipeline, can effectively reduce the copper ion content in the chemical solution, extend the service life of the chemical solution, reduce the cost of the chemical solution, and improve economic efficiency.

[0020] The film removal and re-etching equipment provided by this utility model includes a copper ion removal device, which can effectively reduce the copper ion content in the solution, extend the service life of the solution, reduce the cost of the solution, and improve economic benefits. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the copper ion removal device provided in an embodiment of the present invention;

[0023] Figure 2 A cross-sectional view of the stirring mechanism in the copper ion removal device provided in an embodiment of this utility model;

[0024] Figure 3 for Figure 2 Schematic diagram of the structure of the stirring blades;

[0025] Figure 4 This is a schematic diagram of the pressure filtration mechanism in the copper ion removal device provided in this embodiment of the utility model.

[0026] Icons: 100-Copper ion removal device; 110-Supply tank; 120-Sedimentation tank; 130-Stirring mechanism; 131-Mixing tank; 1311-Inlet; 1312-Outlet; 1313-Adding port; 132-First driving component; 133-Stirring blade; 1331-Rotating shaft; 1332-Stirring rod; 140-Filtration mechanism; 141-Second driving component; 142-Pressure plate; 143-Thrust plate; 144-Filter plate; 145-Limiting column; 146-Filtration cavity; 150-Transportation pipeline; 151-First transport pipeline; 152-Second transport pipeline; 153-Third transport pipeline; 154-Fourth transport pipeline; 155-Liquid pump; 156-Connecting pipe. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of this utility model, it should be noted that the terms "inner," "outer," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," "installed," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0032] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the features in the following embodiments can be combined with each other.

[0033] Please refer to the reference. Figures 1 to 4 This utility model provides a film removal and etching re-etching device (not shown) for performing film removal and etching re-etching on semiconductors. It can effectively reduce the copper ion content in the solution, extend the solution's lifespan, reduce solution costs, and improve economic efficiency.

[0034] It should be noted that the film removal and etching equipment includes a film removal and etching device (not shown) and a copper ion removal device 100. The film removal and etching device is connected to the copper ion removal device 100. The film removal and etching device is used to remove and re-etch the semiconductor, and inputs the etching solution used for etching into the copper ion removal device 100. The copper ion removal device 100 is used to remove copper ions from the solution and supplies the copper ion-removed solution to the film removal and etching device for the next film removal and etching, thereby realizing the recycling of the solution.

[0035] The copper ion removal device 100 includes a supply tank 110, a sedimentation tank 120, a stirring mechanism 130, a filter press mechanism 140, and a delivery pipeline 150. The supply tank 110, sedimentation tank 120, stirring mechanism 130, and filter press mechanism 140 are connected sequentially via the delivery pipeline 150. The filter press mechanism 140 is connected to the supply tank 110 via the delivery pipeline 150, meaning the supply tank 110, sedimentation tank 120, stirring mechanism 130, and filter press mechanism 140 are connected end-to-end via the delivery pipeline 150. The supply tank 110 is connected to the film removal and re-marking device and is used to store the reagent solution for supplying the reagent solution to the film removal and re-marking device. The sedimentation tank 120 is used to precipitate the reagent solution to initially remove some copper ions and other impurities from the reagent solution. The stirring mechanism 130 is used to mix and stir the precipitated solution with the copper removal agent to form a copper solid. The pressure filtration mechanism 140 is used to filter the stirred solution to remove the copper solid. The stirring mechanism 130 and the pressure filtration mechanism 140 work together to remove some of the copper ions from the solution again. In this way, by removing copper ions twice, most of the copper ions in the solution can be removed, effectively reducing the copper ion content, extending the service life of the solution, reducing the cost of the solution, and improving economic efficiency.

[0036] Furthermore, the delivery pipeline 150 includes a first delivery pipeline 151, a second delivery pipeline 152, a third delivery pipeline 153, and a fourth delivery pipeline 154. The supply tank 110 is connected to the sedimentation tank 120 via the first delivery pipeline 151, allowing the liquid medicine in the supply tank 110 to be input into the sedimentation tank 120 via the first delivery pipeline 151. The sedimentation tank 120 is connected to the stirring mechanism 130 via the second delivery pipeline 152, allowing the settled liquid medicine in the sedimentation tank 120 to be input into the stirring mechanism 130 via the second delivery pipeline 152. The stirring mechanism 130 is connected to the filter press mechanism 140 via the third delivery pipeline 153, allowing the stirred liquid medicine in the stirring mechanism 130 to be input into the filter press mechanism 140 via the third delivery pipeline 153. The filter press mechanism 140 is connected to the supply tank 110 via the fourth delivery pipeline 154, allowing the filtered liquid medicine in the filter press mechanism 140 to return to the supply tank 110 via the fourth delivery pipeline 154.

[0037] The first delivery pipeline 151 includes a liquid pump 155 and a connecting pipe 156. One end of the connecting pipe 156 is connected to the liquid supply tank 110, and the other end is connected to the sedimentation tank 120. The liquid pump 155 is installed on the connecting pipe 156 and is used to generate negative pressure to draw the liquid medicine in the liquid supply tank 110 into the sedimentation tank 120 through the connecting pipe 156.

[0038] In this embodiment, the integral structure of the second conveying pipeline 152, the third conveying pipeline 153 and the fourth conveying pipeline 154 is the same as the specific structure of the first conveying pipeline 151, and will not be described again here.

[0039] The stirring mechanism 130 includes a mixing chamber 131, a first driving component 132, and stirring blades 133. The mixing chamber 131 is connected between the sedimentation chamber 120 and the filter press 140 via a conveying pipeline 150. Specifically, one side of the mixing chamber 131 is connected to the sedimentation chamber 120 via a second conveying pipeline 152, and the other side is connected to the filter press 140 via a third conveying pipeline 153. The first driving component 132 is installed in the mixing chamber 131 and is drivenly connected to the stirring blades 133. The stirring blades 133 extend into the mixing chamber 131. The first driving component 132 drives the stirring blades 133 to rotate within the mixing chamber 131, thereby stirring and mixing the chemical solution and copper removal agent within the mixing chamber 131 to improve the copper removal effect of the copper removal agent.

[0040] Furthermore, the mixing chamber 131 is provided with an inlet 1311, an outlet 1312, and an addition port 1313. Both the inlet 1311 and the addition port 1313 are positioned higher than the outlet 1312. The inlet 1311 is used to input the precipitated solution, the addition port 1313 is used to add the copper removal agent, and the outlet 1312 is used to output the stirred solution, so as to facilitate the input and output of the solution and the addition of the copper removal agent.

[0041] The stirring blade 133 includes a rotating shaft 1331 and a stirring rod 1332. A first driving member 132 is connected to the rotating shaft 1331, and the stirring rod 1332 is connected to the rotating shaft 1331 and extends radially along the rotating shaft 1331. The rotating shaft 1331 is perpendicular to the bottom wall of the mixing chamber 131. The first driving member 132 is used to drive the stirring rod 1332 to move within the mixing chamber 131 via the rotating shaft 1331, so as to stir and mix the liquid medicine and copper removal agent within the mixing chamber 131.

[0042] Preferably, there are multiple stirring rods 1332, which are divided into multiple groups. The multiple groups of stirring rods 1332 are arranged parallel to each other along the axial direction of the rotating shaft 1331. In each group, multiple stirring rods 1332 are arranged in a ring array on the circumference of the rotating shaft 1331. The multiple groups of stirring rods 1332 work together to simultaneously drive the liquid medicine and copper removal agent to move in the mixing chamber 131, improve the mixing effect, and thus improve the copper removal effect.

[0043] The filter press mechanism 140 includes a second driving member 141, a pressing plate 142, a thrust plate 143, and multiple filter plates 144. The pressing plate 142, the thrust plate 143, and the filter plates 144 are arranged overlappingly, with the multiple filter plates 144 all disposed between the pressing plate 142 and the thrust plate 143. The second driving member 141 is driven to move the pressing plate 142 toward the thrust plate 143 to filter the liquid medicine through the filter plates 144. The thrust plate 143 is used to limit the extreme positions of the movement of the pressing plate 142 and the filter plates 144. Specifically, there is a pressure filtration cavity 146 between two adjacent filter plates 144. The pressure filtration cavity 146 is used to contain the medicine liquid. When the second driving member 141 drives the pressing plate 142 to move towards the thrust plate 143, the filter plate 144 moves towards the thrust plate 143 along with the pressing plate 142. During this process, the filter plate 144 performs pressure filtration on the medicine liquid in the pressure filtration cavity 146 to filter out the copper solidified product in the medicine liquid and realize the copper removal function.

[0044] Preferably, the filter press mechanism 140 further includes a limiting post 145. The limiting post 145 passes through the pressing plate 142, the thrust plate 143, and multiple filter plates 144, and slides in cooperation with the pressing plate 142, the thrust plate 143, and the filter plates 144. The limiting post 145 is perpendicular to the pressing plate 142. Specifically, the axial direction of the limiting post 145 is the same as the driving direction of the second driving member 141. The limiting post 145 is used to limit the movement of the pressing plate 142 and the filter plates 144 to ensure the stability of their movement.

[0045] In this embodiment, the first driving component 132 is a drive motor and the second driving component 141 is a hydraulic cylinder, but it is not limited to this. In other embodiments, the first driving component 132 can be a pneumatic motor or a hydraulic motor; the second driving component 141 can be an electric cylinder or a pneumatic cylinder; the types of the first driving component 132 and the second driving component 141 are not specifically limited.

[0046] The copper ion removal device 100 provided in this embodiment of the invention comprises a liquid supply tank 110, a sedimentation tank 120, a stirring mechanism 130, and a filter press mechanism 140 connected sequentially via a conveying pipeline 150. The filter press mechanism 140 is connected to the liquid supply tank 110 via the conveying pipeline 150. The liquid supply tank 110 is used to store the solution, the sedimentation tank 120 is used to precipitate the solution, the stirring mechanism 130 is used to mix and stir the precipitated solution with a copper removal agent to form a copper solidified product, and the filter press mechanism 140 is used to filter the stirred solution to remove the copper solidified product. Compared with the prior art, the copper ion removal device 100 provided by this invention, due to the use of the liquid supply tank 110, sedimentation tank 120, stirring mechanism 130, and filter press mechanism 140 connected end-to-end via the conveying pipeline 150, can effectively reduce the copper ion content in the solution, extend the service life of the solution, reduce the cost of the solution, and improve economic efficiency. This results in low operating costs and good process effects for the film removal and re-etching equipment.

[0047] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A copper ion removal device, characterized in that, The device includes a liquid supply tank, a sedimentation tank, a stirring mechanism, a filter press mechanism, and a delivery pipeline. The liquid supply tank, the sedimentation tank, the stirring mechanism, and the filter press mechanism are connected sequentially through the delivery pipeline. The filter press mechanism is connected to the liquid supply tank through the delivery pipeline. The liquid supply tank is used to store the drug solution. The sedimentation tank is used to precipitate the drug solution. The stirring mechanism is used to mix and stir the precipitated drug solution with a copper removal agent to form a copper solidified product. The filter press mechanism is used to filter the stirred drug solution to remove the copper solidified product.

2. The copper ion removal device according to claim 1, characterized in that, The delivery pipeline includes a first delivery pipeline, a second delivery pipeline, a third delivery pipeline, and a fourth delivery pipeline. The liquid supply tank is connected to the sedimentation tank through the first delivery pipeline. The sedimentation tank is connected to the stirring mechanism through the second delivery pipeline. The stirring mechanism is connected to the filter press mechanism through the third delivery pipeline. The filter press mechanism is connected to the liquid supply tank through the fourth delivery pipeline.

3. The copper ion removal device according to claim 2, characterized in that, The first delivery pipeline includes a liquid pump and a connecting pipe. One end of the connecting pipe is connected to the liquid supply tank, and the other end is connected to the sedimentation tank. The liquid pump is installed on the connecting pipe.

4. The copper ion removal device according to claim 1, characterized in that, The stirring mechanism includes a mixing chamber, a first driving component, and stirring blades. The mixing chamber is connected between the sedimentation chamber and the filter press mechanism through the conveying pipeline. The first driving component is installed in the mixing chamber and is drivenly connected to the stirring blades. The stirring blades extend into the mixing chamber.

5. The copper ion removal device according to claim 4, characterized in that, The mixing chamber is provided with an inlet, an outlet, and an addition port. The inlet and the addition port are both positioned higher than the outlet. The inlet is used to input the precipitated solution, the addition port is used to add the copper removal agent, and the outlet is used to output the stirred solution.

6. The copper ion removal device according to claim 4, characterized in that, The stirring blade includes a rotating shaft and a stirring rod. The stirring rod is connected to the rotating shaft and extends radially along the rotating shaft. The rotating shaft is perpendicular to the bottom wall of the mixing chamber.

7. The copper ion removal device according to claim 6, characterized in that, The number of stirring rods is multiple, and the multiple stirring rods are divided into multiple groups. The multiple groups of stirring rods are arranged parallel to each other along the axial direction of the rotating shaft. In each group, the multiple stirring rods are arranged in a ring array on the circumference of the rotating shaft.

8. The copper ion removal device according to claim 1, characterized in that, The pressure filtration mechanism includes a second driving member, a pressing plate, a thrust plate, and multiple filter plates. The pressing plate, the thrust plate, and the filter plates are arranged overlappingly, and the multiple filter plates are all disposed between the pressing plate and the thrust plate. The second driving member is drivenly connected to the pressing plate and is used to drive the pressing plate to move towards the thrust plate so as to filter the medicine liquid through the filter plates.

9. The copper ion removal device according to claim 8, characterized in that, The filter press mechanism also includes a limiting post, which passes through the pressing plate, the thrust plate and the multiple filter plates, and slides with the pressing plate, the thrust plate and the filter plates. The limiting post is perpendicular to the pressing plate.

10. A film removal and re-engraving device, characterized in that, Includes the copper ion removal device as described in any one of claims 1-9.

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