Semiconductor apparatus capable of tracking wafer motion trajectory in real time
By introducing industrial cameras and rotating mechanisms into semiconductor equipment, the problems of large imaging distortion and inability to track wafer movement in real time in existing equipment have been solved, achieving high-precision monitoring of wafer movement trajectory and improving production yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BETONE TECH SUZHOU INC
- Filing Date
- 2025-04-23
- Publication Date
- 2026-05-22
AI Technical Summary
In existing semiconductor equipment, the use of fisheye cameras in visual monitoring systems results in large image distortion and blurred visual effects. Furthermore, the cameras are fixed on the top cover of the transfer cavity and cannot track the movement trajectory of the wafer in real time, making it difficult to quickly locate problems.
An industrial camera combined with horizontal and vertical rotation mechanisms is used. The camera is driven to rotate in the horizontal and vertical planes by horizontal and vertical rotation motors, realizing real-time tracking of the wafer's motion trajectory. The high-precision rotation mechanism reduces imaging distortion and improves imaging accuracy.
It enables real-time monitoring of wafer movement trajectory, reduces imaging distortion, improves imaging accuracy, promptly detects defects during the transport process, and improves production yield.
Smart Images
Figure CN224267211U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a semiconductor device capable of tracking the movement trajectory of a wafer in real time. Background Technology
[0002] Semiconductor chip manufacturing is a highly delicate process. Any deviation during wafer transfer can lead to defects, making real-time monitoring of the wafer's status ideal. However, most existing semiconductor equipment uses fisheye cameras for visual monitoring, which suffer from significant image distortion and blurry visual effects. Furthermore, in current equipment, the camera is typically fixed to the top cover of the transfer cavity, making it impossible to track the wafer's movement in real time. If a problem occurs during wafer transfer, it is difficult to quickly locate the image data showing the time of the problem.
[0003] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content
[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a semiconductor device that can track the movement trajectory of a wafer in real time, so as to solve the problems that most of the visual monitoring systems in existing semiconductor devices use fisheye cameras, which have problems such as large imaging distortion and blurry visual effects; and that in existing devices, the camera is usually fixed on the top cover of the transfer cavity, which cannot track the movement status of the wafer in real time according to its movement trajectory.
[0005] To achieve the above and other related objectives, this utility model provides a semiconductor device capable of real-time tracking of wafer movement trajectories. The semiconductor device includes a transmission cavity, a transfer cavity, a process cavity, and a wafer motion tracking system. A robotic arm for transporting wafers is installed within the transmission cavity. The transfer cavity and the process cavity are both connected to the side of the transmission cavity. The wafer motion tracking system includes an industrial camera, a horizontal rotation mechanism for driving the industrial camera to rotate in a horizontal plane, and a vertical rotation mechanism for driving the industrial camera to rotate in a vertical plane. The horizontal rotation mechanism includes a horizontal rotation motor, a horizontal drive gear, a horizontal rotating gear, and a thrust bearing. The horizontal rotation motor is connected to the horizontal drive gear. The horizontal rotating gear and the horizontal drive gear are horizontally mounted on the top cover of the transmission cavity and mesh with each other. The thrust bearing is fixedly connected to the horizontal rotating gear. The vertical rotation mechanism is connected to the horizontal rotating gear of the horizontal rotation mechanism and to the industrial camera.
[0006] Optionally, there are multiple process chambers and two transfer chambers.
[0007] Optionally, a recessed central observation window is provided in the center of the transmission cavity, and the industrial camera is located inside the central observation window.
[0008] Optionally, the central observation window is a quartz glass observation window.
[0009] Optionally, the central observation window is circumferentially spaced with multiple auxiliary observation windows, each of which corresponds to a process cavity or a transfer cavity.
[0010] Optionally, the process cavity includes a PVD cavity.
[0011] Optionally, the diameter of the horizontal rotating gear is larger than the diameter of the horizontal driving gear.
[0012] Optionally, the vertical rotation mechanism is fixed to the horizontal rotation gear and includes a vertical rotation motor, a vertical drive gear, and a vertical rotation gear. The vertical rotation motor is connected to the vertical drive gear, the vertical rotation gear meshes with the vertical drive gear, and the industrial camera is fixedly connected to the vertical rotation gear.
[0013] Optionally, the industrial camera is fixed on a camera bracket, the camera bracket is connected to a camera bearing seat, and is connected by a vertical rotating gear.
[0014] Optionally, both the horizontal rotary motor and the vertical rotary motor are servo motors.
[0015] As described above, the semiconductor device capable of real-time tracking of wafer movement trajectory provided by this utility model has the following beneficial effects: The semiconductor device provided by this application has an improved structural design and uses an industrial camera with better imaging effect, which can reduce imaging distortion and improve imaging accuracy; the movement of the horizontal rotation mechanism and the vertical rotation mechanism can realize the rotation and tilting movement of the lens, thereby realizing real-time monitoring of the wafer during the transport cavity process, so as to track the wafer movement trajectory, and can promptly detect defects in the wafer during the transport process, which is convenient for subsequent tracking and analysis and helps to improve production yield. Attached Figure Description
[0016] Figure 1 The diagram shown is a top view of an example of the semiconductor device provided by this invention that can track the movement trajectory of a wafer in real time.
[0017] Figure 2 The diagram shows the positional relationship between the transmission cavity of the semiconductor device that can track the wafer motion trajectory in real time, as provided by this utility model, and the wafer motion tracking system.
[0018] Figure 3 Displayed as Figure 2 A schematic diagram of a local cross-sectional structure along line AA.
[0019] Figure 4 Displayed as Figure 2 A schematic diagram of a local cross-sectional structure along line BB.
[0020] Figure 5 The diagram shown is an exemplary workflow diagram of a semiconductor device provided by this utility model that can track the movement trajectory of a wafer in real time. Detailed Implementation
[0021] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. For ease of explanation, when detailing the embodiments of this utility model, the cross-sectional views showing the device structure may be partially enlarged without adhering to the general scale, and the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. Furthermore, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.
[0022] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in the actual implementation. In the actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex. To keep the illustrations as concise as possible, not all structures are indicated in the drawings.
[0023] like Figures 1 to 2 As shown, this utility model provides a semiconductor device that can track the movement trajectory of a wafer in real time. The semiconductor device includes a transmission cavity 1, a transfer cavity 2, a process cavity 3, and a wafer movement tracking system 4.
[0024] The transfer cavity 1, as its name suggests, is used to transfer the wafer 11. A robotic arm 12 for transferring the wafer 11 is installed within the transfer cavity 1. The robotic arm 12 can support the wafer in any suitable manner. For example, in some examples, the wafer can be placed directly on the robotic arm without the need for fixation by other mechanisms. In other examples, the robotic arm can fix the wafer 11 based on the principle of vacuum adsorption, and therefore, the robotic arm 12 can be provided with multiple vacuum adsorption holes. The robotic arm 12 is used to transfer the wafer 11 from the transfer cavity 2 through the transfer cavity 1 to the process cavity 3, and to remove the wafer 11 after processing from the process cavity 3, and then transfer it through the transfer cavity 1 and the transfer cavity 2 to an external cavity. The transfer cavity 1 can be provided with a filter device (not shown) for maintaining the cleanliness of the cavity and an inlet / outlet for connecting to a vacuum device to control the vacuum level within the transfer cavity 1. Both the transfer cavity 2 and the process cavity 3 are connected to the side of the transmission cavity 1. There may be one or more transfer cavities 2 and process cavities 3. For example, in a preferred embodiment, there are two or more process cavities 3 (e.g., ...). Figure 1 (Showing five, but not limited to this), there are two transfer cavities 2. Multiple process cavities 3 can be cavities performing the same process steps, such as all being PVD cavities, or they can be cavities performing different process steps, such as including PVD cavities and degas cavities. The specific internal structure of the process cavity 3 depends on its process requirements and is not limited in this embodiment. The transfer cavity 2 is used to transfer the wafer 11 between the transfer cavity 1 and the external cavity; it can also be considered as part of the transfer cavity 1. When there are two transfer cavities 2, the two transfer cavities 2 can be stacked vertically or as shown in the diagram. Figure 1 The wafers shown are arranged side-by-side on the same plane. Heating and / or cooling devices (not shown) can be installed within the process chamber 3 to heat and / or cool the wafer 11 as needed. Of the two transfer chambers 2, preferably one is used to transfer the wafer 11 from the outside to the transfer chamber 1, and then from the transfer chamber 1 to the process chamber 3; the other is used to transfer the wafer 11, which has undergone processing, to the external chamber. When there are multiple process chambers 3, to facilitate connection between chambers and optimize equipment layout, the transfer chamber 1 is preferably generally cylindrical.
[0025] The wafer motion tracking system 4 includes an industrial camera 41, a horizontal rotation mechanism 42 that drives the industrial camera 41 to rotate in a horizontal plane, and a vertical rotation mechanism 43 that drives the industrial camera 41 to rotate in a vertical plane. The industrial camera 41 refers to a camera device applicable to industrial environments, capable of adapting to complex industrial conditions and operating stably for extended periods. This embodiment does not limit the specific model of the industrial camera 41, as long as it meets the imaging requirements in terms of resolution, frame rate, and other parameters, and is compatible with other structures of semiconductor equipment.
[0026] like Figure 3 As shown, the horizontal rotation mechanism 42 includes a horizontal rotation motor 421, a horizontal drive gear 422, a horizontal rotating gear 423, and a thrust bearing 424. The horizontal rotation motor 421 is connected to the horizontal drive gear 422 and drives the horizontal drive gear 422 to rotate on a horizontal plane. The horizontal rotating gear 423 and the horizontal drive gear 422 are horizontally mounted on the top cover 13 of the transmission cavity 1 and mesh with each other. The thrust bearing 424 is fixedly connected to the horizontal rotating gear 423. The thrust bearing 424, also known as an axial bearing, can be one of a thrust ball bearing, a thrust cylindrical roller bearing, a thrust needle roller bearing, a thrust tapered roller bearing, or a thrust self-aligning roller bearing. The horizontal drive gear 422 can also be called the horizontal drive wheel, while the horizontal rotating gear 423 is called the horizontal driven wheel. Specifically, the rotating shaft of the horizontal rotary motor 421 is connected to the horizontal drive gear 422, and the bearing housing of the horizontal rotating gear 423 is fixedly connected to the thrust bearing 424 to prevent the horizontal rotating gear 423 from moving on the non-rotating surface. The tooth surface of the horizontal rotating gear 423 meshes with the tooth surface of the horizontal drive gear 422. Therefore, when the horizontal drive gear 422 rotates horizontally under the action of the horizontal rotary motor 421, the horizontal rotating gear 423 also rotates in a planar direction due to the meshing action.
[0027] The vertical rotation mechanism 43 is connected to the industrial camera 41 and the horizontal rotation gear 423 of the horizontal rotation mechanism 42. For example, in one embodiment, the vertical rotation mechanism 43 is fixed to the horizontal rotation gear 423 of the horizontal rotation mechanism 42, and the industrial camera 41 is fixed to the vertical rotation mechanism 43. Therefore, when the horizontal rotation gear 423 of the horizontal rotation mechanism 42 rotates, it will drive the vertical rotation mechanism 43 to rotate, thereby driving the industrial camera 41 to rotate horizontally; when the vertical rotation mechanism 43 rotates, it will drive the industrial camera 41 to rotate vertically.
[0028] The vertical rotation mechanism 43 can be considered as driving the industrial camera 41 to swing left and right in a longitudinal direction perpendicular to the horizontal plane. Therefore, it can adopt various commercially available swing mechanisms, such as a device that uses the rotation of a cam to drive a rocker arm to achieve swinging. However, in the preferred example provided in this application, the vertical rotation mechanism 43 adopts a structure similar to the horizontal rotation mechanism 42, which helps to simplify and optimize the equipment structure. For example, Figure 4As shown, the vertical rotation mechanism 43 is fixed to the horizontal rotation gear 423 and includes a vertical rotation motor 431, a vertical drive gear 432, and a vertical rotation gear 433. The vertical rotation motor 431 is connected to the vertical drive gear 432, and the vertical rotation gear 433 meshes with the vertical drive gear 432. The industrial camera 41 is fixedly connected to the vertical rotation gear 433. The vertical drive gear 432 can be called the vertical drive driving wheel, while the vertical rotation gear 433 can be called the vertical driven wheel.
[0029] Both the horizontal rotary motor 421 and the vertical rotary motor 431 are preferably servo motors, which helps to achieve higher precision motion control, improve the smoothness during the motion process, and ensure stable imaging of the industrial camera 41.
[0030] In some examples, such as Figure 3 As shown, the horizontal rotary motor 421 is mounted on the horizontal rotary drive gear via a bracket 425. The shaft of the horizontal rotary motor 421 is fixedly connected to the bearing of the horizontal rotary drive gear. The vertical end of the bracket 425 extends to the side of the fixed flange 426, which is fixed to the top cover 13 of the transmission cavity 1. The thrust bearing 424 can be disposed inside the fixed flange 426.
[0031] The vertical rotating mechanism 43 can adopt a similar connection method. For example, Figure 4 As shown, a vertical rotary motor 431 is fixed to a vertical support bracket 434, which is fixed to the top cover 13 or the horizontal rotation mechanism 42, for example, by fasteners such as flanges. The rotation shaft of the vertical rotary motor 431 extends horizontally to connect with a vertical drive gear 432. A vertical rotating gear 433 is located below the vertical drive gear 432, and the teeth of the two mesh with each other. The vertical rotary motor 431 drives the vertical drive gear 432 to rotate, thereby driving the vertical rotating gear 433 to rotate, and driving the industrial camera 41, which is fixedly connected to the vertical rotating gear 433, to rotate.
[0032] The movements of the horizontal rotation mechanism 42 and the vertical rotation mechanism 43 are typically synchronized with the movements of the robotic arm 12, for example, controlled uniformly by the controller (terminal computer) of the semiconductor device. The controller stores process parameters (recipes) and controls the wafer motion tracking system 4 (controlling the on / off state of the motor) and the timing of the robotic arm 12's operations according to these parameters. Alternatively, control can be achieved using a microcontroller. Since the setting of process parameters is known to those skilled in the art, it will not be elaborated upon in detail.
[0033] The working principle of the semiconductor device provided in this embodiment, which can track the movement trajectory of wafer 11 in real time, can be combined with... Figures 3 to 5 Please provide an explanation. Figure 5The semiconductor device shown has five process chambers 3 and two transfer chambers 2. Taking the transfer of wafer 11 from one of the transfer chambers 2 to one of the process chambers 3 as an example, Figure 5 The image shows the detailed steps of a wafer 11 completing a transfer cycle, as well as the movement of the robotic arm 12 during this process.
[0034] When the transfer of wafer 11 begins, as follows Figure 3 As shown, the horizontal rotation mechanism 42 drives the horizontal rotating gear 423 to rotate, and the vertical rotation mechanism 43 is fixed on the horizontal rotating gear 423. As the horizontal rotating gear 423 moves, the industrial camera 41 rotates synchronously in the horizontal plane to track the movement. Figure 5 In "Step 1", the robotic arm 12 moves from its initial position to the position of the corresponding transfer cavity 2. At this time, the robotic arm 12 is still located inside the transfer cavity 1.
[0035] Next, the robotic arm 12 extends from the transfer cavity 1 into the transit cavity 2 to pick up the wafer 11 (step 2). After the wafer 11 is placed stably, the robotic arm 12 retracts back into the transfer cavity 1 (step 3). During this process, as... Figure 4 As shown, the industrial camera 41 "swings" in a vertical plane to track the movement of the wafer 11;
[0036] Afterwards, the robotic arm 12 rotates to the position of the corresponding process cavity 3 (step 4). During this process, the industrial camera 41 rotates horizontally under the drive of the horizontal rotation mechanism 42.
[0037] Then, the robotic arm 12 extends into the process cavity 3 and places the wafer 11 inside the process cavity 3 (step 5). The robotic arm 12 then retracts back into the transfer cavity 1 (step 6). During this process, the industrial camera 41 "swings" in the vertical plane to track the movement trajectory of the wafer 11 in real time.
[0038] The semiconductor device provided in this embodiment features an improved structural design and uses an industrial camera with better imaging performance, which can reduce imaging distortion and improve imaging accuracy. The movements of the horizontal and vertical rotation mechanisms can be set as needed, for example, to realize the rotation and tilting of the lens by synchronizing with the movement of the robotic arm. This enables real-time monitoring of the wafer during the transport cavity process, allowing for real-time tracking of the wafer's trajectory. Defects in the wafer during transport can be detected in a timely manner, facilitating subsequent tracking and analysis, and helping to improve production yield.
[0039] During chip manufacturing, each wafer 11 has a unique serial number. Therefore, in some examples, during operation, the wafer motion tracking system 4, while receiving the position signal of the robotic arm 12 within the transmission cavity 1, can obtain the serial number of the wafer 11 transported by the robotic arm 12 from the corresponding semiconductor equipment. Simultaneously, it generates a motion control system serial number for the industrial camera 41 regarding this transport process (for example, the generated serial number may include the time and the original serial number of the wafer 11). These serial numbers can be uploaded to the device's controller for storage, automatically stored in the storage device built into the industrial camera 41, or both methods can be used simultaneously. This allows for quick retrieval of the monitoring video of the wafer 11 later, saving time spent searching for videos. Furthermore, since the video is recorded based on the movement trajectory of the wafer 11, the system can obtain the location information when abnormalities occur during wafer 11 transport, facilitating analysis of the cause of the problem.
[0040] To facilitate the installation of the industrial camera 41 and provide it with sufficient space for rotation, in a preferred embodiment, a recessed central observation window 14 is provided in the center of the transmission cavity 1. The industrial camera 41 is located within the central observation window 14, preferably in the exact center. The central observation window 14 is preferably concentrically positioned with the horizontal rotating gear. The recess is preferably wider at the top and narrower at the bottom, so that the sides of the window are sloped, which helps reduce light reflection. The size and depth of the central observation window 14 are such that the camera does not come into contact with the window material during rotation. In some embodiments, the central observation window 14 is made of wear-resistant and highly transparent quartz glass, and the window surface may also be coated with an anti-reflective film and / or a high-transmittance film.
[0041] In some examples, the top cover 13 has multiple auxiliary observation windows 15 spaced circumferentially around the central observation window 14, each auxiliary observation window 15 corresponding to the process chamber 3 or the transfer chamber 2. The auxiliary observation windows 15 can also be made of quartz and can be set as circular planar windows to facilitate the observation of the equipment's interior by the staff.
[0042] The dimensions of the horizontal rotating gear 423 and the horizontal driving gear 422 can be determined as needed. However, in a preferred example, the diameter of the horizontal rotating gear 423 is larger than the diameter of the horizontal driving gear 422. Therefore, the gear can be driven to rotate by a motor with a smaller power, and the industrial camera 41 has a larger rotation range in the horizontal plane. It is also easier to install other structures and helps to miniaturize the equipment.
[0043] In some examples, the industrial camera 41 is fixed to a camera bracket 411, which is connected to a camera bearing housing 412 and also to a vertical rotating gear 433. For example, see reference... Figure 4As shown, two camera bearing seats 412 can be fixed on a horizontal rotating gear. A connecting rod (not shown) is provided between the two camera bearing seats. The camera bracket 411 is fixed at both ends to the connecting rod and is located between the two camera bearing seats 412. The industrial camera 41 is fixed on the camera bracket 411. When the vertical rotating gear 433 rotates, it drives the connecting rod to rotate, which in turn drives the industrial camera 41, which is fixedly connected to the connecting rod, to rotate.
[0044] The semiconductor equipment provided in this embodiment can be any of the following: PVD equipment, CVD equipment, dry etching equipment, etc. When the equipment is a high-temperature process equipment, proper heat insulation treatment is required to prevent thermal damage to the wafer motion tracking system 4.
[0045] In summary, this utility model provides a semiconductor device capable of real-time tracking of wafer movement trajectories. The semiconductor device includes a transmission cavity, a transfer cavity, a process cavity, and a wafer motion tracking system. A robotic arm for transporting wafers is installed within the transmission cavity. The transfer cavity and the process cavity are both connected to the side of the transmission cavity. The wafer motion tracking system includes an industrial camera, a horizontal rotation mechanism for driving the industrial camera to rotate in a horizontal plane, and a vertical rotation mechanism for driving the industrial camera to rotate in a vertical plane. The horizontal rotation mechanism includes a horizontal rotation motor, a horizontal drive gear, a horizontal rotating gear, and a thrust bearing. The horizontal rotation motor is connected to the horizontal drive gear. The horizontal rotating gear and the horizontal drive gear are horizontally mounted on the top cover of the transmission cavity and mesh with each other. The thrust bearing is fixedly connected to the horizontal rotating gear. The vertical rotation mechanism is connected to the horizontal rotating gear of the horizontal rotation mechanism and to the industrial camera. The semiconductor equipment provided in this application features an improved structural design and uses an industrial camera with better imaging performance, which can reduce imaging distortion and improve imaging accuracy. The movement of the horizontal and vertical rotation mechanisms can realize the rotation and tilting of the lens, thereby enabling real-time monitoring of the wafer during the transport cavity process. This allows for tracking of the wafer's movement trajectory, timely detection of defects during the wafer transport process, facilitating subsequent tracking and analysis, and helping to improve production yield.
[0046] Therefore, this utility model effectively overcomes the various shortcomings of the prior art and has high industrial application value.
[0047] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.
Claims
1. A semiconductor device capable of tracking the movement trajectory of a wafer in real time, characterized in that, The semiconductor equipment includes a transmission cavity, a transfer cavity, a process cavity, and a wafer motion tracking system. A robotic arm for transporting wafers is installed within the transmission cavity. Both the transfer cavity and the process cavity are connected to the side of the transmission cavity. The wafer motion tracking system includes an industrial camera, a horizontal rotation mechanism that drives the industrial camera to rotate in a horizontal plane, and a vertical rotation mechanism that drives the industrial camera to rotate in a vertical plane. The horizontal rotation mechanism includes a horizontal rotation motor, a horizontal drive gear, a horizontal rotating gear, and a thrust bearing. The horizontal rotation motor is connected to the horizontal drive gear. The horizontal rotating gear and the horizontal drive gear are horizontally mounted on the top cover of the transmission cavity and mesh with each other. The thrust bearing is fixedly connected to the horizontal rotating gear. The vertical rotation mechanism is connected to the horizontal rotating gear of the horizontal rotation mechanism and the industrial camera.
2. The semiconductor device according to claim 1, characterized in that, The process chambers are multiple, and the transfer chambers are two.
3. The semiconductor device according to claim 1, characterized in that, The transmission cavity has a recessed central observation window, and the industrial camera is located inside the central observation window.
4. The semiconductor device according to claim 3, characterized in that, The central observation window is a quartz glass observation window.
5. The semiconductor device according to claim 3, characterized in that, The central observation window is circumferentially spaced with multiple auxiliary observation windows, each of which corresponds to a process cavity or transfer cavity.
6. The semiconductor device according to claim 1, characterized in that, The process chamber includes a PVD chamber.
7. The semiconductor device according to claim 1, characterized in that, The diameter of the horizontal rotating gear is larger than the diameter of the horizontal driving gear.
8. The semiconductor device according to any one of claims 1 to 7, characterized in that, The vertical rotation mechanism is fixed on the horizontal rotation gear and includes a vertical rotation motor, a vertical drive gear, and a vertical rotation gear. The vertical rotation motor is connected to the vertical drive gear, the vertical rotation gear meshes with the vertical drive gear, and the industrial camera is fixedly connected to the vertical rotation gear.
9. The semiconductor device according to claim 8, characterized in that, The industrial camera is fixed on a camera bracket, which is connected to a camera bearing seat and a vertical rotating gear.
10. The semiconductor device according to claim 8, characterized in that, Both the horizontal and vertical rotary motors are servo motors.