Wafer transmission system based on visual inspection
By adding an image acquisition and processing module to the wafer transport system, the wafer placement offset can be determined and the transport components can be stopped, thus solving the problem of damage during wafer transport and providing data support for analyzing abnormal placement.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-05-22
AI Technical Summary
Existing technologies cannot effectively detect abnormal wafer bias during the transfer of wafers by robotic arms, leading to frequent wafer breakage accidents, and lack data support for analyzing abnormal placement problems.
An image acquisition device is added to acquire images of the wafer placed on the stage. The image processing module determines the offset, the control module stops the transmission component, and an alarm device is set up to remind technicians.
It effectively prevents damage caused by the transmission components continuing to operate when the wafer is offset on the stage, provides data support for analyzing abnormal placement problems, and improves transmission security.
Smart Images
Figure CN224267239U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer transfer system based on vision inspection. Background Technology
[0002] In the manufacture of semiconductor devices, various processes are performed on semiconductor wafers (hereinafter referred to as wafers), including film deposition, etching, oxidation, diffusion, and ion implantation. To improve the productivity of semiconductor devices, multi-chamber semiconductor processing equipment can be used.
[0003] A multi-chamber semiconductor processing system typically includes: a stage for holding and transporting multiple wafers; a loader module (LM), located at atmospheric pressure and equipped with a robotic arm for wafer transport; multiple process modules (PMs) arranged around the loader module, which perform predetermined processing on the wafers in a vacuum environment; and a load lock module (LLM), located between the process modules and the loader module, capable of switching between vacuum and atmospheric pressure environments. Unprocessed wafers on the stage can be sequentially fed into the process modules via the loader module and the load lock module for processing. Processed wafers are then sequentially fed into the next process module via the load lock module and the loader module.
[0004] However, existing technologies still have many problems in the process of robotic arms transferring wafers. Utility Model Content
[0005] The technical problem solved by this invention is to provide a wafer transport system based on visual inspection to reduce wafer damage during transport and to provide data support for resolving abnormal wafer placement.
[0006] To address the aforementioned problems, this utility model provides a vision-based wafer transfer system, comprising: a process chamber having a stage for supporting wafers; a transfer component for transferring the wafers; an image acquisition device for acquiring wafer placement images after the wafers are placed on the stage; an image processing module communicatively connected to the image acquisition device, receiving the wafer placement images transmitted by the image acquisition device, and sending a placement anomaly signal when the wafer is determined to have shifted on the stage based on the wafer placement images; and a control module communicatively connected to both the transfer component and the image processing module, receiving the placement anomaly signal and controlling the transfer component to stop operating upon receiving the placement anomaly signal.
[0007] Optionally, the image acquisition device is located inside the process chamber.
[0008] Optionally, the image acquisition device is located outside the process chamber.
[0009] Optionally, the process chamber has an observation window corresponding to the stage; the image acquisition device is located at the observation window and acquires a wafer placement image through the observation window after the wafer is placed on the stage.
[0010] Optionally, the process chamber includes: an ion implantation chamber, a coating chamber, or an etching chamber.
[0011] Optionally, the stage includes an electrostatic adsorption stage.
[0012] Optionally, the transmission component includes a robotic arm.
[0013] Optionally, the image acquisition device includes a CCD camera.
[0014] Optionally, the image processing module includes: a storage unit for storing a reference image of the wafer after it has been placed on the stage without any abnormal offset; and a comparison unit for comparing the wafer placement image with the reference image, and sending a placement abnormality signal when the comparison result exceeds a threshold.
[0015] Optionally, it also includes: an alarm device, wherein the control module is communicatively connected to the alarm device, and the control module is also used to control the alarm device to start after receiving an abnormal signal.
[0016] Compared with the prior art, the technical solution of this utility model has the following advantages:
[0017] In this invention's vision-based wafer transfer system, the addition of an image acquisition device allows for the acquisition of images of the wafer after it has been placed on the stage. These images are then transmitted to an image processing module. When the image processing module determines that the wafer has shifted off the stage based on the image, it sends a placement anomaly signal to a control module. The control module then stops the transfer component based on this signal, effectively preventing damage to the wafer caused by the transfer component continuing to operate normally when the wafer has shifted off the stage. Furthermore, the image acquisition module can also capture images of the wafer being placed on the stage, providing data support for subsequent troubleshooting of abnormal wafer placement.
[0018] Furthermore, the image acquisition device is located outside the process chamber; the process chamber has an observation window corresponding to the stage; the image acquisition device is positioned at the observation window and acquires wafer placement images through the observation window after the wafer is placed on the stage. When the process chamber has a suitable observation window, by placing the image acquisition device outside the process chamber and acquiring wafer placement images through the observation window, the problem of the image acquisition device's wiring needing to penetrate the sidewall of the process chamber, thus affecting the airtightness of the process chamber, is avoided when the image acquisition device is located inside the process chamber.
[0019] Furthermore, it also includes an alarm device, which is communicatively connected to the control module. Upon receiving a placement anomaly signal, the control module also controls the alarm device to activate. By adding the alarm device, when a placement anomaly occurs on the wafer stage, the alarm device can alert technicians to promptly inspect and resolve the problem. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of a wafer transfer system based on vision inspection according to an embodiment of the present invention;
[0021] Figure 2 This is a schematic diagram of the image processing module in a wafer transmission system based on visual inspection, according to an embodiment of this utility model. Detailed Implementation
[0022] As described in the background section, existing technologies still have many problems in the process of robotic arms transferring wafers. These will be explained in detail below.
[0023] Currently, the lack of end-of-line detection mechanisms in the process chamber means that after the wafer is transferred to the stage within the process chamber, it is impossible to detect whether the wafer has an abnormal bias, while the robotic arm's transfer action continues normally, easily leading to various severe wafer breakage accidents. Existing stages can only confirm whether a wafer is placed, but lack a detection mechanism to check whether the wafer is placed correctly. This makes it impossible to detect abnormal wafer placement, easily resulting in wafer breakage. Furthermore, there is no video recording of abnormal wafer placement, leaving no strong evidence to help in subsequent analysis and resolution.
[0024] Based on this, the present invention provides a wafer transfer system based on visual inspection. By adding an image acquisition device, it can acquire images of the wafer after it has been placed on the stage, and transmit the acquired wafer placement images to the image processing module. When the image processing module determines that the wafer has been misplaced on the stage based on the wafer placement images, it sends a placement anomaly signal to the control module. The control module controls the transfer component to stop operating based on the placement anomaly signal, thereby effectively preventing damage to the wafer caused by the transfer component continuing to operate normally when the wafer is misplaced on the stage. Furthermore, the image acquisition module can also capture images of the wafer being placed on the stage, providing data support for subsequent resolution of abnormal wafer placement.
[0025] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0026] In the description of this utility model, it should be understood that the terms "upper," "lower," "top surface," "bottom surface," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the indicated position or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this utility model. Furthermore, the terms "first" and "second" are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship, order, or relative importance between these entities or operations.
[0027] Figure 1 This is a schematic diagram of the structure of a wafer transfer system based on vision inspection according to an embodiment of this utility model; Figure 2 This is a schematic diagram of the image processing module in a wafer transmission system based on visual inspection, according to an embodiment of this utility model.
[0028] Please refer to Figure 1A vision-based wafer transfer system includes: a process chamber 100, wherein the process chamber 100 has a stage 100b for carrying a wafer 100a; a transfer assembly 101 for transferring the wafer 100a; an image acquisition device 102 for acquiring a wafer placement image 102a after the wafer 100a is placed on the stage 100b; and an image processing module 103 communicatively connected to the image acquisition device 102. The image processing module 103 is used to receive the wafer placement image 102a transmitted by the image acquisition device 102, and when it is determined based on the wafer placement image 102a that the wafer 100a has a placement offset on the stage 100b, it sends a placement abnormality signal; the control module 104 is communicatively connected to the transmission component 101 and the image processing module 103, and is used to receive the placement abnormality signal, and control the transmission component 101 to stop operating after receiving the placement abnormality signal.
[0029] By adding the image acquisition device 102, images of the wafer 100a after it has been placed on the stage 100b can be acquired, and the acquired wafer placement image 102a can be transmitted to the image processing module 103. When the image processing module 103 determines that the wafer 100a has been misplaced on the stage 100b based on the wafer placement image 102a, it sends a placement abnormality signal to the control module 104. The control module 104 controls the transmission component 101 to stop operating based on the placement abnormality signal, thereby effectively preventing damage to the wafer 100a caused by the transmission component 101 continuing to operate normally when the wafer 100a is misplaced on the stage 100b. Furthermore, the image acquisition module can also capture images of the wafer 100a being placed on the stage 100b, providing data support for subsequent solutions to abnormal wafer 100a placement.
[0030] In this embodiment, the image acquisition device 102 is disposed outside the process chamber 100. Specifically, the process chamber 100 has an observation window 100c, which corresponds to the stage 100b; the image acquisition device 102 is disposed at the observation window 100c, and acquires a wafer placement image 102a of the wafer 100a placed on the stage 100b through the observation window 100c.
[0031] When the process chamber 100 has a suitable observation window 100c, by placing the image acquisition device 102 outside the process chamber 100 and acquiring the wafer placement image 102a after the wafer 100a is placed on the stage 100b through the observation window 100c, the problem of the image acquisition device 102 needing to penetrate the side wall of the process chamber 100 when the image acquisition device 102 is placed inside the process chamber 100 is avoided, which would affect the airtightness of the process chamber 100.
[0032] In other embodiments, if the process chamber does not have a suitable observation window, an additional window corresponding to the stage can be opened on the process chamber, and the image acquisition device can be positioned outside the process chamber at the observation window to acquire wafer placement images through the additional window. Alternatively, the image acquisition device can be directly placed inside the process chamber.
[0033] In this embodiment, the process chamber 100 is an ion implantation chamber, meaning that after the wafer 100a is placed on the stage 100b, ion implantation will be performed within the process chamber 100. Ions are implanted from the side wall of the process chamber 100. The stage 100b is located at the bottom of the process chamber 100, and the observation window 100c is located at the top of the process chamber 100 and corresponds to the stage 100b. The stage 100b is controlled by a multi-degree-of-freedom operating component (not shown). The position of the stage 100b is adjusted by the multi-degree-of-freedom operating component, thereby enabling the wafer 100a adsorbed on the stage 100b to receive ion implantation.
[0034] In other embodiments, the process chamber may also be a coating chamber or an etching chamber.
[0035] In this embodiment, the stage 100b is an electrostatic adsorption stage 100b. An electrostatic adsorption stage 100b (E-Chuck) is a device used in semiconductor processes to adsorb and fix the wafer 100a. For example, the electrostatic adsorption stage 100b is used to adsorb and fix the wafer 100a in chemical vapor deposition, physical vapor deposition, ion implantation and etching processes.
[0036] In this embodiment, the transmission component 101 employs a multi-degree-of-freedom robotic arm.
[0037] In this embodiment, the image acquisition device 102 is a CCD camera.
[0038] Please refer to Figure 2In this embodiment, the image processing module 103 includes: a storage unit 1031, which stores a reference image of the wafer 100a after it is placed on the stage 100b without any abnormal offset; and a comparison unit 1032, which compares the wafer placement image 102a with the reference image, and sends the placement abnormal signal when the comparison result exceeds a threshold.
[0039] In other embodiments, the image processing module can also be trained based on a machine learning model. Multiple wafer placement images without abnormal offsets are input into the image processing module in advance for training and testing. After the machine learning model passes the test, it will be put into actual use to process the input wafer placement images in real time, thereby determining whether there is an abnormal placement in the input wafer placement images.
[0040] In this embodiment, the vision-based wafer transfer system further includes an alarm device 105. The control module 104 is communicatively connected to the alarm device 105, and the control module 104, upon receiving a placement anomaly signal, also controls the alarm device 105 to activate. By adding the alarm device 105, when a placement anomaly occurs on the stage 100b, the alarm device 105 can alert technicians to promptly inspect and resolve the problem.
[0041] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A wafer transfer system based on vision inspection, characterized in that, include: A process chamber having a stage for holding a wafer; A transmission component for transmitting the wafer; An image acquisition device, used to acquire a wafer placement image after the wafer is placed on the stage; An image processing module is communicatively connected to the image acquisition device. The image processing module is used to receive the wafer placement image transmitted by the image acquisition device, and based on the wafer placement image, when it is determined that the wafer has a placement offset on the stage, it sends a placement abnormality signal. The control module is communicatively connected to both the transmission component and the image processing module. The control module is used to receive placement abnormality signals and, upon receiving the placement abnormality signals, to control the transmission component to stop operating.
2. The wafer transfer system based on vision inspection according to claim 1, characterized in that, The image acquisition device is located inside the process chamber.
3. The wafer transfer system based on vision inspection according to claim 1, characterized in that, The image acquisition device is located outside the process chamber.
4. The wafer transfer system based on vision inspection according to claim 3, characterized in that, The process chamber has an observation window, which corresponds to the stage; the image acquisition device is located at the observation window and acquires wafer placement images through the observation window after the wafer is placed on the stage.
5. The wafer transfer system based on vision inspection according to claim 1, characterized in that, The process chambers include: ion implantation chamber, coating chamber, or etching chamber.
6. The wafer transfer system based on vision inspection according to claim 1, characterized in that, The stage includes an electrostatic adsorption stage.
7. The wafer transfer system based on vision inspection according to claim 1, characterized in that, The transmission component includes a robotic arm.
8. The wafer transfer system based on vision inspection according to claim 1, characterized in that, The image acquisition device includes a CCD camera.
9. The wafer transfer system based on vision inspection according to claim 1, characterized in that, The image processing module includes: a storage unit for storing a reference image of the wafer after it has been placed on the stage without any abnormal offset; and a comparison unit for comparing the wafer placement image with the reference image, and sending a placement abnormality signal when the comparison result exceeds a threshold.
10. The wafer transfer system based on vision inspection according to claim 1, characterized in that, Also includes: An alarm device is provided, and the control module is communicatively connected to the alarm device. After receiving an abnormal signal, the control module is also used to control the alarm device to start.