A modular manifold and an injection mold

By using a modular manifold design, and employing heating from the first hot runner pipe and fixing with a connecting sleeve, the problems of uneven flow and connection reliability of the manifold under high temperature and high pressure environments are solved, achieving a low-energy and high-efficiency injection molding process.

CN224276004UActive Publication Date: 2026-05-26DONGGUAN REHENG INJECTION TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN REHENG INJECTION TECH CO LTD
Filing Date
2025-04-30
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing manifolds expand under high temperature and high pressure, causing changes in the cross-sectional area of ​​the flow channel, which affects the melt flow balance and results in problems such as uneven filling, shrinkage marks, or flash. Furthermore, the connection structure is easily damaged, increasing production costs and maintenance frequency.

Method used

It adopts a modular flow divider design, including nozzle flow divider, hot nozzle connector and connecting assembly. It is heated by the first hot runner pipe and fixed and insulated by the first connecting sleeve, which reduces energy consumption. The modular structure facilitates manufacturing and maintenance.

Benefits of technology

It significantly reduces injection molding energy consumption, improves melt flow stability and connection reliability, reduces production costs and equipment requirements, and simplifies the maintenance process.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224276004U_ABST
    Figure CN224276004U_ABST
Patent Text Reader

Abstract

A modular manifold includes a nozzle manifold component, multiple hot nozzle connectors, and multiple connecting assemblies. The top surface of the nozzle manifold component has a gate, and at least a portion of its side surfaces each have a manifold outlet communicating with the gate. The bottom surface of the hot nozzle connector has a runner outlet, and its side surface has a connecting port communicating with the runner outlet. Mounting grooves are provided on the nozzle manifold component and all hot nozzle connectors. The connecting assemblies include a first connecting sleeve and a first hot runner pipe. The two ends of the first connecting sleeve are respectively connected to the nozzle manifold component and the hot nozzle connector, and a first mounting cavity is provided inside the sleeve through which both ends pass. The first hot runner pipe is disposed within the first mounting cavity and spaced apart from the inner wall of the first connecting sleeve, and its two ends are respectively sealed to the manifold outlet and the connecting port. This invention also provides an injection mold using the above-described modular manifold. Compared with the prior art, the manifold of this invention significantly reduces energy consumption and the impact of thermal expansion.
Need to check novelty before this filing date? Find Prior Art