One-step formed embedded transparent armor assembly
By using a one-piece molded embedded transparent armor assembly, the problem of connection stability between transparent armor layers is solved by utilizing an outer frame, inorganic transparent material layers, and interlayer bonding material layers, thus achieving structural integration and stable protective performance.
Patent Information
- Application Number
- CN202520823776.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2026-05-26
- Estimated Expiration
- 2035-04-28
AI Technical Summary
The existing transparent armor has insufficient stability in the connection between the layers, making it prone to delamination and separation. Moreover, the manufacturing process is complicated, consumes manpower and materials, and affects its service life.
The system employs a one-piece molded embedded transparent armor assembly, comprising an outer frame, an inorganic transparent material layer, an interlayer bonding material layer, and a splash-proof material layer. Through interlayer bonding of polyurethane material and hot melt adhesive material, a dense adhesive layer is formed, enhancing the connection stability between the layers.
The transparent armor assembly achieves structural integration, improves the connection stability between layers, reduces delamination and separation, extends service life, and better disperses impact force, providing stable protective performance.